TC1072-3.0VCH [TELCOM]

50mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS; 具有关断功能, ERROR OUTPUT和VREF旁路50毫安CMOS LDO
TC1072-3.0VCH
型号: TC1072-3.0VCH
厂家: TELCOM SEMICONDUCTOR, INC    TELCOM SEMICONDUCTOR, INC
描述:

50mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS
具有关断功能, ERROR OUTPUT和VREF旁路50毫安CMOS LDO

调节器 光电二极管 输出元件
文件: 总12页 (文件大小:127K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PRELIMINARY INFORMATION  
TC1072  
50mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS  
CMOS construction eliminates wasted ground current, sig-  
nificantly extending battery life. Total supply current is  
typically50µAatfullload(20to60timeslowerthaninbipolar  
regulators!).  
FEATURES  
Zero Ground Current for Longer Battery Life!  
Very Low Dropout Voltage  
Guaranteed 50mA Output  
High Output Voltage Accuracy  
Standard or Custom Output Voltages  
Power-Saving Shutdown Mode  
ERROR Ouput can be Used as a Low Battery  
Detector, or Processor Reset Generator  
Bypass Input for Ultra-quiet Operation  
Over-Current and Over-Temperature Protection  
Space-Saving SOT-23A-6 Package  
Pin Compatible Upgrades for Bipolar Regulators  
TC1072 key features include ultra low noise operation  
(plus optional Bypass input); very low dropout voltage (typi-  
cally 100mV at full load) and internal feed-forward compen-  
sation for fast response to step changes in load. An error  
output (ERROR) is asserted when the TC1072 is out-of-  
regulation (due to a low input voltage or excessive output  
current). ERRORcanbeusedasalowbatterywarningoras  
a processor RESET signal (with the addition of an external  
RC network). Supply current is reduced to less than 1µA,  
andbothVOUT andERRORaredisabledwhentheshutdown  
input is low. The TC1072 incorporates both over-tempera-  
ture and over-current protection.  
APPLICATIONS  
The TC1072 is stable with an output capacitor of only  
1µF and has a maximum output current of 50mA. For higher  
output current versions, please see the TC1107, TC1108  
and TC1073 (IOUT = 300mA) data sheets.  
Battery Operated Systems  
Portable Computers  
Medical Instruments  
Instrumentation  
Cellular / GSM / PHS Phones  
Linear Post-Regulator for SMPS  
Pagers  
ORDERING INFORMATION  
Output  
Junction  
Part No.  
Voltage **(V) Package  
Temp. Range  
GENERAL DESCRIPTION  
TC1072-2.5VCH  
TC1072-2.7VCH  
TC1072-3.0VCH  
TC1072-3.3VCH  
TC1072-5.0VCH  
2.5  
2.7  
3.0  
3.3  
5.0  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
The TC1072 is a high accuracy (typically ±0.5%) CMOS  
upgradeforolder(bipolar)lowdropoutregulators. Designed  
specifically for battery-operated systems, the TC1072’s  
TYPICAL APPLICATION  
1M  
NOTE: *SOT-23A-6 is equivalent to the EIAJ (SC-74A)  
** Other output voltages available. Please contact TelCom  
Semiconductor for details  
1
6
V
V
V
V
OUT  
IN  
IN  
OUT  
1µF  
PIN CONFIGURATION  
TC1072  
2
5
4
VOUT  
ERROR  
4
Bypass  
5
GND  
Bypass  
ERROR  
C
BYPASS  
6
470pF  
TC1072  
(SOT-23A-6*)  
3
SHDN  
ERROR  
TOP VIEW  
2
3
1
VIN  
GND  
SHDN  
Shutdown Control  
(from Power Control Logic)  
NOTE: *SOT-23A-6 is equivalent to the EIAJ (SC-74A)  
TelCom Semiconductor reserves the right to make changes in the circuitry and specifications ot its devices.  
TC1072-01 6/16/97  
PRELIMINARY INFORMATION  
50mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1072  
*Stresses beyond those listed under "Absolute Maximum Ratings" may  
cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond  
those indicated in the operational sections of the specifications is not  
implied. Exposure to absolute maximum rating conditions for extended  
periods may affect device reliability.  
ABSOLUTE MAXIMUM RATINGS*  
Input Voltage .................................................................7V  
Output Voltage .................................. (– 0.3) to (VIN + 0.3)  
Power Dissipation ....................Internally Limited (Note 7)  
Operating Temperature .................... – 40°C < TJ < 125°C  
Storage Temperature ............................65°C to +150°C  
Maximum Voltage on Any Pin ........... VIN + 0.3V to – 0.3V  
Lead Temperature (Soldering, 10 Sec.)................ +260°C  
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless other-  
wise specified.BOLDFACE type specifications apply for junction temperatures of  
– 40°C to +125°C.  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
VIN  
Input Operating Voltage  
Maximum Output Current  
Output Voltage  
50  
6.5  
V
mA  
IOUT  
MAX  
VOUT  
Note 1  
Note 2  
VR – 2.5%  
V
R ±0.5% VR + 2.5%  
V
TC VOUT  
VOUT Temperature Coefficient  
ppm/°C  
40  
VOUT/VIN  
VOUT/VOUT  
Line Regulation  
Load Regulation  
(VR + 1V) < VIN < 6V  
0.05  
0.5  
%/V  
%
IL = 0.1mA to IOUT  
(Note 3)  
MAX  
VIN – VOUT  
Dropout Voltage (Note 4)  
IL = 0.1mA  
IL = 20mA  
IL = 50mA  
(Note 4)  
5
65  
95  
mV  
IGND  
IIN  
Ground Pin Current  
IL = IOUT  
0
µA  
µA  
MAX, (Note 5)  
Supply Current  
SHDN = VIH, IL = 0  
SHDN = 0V  
50  
IINSD  
PSRR  
Shutdown Supply Current  
Power Supply Rejection Ratio  
Output Short Circuit Current  
Thermal Regulation  
Output Noise  
0.05  
µA  
FRE 1kHz  
64  
dB  
IOUT  
VOUT = 0V  
Note 6  
200  
0.04  
260  
450  
mA  
SC  
VOUT/PD  
%/W  
nV/Hz  
eN  
IL = IOUT  
MAX  
470pF from Bypass to GND  
SHDN Input  
VIH  
VIL  
SHDN Input High Threshold  
SHDN Input Low Threshold  
VIN = 2.5V to 6.5V  
VIN = 2.5V to 6.5V  
45  
%VIN  
%VIN  
15  
2
TC1072-01 6/16/97  
PRELIMINARY INFORMATION  
50mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1072  
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25  
°C, unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
ERROR Open Drain Output  
VMIN  
VOL  
Minimum Operating Voltage  
1.0  
400  
V
mV  
V
Output Logic Low Voltage  
ERROR Threshold Voltage  
ERROR Positive Hysteresis  
1mA Flows to ERROR  
See Figure 2  
Note 8  
VTH  
0.95 x VR  
50  
VHYS  
mV  
NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.2V, 3.3V, 3.8V 5.0V.  
2. TC VOUT (VOUT VOUT  
MIN) x 106  
VOUT x T  
=
MAX –  
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load  
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the  
thermal regulation specification.  
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.  
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load  
current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD).  
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load  
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.  
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the  
thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to  
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.  
8. Hysteresis voltage is referenced by VR.  
PIN DESCRIPTION  
Pin No.  
(SOT-23A-6)  
Symbol  
Description  
1
2
3
VIN  
Unregulated supply input.  
Ground terminal.  
GND  
SHDN  
Shutdown control input. The regulator is fully enabled when a logic high is applied to this  
input. The regulator enters shutdown when a logic low is applied to this input. During  
shutdown, output voltage falls to zero and supply current is reduced to 0.05 microamp  
(typical).  
4
ERROR  
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-  
tolerance by approximately – 5%.  
5
6
Bypass  
VOUT  
Reference bypass input. Connecting a 470pF to this input further reduces output noise.  
Regulated voltage output.  
3
TC1072-01 6/16/97  
PRELIMINARY INFORMATION  
50mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1072  
DETAILED DESCRIPTION  
The TC1072 is a precision fixed output voltage regula-  
tor. (If an adjustable version is desired, please see the  
TC1070 or TC1071 data sheets.) Unlike the bipolar regula-  
tors, the TC1072 supply current does not increase with load  
current. In addition, VOUT remains stable and within regula-  
tion at very low load currents (an important consideration in  
RTC and CMOS RAM battery back-up applications).  
Figure 1 shows a typical application circuit. The regula-  
tor is enabled any time the shutdown input (SHDN) is at or  
above VIH, and shutdown (disabled) when SHDN is at or  
below VIL. SHDN may be controlled by a CMOS logic gate,  
or I/O port of a microcontroller. If the SHDN input is not  
required, it should be connected directly to the input supply.  
While in shutdown, supply current decreases to 0.05µA  
(typical) and VOUT falls to zero volts and ERROR is open-  
circuited.  
VOUT  
HYSTERESIS (VHYS  
)
VTH  
ERROR  
VIH  
VOL  
Figure 2. ERROR Output Operation  
Output Capacitor  
A 1µF (min) capacitor from VOUT to ground is recom-  
mended. The output capacitor should have an effective  
series resistance of 5or less, and a resonant frequency  
above1MHz.A1µFcapacitorshouldbeconnected fromVIN  
to GND if there is more than 10 inches of wire between the  
regulator and the AC filter capacitor, or if a battery is used as  
thepowersource. Aluminumelectrolyticortantalumcapaci-  
tor types can be used. (Since many aluminum electrolytic  
capacitors freeze at approximately – 30°C, solid tantalums  
arerecommendedforapplicationsoperatingbelow 25°C.)  
When operating from sources other than batteries, supply-  
noise rejection and transient response can be improved by  
increasing the value of the input and output capacitors and  
employing passive filtering techniques.  
V
V
V
OUT  
OUT  
IN  
1µF  
1µF  
C1  
BATTERY  
Bypass  
TC1072  
GND  
C3, 470pF  
+
V
SHDN  
ERROR  
R1  
1M  
Shutdown Control  
(to CMOS Logic or Tie  
C2 Requires Only  
if ERROR is used as a  
Processor RESET Signal  
(See Text)  
BATTLOW  
or RESET  
to V if unused)  
IN  
0.2µF  
C2  
Bypass Input  
Figure 1. Typical Application Circuit  
A 470pF capacitor connected from the Bypass input to  
ground reduces noise present on the internal reference,  
which in turn significantly reduces output noise. If output  
noise is not a concern, this input may be left unconnected.  
Larger capacitor values may be used, but results in a longer  
time period to rated output voltage when power is initially  
applied.  
ERROR Open Drain Output  
ERROR is driven low whenenver VOUT falls out of  
regulation by more than – 5% (typical). The condition my be  
caused by low input voltage, output current limiting, or  
thermal limiting. The ERROR output voltage value (e.g.  
ERROR=VOL at4.75(typ)fora5.0Vregulatorand2.85(typ)  
for a 3.0V regulator). ERROR ouput operation is shown in  
Figure 2.  
Thermal Considerations  
Thermal Shutdown  
Note that ERROR is active when VOUT falls to VTH, and  
inactive when VOUT rises above VTH = VHYS.  
Integrated thermal protection circuitry shuts the regula-  
tor off when die temperature exceeds 160°C. The regulator  
remains off until the die temperature drops to approximately  
150°C.  
As shown in Figure 1, ERROR can be used as a battery  
low flag, or as a processor RESET signal (with the addition  
of timing capacitor C2). R1 x C2 should be chosen to  
maintain ERROR below VIH of the processor RESET input  
for at least 200msec to allow time for the system to stabilize.  
Pull-up resistor R1 can be tied to VOUT, VIN or any other  
voltage less than (VIN +0.3V).  
Power Dissipation  
The amount of power the regulator dissipates is prima-  
rilyafunctionofinputandoutputvoltage,andoutputcurrent.  
4
TC1072-01 6/16/97  
PRELIMINARY INFORMATION  
50mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1072  
The following equation is used to calculate worst case  
actual power dissipation:  
= (125 – 55)  
220  
PD (VIN  
VOUT  
ILOAD  
)
MIN MAX  
= 318mW  
MAX  
Where:  
In this example, the TC1072 dissipates a maximum of  
only 60mW; far below the allowable limit of 318mW. In a  
similar manner, Equation 1 and Equation 2 can be used to  
calculate maximum current and/or input voltage limits.  
PD = Worst case actual power dissipation  
= Maximum voltage on VIN  
VIN  
MAX  
VOUT  
= Minimum regulator output voltage  
MIN  
ILOADMAX = Maximum output (load) current  
Layout Considerations  
Equation 1.  
The primary path of heat conduction out of the package  
is via the package leads. Therefore, layouts having a  
ground plane, wide traces at the pads, and wide power  
supply bus lines combine to lower θJA and therefore in-  
crease the maximum allowable power dissipation limit.  
The maximumallowable power dissipation (Equation 2)  
is a function of the maximum ambient temperature (TAMAX),  
the maximum allowable die temperature (125°C) and the  
thermal resistance from junction-to-air (θJA). SOT-23A-6  
packag has a θJA of approximately 220°C/Watt when  
mounted on a single layer FR4 dielectric copper clad PC  
board.  
PD MAX (TJMAX – TA  
)
=
MAX  
θJA  
Where all terms are previously defined.  
Equation 2.  
Equation 1 can be used in conjunction with Equation 2  
to ensure regulator thermal operation is within limits. For  
example:  
Given:  
VIN  
VOUT  
= 3.0V ±10%  
= 2.7V ±0.5V  
MAX  
MIN  
ILOAD = 40mA  
TAMAX = 55°C  
Find: 1. Actual power dissipation  
2. Maximum allowable dissipation  
Actual power dissipation:  
PD (VIN  
VOUT  
ILOAD  
)
MIN MAX  
MAX  
= [(3.0 x 1.05) – (2.7 x .995)]40 x 10–3  
= 18.5mW  
Maximum allowable power dissipation:  
PDMAX = (TJMAX – TAMAX  
)
θJA  
5
TC1072-01 6/16/97  
PRELIMINARY INFORMATION  
50mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1072  
& = part number code + temperature range and voltage  
SOT-23A-6  
TC1072 (V)  
Code  
2.5  
2.7  
3.0  
3.3  
5.0  
E1  
E2  
E3  
E4  
E6  
represents year and quarter code  
represents lot ID number  
PACKAGE DIMENSIONS  
SOT-23A-6*  
.069 (1.75)  
.059 (1.50)  
.118 (3.00)  
.102 (2.60)  
.020 (0.50)  
.014 (0.35)  
.037 (0.95)  
REFERENCE  
.118 (3.00)  
.110 (2.80)  
.057 (1.45)  
.035 (0.90)  
.008 (0.20)  
.004 (0.09)  
10° MAX.  
.006 (0.15)  
.000 (0.00)  
.022 (0.55)  
.014 (0.35)  
Dimensions: inches (mm)  
NOTE: *SOT-23A-6 is equivalent to the EIAJ (SC-74A)  
Sales Offices  
TelCom Semiconductor  
Austin Product Center  
9101 Burnet Rd. Suite 214  
Austin, TX 78758  
TelCom Semiconductor H.K. Ltd.  
10 Sam Chuk Street, 6/F  
San Po Kong  
Kowloon  
Hong Kong  
TelCom Semiconductor  
1300 Terra Bella Avenue  
P.O. Box 7267  
Mountain View, CA 94039-7267  
TEL: 415-968-9241  
TEL: 512-873-7100  
FAX: 512-873-8236  
TEL: 852-2324-0122  
FAX: 852-2354-9957  
FAX: 415-967-1590  
E-Mail: liter@c2smtp.telcom-semi.com  
6
TC1072-01 6/16/97  
Printed in the U.S.A.  
PRELIMINARY INFORMATION  
TC1073  
100mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS  
FEATURES  
GENERAL DESCRIPTION  
Zero Ground Current for Longer Battery Life!  
Very Low Dropout Voltage  
Guaranteed 100mA Output  
High Output Voltage Accuracy  
Standard or Custom Output Voltages  
Power-Saving Shutdown Mode  
ERROR Ouput can be Used as a Low Battery  
Detector, or Processor Reset Generator  
Bypass Input for Ultra-quiet Operation  
Over-Current and Over-Temperature Protection  
Space-Saving SOT-23A-6 Package  
Pin Compatible Upgrades for Bipolar Regulators  
The TC1073 is a high accuracy (typically ±0.5%) CMOS  
upgrade for older (bipolar) low dropout regulators such as  
the LP2980. Designed specifically for battery-operated sys-  
tems, the TC1073’s CMOS construction eliminates wasted  
ground current, significantly extending battery life. Total  
supply current is typically 50µA at full load (20 to 60 times  
lower than in bipolar regulators!).  
TC1073 key features include ultra low noise operation  
(plus optional Bypass input); very low dropout voltage (typi-  
cally 200mV at full load) and internal feed-forward compen-  
sation for fast response to step changes in load. An error  
output (ERROR) is asserted when the TC1073 is out-of-  
regulation (due to a low input voltage or excessive output  
current). ERRORcanbeusedasalowbatterywarningoras  
a processor RESET signal (with the addition of an external  
RC network). Supply current is reduced to less than 1µA,  
andbothVOUT andERRORaredisabledwhentheshutdown  
input is low. The TC1073 incorporates both over-tempera-  
ture and over-temeprature protection.  
APPLICATIONS  
Battery Operated Systems  
Portable Computers  
Medical Instruments  
Instrumentation  
Cellular / GSM / PHS Phones  
Linear Post-Regulator for SMPS  
Pagers  
The TC1073 is stable with an output capacitor of only  
1µF and has a maximum output current of 100mA. For  
higher output current versions, please see the TC1107,  
TC1108 (IOUT = 300mA) data sheets.  
TYPICAL APPLICATION  
ORDERING INFORMATION  
Output  
Junction  
1M  
Part No.  
Voltage** Package  
Temp. Range  
1
TC1073-2.5VCH  
TC1073-2.7VCH  
TC1073-3.0VCH  
TC1073-3.3VCH  
TC1073-5.0VCH  
2.5V  
2.7V  
3.0V  
3.3V  
5.0V  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
SOT-23A-6* – 40°C to +125°C  
6
V
V
V
V
OUT  
IN  
IN  
OUT  
1µF  
TC1073  
2
3
5
4
GND  
Bypass  
ERROR  
C
NOTE: *SOT-23A-6 is equivalent to the EIAJ (SC-74)  
** Other output voltages available. Please contact TelCom  
Semiconductor for details  
BYPASS  
470pF  
SHDN  
ERROR  
PIN CONFIGURATION  
VOUT  
ERROR  
4
Bypass  
5
6
Shutdown Control  
(from Power Control Logic)  
TC1073  
(SOT-23A-6*)  
TOP VIEW  
2
3
1
VIN  
GND  
SHDN  
NOTE: *SOT-23A-6 is equivalent to the EIAJ (SC-74)  
TelCom Semiconductor reserves the right to make changes in the circuitry and specifications ot its devices.  
TC1073-01 6/5/97  
PRELIMINARY INFORMATION  
100mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1073  
*Stresses beyond those listed under "Absolute Maximum Ratings" may  
cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond  
those indicated in the operational sections of the specifications is not  
implied. Exposure to absolute maximum rating conditions for extended  
periods may affect device reliability.  
ABSOLUTE MAXIMUM RATINGS*  
Input Voltage .................................................................7V  
Output Voltage .................................. (– 0.3) to (VIN + 0.3)  
Power Dissipation ....................Internally Limited (Note 7)  
Operating Temperature .................... – 40°C < TJ < 125°C  
Storage Temperature ............................65°C to +150°C  
Maximum Voltage On Any Pin .......... VIN + 0.3V to – 0.3V  
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25  
°C, unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
VIN  
Input Operating Voltage  
Maximum Output Current  
Output Voltage  
Note 9  
100  
6.5  
V
mA  
IOUT  
Note 9  
MAX  
VOUT  
Notes 1, 9  
Note 2, 9  
VR – 2.5%  
V
R ±0.5% VR + 2.5%  
V
TC VOUT  
VOUT Temperature Coefficient  
20  
ppm/°C  
40  
VOUT/VIN  
VOUT/VOUT  
Line Regulation  
Load Regulation  
(VR + 1V) < VIN < 6V  
0.05  
0.5  
%
%
IL = 0.1mA to IOUT  
(Note 3)  
MAX  
VIN – VOUT  
Dropout Voltage (Note 4)  
IL = 0.1mA  
IL = 20mA  
IL = 50mA  
IL =100mA  
(Note 4)  
20  
70  
100  
200  
mV  
IGND  
IIN  
Ground Pin Current  
IL = IOUT  
0
80  
0.05  
µA  
µA  
MAX, (Note 5, 9)  
Supply Current  
SHDN = VIH, IL = 0  
SHDN = 0V  
50  
IINSD  
ROUT  
PSRR  
Shutdown Supply Current  
Output Resistance during Shutdown  
Power Supply Rejection Ratio  
Output Short Circuit Current  
Thermal Regulation  
µA  
SHDN < VIL  
100 x VR  
160 x VR  
64  
kΩ  
FRE 1kHz  
dB  
IOUT  
VOUT = 0V  
Note 6  
300  
500  
mA  
%/W  
°C  
SC  
VOUT/PD  
TSD  
0.04  
160  
Thermal Shutdown Die Temperature  
Thermal Shutdown Hysteresis  
Output Noise  
TSD  
10  
°C  
eN  
IL = IOUT  
260  
nV/Hz  
MAX  
470pF from Bypass to GND  
SHDN Input  
VIH  
VIL  
SHDN Input High Threshold  
SHDN Input Low Threshold  
VIN = 2.5V to 6.5V  
VIN = 2.5V to 6.5V  
45  
%VIN  
%VIN  
15  
2
TC1073-01 6/5/97  
PRELIMINARY INFORMATION  
100mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1073  
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25  
°C, unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
ERROR Open Dranin Output  
VMIN  
VOL  
Minimum Operating Voltage  
1.0  
400  
V
mV  
V
Output Logic Low Voltage  
ERROR Threshold Voltage  
ERROR Positive Hysteresis  
1mA Flows to ERROR  
See Figure 2  
Note 8  
VTH  
0.95 x VR  
50  
VHYS  
mV  
NOTES: 1. VR is the regulator output voltage setting. (VR = 2.5V, 2.7V, 3.0V, 3.3V, 5.0V).  
2. TC VOUT (VOUT VOUT  
MIN) x 106  
VOUT x T  
=
MAX –  
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load  
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the  
thermal regulation specification.  
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.  
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load  
current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD).  
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load  
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.  
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the  
thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to  
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.  
8. Hysteresis voltage is referenced by VR.  
9. Boldface type specifications apply for junction temperatures of – 40°C to +125°C.  
PIN DESCRIPTION  
Pin No.  
(SOT-23A-6) Symbol  
Description  
1
2
3
VIN  
Unregulated supply input.  
Ground terminal.  
GND  
SHDN  
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.  
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output  
voltage falls to zero and supply current is reduced to 0.05 microamp (typical).  
4
ERROR  
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance  
by approximately – 5%.  
5
6
Bypass  
VOUT  
Reference bypass input. Connecting a 470pF to this input further reduces output noise.  
Regulated voltage output.  
3
TC1073-01 6/5/97  
PRELIMINARY INFORMATION  
100mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1073  
DETAILED DESCRIPTION  
The TC1073 is a precision fixed output voltage regula-  
tor. (If an adjustable version is desired, please see the  
TC1070 or TC1071 data sheets.) Unlike the bipolar regula-  
tors, the TC1073 supply current does not increase with load  
current. In addition, VOUT remains stable and within regula-  
tion at very low load currents (an important consideration in  
RTC and CMOS RAM battery back-up applications).  
Figure 1 shows a typical application circuit. The regula-  
tor is enabled any time the shutdown input (SHDN) is at or  
above VIH, and shutdown (disabled) when SHDN is at or  
below VIL. SHDN may be controlled by a CMOS logic gate,  
or I/O port of a microcontroller. If the SHDN input is not  
required, it should be connected directly to the input supply.  
While in shutdown, supply current decreases to 0.05µA  
(typical) and VOUT falls to zero volts and ERROR is open-  
circuited.  
VOUT  
HYSTERESIS (VHYS  
)
VTH  
ERROR  
VIH  
VOL  
Figure 2. ERROR Output Operation  
Output Capacitor  
A 1µF (min) capacitor from VOUT to ground is recom-  
mended. The output capacitor should have an effective  
series resistance of 5or less, and a resonant frequency  
above1MHz.A1µFcapacitorshouldbeconnected fromVIN  
to GND if there is more than 10 inches of wire between the  
regulator and the AC filter capacitor, or if a battery is used as  
thepowersource. Aluminumelectrolyticortantalumcapaci-  
tor types can be used. (Since many aluminum electrolytic  
capacitors freeze at approximately – 30°C, solid tantalums  
arerecommendedforapplicationsoperatingbelow 25°C.)  
When operating from sources other than batteries, supply-  
noise rejection and transient response can be improved by  
increasing the value of the input and output capacitors and  
employing passive filtering techniques.  
V
V
V
OUT  
OUT  
IN  
1µF  
1µF  
C1  
BATTERY  
Bypass  
TC1073  
GND  
C3, 470pF  
+
V
SHDN  
ERROR  
R1  
1M  
Shutdown Control  
(to CMOS Logic or Tie  
C2 Requires Only  
if ERROR is used as a  
Processor RESET Signal  
(See Text)  
BATTLOW  
or RESET  
to V if unused)  
IN  
0.2µF  
C2  
Bypass Input  
Figure 1. Typical Application Circuit  
A 470pF capacitor connected from the Bypass input to  
ground reduces noise present on the internal reference,  
which in turn significantly reduces output noise. If output  
noise is not a concern, this input may be left unconnected.  
Larger capacitor values may be used, but results in a longer  
time period to rated output voltage when power is initially  
applied.  
ERROR Open Drain Output  
ERROR is driven low whenenver VOUT falls out of  
regulation by more than – 5% (typical). The condition my be  
caused by low input voltage, output current limiting, or  
thermal limiting. The ERROR output voltage value (e.g.  
ERROR=VOL at4.75(typ)fora5.0Vregulatorand2.85(typ)  
for a 3.0V regulator). ERROR ouput operation is shown in  
Figure 2.  
Thermal Considerations  
Thermal Shutdown  
Note that ERROR is active when VOUT falls to VTH, and  
inactive when VOUT rises above VTH = VHYS.  
Integrated thermal protection circuitry shuts the regula-  
tor off when die temperature exceeds 160°C. The regulator  
remains off until the die temperature drops to approximately  
150°C.  
As shown in Figure 1, ERROR can be used as a battery  
low flag, or as a processor RESET signal (with the addition  
of timing capacitor C2). R1 x C2 should be chosen to  
maintain ERROR below VIH of the processor RESET input  
for at least 200msec to allow time for the system to stabilize.  
Pull-up resistor R1 can be tied to VOUT, VIN or any other  
voltage less than (VIN +0.3V).  
Power Dissipation  
The amount of power the regulator dissipates is prima-  
rilyafunctionofinputandoutputvoltage,andoutputcurrent.  
4
TC1073-01 6/5/97  
PRELIMINARY INFORMATION  
100mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1073  
The following equation is used to calculate worst case  
actual power dissipation:  
= (125 – 55)  
220  
PD (VIN  
VOUT  
ILOAD  
)
MIN MAX  
= 318mW  
MAX  
Where:  
In this example, the TC1073 dissipates a maximum of  
only 60mW; far below the allowable limit of 318mW. In a  
similar manner, Equation 1 and Equation 2 can be used to  
calculate maximum current and/or input voltage limits. For  
example,themaximumallowableVIN isfoundbysustituting  
the maximum allowable power dissipation of 318mW into  
Equation 1, from which VINMAX = 5.9V.  
PD = Worst case actual power dissipation  
= Maximum voltage on VIN  
VIN  
MAX  
VOUT  
= Minimum regulator output voltage  
MIN  
ILOADMAX = Maximum output (load) current  
Equation 1.  
The maximumallowable power dissipation (Equation 2)  
is a function of the maximum ambient temperature (TAMAX),  
the maximum allowable die temperature (125°C) and the  
thermal resistance from junction-to-air (θJA). SOT-23A-6  
packag has a θJA of approximately 220°C/Watt when  
mounted on a single layer FR4 dielectric copper clad PC  
board.  
Layout Considerations  
The primary path of heat conduction out of the package  
is via the package leads. Therefore, layouts having a  
ground plane, wide traces at the pads, and wide power  
supply bus lines combine to lower θJA and therefore in-  
crease the maximum allowable power dissipation limit.  
PD MAX (TJMAX – TJ  
)
=
MAX  
θJA  
Where all terms are previously defined.  
Equation 2.  
Equation 1 can be used in conjunction with Equation 2  
to ensure regulator thermal operation is within limits. For  
example:  
Given:  
VIN  
VOUT  
= 3.0V ±10%  
= 2.7V ±0.5V  
MAX  
MIN  
ILOAD = 98mA  
TAMAX = 55°C  
Find: 1. Actual power dissipation  
2. Maximum allowable dissipation  
Actual power dissipation:  
PD (VIN  
VOUT  
ILOAD  
)
MIN MAX  
MAX  
= [(3.0 x 1.1) – (2.7 x .995)]40 x 10–3  
= 60mW  
Maximum allowable power dissipation:  
PDMAX = (TJMAX – TAMAX  
)
θJA  
5
TC1073-01 6/5/97  
PRELIMINARY INFORMATION  
100mA CMOS LDO WITH SHUTDOWN,  
ERROR OUTPUT AND VREF BYPASS  
TC1073  
MARKING  
& = part number code + temperature range and voltage  
SOT-23A-6  
TC1073 (V)  
Code  
2.5  
2.7  
3.0  
3.3  
5.0  
F1  
F2  
F3  
F4  
F6  
represents year and quarter code  
represents lot ID number  
PACKAGE DIMENSIONS  
SOT-23A-6*  
.069 (1.75)  
.059 (1.50)  
.118 (3.00)  
.102 (2.60)  
.020 (0.50)  
.014 (0.35)  
.037 (0.95)  
REFERENCE  
.118 (3.00)  
.110 (2.80)  
.057 (1.45)  
.035 (0.90)  
.008 (0.20)  
.004 (0.09)  
10° MAX.  
.006 (0.15)  
.000 (0.00)  
.022 (0.55)  
.014 (0.35)  
Dimensions: inches (mm)  
NOTE: *SOT-23A-6 is equivalent to the EIAJ (SC-74)  
Sales Offices  
TelCom Semiconductor  
1300 Terra Bella Avenue  
P.O. Box 7267  
Mountain View, CA 94039-7267  
TEL: 415-968-9241  
TelCom Semiconductor H.K. Ltd.  
10 Sam Chuk Street, 6/F  
San Po Kong  
Kowloon  
Hong Kong  
TelCom Semiconductor  
Austin Product Center  
9101 Burnet Rd. Suite 214  
Austin, TX 78758  
TEL: 512-873-7100  
FAX: 512-873-8236  
FAX: 415-967-1590  
E-Mail: liter@c2smtp.telcom-semi.com  
TEL: 852-2324-0122  
FAX: 852-2354-9957  
6
TC1073-01 6/5/97  
Printed in the U.S.A.  

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