5962-9073103M2X [TEMIC]
SPST, 2 Func, 1 Channel, CMOS, CQCC20,;
| 型号： | 5962-9073103M2X |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | SPST, 2 Func, 1 Channel, CMOS, CQCC20, |
| 文件： | 总16页 (文件大小：160K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
B
C
D
Changes in accordance with NOR 5962-R053-93.
Changes in accordance with NOR 5962-R060-94.
Changes in accordance with NOR 5962-R041-95.
93-01-07
93-12-06
94-11-30
95-03-24
M. A. Frye
M. A. Frye
M. A. Frye
M. A. Frye
Redrawn with changes. Add case outline X. Technical and editorial changes
throughout.
E
Update drawing to current requirements. Editorial changes throughout. - drw
04-11-09
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
E
E
E
E
SHEET
10
11
12
13
14
PREPARED BY
Rick C. Officer
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
Charles E. Besore
STANDARD
MICROCIRCUIT
DRAWING
APPROVED BY
Michael A. Frye
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, CMOS QUAD, SPST
ANALOG SWITCH, MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
92-01-13
AMSC N/A
REVISION LEVEL
E
SIZE
A
CAGE CODE
5962-90731
67268
SHEET
1
OF
14
DSCC FORM 2233
APR 97
5962-E014-05
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
90731
01
M
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
Circuit function
Switch action
01
02
03
DG411
DG412
DG413
CMOS, quad, SPST analog switch
CMOS, quad, SPST analog switch
CMOS, quad, SPST analog switch
(See figures 2, 3)
(See figures 2, 3)
(See figures 2, 3)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
2
CQCC1-N20
20
16
16
16
square leadless chip carrier
dual-in-line
E
F
X
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CDFP4-F16
flatpack
flatpack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
V+ to V-............................................................................................................ 44 V dc
Ground to V- .................................................................................................... 25 V dc
Logic supply voltage (VL) to V-......................................................................... (Ground -0.3 V dc) to 44 V dc 2/
Digital inputs, VS, VD ........................................................................................ (V-) -2.0 V dc to (V+) +2.0 V dc
or 30 mA, whichever occurs first 2/
Continuous current (any terminal).................................................................... 30 mA
Source or drain current (pulsed, 1.0 ms, 10% duty cycle)................................ 100 mA
Storage temperature range.............................................................................. -65ºC to +150ºC
Lead temperature (soldering, 10 seconds)....................................................... +300ºC
Power dissipation, TA = +25ºC (PD):
Case E.......................................................................................................... 900 mW 3/
Case F and X................................................................................................ 485 mW 4/
Case 2.......................................................................................................... 750 mW 5/
Thermal resistance, junction-to-case (θJC)....................................................... See MIL-STD-1835
1.4 Recommended operating conditions.
Unipolar supply voltage:
V+................................................................................................................. 12 V dc
V-.................................................................................................................. 0 V dc
Bipolar supply voltage:
V+................................................................................................................. 15 V dc
V-.................................................................................................................. -15 V dc
Logic supply voltage (VL) ................................................................................. 5.25 V dc
Ambient operating temperature range (TA) ...................................................... -55ºC to +125ºC
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum
current ratings.
3/ Derate above TA = +75ºC at 12 mW/ºC.
4/ Derate above TA = +70ºC at 6.06 mW/ºC.
5/ Derate above TA = +75ºC at 10 mW/ºC.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
3
DSCC FORM 2234
APR 97
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.2.4 Block diagrams. The block diagrams shall be as specified on figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 82 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
rDS(ON)
unless otherwise specified
Min
0
Max
35
Drain-to-source ON
resistance
VIN = 0.8 V
1, 3
2
01
02
03
01
02
03
01
02
03
01
02
03
Ω
V+ = 13.5 V,
0
0
0
0
0
0
0
0
0
0
0
45
35
V- = -13.5 V,
IS = -10 mA,
VD = ±8.5 V
VIN = 2.4 V
1, 3
2
45
VIN = 0.8 V or
2.4 V 2/
1, 3
2
35
45
VIN = 0.8 V
1, 3
2
80
V+ = 10.8 V,
V- = 0 V,
100
80
IS = -10 mA,
VIN = 2.4 V
1, 3
2
VD = 3.0 V and
8.0 V
100
80
VIN = 0.8 V or
2.4 V 2/
1, 3
2
100
+0.25
+20
+0.25
+20
+0.25
+20
+0.25
+20
+0.25
+20
+0.25
+20
Source OFF leakage
current
IS(OFF)
VIN = 0.8 V
1
-0.25
-20
nA
V+ = 16.5 V,
V- = -16.5 V,
VD = -15.5 V
VS = 15.5 V
2, 3
1
VIN = 2.4 V
-0.25
-20
2, 3
1
VIN = 0.8 V or
2.4 V 2/
-0.25
-20
2, 3
1
VIN = 0.8 V
-0.25
-20
V+ = 16.5 V,
V- = -16.5 V,
VD = 15.5 V
VS = -15.5 V
2, 3
1
VIN = 2.4 V
-0.25
-20
2, 3
1
VIN = 0.8 V or
2.4 V 2/
-0.25
-20
2, 3
See footnotes at end of table.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - continued.
Conditions 1/
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
nA
Test
Symbol
ID(OFF)
unless otherwise specified
Min
Max
Drain OFF leakage
current
VIN = 2.4 V
1
2, 3
1
01
02
03
01
02
03
01
02
03
-0.25
-20
+0.25
V+ = 16.5 V,
+20
+0.25
+20
V- = -16.5 V,
VD = -15.5 V
VS = 15.5 V
VIN = 0.8 V
-0.25
-20
2, 3
1
VIN = 0.8 V or
2.4 V 2/
-0.25
-20
+0.25
+20
2, 3
1
VIN = 2.4 V
-0.25
-20
+0.25
+20
V+ = 16.5 V,
V- = -16.5 V,
VD = 15.5 V
VS = -15.5 V
2, 3
1
VIN = 0.8 V
-0.25
-20
+0.25
+20
2, 3
1
VIN = 0.8 V or
2.4 V 2/
-0.25
-20
+0.25
+20
2, 3
1
Channel ON
ID(ON)
+
VIN = 0.8 V
-0.4
-40
+0.4
+40
nA
V+ = 16.5 V,
leakage current
V- = -16.5 V,
2, 3
1
VS = VD = ±15.5 V
IS(ON)
VIN = 2.4 V
-0.4
-40
+0.4
+40
2, 3
1
VIN = 0.8 V or
2.4 V 2/
-0.4
-40
+0.4
+40
2, 3
Input current with VIN
low
Input under test = 0.8 V,
all others = 2.4 V
IIL
IIH
1, 2, 3
1, 2, 3
9, 11
10
All
All
All
-0.5
-0.5
0
+0.5
+0.5
175
240
250
400
µA
µA
ns
Input current with VIN
high
Input under test = 2.4 V,
all others = 0.8 V
Turn ON time
tON
See figure 4, RL = 300Ω,
CL = 35 pF, VS = ±10 V
0
See figure 4, RL = 300Ω,
9, 11
10
All
0
ns
V+ = 12 V, V- = 0 V, CL = 35 pF,
VS = +8 V
0
See footnotes at end of table.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - continued.
Conditions 1/
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
ns
Test
Symbol
unless otherwise specified
Min
0
Max
145
Turn OFF time
tOFF
See figure 4, RL = 300Ω,
9, 11
10
All
All
CL = 35 pF, VS = ±10 V
0
0
160
125
See figure 4, RL = 300Ω,
9, 11
V+ = 12 V, V- = 0 V, CL = 35 pF,
VS = +8 V
10
9
0
140
VGEN = 0 V, RGEN = 0Ω,
TA = +25°C, CL = 10 nF,
See figure 5
Charge injection 3/
Q
All
-100
-100
+100
pC
µA
VGEN = 6.0 V, RGEN = 0Ω,
CL = 10 nF, V+ = 12 V, V- = 0 V,
TA = +25°C, See figure 5
9
All
All
+100
Positive supply current
I+
V+ = 16.5 V, V- = -16.5 V,
1
2, 3
1
+1.0
+5.0
+1.0
+5.0
VIN = 0 V or 5.0 V
V+ = 13.2 V, V- = 0 V,
All
All
All
All
All
All
All
All
VIN = 0 V or 5.0 V, VL = 5.25 V
2, 3
1
Negative supply current
Logic supply current
Ground current
I-
V+ = 16.5 V, V- = -16.5 V,
VIN = 0 V or 5.0 V
-1.0
-5.0
-1.0
-5.0
µA
µA
µA
2, 3
1
V+ = 13.2 V, V- = 0 V,
VIN = 0 V or 5.0 V, VL = 5.25 V
2, 3
1
IL
V+ = 16.5 V, V- = -16.5 V,
VIN = 0 V or 5.0 V
+1.0
+5.0
+1.0
+5.0
2, 3
1
V+ = 13.2 V, V- = 0 V,
VIN = 0 V or 5.0 V, VL = 5.25 V
2, 3
1
IGND
V+ = 16.5 V, V- = -16.5 V,
VIN = 0 V or 5.0 V
-1.0
-5.0
-1.0
-5.0
2, 3
1
V+ = 13.2 V, V- = 0 V,
VIN = 0 V or 5.0 V, VL = 5.25 V
2, 3
7, 8
Functional tests
See figure 2 and 4.4.1b
1/ V+ = 15 V, V- = -15 V, VL = 5 V and GND = 0 V, unless otherwise specified.
2/ VIN = input voltage to perform proper function.
3/ Parameter shall be guaranteed to the limits specified, if not tested.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-90731
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
7
DSCC FORM 2234
APR 97
Device types
Case outlines
01, 02, and 03
E, F, X
Terminal symbol
2
Terminal
number
1
2
INPUT 1 (IN1)
DRAIN 1 (D1)
SOURCE 1 (S1)
V-
NC
INPUT 1 (IN1)
DRAIN 1 (D1)
SOURCE 1 (S1)
V-
3
4
5
GROUND (GND)
SOURCE 4 (S4)
DRAIN 4 (D4)
INPUT 4 (IN4)
INPUT 3 (IN3)
DRAIN 3 (D3)
SOURCE 3 (S3)
VL
6
NC
7
GROUND (GND)
SOURCE 4 (S4)
DRAIN 4 (D4)
INPUT 4 (IN4)
NC
8
9
10
11
12
13
14
15
16
17
18
19
20
INPUT 3 (IN3)
DRAIN 3 (D3)
SOURCE 3 (S3)
VL
V+
SOURCE 2 (S2)
DRAIN 2 (D2)
INPUT 2 (IN2)
- - -
NC
V+
- - -
SOURCE 2 (S2)
DRAIN 2 (D2)
INPUT 2 (IN2)
- - -
- - -
FIGURE 1. Terminal connections.
Device type 01
Device type 02
Switch 1, 2,
3, and 4
Switch 1, 2,
3, and 4
Logic
Logic
0
1
ON
0
1
OFF
ON
OFF
Device type 03
Switch
1 and 4
Switch
2 and 3
Logic
0
1
OFF
ON
ON
OFF
Logic “0” ≤ 0.8 V
Logic “1” ≥ 2.4 V
FIGURE 2. Truth tables.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
8
DSCC FORM 2234
APR 97
NOTE: All switches are shown for logic “1” input.
FIGURE 3. Block diagrams.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
9
DSCC FORM 2234
APR 97
NOTES:
RL
1. VO = VS
RL + RDS(ON)
2. CL includes fixture and stray capacitance.
3. LOGIC INPUT waveform is inverted for switches that have the
opposite logic sense.
4. VO is the steady state output with the switch ON. Feed through
via switch capacitance may result in spikes at the leading and
trailing edge of the output waveform.
FIGURE 4. Switching times test circuit and waveforms.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
10
DSCC FORM 2234
APR 97
NOTES:
1. CL includes fixture and stray capacitance.
2. Charge injection ∆(Q) = ∆VO CL.
3. Input polarity determined by sense of switch.
FIGURE 5. Charge injection test circuit and waveforms.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
11
DSCC FORM 2234
APR 97
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
12
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
Subgroups
Subgroups
(in accordance with
(in accordance with
Test requirements
MIL-STD-883,
MIL-PRF-38535, table III)
method 5005, table I)
Device
Device
class Q
Device
class V
class M
Interim electrical
1
1
1
parameters (see 4.2)
Final electrical
1/ 1, 2, 3, 7, 8, 9,
10, 11
1/ 1, 2, 3, 7,
8, 9, 10, 11
1/ 1, 2, 3, 7,
8, 9, 10, 11
parameters (see 4.2)
Group A test
1, 2, 3, 7, 8, 9,
10, 11
1, 2, 3, 7, 8,
9, 10, 11
1, 2, 3, 7, 8, 9, 10, 11
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
1
1
1
1
1
1
1, 2, 3
1
1
1/ PDA applies to subgroup 1.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-
883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a. End-point electrical parameters shall be as specified in table II herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table II herein.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
13
DSCC FORM 2234
APR 97
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-
883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a. End-point electrical parameters shall be as specified in table II herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table II herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-90731
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
14
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 04-11-09
Approved sources of supply for SMD 5962-90731 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
Vendor
similar
PIN 2/
number
5962-9073101M2A
5962-9073101M2C
5962-9073101MEA
17856
1ES66
17856
1ES66
3/
DG411AZ/883
DG411AZ/883B
DG411AK/883
DG411AK/883B
DG411AL/883B
DG411AL/883B
DG412AZ/883
DG412AZ/883B
DG412AK/883
DG412AK/883B
DG412AL/883B
DG412AL/883B
DG413AZ/883
DG413AZ/883B
DG413AK/883
DG413AK/883B
DG413AL/883B
DG413AL/883B
5962-9073101MFA
5962-9073101MXC
5962-9073102M2A
5962-9073102M2C
5962-9073102MEA
1ES66
17856
1ES66
17856
1ES66
3/
5962-9073102MFA
5962-9073102MXC
5962-9073103M2A
5962-9073103M2C
5962-9073103MEA
1ES66
17856
1ES66
17856
1ES66
3/
5962-9073103MFA
5962-9073103MXC
1ES66
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - continued
DATE: 04-11-09
Vendor CAGE
number
Vendor name
and address
17856
Siliconix, Inc.
2201 Laurelwood Road
Santa Clara, CA 95054-1516
1ES66
Maxim Integrated Products
120 San Gabriel Dr
Sunnyvale, CA 94086-5125
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2
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