SMCP-672061FV-15/883 [TEMIC]

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28;
SMCP-672061FV-15/883
型号: SMCP-672061FV-15/883
厂家: TEMIC SEMICONDUCTORS    TEMIC SEMICONDUCTORS
描述:

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

先进先出芯片 CD
文件: 总22页 (文件大小:382K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
First-in first-out dual port memory  
16384 x 9 organisation  
Fast Flag and access times: 15, 30 ns  
Wide temperature range: - 55 °C to + 125 °C  
Programmable Half Full Flag  
Fully expandable by word width or depth  
Asynchronous read/write operations  
Empty, full and half flags in single device mode  
Retransmit capability  
Bi-directional applications  
Battery back-up operation: 2V data retention  
TTL compatible  
Single 5V + 10% power supply  
QML Q and V with SMD 5962-93177  
Rad Tolerant  
High Speed  
16 x 9  
Description  
The M672061F implements a first-in first-out algorithm, featuring asynchronous  
read/write operations. The FULL and EMPTY flags prevent data overflow and under-  
flow. The Expansion logic allows unlimited expansion in word size and depth with no  
timing penalties. Twin address pointers automatically generate internal read and write  
addresses, and no external address information are required for the Atmel FIFOs.  
Address pointers are automatically incremented with the write pin and read pin. The 9  
bits wide data are used in data communications applications where a parity bit for  
error checking is necessary. The Retransmit pin resets the Read pointer to zero with-  
out affecting the write pointer. This is very useful for retransmitting data when an error  
is detected in the system.  
Parallel FIFO +  
Programmable  
Flag  
M672061F  
Using an array of eight transistors (8 T) memory cell, the M672061F combines an  
extremely low standby supply current (typ = 0.1 µA) with a fast access time at 15 ns  
over the full temperature range. All versions offer battery backup data retention capa-  
bility with a typical power consumption at less than 2 µW.  
For military/space applications that demand superior levels of performance and reli-  
ability the M672061F is processed according to the methods of the latest revision of  
the MIL PRF 38535 (Q and V) or ESA SCC 9000.  
Rev. E–20-Aug-01  
1
M672061F  
Interface  
Block Diagram  
Pin Configuration  
2
Rev. E20-Aug-01  
Pin Names  
NAMES  
DESCRIPTION  
I0-8  
Q0-8  
W
Inputs  
Outputs  
Write Enable  
Read Enable  
Reset  
R
RS  
EF  
Empty Flag  
Full Flag  
FF  
XO/HF  
XI  
Expansion Out/Half-Full Flag  
Expansion IN  
FL/RT  
VCC  
GND  
First Load/Retransmit  
Power Supply  
Ground  
3
M672061F  
Rev. E20-Aug-01  
M672061F  
Signal Description  
Data In (I0 - I8)  
Data inputs for 9 - bit data  
Reset (RS)  
Reset occurs whenever the Reset (RS) input is taken to a low state. Reset returns both  
internal read and write pointers to the first location. A reset is required after power-up  
before a write operation can be enabled. Both the Read Enable (R) and Write Enable  
(W) inputs must be in the high state during the period shown in Figure 2 (i.e. tRSS before  
the rising edge of RS) and should not change until tRSR after the rising edge of RS.  
Otherwise, pulse write (or read) low during the reset operation loads the Programmable  
Half Full Flag register from the data Inputs I0-I8 (or data outputs Q0-Q8) (shown in fig-  
ure 2). In these two cases the Full Flag and the Programmable Half Full Flag are  
reseted to high and the Empty Flag to low.  
Figure 1. Reset (no write to Programmable Half Full Flag register)  
Notes: 1. EF, FF and HF may change status during reset, but flags will be valid at tRSC  
2. W and R = VIH around the rising edge of RS.  
.
Figure 2. Reset (write (read) to Programmable Half Full Flag register)  
Write Enable (W)  
A write cycle is initiated on the falling edge of this input if the Full Flag (FF) is not set.  
Data set-up and hold times must be maintained in the rise time of the leading edge of  
the Write Enable (W). Data is stored sequentially in the Ram array, regardless of any  
current read operation.  
4
Rev. E20-Aug-01  
Once half the memory is filled, and during the falling edge of the next write operation,  
the Half-Full Flag (HF) will be set to low and remain in this state until the difference  
between the write and read pointers is less than or equal to half of the total available  
memory in the device. The Half-Full Flag (HF) is then reset by the rising edge of the  
read operation.  
To prevent data overflow, the Full Flag (FF) will go low, inhibiting further write opera-  
tions. On completion of a valid read operation, the Full Flag (FF) will go high after TRFF,  
allowing a valid write to begin. When the FIFO stack is full, the internal write pointer is  
blocked from W, so that external changes to W will have no effect on the full FIFO stack.  
Read Enable (R)  
A read cycle is initiated on the falling edge of the Read Enable (R) provided that the  
Empty Flag (EF) is not set. The data is accessed on a first in/first out basis, not including  
any current write operations. After Read Enable (R) goes high, the Data Outputs (Q0 -  
Q8) will return to a high impedance state until the next Read operation. When all the  
data in the FIFO stack has been read, the Empty Flag (EF) will go low, allowing the  
finalread cycle, but inhibiting further read operations while the data outputs remain in  
a high impedance state. Once a valid write operation has been completed, the Empty  
Flag (EF) will go high after tWEF and a valid read may then be initiated. When the FIFO  
stack is empty, the internal read pointer is blocked from R, so that external changes to R  
will have no effect on the empty FIFO stack.  
First Load/Retransmit  
(FL/RT)  
This is a dual-purpose input. In the Depth Expansion Mode, this pin is connected to  
ground to indicate that it is the first loaded (see Operating Modes). In the Single Device  
Mode, this pin acts as the retransmit input. The Single Device Mode is initiated by con-  
necting the Expansion In (XI) to ground.  
The M672061F can be set to retransmit data when the Retransmit Enable Control (RT)  
input is pulsed low. A retransmit operation will set the internal read point to the first loca-  
tion and will not affect the write pointer. Read Enable (R) and Write Enable (W) must be  
in the high state during retransmit. The retransmit feature is intended for use when a  
number of writes are equal to or less than the depth of the FIFO has occured since the  
last RS cycle. The retransmit feature is not compatible with the Depth Expansion Mode  
and will affect the Half-Full Flag (HF), in accordance with the relative locations of the  
read and write pointers.  
Expansion In (XI)  
Full Flag (FF)  
This input is a dual-purpose pin. Expansion In (XI) is connected to GND to indicate an  
operation in the single device mode. Expansion In (XI) is connected to Expansion Out  
(XO) of the previous device in the Depth Expansion or Daisy Chain modes.  
The Full Flag (FF) will go low, inhibiting further write operations when the write pointer is  
one location less than the read pointer, indicating that the device is full. If the read  
pointer is not moved after Reset (RS), the Full Flag (FF) will go low after 16384 writes.  
Empty Flag (EF)  
The Empty Flag (EF) will go low, inhibiting further read operations when the read pointer  
is equal to the write pointer, indicating that the device is empty.  
Expansion Out/Half-Full  
Flag (XO/HF)  
This is a dual-purpose output. In the single device mode, when Expansion In (XI) is con-  
nected to ground, this output acts as an indication of a half-full memory.  
The M672061F offers a variable offset for the Half Full condition. The offset is loaded  
into a register during a reset cycle. When RS is low, the Programmable Half Full Flag  
(PHF) can be loaded from the DATA inputs I0-I8 by pulsing W low or from the DATA out-  
5
M672061F  
Rev. E20-Aug-01  
M672061F  
puts Q0-Q8 by pulsing R low. The offset options are listed in table 1. If PHF is not loaded  
during the reset cycle, the default offset will be the half of the total memory of the device.  
The Programmable Half-Full Flag (PHF) will be set to low and will remain set until the  
difference between the write and read pointers is less than or equal to the Programma-  
ble offset (if the Half Full Flag register has been loaded during the reset cycle) or the half  
of the total memory (if the Half Full register has not been loaded during the reset cycle).  
After half the memory is filled and on the falling edge of the next write operation, the  
Half-Full Flag (HF) will be set to low and will remain set until the difference between the  
write and read pointers is less than or equal to half of the total memory of the device.  
The Half-Full Flag (HF) is then reset by the rising edge of the read operation.  
In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of  
the previous device. This output acts as a signal to the next device in the Daisy Chain by  
providing a pulse to the next device when the previous device reaches the last memory  
location.  
Data Output (Q0 - Q8)  
DATA output for 9-bit wide data. This data is in a high impedance condition whenever  
Read (R) is in a high state.  
6
Rev. E20-Aug-01  
Functional Description  
Operating Modes  
Single Device Mode  
A single M672061F may be used when the application requirements are for 16384  
words or less. The M672061F is in a Single Device Configuration when the Expansion In (XI)  
control input is grounded (see Figure 3.). In this mode the Half-Full Flag (HF), which is an active  
low output, is shared with Expansion Out (XO).  
Figure 3. Block Diagram of Single 16384 × 9  
HF  
(HALF-FULL FLAG)  
(W)  
(R)  
(Q)  
READ  
WRITE  
HF  
9
9
DATAOUT  
DATAIN  
(I)  
(EF)  
(RT)  
EMPTY FLAG  
RETRANSMIT  
FULL FLAG (FF)  
(RS)  
RESET  
EXPANSIONIN(XI)  
M672061F  
Width Expansion Mode  
Word width may be increased simply by connecting the corresponding input control sig-  
nals of multiple devices. Status flags (EF, FF and HF) can be detected from any device.  
Figure 4 demonstrates an 18-bit word width by using two M672061F. Any word width can be  
attained by adding additional M672061F.  
Figure 4. Block Diagram of 16384 X 18 FIFO Memory Used in Width Expansion Mode  
Note:  
Flag detection is accomplished by monitoring the FF, EF and the HF signals on either  
(any) device used in the width expansion configuration. Do not connect any output con-  
trol signals together.  
7
M672061F  
Rev. E20-Aug-01  
M672061F  
Table 1. Programmable Half Full Flag Offset  
I8  
0
I7  
0
0
0
I6  
0
0
0
I5  
0
0
0
I4  
0
0
0
I3  
0
0
0
I2  
0
0
0
I1  
0
0
1
I0  
0
1
0
OFFSET  
0
0
32  
64  
0
...  
8192 (Half Full)  
Default Offset  
1
0
0
0
0
0
0
0
0
...  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
16384-64  
16384-32  
1
Table 2. Reset and retransmit  
Single Device Configuration/Width Expansion Mode  
MODE  
INPUTS  
INTERNAL STATUS  
Read Pointer Write Pointer  
Location Zero  
OUTPUTS  
RS  
0
RT  
X
XI  
0
EF  
0
FF  
1
HF  
1
Reset  
Location Zero  
Location Zero  
Increment (1)  
Retransmit  
Read/Write  
1
0
0
Unchanged  
Increment(1)  
X
X
X
1
1
0
X
X
X
1.  
Pointer will increment if flag is high.  
Table 3. Reset and First Load Truth Table  
Depth Expansion/Compound Expansion Mode  
MODE  
INPUTS  
INTERNAL STATUS  
Read Pointer Write Pointer  
Location Zero Location Zero  
OUTPUTS  
RS  
0
FL  
0
XI  
EF  
0
FF  
(1)  
Reset First Device  
Reset All Other Devices  
Read/Write  
1
1
X
(1)  
(1)  
0
1
Location Zero  
X
Location Zero  
X
0
1
X
X
1.  
XI is connected to XO of previous device.  
See Figure 5  
8
Rev. E20-Aug-01  
Depth Expansion (Daisy The M672061F can be easily adapted for applications which require more than 16384  
words. Figure 5 demonstrates Depth Expansion using three M672061F. Any depth can  
be achieved by adding additional 672061F.  
Chain) Mode  
The M672061F operates in the Depth Expansion configuration if the following conditions  
are met:  
1. The first device must be designated by connecting the First Load (FL) control  
input to ground.  
2. All other devices must have FL in the high state.  
3. The Expansion Out (XO) pin of each device must be connected to the Expansion In  
(XI) pin of the next device. See Figure 5  
4. External logic is needed to generate a composite Full Flag (FF) and Empty Flag  
(EF). This requires that all EFs and all FFs be ØRed (i.e. all must be set to generate the  
correct composite FF or EF). See Figure 5  
5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in the Depth  
Expansion Mode.  
Compound Expansion  
Module  
It is quite simple to apply the two expansion techniques described above together to cre-  
ate large FIFO arrays (see Figure 6).  
Bidirectional Mode  
Applications which require data buffering between two systems (each system being  
capable of Read and Write operations) can be created by coupling M672061F as shown  
in Figure 7 Care must be taken to ensure that the appropriate flag is monitored by each  
system (i.e. FF is monitored on the device on which W is in use; EF is monitored on the device  
on which R is in use). Both Depth Expansion and Width Expansion may be used in this mode.  
Data Flow - Through  
Modes  
Two types of flow-through modes are permitted : a read flow-through and a write flow-  
through mode. In the read flow-through mode (Figure 18) the FIFO stack allows a single  
word to be read after one word has been written to an empty FIFO stack. The data is  
enabled on the bus at (tWEF + tA) ns after the leading edge of W which is known as the  
first write edge and remains on the bus until the R line is raised from low to high, after which the  
bus will go into a three-state mode after tRHZ ns. The EF line will show a pulse indicating tem-  
porary reset and then will be set. In the interval in which R is low, more words may be written to  
the FIFO stack (the subsequent writes after the first write edge will reset the Empty Flag) ; how-  
ever, the same word (written on the first write edge) presented to the output bus as the read  
pointer will not be incremented if R is low. On toggling R, the remaining words written to the  
FIFO will appear on the output bus in accordance with the read cycle timings.  
In the write flow-through mode (Figure 19), the FIFO stack allows a single word of data  
to be written immediately after a single word of data has been read from a full FIFO  
stack. The R line causes the FF to be reset, but the W line, being low, causes it to be set again  
in anticipation of a new data word. The new word is loaded into the FIFO stack on the leading  
edge of W. The W line must be toggled when FF is not set in order to write new data into the  
FIFO stack and to increment the write pointer.  
9
M672061F  
Rev. E20-Aug-01  
M672061F  
Figure 5. Block Diagram of 49152 x 9 FIFO Memory (Depth Expansion)  
Figure 6. Compound FIFO Expansion  
Notes: 1. For depth expansion block see section on Depth Expansion and Figure 4.  
2. For Flag detection see section on Width Expansion and Figure 3  
Figure 7. Bidirectional FIFO Mode  
10  
Rev. E20-Aug-01  
11  
M672061F  
Rev. E20-Aug-01  
M672061F  
Electrical Characteristics  
Absolute Maximum Ratings  
Supply voltage (VCC - GND):..................... 0.3V to 7.0V  
Input or Output voltage applied: ................(GND - 0.3V) to (Vcc + 0.3V)  
Storage temperature: ................................- 65 °C to + 150 °C  
OPERATING RANGE  
OPERATING SUPPLY VOLTAGE  
OPERATING TEMPERATURE  
Military  
Vcc = 5V ± 10%  
55 °C to + 125°C  
DC Parameters  
Parameter  
Description  
M672061F-30  
M672061F-15  
UNIT  
VALUE  
Max  
(1)  
ICCOP  
Operating supply current  
Standby supply current  
Power down current  
110  
5
120  
5
mA  
mA  
µA  
(2)  
ICCSB  
Max  
(3)  
ICCPD  
400  
400  
Max  
1.  
2.  
3.  
Icc measurements are made with outputs open.  
R = W = RS = FL/RT = VIH.  
All input = Vcc.  
PARAMETER  
DESCRIPTION  
Input leakage current  
M672061F  
UNIT  
µA  
µA  
V
VALUE  
(1)  
ILI  
± 1  
± 1  
0.8  
2.2  
0.4  
2.4  
8
Max  
Max  
Max  
Min  
(2)  
ILO  
Output leakage current  
Input low voltage  
(3)  
VIL  
VIH (3)  
Input high voltage  
Output low voltage  
Output high voltage  
Input capacitance  
Output capacitance  
V
(4)  
VOL  
V
Max  
Min  
VOH (4)  
V
(5)  
C IN  
pF  
pF  
Max  
Max  
C OUT (5)  
8
1.  
2.  
3.  
4.  
5.  
0.4 Vin Vcc.  
R = VIH, 0.4 VOUT VCC.  
VIH max = Vcc + 0.3 V. VIL min = -0.3 V or -1 V pulse width 50 ns. For XI input, VIH= 2.8V  
Vcc min, IOL = 8 mA, IOH = -2 mA  
Guaranteed but not tested.  
12  
Rev. E20-Aug-01  
AC Test Conditions  
Input pulse levels:  
................................Gnd to 3.0V  
Input rise/Fall times: ................................5 ns  
Input timing reference levels: .....................1.5V  
Output reference levels: .............................1.5V  
Output load:  
................................See Figure 8.  
Figure 8. Output Load  
13  
M672061F  
Rev. E20-Aug-01  
M672061F  
M672061F- 30  
M672061F- 15  
(1)  
(2)  
(3) (4)  
SYMBOL  
SYMBOL  
PARAMETER  
UNIT  
Min  
Max  
Min  
Max  
READ CYCLE  
TRLRL  
READ CYCLE  
tRC  
tA  
Read cycle time  
40  
-
-
30  
-
25  
-
-
15  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TRLQV  
Access time  
TRHRL  
tRR  
Read recovery time  
10  
30  
5
10  
15  
0
(5)  
TRLRH  
tRPW  
tRLZ  
tWLZ  
tDV  
Read pulse width  
-
-
(6)  
TRLQX  
Read low to data low Z  
-
-
TWHQX  
Write low to data low Z (6) (7)  
Data valid from read high  
Read high to data high Z (6)  
5
-
3
-
TRHQX  
5
-
5
-
TRHQZ  
tRHZ  
-
20  
-
15  
WRITE CYCLE  
TWLWL  
WRITE CYCLE  
tWC  
tWPW  
tWR  
tDS  
Write cycle time  
Write pulse width (5)  
Write recovery time  
Data set-up time  
Data hold time  
40  
-
-
-
-
-
25  
15  
10  
9
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
TWLWH  
30  
TWHWL  
10  
TDVWH  
18  
TWHDX  
tDH  
0
0
RESET CYCLE  
TRSLWL  
TRSLRSH  
TWHRSH  
TRSHWL  
RESET CYCLE  
tRSC  
tRS  
Reset cycle time  
40  
30  
30  
10  
-
-
-
-
25  
15  
20  
10  
-
-
-
-
ns  
ns  
ns  
ns  
Reset pulse width (5)  
Reset set-up time  
Reset recovery time  
tRSS  
tRSR  
RETRANSMIT CYCLE  
TRTLWL  
RETRANSMIT CYCLE  
tRTC  
tRT  
Retransmit cycle time  
40  
30  
30  
10  
-
-
-
-
25  
15  
15  
10  
-
-
-
-
ns  
ns  
ns  
ns  
TRTLRTH  
Retransmit pulse width (5)  
Retransmit set-up time (6)  
Retransmit recovery time  
TWHRTH  
tRTS  
tRTR  
TRTHWL  
14  
Rev. E20-Aug-01  
M672061F  
FLAGS  
TRSLEFL  
FLAGS  
tEFL  
tHFH, tFFH  
tREF  
Reset to EF low  
-
30  
30  
30  
30  
-
-
-
25  
25  
15  
25  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TRSLFFH  
TRLEFL  
Reset to HF/FF high  
Read low to EF low  
Read high to FF high  
Read width after EF high  
Write high to EF high  
Write low to FF low  
Write low to HF low  
Read high to HF high  
Write width after FF high  
-
-
-
TRHFFH  
TEFHRH  
TWHEFH  
TWLFFL  
TWLHFL  
TRHHFH  
TFFHWH  
EXPANSION  
TWLXOL  
TWHXOH  
TXILXIH  
tRFF  
-
-
tRPE  
30  
15  
-
tWEF  
-
30  
30  
30  
30  
-
15  
20  
30  
30  
-
tWFF  
-
-
tWHF  
tRHF  
-
-
-
-
tWPF  
30  
15  
EXPANSION  
tXOL  
tXOH  
tXI  
Read/Write to XO low  
Read/Write to XO high  
XI pulse width  
-
30  
30  
-
-
15  
15  
-
ns  
ns  
ns  
ns  
ns  
-
-
30  
10  
10  
15  
10  
10  
TXIHXIL  
tXIR  
tXIS  
XI recovery time  
XI set-up time  
-
-
TXILRL  
-
-
1.  
STD symbol.  
ALT symbol.  
Timings referenced as in ac test conditions.  
All parameters tested only.  
Pulse widths less than minimum value are not allowed.  
Values guaranteed by design, not currently tested.  
Only applies to read data flow-through mode.  
2.  
3.  
4.  
5.  
6.  
7.  
15  
Rev. E20-Aug-01  
M672061F  
Figure 9. Asynchronous Write and Read Operation  
Figure 10. Full Flag from Last Write to First Read  
16  
Rev. E20-Aug-01  
M672061F  
Figure 11. Empty Flag from Last Read to First Write  
Figure 12. Retransmit  
Note:  
EF, FF and PHF may change status during Retransmit, but flags will be valid at tRTC  
Figure 13. Empty Flag Timing  
W
tWEF  
EF  
R
tRPE  
17  
Rev. E20-Aug-01  
M672061F  
Figure 14. Full Flag Timing  
Figure 15. Programmable Half-Full Flag Timing  
Figure 16. Expansion Out  
18  
Rev. E20-Aug-01  
Figure 17. Expansion In  
Figure 18. Read Data Flow - Through Mode  
Figure 19. Write Data Flow - Through Modes  
19  
M672061F  
Rev. E20-Aug-01  
M672061F  
20  
Rev. E20-Aug-01  
Ordering Information  
Reference Number  
MMCP-672061FV-15-E(*)  
MMCP-672061FV-15  
MMCP-672061FV-30  
SMCP-672061FV-15SB  
SMCP-672061FV-30SB  
SMCP-672061FV-15SC  
SMCP-672061FV-30SC  
MMCP-672061FV-15/883(*)  
MMCP-672061FV-30/883(*)  
SMCP-672061FV-15/883(*)  
SMCP-672061FV-30/883(*)  
5962-9317706QUC  
Temperature Range  
25°C  
Speed  
15ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
30ns  
15ns  
15ns  
15ns  
Package  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
SB28.3  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
FP28.4  
Die  
Quality Flow  
Engineering Samples  
Mil.  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
25°C  
Mil.  
SCC B  
SCC B  
SCC C  
SCC C  
MIL-883 B  
MIL-883 B  
MIL-883 S  
MIL-883 S  
QML Q  
5962-9317705QUC  
QML Q  
5962-9317706VUC  
QML V  
5962-9317705VUC  
QML V  
MMDP-672061FV-15-E  
MMDP-672061FV-15  
MMDP-672061FV-30  
SMDP-672061FV-15SB  
SMDP-672061FV-30SB  
SMDP-672061FV-15SC  
SMDP-672061FV-30SC  
MMDP-672061FV-15/883(*)  
MMDP-672061FV-30/883(*)  
SMDP-672061FV-15/883(*)  
SMDP-672061FV-30/883(*)  
5962-9317706QZC  
Engineering Samples  
Mil.  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
-55 to +125°C  
25°C  
Mil.  
SCC B  
SCC B  
SCC C  
SCC C  
MIL-883 B  
MIL-883 B  
MIL-883 S  
MIL-883 S  
QML Q  
5962-9317705QZC  
QML Q  
5962-9317706VZC  
QML V  
5962-9317705VZC  
QML V  
MM0-672061FV-15-E  
5962-9317706Q9A  
Engineering Samples  
QML Q  
-55 to +125°C  
-55 to +125°C  
Die  
5962-9317706V9A  
Die  
QML V  
Note:  
(*)contact factory  
21  
M672061F  
Rev. E20-Aug-01  
Atmel Wireless & Microcontrollers Sales Offices  
France  
3, Avenue du Centre  
78054 St.-Quentin-en-Yvelines  
Cedex  
France  
Tel: 33130 60 70 00  
Fax: 33130 60 71 11  
Sweden  
Hong Kong  
77 Mody Rd., Tsimshatsui East,  
Rm.1219  
East Kowloon  
Hong Kong  
Tel: 85223789 789  
Fax: 85223755 733  
Kavallerivaegen 24, Rissne  
17402 Sundbyberg  
Sweden  
Tel: 468587 48 800  
Fax: 468587 48 850  
United Kingdom  
Germany  
Korea  
Easthampstead Road  
Bracknell, Berkshire RG12 1LX  
United Kingdom  
Erfurter Strasse 31  
85386 Eching  
Germany  
Ste.605,Singsong Bldg. Young-  
deungpo-ku  
Tel: 441344707 300  
Fax: 441344427 371  
150-010 Seoul  
Korea  
Tel: 8227851136  
Fax: 8227851137  
Tel: 49893 19 70 0  
Fax: 49893 19 46 21  
USA  
2325 Orchard Parkway  
San Jose  
Kruppstrasse 6  
45128 Essen  
Germany  
Tel: 492 012 47 30 0  
Fax: 492 012 47 30 47  
Singapore  
California 95131  
USA-California  
Tel: 1408441 0311  
Fax: 1408436 4200  
25 Tampines Street 92  
Singapore 528877  
Rep. of Singapore  
Tel: 65260 8223  
Fax: 65787 9819  
Theresienstrasse 2  
74072 Heilbronn  
Germany  
Tel: 4971 3167 36 36  
Fax: 4971 3167 31 63  
1465 Route 31, 5th Floor  
Annandale  
New Jersey 08801  
USA-New Jersey  
Tel: 1908848 5208  
Fax: 1908848 5232  
Taiwan  
Wen Hwa 2 Road, Lin Kou  
Hsiang  
244 Taipei Hsien 244  
Taiwan, R.O.C.  
Tel: 88622609 5581  
Fax: 88622600 2735  
Italy  
Via Grosio, 10/8  
20151 Milano  
Italy  
Tel: 390238037-1  
Fax: 390238037-234  
Japan  
1-24-8 Shinkawa, Chuo-Ku  
104-0033 Tokyo  
Japan  
Spain  
Tel: 8133523 3551  
Fax: 8133523 7581  
Principe de Vergara, 112  
28002 Madrid  
Spain  
Tel: 3491564 51 81  
Fax: 3491562 75 14  
Web site  
http://www.atmel-wm.com  
© Atmel Nantes SA, 2001.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Companys standard warranty  
which is detailed in Atmels Terms and Conditions located on the Companys web site. The Company assumes no responsibility for any errors  
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does  
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted  
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmels products are not authorized for use as critical  
components in life support devices or systems.  
Printed on recycled paper.  

相关型号:

SMCP-672061FV-15SB

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28,
TEMIC

SMCP-672061HV-15SB

FIFO, 16KX9, 15ns, Asynchronous, CDIP28
MICROCHIP

SMCP-672061HV-15SCC

Rad. Tolerant High Speed 16 Kb x 9 Parallel FIFO with Programmable Flag
ATMEL

SMCP-672061HV-30SB

FIFO, 16KX9, 30ns, Asynchronous, CDIP28
MICROCHIP

SMCP-672061HV-30SCC

Rad. Tolerant High Speed 16 Kb x 9 Parallel FIFO with Programmable Flag
ATMEL

SMCP-67206E-15/883

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC

SMCP-67206E-15MQ

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC

SMCP-67206E-30MQ

FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC

SMCP-67206E-30SB/SC

FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC

SMCP-67206E-30SV

FIFO, 16KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC

SMCP-67206EV-15

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC

SMCP-67206EV-15/883

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
TEMIC