U2740B-BFP [TEMIC]
UHF AM/FM Transmitter; 超高频调幅/调频发射机型号: | U2740B-BFP |
厂家: | TEMIC SEMICONDUCTORS |
描述: | UHF AM/FM Transmitter |
文件: | 总10页 (文件大小:266K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
U2740B
UHF AM/FM Transmitter
Description
The U2740B-B is an one-chip multi-purpose UHF The digital data is supplied to either an AM- or FM-input
ASK/FSK transmitter IC designed for various applica- pin, the output power being set via the AM-input pin. A
tions within a wide frequency range. When a Chip-Select differential output enables simple applications with loop
(CS) signal is supplied, the IC starts operation (Power-up, antennas. An output driver (XTO_out) can be used for
XTO, VCO, PD) and the VCO is then locked to clocking the microcontrolller.
128 f(XTO). The locked status is indicated at the
Lock-Detect (LD) output.
Features
Applications
One-chip solution with few external components
Keyless entry (automotive, domestic,...)
Wide frequency range (200 to 500 MHz)
Alarm systems
Single voltage supply (2.2 to 5.5 V) with power-down
feature
Remote control
Communication systems
Adjustable output power with differential output for
loop antenna
PLL lock-detect signal
XTO output for µC clock
ESD protection according to MIL–STD. 883
(except Pins 1, 2, 13 and 14)
Low standby current <0.25 A for V = 3 V
S
Single lithium-cell operation
Ordering Information
Extended Type Number
Package
SO16
Remarks
U2740B-BFP
System Block Diagram
Antenna
1 Li cell
U2740B
VCO
Encoder
Power
ampl.
PLL
M44Cx9x
Keys
XTO
RF–Transmitter
13350
Figure 1. System block diagram
TELEFUNKEN Semiconductors
Rev. A3, 24-Feb-97
1 (10)
Preliminary Information
U2740B
Pin Description
Pin
1
Symbol
OSC1
OSC2
IC
Function
VCO tank
VCO tank
OSC1 1
16
15
14
2
AM_in
PAGND
ANT2
3
Internally connected
Lock-detect (open collector)
Ground
2
3
4
OSC2
IC
4
LD
5
GND
FM_in
6
FM modulation input
7
PD_out Phase detector output
XTAL2 FM modulation capacitor
XTAL1 XTAL
13 ANT1
LD
8
9
GND 5
12
11
10
9
V
S
10
11
12
13
14
15
16
XTO_out XTO output (open collector)
CS
Chip-select (power-up)
Supply voltage
6
7
8
FM_in
PD_out
XTAL2
CS
V
S
XTO_out
XTAL1
ANT1
ANT2
Differential output 1
Differential output 2
PAGND Power amplifier ground
AM_in AM modulation input
95 9700
Figure 2. Pinning
Loop
antenna
VS
OSC1
OSC2 AM_in ANT1
ANT2
VS
f
VCO
PA
:128
Power
LD
PD
LD
PD
VRef
IRef
CS
CS
µC
Power–up
Data
FM_in
Clock XTO_out
XTO
VS
XTAL1
XTAL2
GND
PAGND
13324
Figure 3. Block diagram
2 (10)
TELEFUNKEN Semiconductors
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Circuit Description
The transmitter PLL U2740B contains the complete RF
part for a radio control system. The IC consists of a VCO,
a complete PLL circuit, a crystal oscillator, a power
amplifier and a power-up module. An integrated switch
can be used to change the load capacitance of the crystal.
Crystal Oscillator (XTO)
It is a single-pin crystal oscillator, operating at the series
resonant frequency of the crystal. Depending on the type
of crystal used, this oscillator takes 3 to 20 ms until
settling after setting CS to V . The integrated switch can
S
be used to change the load capacitance. Thus, the output
frequency is FSK modulated.
VCO
The VCO is a voltage-controlled current source. The
frequency is determined by the external LC-tank. The
frequency is changed via a Varicap diode.
Power Amplifier (PA)
As figure 4 shows, the differential PA switches its output
current between the two power output pins (ANT1,
ANT2). The output current is seven times the current
flowing into the AM_in Pin. The achievable output power
is about 1.5 mW.
PLL
The complete PLL consists of a prescaler, a digital
phase/frequency detector (PFD) with charge-pump
output. The output frequency is locked to 128 times the
Power-up
frequency of the XTO. The PFD, however, operates at a When CS = 0 V, the circuit is in standby mode with a
frequency four times lower than that of the XTO. A lock- power–down supply current of type. IS,off = 0.1 µA. With
detect output indicates that the PLL is locked.
CS = V , the circuit is in power-up mode.
S
VS
ANT1
0.7 V
ANT2
VCO
Q2
Q1
0.5 mA
4.6 k
AM_in
0.7 V
1
7
PAGND
Iout = 3.5 mA
Figure 4. Power output stage of U2740B
TELEFUNKEN Semiconductors
3 (10)
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Absolute Maximum Ratings
Parameters
Symbol
Min.
–0.3
–0.3
Max.
5.5
Unit
V
Supply voltage
Pin 12
V
S
Voltage at Pins 13 and 14
Input current AM_in
Output current lock detect
Output current XTO_out
Junction temperature
Storage temperature
10
V
Pin 16
Pin 4
0.75
1.5
mA
mA
mA
°C
Pin 10
1.5
T
125
125
j
T
stg
–55
°C
Thermal Resistance
Parameters
Symbol
Min.
Typ.
Max.
120
Unit
K/W
Junction ambient
SO16
R
thJA
Operating Range
All voltages are referred to GND (Pin 5) and PAGND (Pin 15), T
= –40 to +85 C, unless otherwise specified
amb
Parameters
Pin 12
= –20 to +85°C
Symbol
Min.
2.4
Typ.
3.0
3.0
1.8
2.0
Max.
5.5
Unit
V
Supply voltage
V
S
V
S
Supply voltage, T
2.2
5.5
V
amb
Minimum supply voltage, T
Minimum supply voltage, T
Carrier frequency
= 25°C
V
amb
amb
= –20°C
V
200
500
MHz
4 (10)
TELEFUNKEN Semiconductors
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Electrical Characteristics DC
All voltages referred to GND (Pin 5), V = 2.4 to 5.5 V, T
= –40 to +85°C, unless otherwise specified
S
amb
Parameters
Supply current
(power-down)
Test Conditions / Pins
= 0, I = 0, V = 3 V
Symbol
Min.
Typ.
0.05
Max.
0.25
Unit
A
V
V
11
16
S
Pin 12
I
S, OFF
= 0, I = 0, V = 5.5 V
11
16
S
0.1
5.0
0.5
8.0
A
Pin 12
V
V
= 0 V, V = V
I
mA
Supply current
(power-up, transmit space)
16
11
S
S, ON
S, ON
= 0 V, V = 3 V,
16
11
V = 3 V, T
= 25°C,
I
4.5
4.5
5.0
6.5
7.2
mA
S
amb
Pin 12
V
S
= 0 V, V = 5.5 V,
16
11
V = 5.5 V, T
= 25°C,
I
5.8
0.18
11
mA
%/K
mA
amb
S, ON
Pin 12
Temperature coefficient of TKI
1)
supply current
Supply current
(power-up, transmit mark) V = 3 V, T
V
S
= 3 V, V = 3 V,
16 11
= 25°C,
amb
8
13.5
0.4
Pin 12
Pin 11
Pin 11
Pin 11
Pin 11
Pin 6
Power-down voltage
Power-up voltage
Power-up current
V
V
V
V
= 0 V
= 0 V
= 3 V
V
11, OFF
V
V
16
16
11
11
V
11, ON
1.0
40
110
16
65
150
25
I
A
A
11, ON
= 5.5 V
Input current FM_in
V = 3 V
I
I
6
6
4
Output current
Lock-detect
Pin 4
1
1
Output current XTO_out
Pin 10
I
I
mA
10
16
2)
Input current AM_in
R16 = 0 connected to
V = 3 V,
Pin 16
S
T
= 25°C
= 85°C
0.40
0.44
0.50
0.55
0.60
0.65
mA
mA
amb
T
amb
Notes:
1)
There are circuit parts with increasing supply current over temperature. The resulting supply current is
IS(T ) = I (1 + (T – 25°C) TKI)
amb
SDN
amb
2)
This depends on the value of resistor R16 connected to V . If the supply voltage is 2.0 to 3.5 V, Pin 16 can
S
be directly connected to V . For V = 5 V, R16 should be 3.9 k .
S
S
TELEFUNKEN Semiconductors
5 (10)
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Electrical Characteristics AC
All voltages referred to GND (Pin 5), V = 2.2 to 5.5 V, T
= –40 to +85°C, unless otherwise specified
S
amb
Parameters
Extinction ratio
Test Conditions / Pins
= 3 V
Symbol
Min.
–40
Typ.
–50
Max.
4.2
Unit
dB
V
20 log
11
11
(I
out,ON
I
)
out,off
Output current,
transmit mark,
V
= 3 V, V = 0 V
16
Pins 13 and 14
i
2.9
3.5
4
mA
out,pp
3)
(f
= 433.92 MHz)
VCO
Output voltage swing
Difference, Pins 13 and 14
Pin 7
v
5
1
V
(13–14)pp
Phase detector
Output current
I
–1
mA
PD
Phase detector
Output voltage swing
Pin 7
v
PDpp
0.2
V –0.2
S
V
4)
5)
Enable settling time
Modulation bandwidth
Pins 11, 13 and 14
Pin 6
T
100
50
s
enable
6)
BW
kHz
MHz
MHz
kHz
FSK
Output frequency range
XTO frequency range
Modulation bandwidth
Pins 13 and 14
Pins 9 and 10
Pin 16
f
200
1
500
6
VCO
f
XTO
BW
500
ASK
Notes:
3)
The output peak-to-peak current is 7 times the current flowing into the AM_in Pin. The driver stage of the
power amplifier is designed so that the output current is switched between Pins 13 and 14.
4)
The output voltage swing at each collector is limited to 2 V due to the circuit arrangement used. The output
power depends on the load impedance. If optimum load impedance of 1.1 k is used, an output power of
3.5 mA/2 sqrt(2) 1.1 k = 1.7 mW (+2.3 dBm) results.
5)
6)
This is the time if an external clock is delivered to Pin 9 and Pin 11 is set to V until the circuit operates.
S
FSK bandwidth is depending on values for loop filter and VCO, see application note for design hints.
6 (10)
TELEFUNKEN Semiconductors
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Application Circuit (ASK Modulation)
2.2 pF
Losc
R16
I16
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCO
2.7 pF
VS
Loop antenna
I14
I13
IS
f
:128
R14
R4
PA
I4
10 kΩ
C10, C11 = 4.7 pF
VRef
IRef
VS
1 nF
10 nF
I11
Power–
up
R10
I10
12 pF
XTO
Clock
VS
Power–up
Data
µC
Lock detect
13325
Figure 5.
Principle of Operation (ASK Modulation)
CS
(power-up)
XTO_out
1/fxtal
locked
LD
4/fxtal
AM_in
(data/power)
RFout
Time
13326
Figure 6.
TELEFUNKEN Semiconductors
7 (10)
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Application Circuit (FSK Modulation)
2.2 pF
Losc
R16
I16
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCO
2.7 pF
VS
Loop antenna
R14
I14
I13
IS
f
:128
R4
PA
I4
10 kΩ
C10, C11= 4.7 pF
VRef
IRef
VS
1 nF
10 nF
I11
Power–
up
R10
I10
12 pF
XTO
39 pF
VS
Data
Clock
Power–up
Output power
µC
Lock detect
13327
Figure 7.
Principle of Operation (FSK Modulation)
CS
(power-up)
XTO_out
1/fxtal
locked
LD
4/fxtal
AM_in
(data/power)
FM_in
(data)
RFout
Time
13328
Figure 8.
8 (10)
TELEFUNKEN Semiconductors
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Package Information
Package SO16
Dimensions in mm
5.2
4.8
10.0
9.85
3.7
1.4
0.2
0.25
0.10
0.4
3.8
1.27
6.15
5.85
8.89
16
9
technical drawings
according to DIN
specifications
13036
1
8
TELEFUNKEN Semiconductors
9 (10)
Rev. A3, 24-Feb-97
Preliminary Information
U2740B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
10 (10)
TELEFUNKEN Semiconductors
Rev. A3, 24-Feb-97
Preliminary Information
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