U3661M [TEMIC]
Baseband Delay Line; 基带延迟线
| 型号： | U3661M |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | Baseband Delay Line |
| 文件： | 总9页 (文件大小：139K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
U3661M
Baseband Delay Line (64 s)
Application
In TV sets, the integrated baseband delay line circuit is suitable for decoders with color-difference signal outputs
Description
The integrated delay line circuit U3661M is suitable for A summing circuitry combines the information of
all chroma decoders with baseband color-difference adjacent TV-lines, thus giving an interpolated sum for the
outputs. It is suitable for PAL-, SECAM- and PAL-system, storing preceeding lines for the SECAM-
NTSC-signals as well. The U3661M contains two system and providing a comb-filtered output for
separate delay lines for processing (R–Y)-output and NTSC-signals. Due to internally-generated timing,
(B–Y)-output separately. The delay is performed by synchronization is easily done by feeding a line-frequent
internally switched capacitors. On-chip postfiltering impulse (usually the SC-impulse) to the sync-input of
avoids the need for external filter components.
the IC.
Features
One line delay time, addition of delayed and
non-delayed output signals
Line-locked by the sandcastle pulse
No crosstalk between SECAM color
carriers (diaphoty)
Adjustment-free application, VCO without
external components
Comb filtering functions for NTSC
color-difference signals
Handles negative or positive color-difference
input signals
Clamping of ac-coupled input signals
Correction of phase errors in the PAL system
[±(R–Y) and ±(B–Y)]
V
Ref
(B–Y)
(B–Y)
12
11
S+H
LPF
14
Clamping
+
Line memory
Shift register
Line memory
(R–Y)
(R–Y)
S+H
LPF
16
Clamping
Bias
+
V
Ref
3 MHz
Control
f
SC
V
DD2
V
1
3
DD1
9
PLL
SC detector
Clock generator
GND1
GND2
10
5
94 8846
SC pulse
Figure 1. Block diagram
TELEFUNKEN Semiconductors
1 (9)
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
Ordering Information
Extended Type Number
Package
DIP16
SO16
Remarks
U3661M-ADP
U3661M-AFP
Pin Description
Pin
1
2
3
4
5
6
7
8
Symbol
Function
Supply voltage for digital part
Not connected
Ground for digital part
Not connected
Sandcastle-pulse input
Not connected
V
DD2
NC
GND2
NC
SC
NC
1
2
3
4
5
6
7
8
16
15
14
13
V
V (R–Y)
DD2
i
NC
NC
GND2
NC
V (B–Y)
i
NC
NC
Not connected
Not connected
NC
9
V
DD1
Supply voltage for analog part
Ground for analog part
± (R–Y) output signal
± (B–Y) output signal
Not connected
± (B–Y) input signal
Not connected
± (R–Y) input signal
10
11
12
13
14
15
16
GND1
SC
12 V (B–Y)
o
V
o (R–Y)
V
o (B–Y)
11
10
9
NC
V (R–Y)
0
NC
V
i (B–Y)
NC
GND1
NC
V
i (R–Y)
NC
V
DD1
95 10649
Figure 2. Connection diagram
Absolute Maximum Ratings
Reference point Pin 3, 10, unless otherwise specified
Parameters
Supply voltage (Pin 9)
Supply voltage (Pin 1)
Voltage on Pins 5, 11, 12, 14 and 16
Output current (Pin 11, Pin 12)
Power dissipation
Symbol
Min.
–0.5
–0.5
–0.5
Typ.
Max.
+7
+7
Unit
V
V
V
DD1
V
DD2
V
n
V
S
V
I
20
1.1
+150
500
mA
W
°C
V
out
P
T
stg
Storage temperature range
Electrostatic protection* for input/ output pins
–25
* MIL standard 883D, method 3015.7 machine model (all power pins connected together)
Operating Range
Parameters
Supply voltage range (Pin 1, Pin 9)
Ambient temperature range
Symbol
Value
4.5 to 5.5
–10 to +70
Unit
V
s
V
°
T
amb
C
Thermal Resistance
Parameters
Symbol
R
thJA
Value
80
Unit
K/W
Junction ambient
2 (9)
TELEFUNKEN Semiconductors
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
Electrical Characteristics
VDD = 5.0 V, Tamb = 25°C, reference point, Pin 3 and Pin 10 connected together, sandcastle frequency of 15.625 kHz;
unless otherwise specified
Parameters
DC-supply
Test Conditions / Pins
Pin 1, 9
Symbol
Min.
Typ.
Max.
Unit
Supply voltage (analog part)
Supply voltage (digital part)
Supply current (analog part)
Supply current (digital part)
Power dissipation
Pin 9
Pin 1
Pin 9
Pin 1
VDD1
VDD2
IS1
4.5
4.5
5.0
5.0
3.5
1
5.5
5.5
8.0
2
V
V
mA
mA
mW
IS2
P
30
60
Color-difference input signals
Pin 14, 16
Input signal
(peak-to-peak value)
±(R–Y) PAL and NTSC
Pin 16
Pin 14
Pin 16
Pin 14
Vi
Vi
0.525
0.665
1.05
1.0
1.0
2.0
2.0
40
V
V
V
V
k
±(B–Y) PAL and NTSC
±(R–Y) SECAM
±(B–Y) SECAM
Input resistance
Vi
Vi
1.33
During clamping
R14, R16
Input capacitance
C14
C16
10
pF
Input clamping voltage
Non-color input level
during clamping
V14
V16
1.45
V
Color-difference output signals
Pin 11, 12
Output signal
(peak-to-peak value) ±(R–Y) All standards
Pin 11
Pin 12
Vo
Vo
1.05
1.33
0
V
V
±(B–Y) All standards
Ratio of output amplitudes at
equal input signals
V11/V12
–0.4
+0.4
dB
DC output voltage
Output resistance
Pin 11, 12
Pin 11, 12
V11,12
R11,12
Gv
3.0
V
400
6.5
Gain for PAL and NTSC
Gain for SECAM
Ratio Vo / Vi
Ratio Vo / Vi
5.5
6.0
0
dB
dB
dB
Gv
–0.5
+0.5
Ratio of output signals for
adjacent time samples at
constant input signals
Vi 14,16 = 1.33 Vpp
SECAM signals
Pin 11 / Pin 12
V(n)
/
±0.1
V(n+1)
Noise voltage
(RMS value)
Vnoise
1.2
mV
Vi 14,16 = 0, Rgen < 300
f = 10 kHz to 1 MHz, Pin 11, 12
Delay of delayed signals
td
td
ttr
63.94
64.0
65
64.06
µs
ns
ns
Delay of non-delayed signals
Transient time of delayed
signal
300 ns transient of SECAM input
signal, Cload =22 pF, Pin 11, 12
550
Transient time of
non-delayed signal
300 ns transient of SECAM input
signal, Cload = 22 pF, Pin 11, 12
ttr
350
ns
Sandcastle-pulse input
Sandcastle frequency
Top pulse voltage
Pin 5
fSC
V5
14.0
3
15.625
17.0
kHz
V
The leading edge of the burst-key
pulse is used for timing
Vs+0.7
Internal slicing level
Input current
Vslice
I5
V5–1.5 V5–1.25 V5–1.0
V
10
10
µA
pF
Input capacitance
C5
TELEFUNKEN Semiconductors
3 (9)
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
BGP
SC-impulse
H-pulse
Internal clamping
0.3 s
1.6 s
95 10355
Figure 3. Timing of internal clamping
No higher than
V + 0.7 V
S
BGP
1.6 V
At least 1.6 V
H
V
95 10226
Figure 4. Restrictions to SC Pulse
4 (9)
TELEFUNKEN Semiconductors
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
+12 V
560
10
10
47 F
5V1
47 F
22 nF
22 nF
NC
94 8848
1
9
2,4,6,7,8,13,15
(R–Y)
(R–Y)
11
16
14
Chroma
decoder
1 nF
1 nF
Baseband delay line
(B–Y)
(B–Y)
12
10
3
5
SC pulse
*)
*)
Figure 5. Typical application circuit
*) Depends on application (5 V - or 12 V SC pulse)
Baseband
delay
line
Baseband
delay
line
SC-impulse
5 V
5
5
SC-impulse
12 V
SC in
SC in
10 k
6.8 k
95 10354
95 10227
Figure 6. Application with 12 V SC-pulse
Figure 7. Application with 5 V SC-pulse
TELEFUNKEN Semiconductors
Rev. A1, 17-Jul-96
5 (9)
Preliminary Information
U3661M
Internal Pin Circuits
14,16
5
95 10356
95 10357
Figure 8. Color-difference signal inputs
Figure 10. Sandcastle-pulse input
95 10359
11,12
1,9
95 10358
Figure 9. Color-difference signal outputs
Figure 11. Supply voltage VDD2, VDD1
6 (9)
TELEFUNKEN Semiconductors
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
Package Information
20.0 max
19.8 max
Package DIP16
Dimensions in mm
7.82
7.42
4.8 max
0.5 min
6.4 max
3.3
0.39 max
1.64
1.44
0.58
0.48
9.75
8.15
2.54
17.78
Alternative
16
15
14
13
12
11
10
9
technical drawings
according to DIN
specifications
96 11709
1
2
3
4
5
6
7
8
Package DIP16
Dimensions in mm
20.57
18.92
7.87
7.37
0.76
0.13
3.81
3.05
0.89
0.38
6.60
6.10
3.81
3.05
0.38
0.20
1.60
0.64
0.58
0.38
0.81
2.79
2.29
9.40
7.62
1.65
1.14
technical drawings
according to DIN
specifications
96 11650
TELEFUNKEN Semiconductors
7 (9)
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
Package Information
Package SO16
Dimensions in mm
94 8875
8 (9)
TELEFUNKEN Semiconductors
Rev. A1, 17-Jul-96
Preliminary Information
U3661M
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
TELEFUNKEN Semiconductors
9 (9)
Rev. A1, 17-Jul-96
Preliminary Information
相关型号：
©2020 ICPDF网 联系我们和版权申明