2349201-2 [TE]

ZSFP PLUGGABLE I/O INTERCONNECT;
2349201-2
型号: 2349201-2
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

ZSFP PLUGGABLE I/O INTERCONNECT

文件: 总7页 (文件大小:3134K)
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ZSFP+ PLUGGABLE  
I/O INTERCONNECT  
The zSFP+ interconnect is currently one of the fastest single-channel I/O connectors on the market today, transferring data at 28  
Gbps NRZ and 56 Gbps PAM-4. Through a design that is backward-compatible to SFP/SFP+ products, the interconnect is  
hotswappable with existing SFP+ connectors for fast system upgrades of 28-56 Gbps. Alternatively, users can design-in the zSFP+  
connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds–an upgradeability that can result in longterm  
cost savings as this would eliminate the need to fully redesign for higher performance.  
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate). The entire  
product family is o“ered as a dual source option with Molex. LLC.  
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  
zSFP+ Pluggable I/O Interconnect  
FEATURES  
Data rates: Up to 28 Gbps NRZ and 56 Gbps PAM-4, 10  
Gbps Ethernet and 16 Gbps Fibre Channel  
Light pipe options include:  
Surface-mount connector design for single high 1xN cages  
Press-fit 1xN cages and stacked assemblies (connector and  
cage) for one-step, easy PCB placement  
No light pipes  
Coupled, narrow-edged, blanked- and formed-contact beam  
geometry and insert molding for superior signal integrity,  
mechanical and electrical performance  
All 4 light pipes (shown left)  
Inner light pipes  
Backwards-compatibility: Shares same mating interface and  
cage dimensions with the SFP+ connector (connector/single  
high cages are also PCB footprint-compatible)  
Outer light pipes [standard]  
Three light pipes  
Elastomeric gasket or spring finger options for EMI  
containment  
Outer light pipes [reversed]  
Single high cages (1xN) for design flexibility; accommodates  
belly-to-belly applications for increased density and PCB  
space savings; available in 1x1, 1x2, 1x3, 1x4 or 1x6 port  
configurations  
Stacked assemblies o“ered in 2x1, 2x2, 2x4, 2x6, 2x8 or 2x12  
port  
Heat sinks, LEDs and plating choices o“ered  
Additional light pipe configurations available  
APPLICATIONS  
Telecommunications: Cellular infrastructure, central o¥ce  
uplink equipment, optical transport equipment, switches/  
routers, access equipment (CMTS, PON, DSL, etc)  
Data Center: Data center switches and routers, servers,  
storage  
Medical: Medical diagnostic equipment  
Networking: Network interface, switches, routers  
Test and Measurement Equipment  
20-Pin Surface-Mount Connector  
Electrical  
Voltage (max.): 120V AC  
Current (max.): 0.5A  
Dielectric Withstanding Voltage:  
300V AC between contacts  
Mechanical  
Mating Force: 25N  
Unmating Force: 11.5N  
Durability (min.): 250 cycles  
Physical  
High-temperature thermoplastic housing (glass-filled, UL  
94V-0 black)  
High-performance copper alloy contacts  
Plating:  
- Nickel underplating; Tin plating on solder tail area;  
Gold plating on mating area  
- Plating options: 15 and 30ȝ” Gold or Palladium Nickel  
Operating Temperature: -40 to +85oC  
Follow IEEE802.3 cd (including trace)  
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  
PAGE 2  
zSFP+ Pluggable I/O Interconnect  
Connector P/N  
Description  
2170088-1  
2170088-2  
30ȝ” in Au or Au Flash Over PdNi  
15ȝ” in Au or Au Flash Over PdNi  
Follow IEEE802.3 cd ( including trace)  
Cages with Elastomeric Gaskets  
EMI  
Suppression  
Light Pipe  
Option  
1X1  
1X2  
1X4  
1X6  
1X8  
No  
2198709-1* 2198720-1  
2198722-1  
2198721-1  
2198724-1  
2198723-1  
TBD**  
TBD**  
EMI gasket  
Yes  
2198708-1*  
2198719-1  
Cages with EMI Springs  
EMI  
Suppression  
Light Pipe Heat Sink  
1X1  
1X2  
1x3  
1X4  
1X6  
1X8  
Option  
Option  
2274001-1  
2304921-1  
2295325-6  
No  
No  
2227728-1 2349050-1  
2227730-1  
2227729-1  
2227732-1  
2227731-1  
2291579-1 (PCI)  
EMI Spring  
Fingers  
Yes  
Yes  
No  
2274000-1  
TBD*  
2227727-1  
TBD**  
TBD**  
TBD**  
TBD**  
Yes  
2304342-X 2293156-X 2294408-X  
zSFP+ 3 Row Belly-to-Belly Application  
Configuration  
1X2  
2317010-1  
1x4  
2300275-1  
Part Number  
*Tooling in process **Not yet tooled, but planned  
Ganged 1xN Cages  
Mechanical  
Transceiver insertion force (max.): 34 N without heat sink and clip; 45.37 N with heat sink and clip  
Transceiver extraction force (max.): 12.5 N without heat sink and clip; 14.36 N with heat sink and clip  
SFP+ module to surface-mount connector and zSFP+ cage.  
Cage press fit insertion force (max.): 44.5 N for single port cage, 54.3 N for ganged cage  
Cage press fit extraction force (min.): 8.9 N for single port and ganged cages  
Durability (min.): 100 cycles  
Ganged SFP+ 1x4 vs. zSFP+ 1x4  
0
Physical  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
Cage material: Nickel Silver  
PCB thickness (min.): 1.50mm in single sided applications;  
2.25mm (EMI springs) or 3.0mm (elastomeric gasket) in  
belly-to-belly applications  
Operating Temperature: -40 to +85oC  
Ganged SFP+ 1x4 —  
Ganged zSFP+ 1x4 —  
0
5
10  
15  
GHz  
20  
25  
30  
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  
PAGE 3  
zSFP+ Pluggable I/O Interconnect  
Stacked 2xN Assemblies  
Electrical  
Stacked SFP+ vs. zSFP+  
0
Voltage (max.): 120V AC  
Current (max.): 0.5A  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
Dielectric Withstanding Voltage: 300V AC  
between contacts  
Mechanical  
Durability (min.): 100 cycles  
Physical  
Stacked SFP+ —  
Stacked zSFP+ —  
Cage material: Nickel Silver  
- High-temperature thermoplastic housing  
(glass-filled, UL 94V-0 black)  
- High-performance copper alloy contacts  
- Plating: Nickel underplating; Tin plating  
on solder tail area; 30ȝ” Gold plating on  
mating area  
0
5
10  
15  
GHz  
20  
25  
30  
PCB thickness (min.): 1.57mm  
Operating Temperature: -40 to +85oC  
Upper contact row —  
Lower contact row —  
zSFP+ Stacked Interconnects SFP28 PN list  
2 x 1  
2x2  
2x4  
2x6  
2x8  
2x12  
EMI  
Suppression  
Light Pipe  
Configuration  
Performance  
2198318-(x)  
2198318-1  
2198325-(x)  
2198325-1  
2198325-2  
2198325-3  
2198325-4  
1-2198325-7  
1-2198325-8  
2180324-(x)  
2180324-1  
2198339-(x)  
2198339-1  
2198346-(x)  
2198346-1  
2288172-(x)  
2288172-1  
None  
All 4  
2198318-2  
2198318-3  
2198318-4  
1-2198318-7  
1-2198318-8  
2180324-2  
2180324-3  
2180324-4  
1-2180324-7  
1-2180324-8  
2198339-2  
2198339-3  
2198339-4  
1-2198339-7  
1-2198339-8  
2198346-2  
2198346-3  
2198346-4  
1-2198346-7  
1-2198346-8  
2288172-2  
2288172-3  
2288172-4  
1-2288172-7  
1-2288172-8  
Inner  
Standard  
Outer  
3
Outer (reversed)  
Thermally  
Enhanced  
Multiple  
--  
--  
3-2180324-0  
--  
--  
2227838-8  
None  
2198318-5  
2198318-6  
2198318-7  
2198318-8  
1-2198318-9  
2-2198318-0  
2198325-5  
2198325-6  
2198325-7  
2198325-8  
1-2198325-9  
2180324-5  
2180324-6  
2180324-7  
2180324-8  
1-2180324-9  
2198339-5  
2198339-6  
2198339-7  
2198339-8  
1-2198339-9  
2198346-5  
2198346-6  
2198346-7  
2198346-8  
1-2198346-9  
2288172-5  
2288172-6  
2288172-7  
2288172-8  
1-2288172-9  
2-2288172-0  
2227838-7  
2301210-2  
All 4  
Inner  
Standard  
Outer  
3
Outer (reversed)  
2-2198325-0 2-2180324-0 2-2198339-0 2-2198346-0  
Thermally  
Enhanced  
Multiple  
--  
-- 3-2180324-1 2291491-1 --  
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  
PAGE 4  
zSFP+ Pluggable I/O Interconnect  
zSFP+ Stacked Interconnects SFP56 PN list  
NOT YET TOOLED,  
Tooled  
BUT PLANNED  
EMI  
Performance  
Light Pipe  
2 x 1  
2x2  
2x4  
2x6  
2x8  
2x12  
Suppression  
NONE  
INNER/OUTER  
INNER  
2349202-1  
2349202-2  
2349202-3  
2349202-4  
2343522-1  
234522-2  
2343522-3  
2343522-4  
2339978-1  
2339978-2  
2339978-3  
2339978-4  
2347721-1  
2347721-2  
2347721-3  
2347721-4  
2340033-1  
2340033-2  
2340033-3  
2340033-4  
2349201-1  
2349201-2  
2349201-3  
2349201-4  
OUTER  
Standard  
CENTER/  
REVERSED  
OUTER  
1-2349202-7  
1-2349202-8  
1-2343522-7  
1-2343522-8  
1-239978-7  
1-2347721-7  
1-2340033-7  
1-2288172-7  
REVERSED  
OUTER  
1-2339978-8  
1-2347721-8  
1-2340033-8  
1-2349201-7  
1-2349201-8  
NONE  
INNER  
3-2339978-0 3-2347721-0  
3-2340033-0  
3-2340033-2  
2340033-5  
2340033-6  
2340033-7  
2340033-8  
Airflow Enhanced  
--  
--  
NONE  
2349202-5  
2349202-6  
2349202-7  
2349202-8  
234522-5  
2343522-6  
2343522-7  
2343522-8  
2339978-5  
2339978-6  
2339978-7  
2339978-8  
2347721-5  
2347721-6  
2347721-7  
2347721-8  
2349201-5  
2349201-6  
2349201-7  
2349201-8  
INNER/OUTER  
INNER  
OUTER  
CENTER/  
REVERSED  
OUTER  
Standard  
1-2349202-9  
1-2343522-9  
12339978-9  
1-2347721-9  
1-2340033-9  
1-2349201-9  
REVERSED  
OUTER  
2-2349202-0 2-2343522-0 2-2339978-0 2-2347721-0  
2-2340033-0  
--  
2-2349201-0  
--  
REVERSED  
INNER  
--  
2-2347721-1  
3-2347721-1  
NONE  
-
-
3-2343522-3  
-
3-2339978-1  
3-2340033-1  
2-2349201-1  
CENTER/  
REVERSED  
OUTER  
3-2339978-2  
-
-
-
Airflow  
Enhanced  
OUTER  
-
-
-
-
-
-
-
-
3-2339978-3  
-
-
-
-
-
-
REVERSED  
OUTER  
-
-
-
Airflow Enhanced &  
Insulator Tape  
NONE  
NONE  
3-2339978-4  
-
3-2340033-3  
4-2340033-0  
2-2349201-2  
-
Top Cage Heatsink  
Opening  
zSFP+ Stacked Belly-to-Belly  
Configuration  
2x4  
2x12  
2357514-1  
Part Number  
2357518-1  
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  
PAGE 5  
zSFP+ Pluggable I/O Interconnect  
SFP28 Direct Attach Copper Cable Assemblies  
TE’s SFP28 passive copper cable assembly features two di“erential copper pairs, providing one data transmission channel at  
speeds up to 28Gbps per channel that meets 25G Ethernet performance requirements. SFP28 is designed for applications in  
the data center, networking and telecommunications markets that require a high speed, reliable cable assembly,  
O“ered in a broad range of wire gages – from 26AWG through 33AWG – this next generation copper cable assembly features  
low insertion loss and low cross talk. TE’s SFP28 assemblies share the same mating interface with SFP+ form factors, making  
it backward compatible with existing SFP+ I/O ports. SFP28 can be used with legacy 10G Ethernet and 16G Fibre Channel  
applications with substantial signal integrity margin.  
In addition to SFP28 straight cables, TE o“ers break out assemblies with a 100G QSFP28 module on one end breaking out  
to four SFP28 modules on the opposite end of the assembly. In-line SI based production testing ensures that each cable  
assembly meets the electrical performance requirements of the applicable industry standard specification.  
Features and Benefits  
Compatible with IEEE 802.3by and Fibre Channel industry standards  
Supports single lane data rate up to 28 Gbps  
Optimized construction to minimize insertion loss and cross talk  
Customized cable braid termination limits EMI radiation  
Backward compatible with existing SFP+ form factor connectors and cages  
Pull-to-release latch design  
30AWG through 32AWG cable  
SFP28 to SFP28 Straight Cable Assembly  
Straight and breakout cable assembly configurations available  
Customizable EEPROM mapping for cable signature  
RoHS compliant  
Industry Standards  
25G Ethernet (IEEE 802.3by)  
Fibre Channel  
SFF-8402 SFP+ 1X 28Gb/s Pluggable Transceiver Solution (SFP28)  
SFF-8665 QSFP+ 28G 4X Pluggable Transceiver Solution (QSFP28)  
QSFP28 to 4x SFP28 Breakout Cable  
Assembly  
SFP28 Part Number Detail  
Base  
Part  
Number  
Dash to Length (meters)  
Description  
AWG  
0.5  
1
1.5  
-3  
2
3
4
5
2821262  
2821222  
2821223  
2821224  
33  
30  
28  
26  
33  
30  
28  
26  
-1  
-2  
-3  
-4  
-2  
-2  
-5  
-1  
-1  
-1  
SFP28 to SFP28  
Straight Assembly  
-3  
-2  
-3  
-3  
-8  
-1  
QSFP28 to 4x  
SFP28  
-10  
-2  
-4  
2821033  
Breakout  
Assembly  
-12  
-5  
Contact your TE Representative for customized lengths.  
DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  
PAGE 6  
For More Information  
te.com/products/zsfp+  
TE Technical Support Center  
USA:  
+1 (800) 522-6752  
+1 (905) 475-6222  
+52 (0) 55-1106-0800  
Canada:  
Mexico  
Latin/S. America: +54 (0) 11-4733-2200  
Germany:  
UK:  
+49 (0) 6251-133-1999  
+44 (0) 800-267666  
+33 (0) 1-3420-8686  
+31 (0) 73-6246-999  
+86 (0) 400-820-6015  
France:  
Netherlands:  
China:  
Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.  
*as defined www.te.com/leadfree  
te.com  
© 2019 TE Connectivity Ltd. family of companies. All Rights Reserved.  
0/20  
TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.  
zSFP+ is a part of the ZXP® family of connectors and uses the ZXP technology.  
ZXP is a registered trademark of Molex LLC.  
Other logos, product and company names mentioned herein may be trademarks of their respective owners.  
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DATA AND DEVICES /// ZSFP+ I/O INTERCONNECT  

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