AN-010 [TE]
Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components; 符合RoHS标准* E系列表面贴装元件回流焊指南
| 型号： | AN-010 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components |
| 文件： | 总2页 (文件大小：32K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AN-010
Reflow Soldering Guidelines for RoHS* Compliant
E-Series Surface Mount Components
Rev. B
Introduction
Solder Pad Layout
This application note describes recommended prac-
tices and guidelines for the successful
assembly of M/A-COM Technology Solutions E-
Series surface mount components using automated
solder reflow techniques. Incorrect handling, stor-
age, reflow and cleaning may damage the compo-
nents.
Each E-series surface mount data sheet
recommends a solder pad layout based on IPC
standards. Deviation from these recommended
layouts can adversely effect the solder joint strength
and integrity.
Component Construction
All M/A-COM Technology Solutions E-series compo-
nents are designed to withstand solder reflow condi-
tions, as recommended in this application note. The
table below details the construction of our most popu-
lar surface mount components.
Handling and Storage Precautions
Most E-series components are static sensitive and
are packaged accordingly. Appropriate handling pre-
cautions should be observed. The typical shelf life of
these components is 24 months. However, corro-
sive, salty or high humidity atmospheres can have
an adverse affect on the solderability of
contact pads/pins. Manual handling of the
components is not recommended.
Component Construction
Substrate Type
Plating Construction
Cover Material (where applicable)
Ceramic
Leadless
Electroless Nickel Immersion Gold
(ENIG)
High temperature polymer mould
High temperature 6/6 nylon disk
DAP
SOT
Sn over Copper
FR-4
Leadless
ENIG
High temperature polymer mould
High temperature 6/6 nylon disk
Galvanised steel
Solder Paste
Component Placement
M/A-COM Technology Solutions E-series compo-
nents are designed to work with most recom-
mended reflow profiles for the SAC305/SAC405
type solders, and are fully compatible with the stan-
dard reflow profiles used for the SN60, SN62 and
SN63 solder pastes, including no-clean pastes.
For most case styles, a paste thickness of 0.25mm
± 0.05mm will provide an adequate
E-Series components are designed for placement
using automatic Pick and Place equipment.
Component placement is critical to negate shorts
caused by solder bridging. Most E-series
components can accept a side overhang of up to 50%
of the pad width, and a toe overhang of up to 10% of
pad length.
For the SM-22 case style, side overhang must be less
than 25%, and toe overhang less than 5%.
solder joint. For the SM-22 case style, a solder
paste thickness of 0.20mm ± 0.025mm is
recommended.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
AN-010
Reflow Soldering Guidelines for RoHS* Compliant
E-Series Surface Mount Components
Rev. B
General Soldering Precautions: Lead-Free Soldering Process
Relation of qualification profile and actual
production profile
Process Requirements
The ovens used should be 100% convection reflow.
Where applicable, thermocouples should be securely
attached to the top surface of a representative com-
ponent to insure the temperature exposure.
This can be done three times.
The profiles listed in this document are not
production reflow profiles, but are related to those
profiles with an added margin of safety to account
for oven variation, temperature drift, and product
variation and process robustness.
We recommended 90 seconds above 217°C with a
maximum temperature of 260°C.
The 60 seconds at temperatures >250°C is the maxi-
mum duration these package types should be ex-
posed to.
The actual profile used in production will be dictated
primarily by the solder composition selected.
Exposure
Condition
less than 3°C / second
Average ramp-up rate (30°C to 217°C)
> 100°C
between 360-600 seconds
at least 240 seconds
> 150°C
at least 90 seconds
> 217°C
greater or equal to 255°C at least 15 seconds
less than 6°C / second
no greater than 360 seconds
Peak Temperature
Cool-down rate (Peak to 50°C)
Time from 30°C to 255°C
All temperatures shown are +5/-0°C
2
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
Visit www.macomtech.com for additional data sheets and product information.
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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