CRGP2512 [TE]

SMD Precision Pulse Thick Film Chip Resistor;


型号：	CRGP2512
厂家：	TE CONNECTIVITY
描述：	SMD Precision Pulse Thick Film Chip Resistor
文件：	总10页 (文件大小：542K)
中文：	中文翻译
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SMD Precision Pulse Thick Film Chip Resistor

Type CRGP Series

Key Features

Small size and

light weight

Suitable for

both wave and

reflow

soldering

techniques

Supplied on

tape

Pulse Rated

7 different

package sizes

TE Connectivity is pleased to introduce this SMD Pulse withstand thick film Chip

resistor, suitable for auto placement in volume and for most applications.

Available in five different packages and supplied on tape and reel for automatic

insertion processes. Standard values – E24 Series

Terminal finish

matte Sn over

Characteristics – Electrical

Type

CRGP0402 CRGP0603 CRGP0805 CRGP1206

Power Rating @ 70°C

Max. Working Voltage

Max. Overload Voltage

Dielectric Withstand

Temperature Range

Ambient Temperature

0.125W

50V

0.25W

50V

0.33W

150V

0.5W

200V

400V

500V

100V

300V

500V

-55°C ~ +155°C

70°C

Type

CRGP1210

0.75W

200V

CRGP2010

1.25W

CRGP2512

Power Rating @ 70°C

Max. Working Voltage

Max. Overload Voltage

Dielectric Withstand

Temperature Range

Ambient Temperature

400V

500V

800V

1000V

500V

-55°C ~ +155°C

70°C

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Power derating curve

Power rating based on continuous load operation in ambient temperature of

70°C. For resistors operated in ambient temperatures above 70°C, power

rating must be derated in accordance with this curve.

Dimensions:

Dimension (mm)

Type

ℓꢀ

ℓꢁ

CRGP0402

CRGP0603

CRGP0805

1.10±0.10

1.60±0.10

2.00±0.15

0.50±0.05

0.80±0.10

1.25+0.15

-0.10

0.35±0.05

0.45±0.10

0.55±0.10

0.20±0.10

0.30±0.20

0.40±0.20

0.25±0.10

0.30±0.20

0.40±0.20

CRGP1206

3.10±0.15

1.55+0.15

-0.10

0.55±0.10

0.45±0.20

CRGP1210

CRGP2010

CRGP2512

3.10±0.10

5.00±0.10

6.35±0.10

2.60±0.20

2.50±0.20

3.20±0.20

0.55±0.10

0.55±0.25

0.60±0.25

0.50±0.20

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Construction:

Power Rating and Resistance Range:

Type

Power Rating Tolerance

@ 70°C

±1%

Resistance

Range

Standard

Series

E24

CRGP0402

0.125W

0.25W

0.33W

0.5W

1R0 – 10M

E96 by

negotiation

E24

E96 by

negotiation

E24

E96 by

negotiation

E24

E96 by

negotiation

E24

E96 by

negotiation

E24

E96 by

negotiation

E24

±5%

±1%

±5%

CRGP0603

CRGP0805

CRGP1206

CRGP1210

CRGP2010

CRGP2512

±1%

±5%

±1%

±5%

±1%

±5%

0.75W

1.25W

±1%

±5%

±1%

±5%

E96 by

negotiation

Marking:

E24 series 0603 – 2512 3 Digits – first two digits denote significant figures of

resistance and third digit denotes number of zeros thereafter. EG

2K2

222

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Marking for E96 Series 0805 – 2512 4 digits – First three digits denote significant

figures of resistance and fourth digit denotes number of zeros thereafter. EG.

100R

1000

For ohꢂiꢃ ꢄalues ꢅeloꢆ ꢀꢇꢇR letter ꢈRꢉ deꢊotes deꢃiꢂal poiꢊt. EG

ꢀR8 / ꢀ.8Ω

1R80

0402 size chips are not marked

0603 E96 3 digit marking.

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor



Marking for E96 series 0603 size with no marking code marked as

per E24 values.

Pulse withstand capacity

The single impulse graph is the result of 50 impulses of rectangular shape

applied at one-minute intervals. The limit of acceptance was a shift in

resistance of less than 1% from the initial value. The power applied was

subject to the restrictions of the maximum permissible impulse voltage

graph shown.

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Performance Specification:

Characteristic Limits

Test Methods

(JIS C 5201-1)

Temperature

Coefficient

±100PPM/°C

*0402:

ꢀΩ-ꢀꢇΩ : ± ꢋꢇꢇ PPM/℃

ꢀꢀΩ-ꢀꢇꢇΩ : ± 200 PPM/℃

>ꢀꢇꢇΩ : ± ꢀꢇꢇ PPM/℃

Natural resistance change per temp.

degree centigrade

R1-R2

--------- xꢀꢇ⁶ ꢌPPM/°Cꢍ

R1(t2-t1)

R1 resistance value at room temperature

(t1)

R2 Resistance value at room temperature

+100°C (t2)

(Sub-clause 4.8)

Short term

overload

Resistance change rate is

±ꢎ% : ±ꢌꢁ.ꢇ% ±ꢇ.ꢀΩꢍ Max.

±ꢀ% : ±ꢌꢀ.ꢇ% ±ꢇ.ꢀΩꢍ Max.

Permanent resistance change after the

application of a potential of 2.5 times

RCWV for 5 seconds

Sub-clause 4.13

Twist of Test Board :

Y/X = 5/90 mm for 10 seconds

(Sub-clause 4.33)

Terminal

Bending

± ꢌꢀ.ꢇ% ±ꢇ.ꢇꢎΩꢍ Max.

ꢀ,ꢇꢇꢇMΩ or ꢂore

Insulation

Resistance

Apply 500V DC between protective coating

and termination for 1 min, then measure

(Sub-clause 5.6)

Dielectric

Withstand

Voltage

No evidence of flashover,

mechanical damage, arcing and termination for 1 minute

Apply 500V AC between protective coating

or insulation breakdown.

(Sub-clause 4.7)

Soldering Heat Resistance change rate is

±ꢌꢀ.ꢇ%+ꢇ.ꢇꢎΩꢍ Max.

Dip the resistor into a solder bath having a

temperature of 260°C±3°C and hold it for

10±1 seconds

(Sub-clause 4.18)

Solderability

95% coverage Min.

Test temperature of solder : 245 ± 3 ℃

Dwell time in solder : 2 ~ 3 seconds

(Sub-clause 4.17)

Solder Temp.

Reference

Electrical characteristics

shall be satisfied without

distinct deformation in

appearance.

Wave soldering condition: (2 cycles Max.)

Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec.

Peak temp.: 260 ℃

Reflow soldering condition: (2 cycles Max.)

Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec.

Suggestion solder temp.: 235 ~ 255 ℃, 20 ~

40 sec.

(95% coverage Min.)

Peak temp.: 260 ℃

Hand Soldering 300°C 5 seconds

Dimensions in

Dimensions Shown for

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

reference purposes only.

Specifications subject to

change

SMD Precision Pulse Thick Film Chip Resistor

Performance Specification (continued)

Characteristic

Limits

Test Methods

(JIS C 5201-1)

Resistance change after continuous 5

cycles for duty specified below:

Step Temperature

Time

Resistance change rate is:

±5%: ±ꢌꢏ%±ꢇ.ꢀΩꢍ Max.

±ꢀ%: ±ꢌꢇ.ꢎ%±ꢇ.ꢀΩꢍ Max.

-55°C±3°C

30 mins.

10~15 mins.

30 mins.

10~15 mins.

Temperature

Cycling

Room Temp.

+155°C±2°C

Room Temp.

(Sub-clause 4.19)

Temporary resistance change after

240 hours exposure in a humidity test

chamber controlled at 40±2°C and 90-

95% relative humidity

Resistance change rate is:

± ꢌꢏ.ꢇ% + ꢇ.ꢀΩꢍ Max.

Humidity

(Sub-clause 4.24)

Load Life In

Humidity

Resistance change rate is:

±ꢎ% : ±ꢌꢏ.ꢇ% ±ꢇ.ꢀΩꢍ Max.

±ꢀ% : ±ꢌꢀ.ꢇ% ±ꢇ.ꢀΩꢍ Max.

Resistance change after 1,000 hours

(1.5 hours "on", 0.5 hour "off") at

RCWV in a humidity chamber

controlled at 40℃ ± 2℃ and 90 to 95

% relative humidity.

(Sub-clause 4.24.2.1)

Load Life

Resistance change rate is:

±ꢎ% : ±ꢌꢏ.ꢇ% ±ꢇ.ꢀΩꢍ Max.

±ꢀ% : ±ꢌꢀ.ꢇ% ±ꢇ.ꢀΩꢍ Max.

Permanent resistance change after

1,000 hours operating at RCWV, with

duty cycle of (1.5 hours "on", 0.5 hour

"off") at 70℃ ± 2℃ ambient

(Sub-clause 4.25.1

Packaging Specification

Paper taping

Type

A ±

0.2

B ±

0.2

C ±

0.05

2.0

ØD +0.1

-0

1.5

E ±

0.1

F ±

G ±

0.1

W ±

0.2

8.0

T ±

0.1

0.05

3.5

0402

0603

0805

1206

1210

0.65

1.10

1.65

2.00

2.80

1.15

1.75

4.0

0.45

1.90

2.40

3.60

3.50

1.5

1.75

4.0

0.67

0.81

0.75

1.5

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Embossed Taping

Type

±0.2

ØD

ØD1

+0.1

-0

±0.1

±0.05 ±0.1

±0.2

T ±

0.1

±0.05 +0.1

-0

2010 2.90

2512 3.50

5.60

6.70

2.0

1.5

1.75

5.5

4.0

12.0

1.0

Peeling strength of cover tape:

Test condition: 0.1 to 0.7 N at a peel off speed of 300mm / min.

Reel Dimensions (mm):

Type

Tape

Reel

Qty

A ± 0.5 B ± 0.5 C ± 0.5

D ± 1

M ± 2

W ± 1

0402

0603

0805

1206

1210

2010

2512

Paper

10,000

5,000

4,000

178

Paper

Embossed

13.8

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Label:

A. TE Product Number

C. Quantity

B. Product Description

D. Lot Number

E. RoHS Statement

Example:

Environment Related Substance

This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and

Halogen free.

Ozone layer depleting substances.

Ozone depleting substances are not used in our manufacturing process of this

product.

This product is not manufactured using Chloro fluorocarbons (CFCs),

Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other

ozone depleting substances in any phase of the manufacturing process.

Storage Condition

The performance of these products, including the solderability, is guaranteed for a

year from the date of arrival at your company, provided that they remain packed as

they were when delivered and stored at a temperature of 25°C ± 10°C and a relative

humidity of 60%RH ± 10%RH, chemical and dust free atmosphere

Even within the above guarantee periods, do not store these products in the

following conditions otherwise, their electrical performance and/or solderability may

be deteriorated, and the packaging materials (e.g. taping materials) may be deformed

or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S,

NH3, SO2, or NO2

2. In direct sunlight

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

SMD Precision Pulse Thick Film Chip Resistor

Solder Profile

Wave soldering condition: (2 cycles Max.)

Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec.

Peak temp.: 260 ℃

Reflow soldering condition: (2 cycles Max.)

Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec.

Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec.

Peak temp.: 260 ℃

Hand Soldering condition: The Soldering iron tip should be less than 300°C

and maximum contact time should be 5 seconds

How To Order

CRGP

Common Part

0603

Size

Tolerance

10K

Resistance Value

ꢀ ohꢂ ꢌꢀΩꢍ ꢀRꢇ

0402

0603

0805

1206

1210

2010

2512

ꢀK ohꢂ ꢌꢀꢇꢇꢇΩꢍ ꢀKꢇ

CRGP – Pulse

Withstand Thick

Film Chip Resistor

F - ±1%

J - ±5%

ꢀꢇꢇK ohꢂ ꢌꢀꢇꢇꢇꢇꢇΩꢍ

100K

ꢀM ohꢂ ꢌꢀꢇꢇꢇꢇꢇꢇΩꢍ ꢀMꢇ

Dimensions in

Dimensions Shown for

reference purposes only.

Specifications subject to

change

9-1773463-9 CIS WR 03/2018

For Email, phone or live chat,

go to: www.te.com/help

millimetres unless

otherwise specified

CRGP2512 [TE]

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