M02066G-21 [TE]

3.3 Volt Laser Driver IC for Applications to 3 Gbps;
M02066G-21
型号: M02066G-21
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

3.3 Volt Laser Driver IC for Applications to 3 Gbps

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Preliminary Information  
This document contains information on a new product. The parametric information, although not  
fully characterized, is the result of testing initial devices.  
M02066  
3.3 Volt Laser Driver IC for Applications to 3 Gbps Data Sheet  
The M02066 is a highly integrated, programmable laser driver intended for SONET/SDH applications with FEC to 3  
Gbps. Using differential PECL data and clock inputs, the M02066 supplies the bias and modulation current  
required to drive an edge-emitting laser. The modulation output can be DC-coupled to the laser diode, giving a  
significant power saving over AC-coupled operation.  
The M02066 includes automatic power control to maintain a constant average laser output power over temperature  
and life. In addition, the modulation current can be temperature compensated to minimize variation in extinction  
ratio over temperature.  
Output flags indicate laser end of life as well as failure of the APC circuitry to maintain average output power.  
General Note: This product was previously called the CX02066.  
Features  
Applications  
• Short reach and Metro SONET/SDH  
• Datacomms Modules  
• High speed operation; suitable for applications to 3 Gbps.  
• Typical rise/fall times of 90 ps.  
• DC or AC coupled modulation drive.  
• Add/Drop Multiplexers  
• Differential data and clock inputs to minimize pattern dependent  
jitter.  
• Digital Cross Connects  
• Independently Programmable Laser Bias and Modulation currents.  
• Bias current to 100 mA and modulation current to 85 mA at VCC =  
3.3 V  
• Automatic Laser Power Control, with programmable temperature  
compensation and ‘Slow-Start’.  
• Bias and modulation current monitor  
• Operates with +3.3 Volt supply  
• Functionally compatible with MAX 3869  
• The M02066-21 and M02066-51 are available in a BCC+24  
package. The M02066-82 is available in a TQFP32 package.  
• Available in RoHS compliant packages  
Functional Block Diagram  
V
CC  
CEN  
OUT-  
OUT+  
RD  
R
SHUNT  
C
SHUNT  
D
DATA  
CLK  
GNDA  
Q
X100  
DIS  
ENA  
BIAS  
I
MON  
X60  
BIAS  
I
BIAS  
60  
X1  
PD  
Failure  
Detect  
MOD  
FAIL  
MON  
I
MOD  
60  
V
REF  
NOTE: BCC+24 Package  
PD and MPCSET are common on Pin 13  
BIASMON and MODMON are common on Pin 4  
MPC  
OCA  
SET  
SET  
OCA  
C
MPC  
R
MPCSET  
V
CC  
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02066-DSH-001-D  
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Preliminary Information / Mindspeed Proprietary and Confidential  
Ordering Information  
Part Number  
Package  
M02066-21  
BCC+24 package with 20 ps or less DCD  
M02066-51  
BCC+24 package with 50 ps or less DCD  
M02066-82  
TQFP32 package with 80 ps or less DCD  
M02066-EVME  
M02066-T-EVM  
M02066G-21 *  
M02066G-51 *  
M02066G-82 *  
BCC+24 electrical evaluation board  
Optical evaluation board, TO-can laser  
BCC+24 RoHS compliant package, with 20 ps or less DCD  
BCC+24 RoHS compliant package, with 50 ps or less DCD  
TQFP32 RoHS compliant package, with 80 ps or less DCD  
* The letter “G” designator after the part number indicates that the device is RoHS-compliant. Refer to www.mindspeed.com for additional  
information.  
Revision History  
Revision  
Level  
Date  
ASIC Revision  
Description  
D
Preliminary  
November 2006  
x
Added RoHS package information, updated format, no specification  
changes.  
BCC+24L Top View  
TQFP32 Top View  
24 23 22 21  
20  
OCA  
SET  
19  
18  
1
CEN  
V
D
D
1
2
3
4
5
6
7
8
24 PD  
CC  
IN  
2
MOD  
SET  
DIS  
GND  
MON  
FAIL  
OCA  
23  
22  
21  
GND  
GND  
A
A
3
4
5
6
17  
TC  
IN  
START  
1
6
V
4mm  
TC  
CC  
V
5mm  
CC  
SLOPE  
CLK  
20 OUT-  
15  
GND  
CLK  
19  
18  
17  
OUT+  
14  
C
MPC  
V
V
CC  
BIAS  
CC  
V
7
13  
11  
8
9
10  
12  
PD  
CC  
CEN  
4mm  
5mm  
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1.0 Product Specification  
1.1  
Absolute Maximum Ratings  
These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.  
Functional operation at these levels is not implied.  
Table 1-1.  
Absolute Maximum Ratings  
Parameter  
Rating  
Units  
Power supply (V -GND)  
-0.5 to +6.0  
-40 to +85  
-65 to +150  
120  
V
CC  
Operating ambient  
°C  
Storage temperature  
°C  
Maximum laser bias current  
mA  
mA  
Maximum laser modulation current (through OUT+/OUT2+, OUT-/OUT2-)  
100  
1.2  
Recommended Operating Conditions  
Table 1-2.  
Recommended Operating Conditions  
Parameter  
Rating  
Units  
Power supply (V -GND)  
3.3 10ꢀ  
-40 to + 120  
-40 to + 85  
V
CC  
Junction temperature (die)  
Operating ambient  
°C  
°C  
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Product Specification  
1.3  
DC Characteristics  
V
=+3.3V 10%, T =-40 °C to +85 °C, unless otherwise noted.  
CC  
A
Table 1-3.  
DC Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Supply current  
Supply current  
I
= 50 mA I  
= 50 mA  
MOD  
-
57  
-
mA  
BIAS  
Excluding I  
and I  
BIAS  
MOD  
I
= 100 mA I  
= 85 mA  
MOD  
-
2
-
70  
-
75  
mA  
mA  
BIAS  
MOD  
and I  
Excluding I  
BIAS  
Bias current adjust range  
Limited by OCA  
range  
across temperature  
100  
SET  
Bias current with output disabled  
Maximum bias current limit  
Tx_Disable = HIGH  
-
-
300  
µA  
mA  
µA/°C  
V
(1)  
T = +85 °C (adjustable)  
100  
-
-
A
Change in OCA  
over temperature  
200  
2.1  
-
-
SET  
Monitor diode reverse bias voltage  
-
-
1500  
-
Monitor diode current adjustment range  
10  
2.0  
µA  
TTL/CMOS input HIGH voltage  
(CEN, DIS)  
-
V
TTL/CMOS input LOW voltage  
(CEN, DIS)  
-
-
-
-
-
0.8  
-
V
V
V
CMOS output HIGH voltage  
(FAIL, OCA)  
2.4  
-
CMOS output LOW voltage  
(FAIL, OCA)  
0.4  
Differential input impedance  
Common-mode input voltage  
Self-biased common mode input voltage  
NOTE:  
Data and clock inputs  
Data and clock inputs  
2.5  
-
kΩ  
V
V
-1.7  
V -(V (Diff)/4)  
CC IN  
CC  
CC  
V
-1.7  
-
V
-0.47  
V
CC  
(V = +3.3 V 10ꢀ, T = 40 °C to + 85 °C, unless otherwise noted)  
CC  
A
1.  
R
= 0 Ω  
OCASET  
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Product Specification  
1.4  
AC Characteristics  
VCC = +3.3V 10%, TA = -40 °C to +85 °C, unless otherwise noted.  
Table 1-4.  
AC Characteristics  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Units.  
Differential input voltage  
= 2 x (D  
- D  
)
300  
1860  
mV  
IN HIGH  
IN LOW  
(clock inputs follow same relationship)  
Modulation current range  
2.5  
85  
mA  
µA  
Modulation current with output disabled  
DIS=HIGH  
Adjustable  
300  
4
Programmable range for modulation  
current temperature coefficient  
500  
10  
ppm/°C  
Programmable temperature at which  
modulation current TC compensation  
enables  
Programmed by choice of R  
20  
60  
°C  
ps  
TCSET  
(1)  
Modulation output rise time  
Modulation output fall time  
20ꢀ to 80ꢀ into 25 Ω  
90  
90  
20ꢀ to 80ꢀ into 25 Ω  
Overshoot of modulation output current  
Modulation output pulse width distortion  
Into 25 load  
-10  
+10  
(2)  
Measured using alternating 1-0 pattern  
20  
ps  
RMODSET = 7 kΩ  
(3)  
Modulation output pulse width distortion  
Modulation output pulse width distortion  
Modulation output random jitter  
Measured using alternating 1-0 pattern  
RMODSET = 7 kΩ  
50  
ps  
ps  
(4)  
Measured using alternating 1-0 patternRMODSET = 7  
kΩ  
80  
rms 12 kHz to 20 MHz  
4
mUI  
ps  
(2)  
Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 load using 1867  
42  
23  
MHz Bessel filter: 2 -1 PRBS at 2.488 Gbps; using  
clock inputs (includes PWD, random and  
deterministic)  
(3)  
Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 load using 1867  
72  
ps  
ps  
23  
MHz Bessel filter: 2 -1 PRBS at 2.488 Gbps; using  
clock inputs (includes PWD, random and  
deterministic)  
(4)  
Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 load using 1867  
100  
23  
MHz Bessel filter: 2 -1 PRBS at 2.488 Gbps; using  
clock inputs (includes PWD, random and  
deterministic)  
NOTES:  
(V = +3.3 V 10ꢀ, T = 40 °C to + 85 °C, unless otherwise noted)  
CC  
A
1.  
I
= 28 mA  
MOD  
2. Applies only to the M02066-21.  
3. Applies only to the M02066-51.  
4. Applies only to the M02066-82.  
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2.0 Pin Description  
2.1  
Pin Descriptions  
Table 2-1.  
Pin Descriptions (BCC+24)  
Pin No.  
Name  
Function  
1
2
3
4
5
CEN  
DIS  
Clock enable input (TTL/CMOS). Set HIGH or not connected to use CLK inputs, LOW when not using CLK inputs  
Bias and modulation output disable (TTL/CMOS). LOW for normal operation  
Ground  
GND  
MON  
FAIL  
Monitor output, connect a resistor between this pin and V to monitor the sum of bias and modulation currents  
CC  
Mean power control failure indicator (TTL/CMOS). Goes LOW when control loop is no longer able to maintain constant  
current at PD  
6
7
OCA  
Over-current alarm (TTL/CMOS). Goes LOW when I  
exceeds the preset bias current limit  
BIAS  
V
Power supply  
CC  
8
BIAS  
Laser bias current output  
Power supply  
9
V
CC  
10  
11  
12  
13  
OUT+  
OUT-  
Positive modulation current output. Sinks current when D is HIGH  
IN  
Negative modulation current output. Sinks current when D is HIGH  
IN  
GND  
PD  
Ground for output stage. (inductor to ground)  
A
Monitor photo diode input. This input is connected to the monitor photodiode anode for automatic power control. A  
resistor between this pin and ground sets the mean optical power  
14  
15  
16  
C
Mean power control loop dominant pole capacitor  
Ground  
MPC  
GND  
TC  
Connecting a resistor between this pin and ground sets the temperature coefficient of I  
(using the internal IC  
MODSET  
SLOPE  
temperature)  
17  
TC  
Secondary temperature coefficient of I  
temperature compensation starts  
. A resistor on this pin to ground sets the temperature at which the  
MOD  
START  
18  
19  
20  
21  
MOD  
Modulation current set. Connect a resistor between this pin and ground to set  
Over current alarm set. Connect a resistor between this pin and ground to set  
Power supply  
SET  
OCA  
SET  
V
CC  
D
Positive data input (PECL). Self biased  
IN  
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Pin Description  
Table 2-1.  
Pin Descriptions (BCC+24) (Continued)  
Pin No.  
Name  
Function  
22  
23  
D
Negative data input (PECL). Self biased  
IN  
CLK  
CLK  
Positive clock input (PECL). Self biased. Connect to V if not used  
cc  
24  
Negative clock input (PECL). Self biased. Can be disconnected if not used  
NOTE:  
The center pad must be connected to ground through an array of vias for good electrical and thermal performance.  
Table 2-2.  
Pin Descriptions (TQFP 32)  
Pin No.  
Name  
Function  
1, 4, 7, 16,  
18, 21, 25,  
32  
V
Power supply  
CC  
D
D
2
3
5
6
Positive data input (PECL). Self biased  
Negative data input (PECL). Self biased  
IN  
IN  
Positive clock input (PECL). Self biased. Connect to V if not used  
CLK  
CLK  
cc  
Negative clock input (PECL). Self biased. Can be disconnected if not used  
Clock enable input (TTL/CMOS). Set HIGH or not connected to use CLK inputs, LOW when not using CLK  
inputs  
8
CEN  
9
ENA  
GND  
Bias and modulation output enable (TTL/CMOS). HIGH for normal operation  
Ground  
10  
Bias monitor and temperature- dependent bias current limit. Connect a resistor between this pin and V to  
CC  
BIAS  
11  
12  
13  
MON  
MON  
monitor  
MOD  
Modulation current monitor. Connect a resistor between this pin and V to monitor  
CC  
Mean power control failure indicator (TTL/CMOS). Goes LOW when control loop is no longer able to maintain  
FAIL  
constant current at I  
PIN  
Over-current alarm (TTL/CMOS). Goes LOW when I  
exceeds the preset bias current limit  
14  
15  
17  
19  
OCA  
GND  
BIAS  
OUT+  
BIAS  
Ground  
Laser bias current output  
Positive modulation current output. Sinks current when D is HIGH  
IN  
Negative modulation current output. Sinks current when D is HIGH  
20  
22  
23  
OUT-  
IN  
GND  
Ground for output stage (inductor to ground)  
Ground for output stage (inductor to ground)  
A
GND  
A
Monitor photo diode input. This input is connected to the monitor photodiode anode for automatic power  
control.  
24  
26  
PD  
C
Mean power control dominant pole capacitor  
MPC  
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Pin Description  
Table 2-2.  
Pin No.  
27  
Pin Descriptions (TQFP 32) (Continued)  
Name  
Function  
Not connected and may be grounded for compatibility with MAX3869  
NC  
Connecting a resistor between this pin and ground sets the temperature coefficient of I  
internal IC temperature)  
(using the  
MODSET  
TC  
28  
SLOPE  
MPC  
MOD  
OCA  
29  
30  
A resistor between this pin and ground sets the mean optical power  
Modulation current set. Connect a resistor between this pin and ground to set  
Over current alarm set. Connect a resistor between this pin and ground to set  
SET  
SET  
SET  
31  
NOTE:  
TC  
is internally connected to 0 V in the TQFP32.  
START  
The center pad must be connected to ground through an array of vias for good electrical and thermal performance.  
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3.0 Functional Description  
3.1  
Overview  
The M02066 laser driver consists of a high-speed modulation driver and a laser bias generator with mean power  
control (MPC). It is optimized for high speed, low power operation at 3.3V supply. To minimize the pattern-  
dependent jitter of the input signal, the device accepts an input clock signal for data retiming. This feature can be  
enabled using the external CEN pin.  
Figure 3-1. CX02068 Block Diagram  
V
CC  
CEN  
OUT-  
OUT+  
RD  
R
SHUNT  
C
SHUNT  
D
DATA  
CLK  
GNDA  
Q
X100  
DIS  
ENA  
BIAS  
I
MON  
X60  
BIAS  
I
BIAS  
60  
X1  
PD  
Failure  
Detect  
MOD  
FAIL  
MON  
I
MOD  
60  
V
REF  
NOTE: BCC+24 Package  
PD and MPCSET are common on Pin 13  
BIASMON and MODMON are common on Pin 4  
MPC  
OCA  
SET  
SET  
OCA  
C
MPC  
R
MPCSET  
V
CC  
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Functional Description  
3.2  
Features  
High speed operation; suitable for applications to 3 Gbps.  
Typical rise/fall times of 90 ps.  
DC or AC coupled modulation drive.  
Differential data and clock inputs to minimize pattern dependent jitter.  
Independently Programmable Laser Bias and Modulation currents.  
Bias current to 100 mA and modulation current to 85 mA at VCC = 3.3 V  
Automatic Laser Power Control, with programmable temperature compensation and ‘Slow-Start’.  
Bias and modulation current monitor  
Operates with +3.3 Volt supply  
Functionally compatible with MAX 3869  
The M02066-21 and M02066-51 are available in a BCC+24 package. The M02066-82 is available in a TQFP32  
package.  
Available in RoHS compliant packages  
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Functional Description  
3.3  
Modulator  
The M02066 modulation output is optimized for driving a 25load; the minimum required voltage at OUT+ and  
OUT- is 0.6V. To interface with the laser diode, a matching resistor (RD) is required for impedance matching. An  
RC shunt network is necessary to compensate for the laser diode parasitic inductance, thereby improving the  
optical eye.  
Typical values are R  
= 39, C  
= 3.9 pF.  
SHUNT  
SHUNT  
These values will need to be optimized for a specific laser.Any capacitive loading at the cathode of a laser diode will  
degrade the optical output performance. An inductor is used to isolate the BIAS pin from the laser cathode. See  
Figure 3-1.  
The modulator output stage is designed to drive up to 85mA in either AC-coupled or DC-coupled mode. DC-  
coupled performance depends on the laser used.  
R
determines the modulation current according to the following formula: I  
= 350/R  
MODSET  
MODSET  
MOD  
Figure 3-2 shows the modulation current for a given R  
resistor.  
MODSET  
Figure 3-2. Modulation Current vs. R  
MODSET  
Modulation Current in m A  
90.00  
80.00  
70.00  
60.00  
50.00  
40.00  
30.00  
20.00  
10.00  
0.00  
0
10  
20  
30  
40  
Rmodset (kohms)  
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Functional Description  
3.4  
Mean Power Control Loop  
To maintain constant average optical power, the M02066 incorporates a control loop to compensate for the  
changes in laser threshold current over temperature and lifetime. A monitor photodiode mounted in the laser  
package is used to convert the optical power into a photocurrent. The MPC loop adjusts the laser bias current so  
that the voltage at PD is matched to an on-chip reference voltage. The external resistor (R  
power.  
) sets the optical  
MPCSET  
R
= 1.28/I  
PIN  
MPCSET  
I
is the mean current from the monitor photodiode at the required mean laser power level (see laser  
PIN  
datasheet).The time constant of the loop is determined by C  
. In some applications the internal capacitance at  
MPC  
C
may be sufficient and an external C  
will not be required.  
MPC  
MPC  
Table 3-1.  
MPC Loop Bandwidth  
6 dB cutoff frequency  
CMPC  
0
17 MHz  
100 kHz  
10 kHz  
1 kHz  
1 nF  
10 nF  
100 nF  
(at 6 dB cut off frequency) vs C  
(for nominal process)  
MPC  
Figure 3-3 shows the bias current vs R  
over the full operating temperature range.  
MPCSET  
Figure 3-3. Bias Current vs. R  
MPCSET  
120  
100  
80  
60  
40  
20  
0
0
5000  
10000 15000 20000 25000 30000 35000  
R
MPCSET  
-40  
0
25  
50  
85  
Symbols shown indicate °C  
NOTE:  
This curve will scale with monitor photodiode current transfer efficiency.  
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Functional Description  
There are two safety features integrated into the MPC loop; an Over-Current Alarm and an MPC loop failure alarm.  
The Over-Current Alarm (OCA) circuit limits the maximum bias current generated by the M02060. The bias current  
limit is set by an external resistor to ground, R  
. When this limit is exceeded the OCA pin is asserted LOW.  
OCA  
Figure 3-4 shows the maximum bias current limit vs R  
.
OCA  
Figure 3-4. Typical limiting current vs R  
(at 25 °C)  
OCA  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
30000  
40000  
10000  
20000  
ROCA ()  
3.5  
Safety Logic  
Safety logic is provided in order to limit the maximum bias current. The bias current at which the safety logic trips  
is set by an external resistor to ground (R ) from the OCA pin. When the bias current limit is reached alarm  
OCA  
SET  
flag OCA is asserted LOW. A loop failure alarm is also provided to detect when the bias current can no longer be  
adjusted to achieve the desired average optical power.  
3.6  
Data Input Latch  
To minimize input data pattern-dependent jitter, a differential clock signal can be connected to the data input latch.  
If CEN is HIGH, the input data is retimed by the rising edge of CLK+. If CEN is LOW, the input data is directly  
connected to the output stage. If CEN is left floating it will be pulled HIGH by the internal circuitry. When this latch  
function is not used, connect CLK+ to V and leave CLK- unconnected.  
CC  
3.7  
Enable Control  
The M02066 incorporates a dual laser driver enable function. When ENA is LOW or DIS is HIGH, both the bias  
and modulation currents are off. DIS and ENA are available on the M02066 die only, DIS is available on the BCC  
package only, ENA is available on the TQPF package.  
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Functional Description  
3.8  
Current Monitors  
The M02066 features bias and modulation current monitor outputs. The BIAS  
output sinks a current equal to  
MON  
nominally 1/60 of the laser bias current (I  
). The MOD  
output sinks a current equal to nominally 1/60 of the  
BIAS  
MON  
laser peak to peak modulation current (I  
). BIAS  
and MOD  
should be connected through a pull-up  
MON  
MOD  
MON  
resistor to V . Choose a pull-up resistor value that ensures a voltage at BIAS  
greater than V -1.6V and a  
CC  
MON  
CC  
voltage at MOD  
greater than V - 1.0V. These pins should be tied to V if not used.  
MON  
CC CC  
Figure 3-5. Typical Eye Diagram  
2.5 Gbps optical eye @ -3 dBm  
(1.87 GHz filter)  
3.9  
Temperature Compensation  
The reduction in slope efficiency of typical laser diodes caused by increased temperature can be compensated by  
utilising the TC and TC features of the M02066. Under closed loop conditions the average optical  
START  
SLOPE  
power will be maintained by the Mean Power Control loop, compensating for factors such as temperature and age.  
However, as the laser slope efficiency reduces with increasing temperature the laser diode will require a greater  
peak to peak current swing in order to maintain the same peak to peak optical output swing. To this end the  
M02066 senses temperature and can be programmed to increase the modulation current amplitude accordingly.  
Two external resistors are used to program the temperature compensation.  
The temperature (TC  
) at which the compensation begins to take effect is set by a resistor (RTC  
) from  
START  
START  
the TC  
pin to ground. The rate of increase of modulation current with temperature (beyond TC  
) is set  
START  
START  
by a resistor (RTC  
) from the TC  
pin to ground.  
SLOPE  
SLOPE  
As a safety feature, the M02066 limits the increased modulation current to twice the initial (ambient) modulation  
current.  
The effects of the two programming resistors are shown schematically in the Temperature Compensation graph  
below.  
If using the TQFP package; only TC  
is programmable, TC  
is connected to 0 V.  
SLOPE  
START  
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02066-DSH-001-D  
Mindspeed Technologies  
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Preliminary Information / Mindspeed Proprietary and Confidential  
Functional Description  
For more details on temperature compensation see the appropriate applications note.  
Figure 3-6. Temperature Compensation  
80 m A  
TC S LO P E  
1
2
IM O D  
T C ST A R T  
+80 °C  
-40 °C  
0 m A  
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02066-DSH-001-D  
Mindspeed Technologies  
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Preliminary Information / Mindspeed Proprietary and Confidential  
4.0 Packaging Specification  
4.1  
Packaging Specification  
Figure 4-1. Bare Die Information  
VCC  
CEN  
ENA  
DIS  
OCASET  
MODSET  
GND  
GND  
BIASMON  
MPCSET  
TCSTART  
MODMON  
FAIL  
GND  
TCSLOPE  
GND  
OCA  
GND  
CMPC  
VCC  
GND  
VCC  
Dimensions:  
Pad opening 84 x 84 µ  
Die size 1790 x 1718 µ  
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Mindspeed Technologies  
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Preliminary Information / Mindspeed Proprietary and Confidential  
Packaging Specification  
Table 4-1.  
Pad Centers  
PIN  
X
Y
PIN  
X
Y
PIN  
X
Y
PIN  
X
Y
CEN  
ENA  
DIS  
-727  
-727  
-727  
-727  
-727  
-727  
-727  
-727  
-727  
-727  
-727  
550  
440  
330  
220  
110  
0
BIAS  
-550  
-440  
-330  
-210  
-210  
100  
100  
220  
330  
440  
550  
-711  
-711  
-711  
-711  
-711  
-711  
-711  
-711  
-711  
-711  
-711  
V
727  
727  
727  
727  
727  
727  
727  
727  
727  
727  
727  
-550  
-440  
-33-  
-220  
-110  
0
GND  
550  
440  
330  
220  
110  
0
711  
711  
711  
711  
711  
711  
711  
711  
711  
711  
711  
CC  
GND  
C
V
CC  
A
MPC  
V
GND  
D
D
CC  
IN  
IN  
GND  
*OUTP  
*OUTP  
*OUTN  
*OUTN  
TC  
SLOPE  
BIAS  
MOD  
GND  
V
MON  
MON  
CC  
TC  
GND  
START  
FAIL  
-110  
-220  
-330  
-440  
-550  
MPC  
110  
220  
330  
440  
550  
V
-110  
-220  
-330  
-440  
-550  
SET  
CC  
GND  
OCA  
GND  
V
GND  
CLK  
CLK  
CC  
GND  
GND  
PD  
MOD  
A
A
SET  
SET  
OCA  
V
CC  
V
V
GND  
CC  
CC  
NOTE:  
* Single pad/double bond  
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02066-DSH-001-D  
Mindspeed Technologies  
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Preliminary Information / Mindspeed Proprietary and Confidential  
Packaging Specification  
Figure 4-2. TQFP32 Package Information  
C0.50±.05X4°5  
F1  
/
PIN 1 ID. 0 0±.5.05  
N
Exposed Pad  
1
E
E1  
F2  
-A-  
-B-  
Chamfer .203 (4X  
-D-  
D1  
BOTTOM VIEW  
D
TOP VIEW  
DETAIL X  
DETAIL A  
0.17 MAX.  
A2  
A
aaa  
M
C
b
b
DETAIL A  
SIDE VIEW  
12° TYP.  
01  
A3  
R1  
GAGE PLANE  
0.25  
-H-  
A3  
R
A1  
0
-C-  
STAND  
OFF  
12° TYP.  
e
SEATING PLANE  
ccc -C-  
L
COPLANARITY  
L1  
DETAIL X  
Table 4-2.  
TQFP32 Package Dimensions  
Dim  
Tol.  
5 x 5 x 1.0 mm  
Dim  
Tol.  
5 x 5 x 1.0 mm  
N
A
Lead count  
Max.  
32  
1.20  
0.05  
1.00  
0.4365  
7.00  
5.00  
7.00  
5.00  
0.60  
1.00  
e
b
Typ.  
0.05  
***  
0.50  
0.22  
0° - 7°  
6°  
A1  
A2  
A3  
D
0.05  
0
0.05  
01  
R
4°  
0.05  
Max.  
Typ.  
Max.  
Max.  
0.10  
0.10  
0.15  
0.15  
0.08  
0.08  
2.67  
2.67  
0.15  
R1  
aaa  
ccc  
F1  
F2  
D1  
E
0.05  
0.15  
E1  
L
0.05  
+0.15/-0.15  
Ref.  
L1  
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Preliminary Information / Mindspeed Proprietary and Confidential  
Packaging Specification  
Figure 4-3. BCC+24L Package Information  
TOP VIEW  
(PIN 1 CORNER)  
4.00  
± 0.10  
X
0.67  
±
0.025  
0.075 ± 0.025  
0.15  
Y
0.80 MAX  
BOTTOM VIEW  
3.15  
0.50 TYP.  
0.50 ± 0.10  
0.08  
M Z X Y  
C0.2  
0.08  
M Z X Y  
0.30 ± 0.03  
0.45 ± 0.03  
2.20  
0.45 ± 0.03  
C.L(PKG.)  
"B"  
0.08  
M Z X Y  
DETAIL "B" (20X)  
DETAIL "C" (3X)  
DETAIL "A"  
"A"(PI N 1 CORNER)  
3.20  
"C"  
Table 4-3.  
Features  
DIE  
BCC+24  
TQFP  
ENA  
DIS  
YES  
YES  
YES  
YES  
YES  
NO  
YES  
(1)  
YES  
NO  
BIAS  
YES  
YES  
(2)  
MON  
MON  
MOD  
(1)  
TEMPCOMP  
SIZE (mm)  
YES  
4 x 4  
1.79 x 1.72  
5 x 5  
NOTES:  
1. BIAS  
and MOD  
current sinks are common on pin 4.  
MON  
MON  
2.  
R
= 0 (internally bonded) R  
can be used on pin 28.  
TCSTART  
TCSLOPE  
®
02066-DSH-001-D  
Mindspeed Technologies  
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Preliminary Information / Mindspeed Proprietary and Confidential  
www.mindspeed.com  
General Information:  
Telephone: (949) 579-3000  
Headquarters - Newport Beach  
4000 MacArthur Blvd., East Tower  
Newport Beach, CA 92660  
®
© 2006 Mindspeed Technologies , Inc. All rights reserved.  
®
®
Information in this document is provided in connection with Mindspeed Technologies ("Mindspeed ") products.  
These materials are provided by Mindspeed as a service to its customers and may be used for informational  
purposes only. Except as provided in Mindspeed’s Terms and Conditions of Sale for such products or in any  
separate agreement related to this document, Mindspeed assumes no liability whatsoever. Mindspeed assumes  
no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and  
product descriptions at any time, without notice. Mindspeed makes no commitment to update the information and  
shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its  
specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any  
intellectual property rights is granted by this document.  
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR  
IMPLIED, RELATING TO SALE AND/OR USE OF MINDSPEED PRODUCTS INCLUDING LIABILITY OR  
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL  
DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER  
INTELLECTUAL PROPERTY RIGHT. MINDSPEED FURTHER DOES NOT WARRANT THE ACCURACY OR  
COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE  
MATERIALS. MINDSPEED SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR  
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,  
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.  
Mindspeed products are not intended for use in medical, lifesaving or life sustaining applications. Mindspeed  
customers using or selling Mindspeed products for use in such applications do so at their own risk and agree to  
fully indemnify Mindspeed for any damages resulting from such improper use or sale.  
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Preliminary Information / Mindspeed Proprietary and Confidential  

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