MA02203AD-R13 [TE]
3.6 V, 450 mW DECT RF Power Amplifier IC; 3.6 V ， 450毫瓦的DECT RF功率放大器IC
| 型号： | MA02203AD-R13 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | 3.6 V, 450 mW DECT RF Power Amplifier IC |
| 文件： | 总5页 (文件大小：92K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3.6 V, 450 mW DECT RF Power
Amplifier IC
V 1.0
Features
Functional Schematic
§
§
§
§
§
§
Ideal for DECT Applications
+26.5 dBm Output Power
24.5 dB Power Gain
N/C
N/C
+VDD1
+VDD2
Single Positive Supply
Class A Bias
GND
GND
RFIN
GND
GND
GND
RFOUT
GND
No External RF Matching Required
GND
GND
N/C
Description
N/C
16 pin narrow body SOIC
The MA02203AD is a two stage power amplifier
designed for DECT applications to have an output
power of +26.5 dBm with an input power of 2 dBm.
This power amplifier operates at +3.6 volts with
Pin Configuration
35% typical power added efficiency.
The
MA02203AD is mounted in a narrow body 16-pin
SOIC plastic package.
Pin
Function
Description
1
N/C
Not Connected
The MA02203AD is fabricated using M/A-COM’s
self-aligned MSAG®-Lite MESFET process for a low
single supply voltage, high power efficiency, and
excellent reliability.
2
VDD1
First Stage Supply Voltage
Ground
3
GND
GND
RFIN
GND
GND
N/C
4
Ground
5
RF Input
This part is not recommended for new designs. M/A-
COM’s MA02206GJ has superior RF performance
with less DC power consumption in a smaller
package. Pricing on the MA02206GJ is also less
than the MA02203AD.
6
Ground
7
Ground
8
Not Connected
Not Connected
Ground
9
N/C
10
11
12
13
14
15
16
GND
GND
RFOUT
GND
GND
VDD2
Ground
RF Output
Ordering Information
Ground
Part Number
Description
Ground
MA02203AD-R7
MA02203AD-R13
7 inch, 1000 piece reel
13 inch, 3000 piece reel
Second Stage Supply Voltage
Not Connected
N/C
Specifications subject to change without notice.
nNorth America: Tel. (800) 366-2266
nAsia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
nEurope: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
1
Visit www.macom.com for additional data sheets and product information.
3.6 V, 450 mW DECT RF Power Amplifier IC
MA02203AD
V 1.0
Electrical Specifications: TS = 40 °C1, Z0 = 50 W2,3
Parameter
Test Conditions
Units
Min
Typ
Max
Frequency
MHz
dBm
dB
dB
mA
-
1880
25.5
1900
27.5
0.5
Output Power
26.5
0.2
Pout Frequency Dependency
Power Gain
24.5
350
Current Consumption
Input VSWR, PA On
Input VSWR, PA Off
Isolation, PA Off
2nd Harmonics
3rd Harmonics
420
2.0:1
2.0:1
1.6:1
1.4:1
VDD1, VDD2 = 0 V
-
VDD1, VDD2 = 0 V
dB
dBc
dBc
40
31
55
Junction of 2nd stage FET to pin 11, Duty
Cycle=50%
Thermal Resistance
Load Mismatch
oC/W
-
63
VDD = 4.6 V, VSWR = 10:1, PIN = 7 dBm
No degradation
PIN = -3 to +7 dBm, VDD = 0 - 4.6 V, 0 mW
< POUT < 450 mW, TS = -40 to +75 °C, Load
VSWR = 10:1
Stability
-
All spurs < -60 dBc
1. Ts is the temperature measured at the soldering point of pin 11.
2. Unless otherwise specified, input power is +2 dBm, VDD is +3.6 V, and test frequency is 1890 MHz.
Absolute Maximum Ratings1
Parameter
Absolute Maximum
Max Input Power
+6 dBm
+5.5 volts
Operating Voltages
Operating Temperature, Ts
Channel Temperature
Storage Temperature
-40 °C to +75 °C
+150 °C
-40 °C to +150 °C
1. Exceeding any one or combination of these limits may cause permanent damage.
Specifications subject to change without notice.
nNorth America: Tel. (800) 366-2266
nAsia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
nEurope: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
2
Visit www.macom.com for additional data sheets and product information.
3.6 V, 450 mW DECT RF Power Amplifier IC
MA02203AD
V 1.0
Application Information
Static Sensitivity
Gallium arsenide integrated circuits are ESD sensitive and can be damaged by static electricity. Use proper ESD precautions when
handling these devices.
Board Layout
Sample Test Board
50 Ohm Lead Transition
Typical Performance Curves
Output Power and Current vs. Input Power
Output Power, PAE, and VSWR vs. Frequency
45
4:1
3:1
2:1
1:1
30
0.6
0.4
0.2
0.0
h
40
25
20
15
10
5
POUT
35
POUT
30
25
IDD
PIN = +2 dBm
20
VDD = 3.6 V
15
f = 1.89 GHz
VDD = 3.6 V
10
5
VSWR
0
0
1.7
1.8
1.9
2
-10
-5
0
5
¦
, Frequency (GHz)
PIN, Input Power (dBm)
Specifications subject to change without notice.
nNorth America: Tel. (800) 366-2266
nAsia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
nEurope: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
3
Visit www.macom.com for additional data sheets and product information.
3.6 V, 450 mW DECT RF Power Amplifier IC
MA02203AD
V 1.0
Output Power and Current vs. Supply Voltage
Harmonics
30
25
20
15
10
5
0.6
0.5
0.4
0.3
0.2
0.1
0
30
¦
o = 1.89 GHz
20
10
POUT
PIN = +2 dBm
VDD = 3.6 V
0
IDD
-10
-20
-30
-40
¦
=1.89 GHz
PIN = +2 dBm
0
2.8
3.0 3.2 3.4
3.6 3.8
4.0 4.2 4.4 4.6
¦ o
2¦ o
3¦ o
4¦ o
5¦ o
VDD, Supply Voltage (V)
Frequency
Output Power and Current vs. Frequency, Ts = -40oC
Output Power and Current vs. Frequency, Ts = +75oC
30
25
20
15
10
5
0.6
0.5
0.4
0.3
0.2
0.1
0
30
25
20
15
10
5
0.6
POUT
0.5
0.4
0.3
0.2
0.1
0
POUT
IDD
IDD
PIN = +2 dBm
VDD = 3.6 V
PIN = +2 dBm
VDD = 3.6 V
Ts = -40 °C
Ts = +75 °C
0
0
1.7
1.8
¦
1.9
, Frequency (GHz)
2
1.7
1.8
1.9
2
¦
, Frequency (GHz)
Output Power and Current vs. Temperature
Power Dissipation vs. Temperature
30
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.0
25
20
15
10
5
POUT
2.5
2.0
IDD
Slope = -1 / RTH J-S
1.5
1.0
0.5
0.0
PIN = +2 dBm
VDD = 3.6 V
0
-50
-25
0
25
50
75
0
25
50
75
100
125
150
175
TS, Operating Temperature (°C)
TS, Temperature at Solder Point of Pin 11 (°C)
Specifications subject to change without notice.
nNorth America: Tel. (800) 366-2266
nAsia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
nEurope: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
4
Visit www.macom.com for additional data sheets and product information.
3.6 V, 450 mW DECT RF Power Amplifier IC
MA02203AD
V 1.0
Application Schematic
+VDD
C1
C2
L1
L2
1
16
15
N/C
N/C
2
3
14
13
4
RF OUTPUT
RF INPUT
5
12
11
10
6
7
8
9
N/C
N/C
60mil GETEK Board
List of components:
C1 = C2 = 100 pF DLI multilayer ceramic chip capacitor (C11AH101K5TXL)
L1 = 8.2 nH Coilcraft chip inductor (1008CT.080XKBB)
L2 = 27 nH Coilcraft chip inductor (1008CS.270XKBB)
SOIC-16 Narrow Body Package
Dimensions in
millimeters
Dimensions in inches
Symbol
Min
1.35
0.10
Nom
1.60
Max
1.75
0.25
Min
Nom
Max
A
A1
A2
B
C
D
E
e
H
L
0.053
0.004
0.063
0.068
0.010
1.45
0.41
0.20
9.91
3.91
1.27
5.99
0.71
0.057
0.016
0.008
0.390
0.154
0.050
0.236
0.028
0.33
0.19
9.80
3.80
0.51
0.25
10.01
4.00
0.013
0.0075
0.386
0.150
0.020
0.0098
0.394
0.157
5.79
0.38
6.20
1.27
0.10
8°
0.228
0.015
0.244
0.050
0.004
8°
y
0°
0°
q
NOTES:
1.
2.
3.
4.
Controlling dimension: inch
Lead frame material: copper alloy C151
Lead thickness after solder plating will be 0.013" maximum
Dimension “D” does not include mold flash, protrusions or gate
burrs
5.
6.
Dimension “E” does not include interlead flash or protrusions
Tolerance: ±0.010" unless otherwise specified
Specifications subject to change without notice.
nNorth America: Tel. (800) 366-2266
nAsia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
nEurope: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
5
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