MA03503D_1 [TE]

Control Chip, Parallel Input Gain/Phase Control 8.0-11.0 GHz; 控制芯片,并行输入增益/相位控制8.0-11.0 GHz的
MA03503D_1
型号: MA03503D_1
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Control Chip, Parallel Input Gain/Phase Control 8.0-11.0 GHz
控制芯片,并行输入增益/相位控制8.0-11.0 GHz的

文件: 总6页 (文件大小:504K)
中文:  中文翻译
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Control Chip, Parallel Input Gain/Phase Control  
8.0-11.0 GHz  
MA03503D  
Rev A  
Preliminary Information  
Features  
6-bit Phase Shifter and 5-bit Attenuator  
Parallel Control Input  
50 Input and Output Impedance  
GaAs MSAG® Process  
Proven Manufacturability and Reliability  
No Airbridges  
Polyimide Scratch Protection  
No Hydrogen Poisoning Susceptibility  
Description  
The MA03503D is a parallel control input phase shifter/attenuator/buffer  
amplifier MMIC. The on-chip driver circuitry allows for control of the 6 phase  
and 5 attenuation bits using TTL/CMOS compatible voltage levels, and elimi-  
nates the need for complementary inputs. This product is fully matched to  
50 ohms on both the input and output.  
Primary Applications  
Radar Systems  
Fabricated using M/A-COM’s repeatable, high performance and highly reli-  
able GaAs Multifunction Self-Aligned Gate (MSAG®) Process, each device  
is 100% RF tested on wafer to ensure performance compliance.  
M/A-COM’s MSAG process features robust silicon-like manufacturing proc-  
esses, planar processing of ion implanted transistors, multiple implant capa-  
bility enabling power, low-noise, switch and digital FETs on a single chip,  
and polyimide scratch protection for ease of use with automated manufactur-  
ing processes. The use of refractory metals and the absence of platinum in  
the gate metal formulation prevents hydrogen poisoning when employed in  
hermetic packaging.  
Electrical Characteristics: TB = 25°C1, Z0 = 50, VDD = 5V, VGG = -4V, VEE = -4.0  
Parameter  
Symbol  
Minimum  
Typical  
Maximum  
Units  
Bandwidth  
f
8.0  
11.0  
GHz  
Gain  
Gn  
13  
18  
22.5  
dB  
1-dB Compression Point  
Input Return Loss  
P1dB  
IRL  
22  
16  
dBm  
dB  
10  
10  
Output Return Loss  
ORL  
16  
23  
dB  
dB  
Attenuation Range (5-bits, 0.75dB step)  
RMS Attenuation Error (Uncorrected)  
0.75 dB Attenuator Bit  
0.2  
0.8  
dB  
dB  
0.5  
1.0  
1.0  
2.0  
1.5 dB Attenuator Bit  
3 dB Attenuator Bit  
6 dB Attenuator Bit  
12 dB Attenuator Bit  
1.5  
3.0  
6.0  
12  
dB  
dB  
dB  
dB  
2.4  
3.6  
5.0  
7.0  
10.8  
13.2  
1. TB = MMIC Base Temperature  
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Control Chip, Parallel Input Gain/Phase Control  
8.0-11.0 GHz  
MA03503D  
Rev A  
Preliminary Information  
Electrical Characteristics: TB = 25°C, Z0 = 50Ω, VDD = 5V, VGG = -4V, VEE = -4.0  
Parameter  
Symbol  
Minimum  
Typical  
Maximum  
Units  
Phase Shift Range (6 bits, 5.6 degree step)  
360  
Deg  
RMS Phase Error (Uncorrected)  
5.6 Degree Bit  
2
5.3  
11.0  
22.0  
44.0  
90.0  
180  
+/-1.0  
28  
Deg  
Deg  
Deg  
Deg  
Deg  
Deg  
Deg  
dB  
4.0  
8.0  
7.0  
11.25 Degree Bit  
13.0  
24.0  
47.0  
95.0  
190  
22.5 Degree Bit  
19.0  
40.0  
85.0  
170  
45 Degree Bit  
90 Degree Bit  
180 Degree Bit  
Gain Variation over all Phase Shifter settings  
Output Third Order Intercept Point  
Noise Figure  
OTOI  
NF  
dBm  
dB  
10  
Drain Supply Current  
IDD  
160  
325  
1
500  
10  
mA  
mA  
mA  
mA  
mA  
nS  
Gate Supply Current  
IGG  
Digital Power Supply Current  
Input Logic High Current  
Input Logic Low Current  
Timing Delay-Enable Signal to Bit Change  
IEE  
15  
25  
0.5  
0.1  
25  
Absolute Maximum Conditions 2  
Parameter  
Symbol  
Absolute Maximum  
Units  
Input Power  
20  
8.0  
dBm  
V
PIN  
VDD  
VGG  
IDQ  
Drain Supply Voltage  
Gate Supply Voltage  
-6.0  
V
Quiescent Drain Current (No RF)  
Quiescent DC Power Dissipated (No RF)  
Digital Power Supply Voltage  
Junction Temperature  
500  
mA  
W
2.5  
PDISS  
VEE  
Tj  
-6.0  
V
180  
°C  
°C  
°C  
Storage Temperature  
TSTG  
-55 to +150  
310  
Die Attach Temperature  
2. Operation beyond these limits may result in permanent damage to the part.  
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Control Chip, Parallel Input Gain/Phase Control  
8.0-11.0 GHz  
MA03503D  
Rev A  
Preliminary Information  
Recommended Operating Conditions 3  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Drain Supply Voltage  
VDD  
4.0  
5.0  
6.0  
V
V
Gate Supply Voltage  
Digital Power Supply Voltage  
Input Logic High Voltage  
Input Logic Low Voltage  
Clock Frequency  
VGG  
VEE  
VIH  
VIL  
-4.5  
-4.2  
3.0  
-4.0  
-4.0  
3.5  
0.0  
20  
-3.5  
-3.8  
5.0  
V
V
0.0  
0.8  
V
FCLK  
TJ  
MHz  
ºC  
ºC  
Junction Temperature  
MMIC Base Temperature  
150  
TB  
Note 4  
3. Operation outside of these ranges may reduce product reliability.  
4. Maximum MMIC Base Temperature = 150°C— 31.8° * VDD * IDQ  
Operating Instructions  
This device is static sensitive. Please handle with  
care. To operate the device, follow these steps.  
1. Apply VGG = -4 V, VEE = -4V, VDD= 0 V.  
2. Ramp VDD to desired voltage, typically 5 V.  
3. Adjust VGG to set IDQ  
.
4. Set RF input.  
5. Power down in reverse. Turn VGG off last.  
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Control Chip, Parallel Input Gain/Phase Control  
8.0-11.0 GHz  
MA03503D  
Rev A  
Preliminary Information  
Typical Small Signal Characteristics (VDD=5V, VGG=-4V)  
- 10. 0  
- 12. 0  
- 14. 0  
- 16. 0  
- 18. 0  
- 20. 0  
- 22. 0  
22. 0  
21. 0  
20. 0  
19. 0  
18. 0  
17. 0  
16. 0  
15. 0  
14. 0  
S22:  
S11:  
8.0  
8. 5  
9. 0  
9. 5  
10.0  
10.5  
11.0  
Fr equency ( GHz )  
8.0  
8. 5  
9. 0  
9.5  
10.0  
10.5  
11. 0  
Fr equency ( GHz )  
Figure 2. Input and Output Match  
Figure 1. Gain  
4. 5  
4. 0  
3. 5  
3. 0  
2. 5  
2. 0  
1. 5  
1. 0  
0. 5  
0. 0  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0. 15  
0. 10  
0.05  
0.00  
8.0  
8. 5  
9. 0  
9.5  
10.0  
10.5  
11.0  
8.0  
8. 5  
9.0  
9.5  
10. 0  
10. 5  
11.0  
Fr equency ( GHz )  
Fr equency ( GHz )  
Figure 3. RMS Attenuation Error  
Figure 4. RMS Phase Error  
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
Visit www.macom.com for additional data sheets and product information.  
Control Chip, Parallel Input Gain/Phase Control  
8.0-11.0 GHz  
MA03503D  
Rev A  
Preliminary Information  
Mechanical Information  
Chip Size: 5.978 x 3.975 x 0.075 mm (236 x 157 x 3 mils)  
3.975mm.  
3.823mm.  
IN  
VGG  
3.224mm.  
3.174mm.  
DA1  
2.974mm.  
DA2  
2.774mm.  
DA3  
2.575mm.  
2.375mm.  
2.175mm.  
1.976mm.  
1.776mm.  
1.577mm.  
1.377mm.  
1.177mm.  
0.977mm.  
0.778mm.  
DA4  
DA5  
VEE  
+
GND  
DA6  
DA7  
DA8  
DA9  
DA10  
DA11  
VDD  
0.752mm.  
OUT  
0.153mm.  
0
0
Bond Pad Dimensions  
Pad  
Size (mils)  
6 x 6  
Size (μm)  
150 x 150  
150 x 150  
150 x 150  
RF In and Out  
DC Supply Voltages  
DC Control Voltages  
6 x 6  
6 x 6  
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  
Control Chip, Parallel Input Gain/Phase Control  
8.0-11.0 GHz  
MA03503D  
Rev A  
Preliminary Information  
Assembly and Bonding Diagram  
100 pF  
100 pF  
VGG  
VDD  
0.1 μF  
0.1 μF  
RFOUT  
RFIN  
DATA  
11  
100 pF  
VEE  
0.1 μF  
Figure 5. Recommended bonding diagram.  
Support circuitry typical of MMIC characterization fixture for CW testing.  
Assembly Instructions:  
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.  
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For  
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of  
shortest length, although ball bonds are also acceptable.  
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent  
damage to amplifier.  
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  

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