MA46H120 [TE]

GaAs Constant Gamma Flip- Chip Varactor Diode; 砷化镓恒伽玛倒装变容二极管
MA46H120
型号: MA46H120
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

GaAs Constant Gamma Flip- Chip Varactor Diode
砷化镓恒伽玛倒装变容二极管

二极管 变容二极管
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MA46H120  
GaAs Constant Gamma Flip-  
Chip Varactor Diode  
Features  
Chip Layout  
·
·
·
·
·
·
Constant Gamma for Linear Tuning  
Low Parasitic Capacitance  
High Q  
Silicon Nitride Passivation  
Polyimide Scratch Protection  
Surface Mount Configuration  
TOP VIEW  
Description  
M/A-COM’s MA46H120 is a gallium arsenide flip chip  
hyperabrupt varactor diode. These devices are fabricated on  
OMCVD epitaxial wafers using a process designed for high  
device uniformity and extremely low parasitics.  
The  
MA46H120 diodes are fully passivated with silicon nitride  
and have an additional layer of polyimide for scratch  
protection. The protective coatings prevent damage to the  
junction during automated or manual handling. The flip chip  
configuration is suitable for pick and place insertion.  
BOTTOM VIEW  
Applications  
The MA46H120 hyperabrupt GaAs tuning varactor is  
designed for wide bandwidth VCOs and voltage tuned filters  
where large capacitance change versus tuning voltage and  
high Q are required. With a constant gamma of 1.0, these  
diodes are particularly useful where highly predictable  
frequency tuning is required.  
Electrical Specifications @ T = +25° C  
A
Breakdown Voltage @ IR = 10 m A, VB = 15V Minimum  
CT  
(pF)  
CT  
CT  
Q Factor  
Gamma  
(pF)  
(pF)  
f=1MHz, VR=0V  
f=1MHz, VR=4V  
Min Typ Max  
f=1MHz, VR=10V  
Min Typ Max  
0.20 3000  
f=50MHz, VR=4V  
VR=2-12V  
Typ  
Min  
Typ Max  
Min Typ Max  
Min  
Max  
MA46H120  
1.1  
0.30  
0.40 0.14  
0.9  
1.1  
V3.00  
M/A-COM Division Of AMP Incorporated n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087  
n Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020  
www.macom.com  
AMP and Connecting at a Higher Level are trademarks.  
Specifications subject to change without notice.  
GaAs Constant Gamma Flip-Chip Varactor Diode  
MA46H120  
Chip Outline Drawing  
Typical Performance Curve  
(ODS-1203)  
CAPACITANCE vs VOLTAGE  
Gamma = 1.0 ± 10% from 2 - 12 Volts  
1
0.1  
1
10  
100  
REVERSE VOLTAGE (V)  
INCHES  
MIN  
MM  
Absolute Maximum Ratings1  
DIM  
A
MAX  
.027  
.015  
.008  
.009  
.006  
.020  
MIN  
.64  
.32  
.15  
.17  
.10  
.45  
MAX  
.69  
.37  
.20  
.22  
.15  
.50  
Parameter  
Maximum Ratings  
-40°C to +125°C  
-65°C to +150°C  
100 mW  
.025  
.012  
.006  
.007  
.004  
.018  
Operating Temperature  
Storage Temperature  
Power Dissipation  
Mounting Temperature  
B
C
+235°C for 10 seconds  
1. Exceeding these limits may cause permanent damage.  
D
E
F
Mounting Techniques  
Handling Procedures  
These chips were designed to be inserted onto hard or soft  
substrates with the junction side down. They can be  
mounted with conductive epoxy or with a low temperature  
solder preform. The die can also be assembled with the  
junction side up, and wire or ribbon bonds made to the pads.  
The following precautions should be observed to avoid  
damaging GaAs Flip-Chips:  
Cleanliness  
These chips should be handled in a clean environment. Do  
not attempt to clean die after installation.  
Solder Die Attachment  
Solder which does not scavenge gold, such as Indalloy #2, is  
recommended. Sn-Pb based solders are not recommended  
due to solder embrittlement. Do not expose die to a  
temperature greater than 235°C, or greater than 200°C for  
longer than 10 seconds. No more than three seconds of  
scrub should be required for attachment.  
Static Sensitivity  
Varactor diodes are ESD sensitive and can be damaged by  
static electricity. Proper ESD techniques should be followed  
to when handling these devices.  
General Handling  
The protective polymer coating on the active areas of these  
dice provides scratch protection, particularly for the metal  
airbridge which contacts the anode. Dice can be handled  
with tweezers or vacuum pickups and are suitable for use  
with automatic pick-and-place equipment.  
Epoxy Die Attachment  
Assembly can be preheated to 125 - 150°C. Use a minimum  
amount of epoxy. Cure epoxy per manufacturer’s schedule.  
For extended cure times, temperatures must be kept below  
200°C.  
V3.00  
M/A-COM Division Of AMP Incorporated n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087  
n Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020  
www.macom.com  
AMP and Connecting at a Higher Level are trademarks.  
Specifications subject to change without notice.  

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