MA4GP030-277 [TE]
GaAs PIN Diode Chips; 的GaAs PIN二极管芯片
| 型号： | MA4GP030-277 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | GaAs PIN Diode Chips |
| 文件： | 总6页 (文件大小：333K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GaAs PIN Diode Chips
Rev. V1
RoHS Compliant
Features
Anode
♦ May Be Directly Driven By TTL Signals
♦ RoHS Compliant
♦ Low Series Resistance
♦ Fast Switching Speed
♦ No Reverse Bias Required
Description
Gallium Arsenide PIN diodes offer improved
performance characteristics over silicon in many
microwave semiconductor applications These
benefits result from the intrinsic semiconductor
properties of GaAs. Its inherent high carrier mobility
results in a low resistance fast switching device. The
low carrier concentration in the I region layer
produces a near zero punch through bias voltage.
Gallium Arsenide's high band gap also assures it will
operate at high operating temperatures.
Full Area Cathode
Switching speeds in the low nanosecond range
using an inexpensive TTL buffer logic is attainable
with GaAs PIN diodes. This performance can be
achieved because GaAs PIN diodes exhibit high
impedance at a positive bias (up to .5V). Reverse
bias is not required for many GaAs PIN diode
applications. Low loss, in switch and phase shifter
circuits at frequencies up to 40 GHz is possible as a
result of low parasitic series resistance in the
conducting and non-conducting states.
MIL-STD 750 Environmental Ratings
M/A-COM’s GaAs PIN diode chips are also available
in several different package styles. See page 4
Method
Parameter
Level
Absolute Maximum Ratings1
5cycles
-65°C to +150°C
Temp. Cycling
1051
Parameter
Maximum Value
-65°C to +175°C
-65°C to +175°C
0.25W @ 25°C
Vibration
2056
2006
15g’s
Operating Temperature
Storage Temperature
Power Dissipation
Constant Acceleration
20,000g”s
Moisture Resistance
(Packaged diodes)
1021
10 Days
Junction Temperature
Mounting Temperature
+175°C
+320°C for 10 seconds
1. Exceeding these limits may cause permanent damage.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
GaAs PIN Diode Chips
Rev. V1
RoHS Compliant
GaAs Chip Specification @ TAMB = +25°C
Nominal Characteristics
Max. Rev.
Volt.1
Max. Cap.
1 MHz
Cj @ -10 V
Max. Series Res. 2 Carrier Lifetime
Switching Speed 3
Part Number
1 GHz
RS @ 20 mA
TL @ IFOR = 10 mA
IREV = 6 mA
7 GHz
VR < 10 µA
ηS
VDC
pF
Ω
ηS
MA4GP022-277
MA4GP030-277
50
0.15
1.0
5
15
25
100
0.06
2.0
10
Notes:
1. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10µA.
2. Chip is mounted into case style ODS 30 ceramic package.
3. Switching speed is measured between 1 dB and 20 dB loss in a shunt mounted switch
Case Style 277 (Chip)
Typical TTL Driver Circuit
A
B
B
C
Anode
Mils
7 ± .5
Dimension
Millimeters
A
B
C
.178 ± .013
.279 ± .025
.056 ± .008
11 ± 1
2.2 ± .3
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
GaAs PIN Diode Chips
Rev. V1
RoHS Compliant
Typical Performance @ TAMB = +25°C
MA4GP022
MA4GP030
Figure 3. Typical Capacitance vs. Voltage at 1 GHz
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
GaAs PIN Diode Chips
Rev. V1
RoHS Compliant
Ordering Information
The GaAs Chip specifications shown in the table on page 2 are for the stand alone die, package style 277. Note that the
table lists the bare die junction capacitance and that the total capacitance for the base part in an alternative package will
differ. The total capacitance in an alternative package can be computed by adding the capacitance shown in the table
on page 2 to the parasitic capacitance of the alternative package as defined in the Package Parasitic Capacitance
table below. The base part numbers are only available in the case styles shown in the Package Availability Table
below. To order, indicate the base part number followed by a dash and the desired package style.
For example: The MA4GP030-30 is the MA4GP030 chip in the 30 style package.
Package Parasitic Capacitance
Package Style Inductance (nH)
Cap. (pF)
30
120
137
276
277
1056
0.40
0.40
0.40
0.18
0.13
0.13
Style 120
0.40
0.13
B
N/A (Chip)
0.20
N/A (Chip)
0.20
A
Package Availability Table
Dimension
Mils
Millimeters
A
B
53 ± 2
45 ± 5
1346 ± 51
Base Part Number
Available Package Styles
1143 ± 127
MA4GP022
MA4GP030
137, 277
30, 120, 276, 277, 1056
Style 30
Style 137
B
A
C
F
E
B
Cathode
G
D
C
E
D
G
H
A
Dimension
Mils
Millimeters
A
B
C
D
E
F
100 ± 10
20 ± 2
2540 ± 254
508 ± 51
Dimension
Mils
Millimeters
100 ± 5
4 ± 1
2540 ± 127
102 ± 25
A
B
C
D
E
F
121 ± 4
62 ± 2
215 ± 10
91 ± 6
62 ± 2
62 ± 2
20 ± 4
81 ± 2
3073 ± 102
1575 ± 51
5461 ± 254
2311 ± 152
1575 ± 51
1575 ± 51
508 ± 102
2057 ± 51
50 max.
1270 max.
G
14 max.
356 max.
G
H
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
GaAs PIN Diode Chips
Rev. V1
RoHS Compliant
Package Styles
Style 137
Style 1056
A
C
B
Cathode
A
A
E
Cathode
D
F
Dimension
Mils
100 ± 10
20 ± 2
Millimeters
B
A
B
C
D
E
F
2540 ± 254
D
E
508 ± 51
100 ± 5
4 ± 1
2540 ± 127
102 ± 25
F
50 max.
14 max.
1270 max.
356 max.
C
Dimension
Mils
Millimeters
A
B
C
D
E
F
70 ± 5
37 ± 4
33 ± 3
15 ± 2
12 ± 2
48 ± 5
1778 ± 127
940 ± 102
838 ± 76
Style 276
A
B
381 ± 51
305 ± 51
1219 ± 127
C
D
F
E
Dimension
Mils
15 ± 5
45 ± 5
5 max.
53 ± 2
200 min.
20 ± 1
Millimeters
381 ± 127
1143 ± 127
127 max.
A
B
C
D
E
F
1346 ± 51
5080 min.
508 ± 25
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
GaAs PIN Diode Chips
Rev. V1
RoHS Compliant
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk handling should ensure that abrasion and
mechanical shock are minimized.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform or electrically
conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of con-
tamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas is applied, the work area temperature should be approximately
290oC. The chip should not be exposed to temperatures greater than 320oC for more than 10
seconds.
Eutectic Die Attachment Using Reflow Oven: See Application Note M541, “Bonding and Handling
Procedures for Chip Diode Devices” at www.macom.com for recommended time-temperature profile.
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to
ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for
1 hour.
Wire and Ribbon Bonding: It is recommended that thermo-compression or thermo-sonic bonding
be used with little or no ultrasonics. The bonding tool and wire or ribbon used should be smaller than
the anode contact diameter. A bonder heat stage temperature setting of 200oC, tool tip temperature
of 150°C and a force of 18 to 50 grams is suggested. If ultrasonic scrubbing is necessary it should be
adjusted to the minimum required to achieve a good bond. Excessive energy may cause the anode
metallization to separate from the chip.
For more detailed handling and assembly instructions, see Application Note M541,
“Bonding and Handling Procedures for Chip Diode Devices” at www.macom.com.
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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