MA4P1450-1091T [TE]
High Power PIN Diodes; 大功率PIN二极管
| 型号： | MA4P1450-1091T |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | High Power PIN Diodes |
| 文件： | 总12页 (文件大小：1494K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MA4P HIPAX™
High Power PIN Diodes
V9
Package Styles
Features
♦
♦
♦
♦
♦
♦
♦
♦
♦
High Power Handling
Low Loss / Low Distortion
Voltage Ratings up to 1000 Volts
Passivated Chip for Low Leakage Current
Low Theta (θ) Due to Full Face Chip Bonding
Leadless Low Inductance MELF Packages
Various Package Options
Available as Chips
Fully RoHS Compliant
401 & 402
1072 & 1091
Description
Applications
M/A-COM Technology Solutions MELF and HIPAX
PIN diode series are designed for usage in switch
and attenuator applications requiring high power
handling and low distortion. The MELF and HIPAX
PIN diodes incorporate a fully passivated PIN diode
chip resulting in an extremely low reverse bias
leakage current. The semiconductor technology
utilized in the MELF and HIPAX families draws on
M/A-COM’s substantial experience in PIN diode
design and wafer fabrication. The result is a device
which has a thick I-region and long carrier lifetime
while maintaining low series resistance and
capacitance values. The chips of the MELF and
HIPAX PIN diodes are enclosed in a rugged
ceramic package and is full face bonded to metal
pins on both the anode and cathode. The result is a
low loss PIN diode with low thermal resistance due
to symmetrical thermal paths. The parts are offered
in either a HIPAX , axial leaded or Metal Electrode
Leadless Faced (MELF) surface mount packages
that have a rectangular outline. These rectangular
SMQ, PIN diodes are designed for high volume tape
and reel assembly. This easy to use package
design makes automatic pick and place, indexing
and assembly, extremely easy. The parallel flat
surfaces are suitable for most key jaw or vacuum
pick-up techniques. All solderable surfaces are tin
plated and compatible with industry standard reflow
and vapor phase soldering processes.
HIPAX PIN diodes are designed for use in a wide
variety of switch and attenuator applications from HF
through UHF frequencies and at power levels above
1kW, CW. The internal chip as well as each diode
assembly has been comprehensively tested and
characterized to ensure predictable and repeatable
performance.
Design Recommendations
♦Low Distortion Attenuators
•MA4P4301B
♦Surface Mount Switches
•MA4P7101F
♦Cellular Radio Antenna Switches
• MA4P1200, MA4P1250
Absolute Maximum Ratings
TAMB = +25°C (Unless Otherwise Noted) 1,2
Parameter
Absolute Maximum
D.C. Reverse Voltage
(See Tables)
Operating Chip Junction
Temperature
-55°C to +175°C
Storage Temperature
-55°C to +200°C
Installation Temperature
+280°C for 30 Seconds
Notes
1.Operation of this device above any one of these
parameters may cause permanent damage.
2.Please refer to application note M538 for surface
mounting instructions.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
1
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
MA4P1000 Series Electrical Specifications @ TAMB = +25°C
RS
RP
VR
Reverse Voltage
VDC
CT
Total Capacitance
pF
Series Resistance
Parallel Resistance
Ω
kΩ
Conditions
Conditions
Conditions
Part Number
Condition
f = 1 MHz
VR = 50 V
f = 100 MHz
IF = 50 mA
f = 100 MHz
VR = 0 V
IR = 10 μA
MAXIMUM
MINIMUM
TYPICAL MAXIMUM TYPICAL MAXIMUM
MINIMUM
RATING
MA4P1200 - 401T
MA4P1250 -1072T
MA4P1450 -1091T
50
50
50
100
100
100
1.2
0.8
1.8
1.5
1.2
2.5
0.5
0.5
0.5
0.75
0.75
0.75
5
5
5
VF
TL
Forward Bias
Reverse Bias
Forward Voltage
Carrier Lifetime
Harmonic Distortion Harmonic Distortion
R(2a/a) * R(3a/a)
R(2a/a) – R(3a/a)
Conditions
Conditions
Conditions
Condition
IF = 50 mA
Part Number
IF = 10 mA
IR = 6 mA
f = 100 MHz
PIN = 30 W
f = 100 MHz
PIN = 0 dBm
MAXIMUM 2
RATING
TYPICAL
MINIMUM TYPICAL MINIMUM TYPICAL MINIMUM TYPICAL
MA4P1200 - 401T1
MA4P1250 -1072T1
MA4P1450 -1091T1
0.85
0.85
0.85
1.0
2
2
2
8
8
8
80
80
80
90
90
90
60
60
60
70
70
70
1.0
1.0
* Notes: 1.) Also available in a non-magnetic package for MRI applications. Same electrical specifications as above.
Non-magnetic version of the MA4P1200 - 401T = MA4P1200NM - 401T
Non-magnetic version of the MA4P1250 - 1072T = MA4P1250NM -1072T
2.) Maximum forward current for all devices @ 1V is 1.5A
Power Dissipation and Thermal Resistance Ratings @ TAMB = +25°C
MA4P1200-401T
MA4P1250-1072T
MA4P1450-1091T
Package
Style
CONDITION
PDISS
1.5 W
5.5W
θJC
PDISS
—
θJC
—
PDISS
—
θJC
—
No Heatsink
Lead Length 1/4"
No Heatsink
B
15°C/W
Axial Lead
—
—
—
—
6W
18W
10W
30W
F
15°C/W
5°C/W
MELF
Infinite Heatsink
Specifications subject to change without notice
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
2
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Typical Performance Curves @ TAMB = +25°C
MA4P1200 Series
Capacitance vs. Frequency & Reverse Bias
Series Resistance @ 100 MHz vs. Forward Current
pF
Ω
MHz
Frequency
Forward Current
Heatsink Temperature vs. Max. Power Dissipation
Parallel Resistance vs. Frequency & Reverse Bias
Ω
MHz
Frequency
°C
Heatsink Temperature
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
3
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Typical Performance Curves @ TAMB = +25°C
MA4P1250 Series
Series Resistance @ 100 MHz vs. Forward Current
Capacitance vs. Frequency & Reverse Bias
pF
Ω
MHz
Forward Current
Frequency
Parallel Resistance vs. Frequency & Reverse Bias
Carrier Lifetime vs. Forward Bias Current
Ω
MHz
Frequency
Forward Current
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
4
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Typical Performance Curves @ TAMB = +25°C
MA4P1450 Series
Capacitance vs. Frequency and Reverse Bias
Series Resistance @ 100 MHz vs. Forward Current
pF
Ω
MHz
Frequency
Forward Current
Parallel Resistance vs. Frequency and Reverse Bias
Ω
MHz
Frequency
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
5
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
MA4P4000 - MA4P7000 Series Electrical Specifications @ TAMB = +25°C
MA4P4000 MA4P4300
MA4P7000 MA4P7100
Parameter
Symbol
RS
Condition
Series
Series
Series
Series
IF = 100 mA
f = 100 MHz
VR = 100 V
f = 1 MHz
Maximum Series Resistance
Maximum Total Capacitance
Minimum Parallel Resistance
0.5 Ω
1.0 Ω
0.9 Ω
0.5 Ω
CT
2.2 pF
2.0 pF
0.7 pF
1.0 pF
VR = 100 V
f = 100 MHz
RP
20 kΩ
50 kΩ
200 kΩ
100 kΩ
IF = 10 mA
IR = 6 mA
Minimum Carrier Lifetime
Maximum Forward Voltage
Maximum Reverse Current
Nominal I-Region Width
TL
VF
IR
6 µs
1.0 V
8 µs
1.2 V
3 µs
1.0 V
2.5 µs
1.0 V
IF = 100 mA
At Maximum Rated
Reverse Voltage
1 µA
1 µA
1 µA
1 µA
μ
—
175 µm
300 µm
175 µm
100 µm
Maximum Rated Reverse Voltage ( VR ) vs. Model Numbers
Maximum Rated
Reverse
MA4P4000
Series
MA4P4300
Series
MA4P7000
Series
MA4P7100
Series
MA4P4001B-402
MA4P4001F-1091T
MA4P4002B-402
MA4P4002F-1091T
MA4P4301B-402
MA4P4301F-1091T
MA4P7101B-401/401T
MA4P7101F-1072T
MA4P7102B-401/401T
100 Volts
200 Volts
400 Volts
600 Volts
MA4P7001F-1072T
MA4P7002B-401T
—
—
—
MA4P7002F-1072T MA4P7102F-1072T
MA4P7104B-401/401T
MA4P7104F-1072T
—
—
MA4P4006B-402
MA4P4006F-1091T
MA4P7006B-401T
MA4P7006F-1072T
—
Power Dissipation and Thermal Resistance Ratings @ TAMB = +25°C
MA4P4000
Series
MA4P4300
Series
MA4P7000
Series
MA4P7100
Series
Package Style
Condition
PDISS
θJC
PDISS
θJC
PDISS
θJC
PDISS
θJC
1/4” Lead Length
12 W 12.5°C/W 10 W 15°C/W
5 W
30°C/W
6 W
25°C/W
B
Axial Leaded
No Heatsink
Infinite Heatsink
Single 1 µs pulse
2.5 W
7.5 W
—
20°C/W
—
2.5 W
5 W
—
30°C/W
—
1.5 W
3 W
—
50°C/W
—
1.5 W
3 W
—
50°C/W
—
F
MELF
Both B and F
100 kW
100 kW
15 kW
15 kW
Both B and F
Single 100 µs pulse
5 kW 0.03°C/W 5 kW 0.03°C/W 300 W 0.5°C/W 300 W 0.5°C/W
*Specifications subject to change without notice
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
6
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Typical Performance Curves @ TAMB = +25°C
MA4P4000,MA4P4300, MA4P7000, MA4P7100 Series
Series Resistance at 100 MHz vs. Forward Current
MA4P4000, MA4P4300 Series
Series Resistance at 100 MHz vs. Forward Current
MA4P7000, MA4P7100 Series
Ω
Ω
Forward Current
Forward Current
Carrier Lifetime vs. Forward Bias Current
Thermal Resistance vs. Pulse Width
MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series
MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series
µS
°C/W
Forward Current
Pulse Width
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
7
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Typical Performance Curves @ TAMB = +25°C
MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series
Capacitance vs. Frequency & Reverse Bias
Capacitance vs. Frequency & Reverse Bias
MA4P4000 Series
MA4P4300 Series
pF
pF
MHz
Frequency
MHz
Frequency
Capacitance vs. Frequency & Reverse Bias
MA4P7100 Series
Capacitance vs. Frequency & Reverse Bias
MA4P7000 Series
pF
pF
MHz
MHz
Frequency
Frequency
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
8
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Typical Performance Curves @ TAMB = +25°C
MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series
Parallel Resistance vs. Reverse Bias & Frequency
MA4P4000 Series
Parallel Resistance vs. Reverse Bias & Frequency
MA4P4300 Series
Ω
Ω
Volts
Volts
Reverse Bias
Reverse Bias
Parallel Resistance vs. Reverse Bias & Frequency
MA4P7000 Series
Parallel Resistance vs. Reverse Bias & Frequency
MA4P7100 Series
Ω
Ω
Volts
Volts
Reverse Bias
Reverse Bias
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
9
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Case Styles
401 Axial Leaded Packages
402 Axial Leaded Packages
Cathode Band
B
D
C
C
A
Parts Available
in
401 Package
(tape and reel)
INCHES
MM
Parts Available
in
402 Package
(bulk only)
INCHES
MM
MIN. MAX MIN. MAX.
MIN. MAX MIN. MAX.
A
B
C
D
—
—
0.130
0.090
—
—
3.30
2.29
—
MA4P7002B-401T
MA4P7006B-401T
MA4P7101B-401T
MA4P7102B-401T
MA4P7104B-401T
A
—
0.230
0.140
—
5.84
MA4P4001B-402
MA4P4002B-402
MA4P4006B-402
MA4P4301B-402
B
C
D
—
—
3.56
—
0.975
24.77
0.975
24.64
0.027 0.029 0.69
0.74
0.039 0.041 0.76 1.02
1091 MELF Surface Mount Packages
1072 MELF Surface Mount Packages
Parts Available
in
1091 Package
(tape and reel
only)
Parts Available
In
1072 Package
(tape and reel only)
INCHES
MM
INCHES
MM
MIN. MAX. MIN. MAX.
MIN. MAX. MIN. MAX.
0.080 0.095 2.032 2.413
0.115 0.135 2.921 3.429
MA4P7001F-1072T
MA4P7002F-1072T
MA4P7006F-1072T
MA4P7101F-1072T
MA4P7104F-1072T
A
0.138 0.155 3.51 3.94
A
B
MA4P4001F-1091T
MA4P4002F-1091T
MA4P4006F-1091T
MA4P4301F-1091T
B
C
0.180 0.200 4.57 5.08
0.008 0.030 0.203 0.762
C 0.008 0.030 0.203 0.762
*Specifications subject to change without notice
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
10
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
MELF Assembly Recommendations
♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable sur-
faces of MELF devices are tin plated 50 μM thick to ensure an optimum connection.
♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website.
MELF Internal Construction
Circuit Pad Layout for MELF Diodes
Package Style
1072
Package Style
1091
Dimension
inches
mm
inches
mm
A
B
C
0.093
0.050
0.060
2.36
1.27
1.52
0.150
0.050
0.100
3.81
1.27
2.54
Ordering Information
MELF diodes are available in tape and reel in quantities as shown in table below
Quantity
Package Style
Bulk Devices Per Bag
7” Reel
1500
500
1072T
1091T
N/A
N/A
Tape and reel information can be found on the M/A-COM website at http://www.macomtech.com/Application Notes/pdf/M513.pdf
*Specifications subject to change without notice
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
11
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4P HIPAX™
High Power PIN Diodes
V9
Axial Leaded HIPAX Assembly Recommendations
♦ Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming the
bend no closer than .060 inches from the body of the part. Bending the lead < 0.060 inches from the body of the part
is not recommended and may cause internal damage to the chip. Appropriate fixturing should be used.
♦ Devices may be soldered using standard 60Sn/40Pb or any RoHS compliant solders. Axial leads are tin plated 50μm
thick to ensure an optimum connection.
♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website.
Case Style 401 & 402
Internal Construction
Case Style 401 & 402
Minimum Bend Distance
Cathode Band
Passivated Chip
.060” Min
.060” Min
Ordering Information
Axial leaded diodes are available in tape and reel or bulk in quantities as shown in table below
Package Style
Quantity Per Reel
Bulk Devices Per Bag
401T
402
500
N/A
N/A
100
Environmental Ratings
HIPAX PIN diodes are designed to meet most environmental and electrical requirements and may be ordered
screened to MIL-STD-750 specifications as described in the table below.
TEST
METHOD
DESCRIPTION/ CONDITIONS
Moisture Resistance
High Temperature Storage
HTRB
1021
1031
85°C, 85% Relative Humidity, 168 hrs
+175°C , 250 Hours
1038
80% of rated VR, 50°C, 96 Hours
-65°C to +175°C, 20 Cycles
1 X 10-7 CC/Sec
Temperature Shock
Fine Leak
1051
1071 Cond. H
2006
Constant Acceleration
Solderability
20,000 G’s
2026
IPC/JDEC J-STD-02
Tension1
Lead Fatigue1
2036.3 Cond. A
2036.3 Cond. E
2 Lbs., 30 Seconds
3 Cycles, 8 oz., 90°,
Note:
1.Test applicable to HIPAX axially leaded devices only.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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