MA4P4002B-402 [TE]

DIODE PIN CERAMIC AXIAL HI-PAX;
MA4P4002B-402
型号: MA4P4002B-402
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

DIODE PIN CERAMIC AXIAL HI-PAX

衰减器 开关 二极管
文件: 总13页 (文件大小:2305K)
中文:  中文翻译
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MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Features  
Package Styles  
High Power Handling  
Low Loss / Low Distortion  
Voltage Ratings up to 1000 Volts  
Passivated Chip for Low Leakage Current  
Low Theta (θ) Due to Full Face Chip Bonding  
Leadless Low Inductance MELF Packages  
Various Package Options  
Available as Chips  
Fully RoHS Compliant  
Non-Magnetic Packages Available for MRI  
401 & 402  
1072 & 1091  
Description  
Applications  
The MELF and HIPAX PIN diode series are  
designed for usage in switch and attenuator  
applications requiring high power handling and low  
HIPAX PIN diodes are designed for use in a wide  
variety of switch and attenuator applications from  
HF through UHF frequencies and at power levels  
above 1 kW, CW. The internal chip as well as each  
diode assembly has been comprehensively tested  
and characterized to ensure predictable and  
repeatable performance.  
distortion. These diodes incorporate  
a
fully  
passivated PIN diode chip resulting in an extremely  
low reverse bias leakage current. The  
semiconductor technology utilized in the MELF and  
HIPAX families draws on MACOM ’s substantial  
experience in PIN diode design and wafer  
fabrication. The result is a device which has a thick  
I-region and long carrier lifetime while maintaining  
low series resistance and capacitance values. The  
chips of the MELF and HIPAX PIN diodes are  
enclosed in a rugged ceramic package and is full  
face bonded to metal pins on both the anode and  
cathode. The result is a low loss PIN diode with low  
thermal resistance due to symmetrical thermal  
paths. The parts are offered in either magnetic or  
non-magnetic, HIPAX (axial leaded) or MELF (Metal  
Electrode Leadless Faced) surface mount packages  
for MRI applications. The MELF is a rectangular  
SMQ, package which is designed for high volume  
tape and reel assembly. This easy to use package  
design makes automatic pick and place, indexing  
and assembly, extremely easy. The parallel flat sur-  
faces are suitable for most key jaw or vacuum pick-  
up techniques. All of the solderable surfaces are tin  
plated and compatible with industry standard reflow  
and vapor phase soldering processes. See Applica-  
tion Note M538 for a typical solder reflow profile.  
Design Recommendations  
Low Distortion Attenuators  
MA4P4301B  
Surface Mount Switches  
MA4P7101F  
Cellular Radio Antenna Switches  
MA4P1200, MA4P1250  
Absolute Maximum Ratings  
TA = +25°C (Unless Otherwise Noted)1  
Parameter  
Absolute Maximum  
DC Reverse Voltage (VR)  
(See Tables)  
Operating Chip Junction  
Temperature  
-55°C to +175°C  
Storage Temperature  
Installation Temperature  
ESD  
-55°C to +200°C  
+280°C for 30 Seconds  
Class 1A, HBM  
Many of MACOM’s HIPAX PIN diodes are also  
available as chips. Please consult the “Silicon PIN  
Chip Datasheet” for availability and specifications.  
Notes  
1.Operation of this device above any one of these  
parameters may cause permanent damage.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
MA4P1000 Series Electrical Specifications @ TA = +25°C  
CT  
Total Capacitance  
pF  
VR  
Reverse Voltage  
VDC  
RS  
Series Resistance  
W
RP  
Parallel Resistance  
kW  
Part #  
(NM Indicates Non-  
Magnetic)  
VR = 50 V, 1 MHz  
IR = 10 mA  
IF = 50 mA, 100 MHz  
VR = 0 V, 100 MHz  
Min.  
Typ.  
Max.  
Min.  
Max.  
Typ.  
Max.  
MA4P1200 - 401T  
MA4P1200NM - 401T  
MA4P1250 -1072T  
1.2  
1.2  
0.8  
1.5  
1.5  
1.2  
50  
100  
0.5  
0.75  
5
MA4P1250NM -1072T  
MA4P1450 -1091T  
0.8  
1.8  
1.2  
2.5  
VF  
TL  
Forward Bias  
Reverse Bias  
Forward Voltage  
(Max. I Forward @ 1V ≤  
Carrier Lifetime  
Harmonic Distortion Harmonic Distortion  
R(2a/a) * R(3a/a) R(2a/a) R(3a/a)  
Part #  
PIN = 30 W, 100 MHz PIN = 0 dBm, VR = 0 V,  
IF = 50 mA 100 MHz  
(NM Indicates Non-  
Magnetic)  
IF = 50 mA  
IF = 10 mA, IR = 6 mA  
Typ.  
Max.  
Min.  
Typ.  
Min.  
Typ.  
Min.  
Typ.  
MA4P1200 - 401T  
MA4P1200NM - 401T  
MA4P1250 -1072T  
MA4P1250NM-1072T  
MA4P1450 -1091T  
0.85  
1.0  
2
8
80  
90  
60  
70  
*Notes:  
1.) “NM” in the base part number signifies non-magnetic package.  
2.) “T” suffix denotes tape and reel  
Power Dissipation and Thermal Resistance Ratings @ TA = +25°C  
MA4P1200(NM)-401T  
MA4P1250(NM)-1072T  
MA4P1450-1091T  
Package  
Style  
Condition  
PDISS  
1.5 W  
5.5 W  
θJC  
PDISS  
θJC  
PDISS  
θJC  
No Heatsink  
Lead Length 1/4"  
No Heatsink  
B
15°C/W  
Axial Lead  
6 W  
18 W  
10 W  
30 W  
F
15°C/W  
5°C/W  
MELF  
Infinite Heatsink  
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Typical Performance Curves @ TA = +25°C  
MA4P1200 Series  
Capacitance vs. Frequency & Reverse Bias  
Series Resistance @ 100 MHz vs. Forward Current  
pF  
Ω
MHz  
Frequency  
Forward Current  
Heatsink Temperature vs. Max. Power Dissipation  
Parallel Resistance vs. Frequency & Reverse Bias  
Ω
MHz  
Frequency  
°C  
Heatsink Temperature  
3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Typical Performance Curves @ TA = +25°C  
MA4P1250 Series  
Series Resistance @ 100 MHz vs. Forward Current  
Capacitance vs. Frequency & Reverse Bias  
pF  
Ω
MHz  
Forward Current  
Frequency  
Parallel Resistance vs. Frequency & Reverse Bias  
Carrier Lifetime vs. Forward Bias Current  
Ω
MHz  
Frequency  
Forward Current  
4
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Typical Performance Curves @ TA = +25°C  
MA4P1450 Series  
Capacitance vs. Frequency and Reverse Bias  
Series Resistance @ 100 MHz vs. Forward Current  
pF  
Ω
MHz  
Frequency  
Forward Current  
Parallel Resistance vs. Frequency and Reverse Bias  
Ω
MHz  
Frequency  
5
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
MA4P4000 - MA4P7100 Series Electrical Specifications @ TA = +25°C  
MA4P4000 MA4P4300  
MA4P7000  
Series  
MA4P7100  
Series  
Parameter  
Symbol  
Condition  
Series  
0.5 Ω  
2.2 pF  
20 kΩ  
20 µs  
1.0 V  
1 µA  
Series  
1.0 Ω  
2.0 pF  
50 kΩ  
15 µs  
1.2 V  
1 µA  
Maximum Series Resistance  
Maximum Total Capacitance  
Minimum Parallel Resistance  
Minimum Carrier Lifetime  
Maximum Forward Voltage  
Maximum Reverse Current  
RS  
CT  
RP  
TL  
VF  
IR  
IF = 100 mA  
VR = 100 V  
0.9 Ω  
0.7 pF  
200 kΩ  
5 µs  
0.5 Ω  
1.0 pF  
100 kΩ  
2.5 µs  
1.0 V  
VR = 100 V  
IF = 10 mA  
IF = 100 mA  
1.0 V  
1 µA  
At max. rated voltage  
1 µA  
Nominal I-Region Width  
μ
175 µm  
300 µm  
175 µm  
100 µm  
Maximum Reverse Voltage Rating ( VR )  
Maximum Reverse  
Voltage Rating  
MA4P4000  
Series  
MA4P4300  
Series  
MA4P7000  
Series  
MA4P7100  
Series  
MA4P4001B-402  
MA4P4001BNM-402  
MA4P4001F-1091T  
MA4P4301B-402  
MA4P4301F-1091T  
MA4P7101B-401T  
MA4P7101F-1072T  
100 V  
MA4P7001F-1072T  
MA4P4002B-402  
MA4P4002F-1091T  
MA4P7002B-401T  
MA4P7002F-1072T  
MA4P7102B-401T  
MA4P7102F-1072T  
200 V  
400 V  
600 V  
MA4P4302B-402  
MA4P7104B-401T  
MA4P7104F-1072T  
MA4P4006F-1091T  
MA4P4006B-402  
MA4P7006B-401T  
MA4P7006F-1072T  
*Notes:  
1.) “NM” in the base part number signifies non-magnetic package.  
2.) “T” suffix denotes tape and reel.  
MA4P4000  
Package  
MA4P4300  
Series  
MA4P7000  
Series  
MA4P7100  
Series  
Series  
Condition  
Style  
PDISS  
θJC  
PDISS  
θJC  
PDISS  
θJC  
PDISS  
θJC  
1/4” Lead Length  
No Heatsink  
12 W  
2.5 W  
7.5 W  
12.5°C/W  
10 W  
2.5 W  
5 W  
15°C/W  
5 W  
30°C/W  
6 W  
25°C/W  
B
Axial Leaded  
30°C/W  
1.5 W  
10 W  
1.5 W  
F
Infinite Heatsink  
20°C/W  
15°C/W  
11.5 W  
13°C/W  
MELF  
Both B and F  
Both B and F  
Single 1 µs pulse 100 kW  
Single 100 µs 5 kW  
100 kW  
5 kW  
15 kW  
15 kW  
300 W  
0.03°C/W  
0.03°C/W 300 W  
0.5°C/W  
0.5°C/W  
6
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Typical Performance Curves @ TAMB = +25°C  
MA4P4000,MA4P4300, MA4P7000, MA4P7100 Series  
Series Resistance at 100 MHz vs. Forward Current  
MA4P4000, MA4P4300 Series  
Series Resistance at 100 MHz vs. Forward Current  
MA4P7000, MA4P7100 Series  
Ω
Ω
Forward Current  
Forward Current  
Carrier Lifetime vs. Forward Bias Current  
Thermal Resistance vs. Pulse Width  
MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series  
MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series  
µS  
°C/W  
Forward Current  
Pulse Width  
7
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Typical Performance Curves @ TAMB = +25°C  
MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series  
Capacitance vs. Frequency & Reverse Bias  
Capacitance vs. Frequency & Reverse Bias  
MA4P4000 Series  
MA4P4300 Series  
pF  
pF  
MHz  
Frequency  
MHz  
Frequency  
Capacitance vs. Frequency & Reverse Bias  
MA4P7100 Series  
Capacitance vs. Frequency & Reverse Bias  
MA4P7000 Series  
pF  
pF  
MHz  
MHz  
Frequency  
Frequency  
8
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Typical Performance Curves @ TAMB = +25°C  
MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series  
Parallel Resistance vs. Reverse Bias & Frequency  
MA4P4000 Series  
Parallel Resistance vs. Reverse Bias & Frequency  
MA4P4300 Series  
Ω
Ω
Volts  
Volts  
Reverse Bias  
Reverse Bias  
Parallel Resistance vs. Reverse Bias & Frequency  
MA4P7000 Series  
Parallel Resistance vs. Reverse Bias & Frequency  
MA4P7100 Series  
Ω
Ω
Volts  
Volts  
Reverse Bias  
Reverse Bias  
9
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Case Styles  
401 Axial Leaded Packages  
402 Axial Leaded Packages  
Cathode Band  
Cathode Band  
B
B
D
D
C
C
A
C
C
A
401 Package  
(tape and reel only)  
402 Package  
(bulk only)  
INCHES  
MM  
INCHES  
MM  
500 or 1000 pcs/reel  
specify when ordering  
100 pcs/bag  
Min. Max. Min. Max.  
Min. MAX Min. Max.  
A
B
0.130  
0.090  
3.30  
2.29  
A
0.230  
0.140  
5.84  
MA4P1200-401T  
MA4P1200NM-401T  
MA4P7002B-401T  
MA4P7006B-401T  
MA4P7101B-401T  
MA4P7102B-401T  
MA4P7104B-401T  
MA4P4001B-402  
MA4P4001BNM-402  
MA4P4002B-402  
MA4P4006B-402  
MA4P4301B-402  
MA4P4302B-402  
B
C
3.56  
0.975  
24.77  
C 0.975  
24.77  
D
0.039 0.041 0.99 1.04  
D 0.027 0.029 0.69 0.74  
1072 MELF Surface Mount Packages  
1091 MELF Surface Mount Packages  
Cathode  
Cathode  
B
A
B
A
Solderable  
Surfaces  
Solderable  
Surfaces  
A
A
C
C
1072 Package  
(tape and reel only)  
1091 Package  
(tape and reel only)  
INCHES  
MM  
INCHES  
MM  
1500 or 5000 pcs/reel  
specify when ordering  
500 pcs/reel  
Min. Max. Min. Max.  
Min. Max. Min. Max.  
MA4P1250-1072T  
MA4P1250NM-1072T  
MA4P7001F-1072T  
MA4P7002F-1072T  
MA4P7006F-1072T  
MA4P7101F-1072T  
MA4P7104F-1072T  
A 0.080 0.095 2.032 2.413  
A
B
C
0.138 0.155 3.51 3.94  
MA4P1450-1091T  
MA4P4001F-1091T  
MA4P4002F-1091T  
MA4P4006F-1091T  
MA4P4301F-1091T  
B 0.115 0.125 2.921 3.175  
C 0.008 0.023 0.203 0.584  
0.181 0.191 4.57 4.85  
0.011 0.026 0.279 0.660  
10  
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
MELF Assembly Recommendations  
Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable  
surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection.  
For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the MACOM website.  
Circuit Pad Layout for MELF Diodes  
MELF Internal Construction  
Package Style  
Dimension  
1072  
inches  
1091  
inches  
mm  
2.36  
1.27  
1.52  
mm  
3.81  
1.27  
2.54  
A
B
C
0.093  
0.050  
0.060  
0.150  
0.050  
0.100  
A
C
B
B
Ordering Information  
MELF diodes are available in tape and reel in quantities as shown in table below  
Package Style  
Quantity (7” Reel)  
Bulk Devices Per Bag  
1072T  
1091T  
1500 or 5000  
500  
N/A  
N/A  
Tape and reel information can be found in application note M513 the MACOM website.  
11  
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Axial Leaded HIPAX Assembly Recommendations  
Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming  
the bend no closer than .060 inches from the body of the part. Bending the lead <0.060 inches from the body of  
the part is not recommended and may cause internal damage to the chip. Appropriate fixturing should be used.  
Devices may be soldered using standard 60Sn/40Pb or any RoHS compliant solders. Axial leads are tin plated  
50 μm thick to ensure an optimum connection.  
For recommended Sn/Pb and RoHS soldering profiles see Application Note M538 on the MACOM website.  
Case Style 401 & 402  
Case Style 401 & 402  
Internal Construction  
Minimum Bend Distance  
Cathode Band  
Passivated Chip  
.060” Min  
.060” Min  
Ordering Information  
Axial leaded diodes are available in tape and reel or bulk in quantities shown in the table below  
Package Style  
Quantity Per Reel  
Bulk Devices Per Bag  
401T  
402  
500 or 1000 (specify qty. when ordering)  
N/A  
N/A  
100  
Environmental Ratings  
HIPAX PIN diodes are designed to meet most environmental and electrical requirements and may be ordered  
screened to MIL-STD-750 specifications as described in the table below.  
TEST  
METHOD  
DESCRIPTION/ CONDITIONS  
Moisture Resistance  
High Temperature Storage  
HTRB  
1021  
1031  
85°C, 85% Relative Humidity, 168 hrs  
+175°C , 250 Hours  
1038  
80% of rated VR, 50°C, 96 Hours  
-65°C to +175°C, 20 Cycles  
1 x 10-7 CC/Sec  
Temperature Shock  
Fine Leak  
1051  
1071 Cond. H  
2006  
Constant Acceleration  
Solderability  
20,000 G’s  
2026  
IPC/JDEC J-STD-02  
Tension1  
Lead Fatigue1  
2036.3 Cond. A  
2036.3 Cond. E  
2 Lbs., 30 Seconds  
3 Cycles, 8 oz., 90°,  
Note:  
1) Test applicable to HIPAX axially leaded devices only.  
12  
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
MACOM Technology Solutions Inc. All rights reserved.  
Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM")  
products. These materials are provided by MACOM as a service to its customers and may be used for  
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or  
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM  
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to  
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update  
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future  
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,  
to any intellectual property rights is granted by this document.  
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR  
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR  
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR  
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR  
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY  
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN  
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR  
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,  
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.  
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM  
customers using or selling MACOM products for use in such applications do so at their own risk and agree to  
fully indemnify MACOM for any damages resulting from such improper use or sale.  
13  
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  

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