MAAPGM0029-DIE [TE]
Amplifier, Power, 1W 3.5-6.5 GHz; 放大器,电源, 1W 3.5-6.5 GHz的型号: | MAAPGM0029-DIE |
厂家: | TE CONNECTIVITY |
描述: | Amplifier, Power, 1W 3.5-6.5 GHz |
文件: | 总5页 (文件大小:213K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Amplifier, Power, 1W
3.5-6.5 GHz
MAAPGM0029-DIE
903240 —
Preliminary Information
Features
♦ 1 Watt Saturated Output Power Level
♦ Variable Drain Voltage (4-10V) Operation
♦ MSAG™ Process
Description
The MAAPGM0029-Die is a 2-stage 1 W power amplifier with
on-chip bias networks. This product is fully matched to 50
ohms on both the input and output. It can be used as a power
amplifier stage or as a driver stage in high power applications.
Fabricated using M/A-COM’s repeatable, high performance
and highly reliable GaAs Multifunction Self-Aligned Gate
(MSAG™) Process, each device is 100% RF tested on wafer
to ensure performance compliance.
Primary Applications
♦ Wireless Local Loop
♦ 3.7- 4.2 GHz SatCom
M/A-COM’s MSAG™ process features robust silicon-like
manufacturing processes, planar processing of ion implanted
transistors, multiple implant capability enabling power, low-
noise, switch and digital FETs on a single chip, and polyimide
scratch protection for ease of use with automated manufactur-
ing processes. The use of refractory metals and the absence
of platinum in the gate metal formulation prevents hydrogen
poisoning when employed in hermetic packaging.
Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VDD = 8V, VGG = -2V, Pin = 16 dBm
Parameter
Symbol
Typical
Units
Bandwidth
3.5-6.5
GHz
f
Output Power
31
40
30
dBm
%
POUT
PAE
Power Added Efficiency
1-dB Compression Point
dBm
P1dB
Small Signal Gain
Input VSWR
20
dB
G
VSWR
1.5:1
Gate Current
Drain Current
< 4
< 400
42
mA
mA
IGG
IDD
Output Third Order Intercept
OTOI
dBm
dB
Noise Figure
2nd Harmonic
3rd Harmonic
NF
2f
7
-15
-25
dBc
dBc
3f
1. TB = MMIC Base Temperature
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 1W
3.5-6.5 GHz
MAAPGM0029-DIE
903240 —
Preliminary Information
Maximum Operating Conditions 2
Parameter
Input Power
Absolute Maximum
Units
dBm
V
Symbol
PIN
21.0
+12.0
-3.0
Drain Supply Voltage
Gate Supply Voltage
Quiescent Drain Current (No RF)
VDD
V
VGG
IDQ
PDISS
Tj
470
mA
W
3.1
Quiescent DC Power Dissipated (No RF)
Junction Temperature
180
°C
Storage Temperature
TSTG
-55 to +150
°C
2. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may
result in performance outside the guaranteed limits.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Drain Voltage
Gate Voltage
VDD
VGG
PIN
Tj
4.0
8.0
-2.0
16.0
10.0
-1.5
V
V
-2.3
Input Power
19.0
dBm
°C
Junction Temperature
MMIC Base Temperature
150
TB
Note 2
°C
2. Maximum MMIC Base Temperature = 150°C— 25.5 ºC/W * VDD * IDQ
Operating Instructions
This device is static sensitive. Please handle with
care. To operate the device, follow these steps.
1. Apply VGG = -2 V, VDD= 0 V.
2. Ramp VDD to desired voltage, typically 8 V.
3. Adjust VGG to set IDQ, (approximately @ –2 V).
4. Set RF input.
5. Power down sequence in reverse. Turn gate
voltage off last.
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
2
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 1W
3.5-6.5 GHz
MAAPGM0029-DIE
903240 —
Preliminary Information
50
40
30
20
10
0
50
40
30
20
10
0
50
40
30
20
10
0
50
40
30
20
10
0
POUT
PAE
POUT
PAE
4
5
6
7
8
9
10
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
Drain Voltage (V)
Frequency (GHz)
Figure 2. Saturated Output Power and Power Added Efficiency vs. Drain Voltage at fo = 5 GHz.
Figure 1. Output Power and Power Added Efficiency vs. Frequency at VDD = 8V
and Pin = 16dBm.
50
40
30
20
10
0
30
25
20
15
10
5
6
5
4
3
2
1
VDD = 4
VDD = 8
VDD = 6
VDD = 10
GAIN
VSWR
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
Frequency (GHz)
Frequency (GHz)
Figure 4. Small Signal Gain and Input VSWR vs. Frequency at VDD = 8V.
Figure 3. 1dB Compression Point vs. Drain Voltage
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 1W
3.5-6.5 GHz
MAAPGM0029-DIE
903240 —
Preliminary Information
Mechanical Information
Chip Size: 2.980 x 1.980 x 0.075 mm (117x 78 x 3 mils)
1.980 mm.
1.828 mm.
0.990 mm.
0.990 mm.
0.152 mm.
0
0
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Pad
Size (mils)
4 x 8
Size (μm)
100 x 200
200 x 150
150 x 150
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
8 x 6
6 x 6
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
4
Visit www.macom.com for additional data sheets and product information.
Amplifier, Power, 1W
3.5-6.5 GHz
MAAPGM0029-DIE
903240 —
Preliminary Information
Assembly and Bonding Diagram
VDD
0.1 μF
100 pF
RFIN
RFOUT
100 pF
VGG
0.1 μF
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW test-
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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