MADP-000907-14020P [TE]
Solderable AlGaAs Flip Chip PIN;
| 型号： | MADP-000907-14020P |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Solderable AlGaAs Flip Chip PIN 开关 测试 二极管 |
| 文件： | 总6页 (文件大小：685K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
V3
Features
Low Series Resistance
Chip Dimensions
Ultra Low Capacitance
Millimeter Wave Switching & Cutoff Frequency
Useable up to 70GHz
2 Nanosecond Switching Speed
Can be Driven by a Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
RoHS Compliant
Description
M/A-COM Technology Solutions MADP-000907-14020
is a solderable, flip-chip Aluminum Gallium Arsenide
(AlGaAs) PIN diode. It is fabricated with MOCVD grown
epitaxy using a process and design that optimizes
device to device uniformity and produces extremely low
parasitics. The diode exhibits an exceptionally low RC
product (0.1ps) and a 2-3 nS switching speed. The chips
are fully passivated with silicon nitride and have an
added BCB polymer layer for scratch protection. The
BCB protective coating prevents damage to the diode
junction area and anode air-bridge during handling and
assembly.
Applications
Notes:
The ultra low capacitance of the MADP-000907-14020
allows for operation at millimeter wave frequencies for
RF switches and phase shifter applications. The diode is
designed to be used in pulsed or CW applications,
where single digit nS switching speed is required. The
low capacitance of the MADP-000907-14020 makes it
ideal for use in many microwave multi-throw switch
assemblies, where the series capacitance of each “off”
1. Yellow areas indicate ohmic gold mounting pads
2. Pad finish is 0.2µm of gold over 4µm nickel.
Inches
Millimeters
DIM
MIN.
MAX.
MIN.
MAX.
Absolute Maximum Ratings TAMB = +25°C
A
B
C
D
E
F
0.026
0.014
0.007
0.004
0.007
0.018
0.027
0.015
0.008
0.005
0.0073
0.019
0.660
0.343
0.165
0.109
0.173
0.462
0.686
0.368
0.191
0.135
0.185
0.488
(unless otherwise specified)
Parameter
Reverse Voltage
Absolute Maximum
45V
-55°C to +125°C
-55°C to +150°C
+175°C
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power (RF + DC)
C.W. Incident Power
100mW
+23 dBm
Mounting Temperature
+280°C for 10 seconds
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
V3
Electrical Specifications @ TAMB = +25°C
Typ.
Max.
Parameter
Symbol
Conditions
Units
Total Capacitance
CT
-10V,1MHz
pF
0.025
0.030
Series Resistance
Forward Voltage
RS
VF
IR
+10mA, 1GHz
+10mA
Ω
5.2
7.0
V
1.33
1.45
Reverse Leakage Current 1
Switching Speed 2
VR = -45V
10GHz
nA
nS
——
50
TRISE
TFALL
2
——
Notes:
1. The max rated VR(-45V) is sourced and the resultant reverse leakage current, Ir, is measured to be
<50nA
2. Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series
mounted diode. Driver delay is not included.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
V3
Typical RF Performance @ TAMB = +25°C
Insertion Loss vs. Frequency
I. Loss @5mA
I. Loss @15mA
I. Loss @50mA
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Frequency (GHz)
Return Loss vs. Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
-20.0
-22.0
-24.0
-26.0
-28.0
-30.0
-32.0
-34.0
-36.0
-38.0
-40.0
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
V3
Typical RF Performance @ TAMB = +25°C
Isolation vs. Frequency
4
Frequency (Hz)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
V3
Device Installation Guidelines
Cleanliness
This device should be handled in a clean environment. The chip is resistant to solvents and may be cleaned
using approved industry standard practices and chemicals.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD
handling techniques should be used. These devices are rated Class 0, (0-199V) HBM per MIL-STD-883, method
3015.7 and should be handled in a static-free environment.
General Handling
The die has a BCB, polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy
The MADP-000907-14020 is designed to be inserted onto hard or soft substrates with the junction/pad side
down. It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately
1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure
times, > 30 minutes, temperatures must be kept below 200°C.
Eutectic Solder Die Attached
63/37 Sn/Pb or any RoHS compliant solder may be used for diode attachment. It is recommended that the
attachment surface be preheated to 100°C prior to re-flow in order to minimize CTE mismatches. Gradual
temperature ramp up and ramp down is also recommended with a maximum soldering temperature of 280°C for
less than 10 seconds. See Application Note M538 for recommended soldering profile.
Circuit Pad Layout
0.013”
Ordering Information
Part Number
Packaging
0.012”
(2) PL
MADP-000907-14020W
MADP-000907-14020P
Waffle Pack
Tape and Reel
0.008”
(2) PL
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
V3
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
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CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
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