MADP-042405-130600 [TE]
SURMOUNT TM 5 レm PIN Diodes; 众志成城TM 5レ米PIN二极管
| 型号： | MADP-042405-130600 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | SURMOUNT TM 5 レm PIN Diodes |
| 文件： | 总4页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series
V2
Absolute Maximum Ratings1
Features
@ TA = +25 °C (unless otherwise
specified)
•
•
•
•
•
•
•
Surface Mount, 5 µm I-Region Length Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
Parameter
Absolute Maximum
042
305
042
405
042
505
042
905
Part
Forward
Current
250 mA
l -80 V l
Reverse
Voltage
Description and Applications
Operating
Temperature
-55 °C to +125 °C
-55 °C to +150 °C
+175 °C
This device is a Silicon-Glass PIN diode chip fabricated
with M/A-COM’s patented HMICTM process. This
device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This Vertical Topology provides for
Exceptional Heat Transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
Storage
Temperature
Junction
Temperature
C.W. Inci-
dent Power
(dBm)
40
44
43
35
Mounting
Temperature
+300 °C for 10 seconds
1. Operation of this device above any one of these parameters
may cause permanent damage.
Case Style
ODS-1306
These packageless devices are suitable for usage in
Moderate Incident Power ( 10 W C.W. ) and 50 W , 1
uS, 0.01 Duty Cycle, Peak Power, Series, Shunt, or
Series-Shunt Switches. Smaller Parasitic
Inductance, 0.4 nH, and Excellent RC Constant,
make the devices ideal for Higher Frequency Switch
Elements compared to their Plastic Device Counterparts.
A
B
C
G
Bottom Side Contacts are Circuit Side
Dim
Inches
Min.
Millimeters
Max.
Min.
Max.
A
B
C
D
E
F
0.040
0.021
0.004
0.013
0.011
0.013
0.019
0.042
1.025
0.525
0.102
0.325
0.275
0.325
0.475
1.075
0.023
0.008
0.015
0.013
0.015
0.021
0.575
0.203
0.375
0.325
0.375
0.525
D
E
F
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
3. Both Devices have Same Outline Dimensions ( A to G ).
G
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series
V2
Electrical Specifications @ + 25 °C
Min
Typ
MADP-042305
0.14
Max
0.22
0.22
Min
Typ
MADP-042505
0.28
Max
0.40
0.40
Parameter
Symbol
Conditions
Units
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
CT
CT
CT
CT
RS
RS
VF
- 10 V, 1 MHz 1
- 10 V, 1 GHz 1,3
- 40 V, 1 MHz 1
- 40 V, 1 GHz 1,3
+ 20 mA, 1 GHz 2,3
+ 50 mA, 1 GHz 2,3
+ 10 mA
pF
pF
pF
pF
Ω
0.15
0.28
0.13
0.27
0.14
0.27
1.32
0.83
Resistance
1.18
0.76
Ω
V
Forward Voltage
Reverse Leakage
Current
0.87
1.00
10
0.84
1.00
10
IR
| -80V |
uA
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
Input Third Order
Intercept Point
IIP3
dBm
72
76
IH=0.5A, IL=10 mA
C.W. Thermal
Resistance
145
180
115
210
° C / W
RθJL
+10 mA / -6 mA
( 50 % - 90 % V )
Lifetime
TL
nS
Min
Typ
MADP-042405
0.61
Max
0.75
0.75
Min
Typ
MADP-042905
0.06
Max
0.18
0.18
Parameter
Symbol
Conditions
Units
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
CT
CT
CT
CT
RS
RS
VF
- 10 V, 1 MHz 1
- 10 V, 1 GHz 1,3
- 40 V, 1 MHz 1
- 40 V, 1 GHz 1,3
+ 20 mA, 1 GHz 2,3
+ 50 mA, 1 GHz 2,3
+ 10 mA
pF
pF
pF
pF
Ω
0.61
0.06
0.57
0.06
0.58
0.06
0.62
3.14
Resistance
0.58
2.60
Ω
V
Forward Voltage
Reverse Leakage
Current
0.82
1.00
10
0.93
1.00
10
IR
| -80V |
uA
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
Input Third Order
Intercept Point
IIP3
dBm
80
65
IH=0.5A, IL=10 mA
C.W. Thermal
Resistance
100
255
185
140
° C / W
RθJL
+10 mA / -6 mA
( 50 % - 90 % V )
Lifetime
TL
nS
1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
3. Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder
4. Steady-state RθJL measured with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder.
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series
V2
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and
skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for
individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active
junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80 Au / 20 Sn @ ~ + 280 °C or Sn 60 / Pb 40 ~ + 185 °C solder is recommended. Conductive silver epoxy for
die attachment ~ + 150 °C may also be used for lower Incident power ( < 1 W Average Power ) applications.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top
surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal
stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since
the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected
through the die after attach is completed.
A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface
Mounting Instructions “ on the MA-COM website www.macom.com
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series
V2
MADP-042005 Series Typical Performance Curves @ +25 °C
Ct vs V
Rs vs I
Ct @ 1GHz
Rs @ 1GHz
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
10.000
042405
042505
042905
042305
042505
1.000
042405
042305
042905
0.000
0
0.100
0.001
5
10
15
20
25
30
35
40
0.010
0.100
Bias (V)
Bias (A)
Ct vs F
Ct vs F
Ct @ 10V
Ct @ 40V
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
042405
042405
042505
042305
042905
042505
042305
042905
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
Freq (Hz)
Rs vs F
Rs vs F
Rs @ 10mA
Rs @ 20mA
4.50E+00
4.00E+00
3.50E+00
3.00E+00
2.50E+00
2.00E+00
1.50E+00
1.00E+00
5.00E-01
0.00E+00
4.00E+00
3.50E+00
3.00E+00
2.50E+00
2.00E+00
1.50E+00
1.00E+00
5.00E-01
0.00E+00
042905
042905
042305
042505
042305
042505
042405
042405
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00 08 08 08 08 09 09 09 09 09
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00 08 08 08 08 09 09 09 09 09
Freq (Hz)
Freq (Hz)
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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