NPA1003 [TE]

Gallium Nitride 28V, 5W, 20-1500 MHz MMIC Amplifier;
NPA1003
型号: NPA1003
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Gallium Nitride 28V, 5W, 20-1500 MHz MMIC Amplifier

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NPA1003  
Gallium Nitride 28V, 5W, 20-1500 MHz MMIC Amplifier  
Built using the SIGANTIC® process - A proprietary GaN-on-Silicon technology  
Features  
Broadband operation from 20-1500 MHz  
28V Operation  
Input and output matched to 50 ohms  
Industry Standard QFN Plastic Package  
High Drain Efficiency (>50%)  
Applications  
Broadband General Purpose  
Defense Communications  
Land Mobile Radio  
20-1500 MHz  
5W  
GaN MMIC PA  
Wireless Infrastructure  
VHF/UHF/L-Band Radar  
Product Description  
The NPA1003 is a wideband, internally-matched, GaN MMIC power amplifier optimized for 20-  
1500 MHz operation. This device has been designed for CW, pulsed, and linear operation with  
output power levels exceeding 5W (37 dBm) in an industry standard, surface mount, QFN4X4-16  
plastic package.  
RF Specifications (CW, 1000 MHz): VDS = 28V, IDQ = 100mA, TC= 25°C  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
GSS  
Small-signal Gain  
-
18  
-
dB  
PSAT  
Saturated Output Power  
-
-
38.5  
50  
-
-
-
-
-
-
dBm  
%
Efficiency at Saturated Output Power  
Noise Figure  
SAT  
NF  
-
2.0  
16  
dB  
dB  
%
GP  
PAE  
VDS  
Gain at POUT = 5W  
14  
38  
-
Power Added Efficiency at POUT = 5W  
Drain Voltage  
42  
28  
V
Ruggedness: Output Mismatch, all phase angles  
VSWR = 10:1, No Device Damage  
Page 1  
NDS-030 Rev. 4, 011414  
NPA1003  
DC Specifications: TC = 25°C  
Symbol  
Off Characteristics  
IDLK Drain-Source Leakage Current  
Parameter  
Min  
Typ  
Max  
Units  
-
-
-
-
2
1
mA  
mA  
(VGS=-8V, VDS=100V)  
IGLK  
Gate-Source Leakage Current  
(VGS=-8V, VDS=0V)  
On Characteristics  
VT  
Gate Threshold Voltage  
(VDS=28V, ID=2mA)  
-2.5  
-1.6  
-1.2  
1.6  
1.5  
-0.5  
V
V
VGSQ  
RON  
Gate Quiescent Voltage  
(VDS=28V, ID=100mA)  
-2.1  
-0.3  
On Resistance  
(VDS=2V, ID=15mA)  
-
-
-
-
ID, MAX  
Maximum Drain Current  
(VDS=7V pulsed, 300µS pulse width,  
0.2% Duty Cycle)  
A
Thermal Resistance Specification:  
Symbol  
Parameter  
Typ  
Units  
Thermal Resistance (Junction-to-Case),  
TJ = 180 °C  
12  
°C/W  
RJC  
Junction Temperature (TJ) measured using IR Microscopy, Case Temperature (TC) measured using a thermocouple embedded in  
heatsink.  
Absolute Maximum Ratings: Not simultaneous, TC = 25°C unless otherwise noted  
Symbol  
Parameter  
Max  
Units  
VDS  
VGS  
IG  
Drain-Source Voltage  
100  
-10 to 3  
4
V
V
Gate-Source Voltage  
Gate Current  
mA  
W
PT  
Total Device Power Dissipation (Derated above 25°C)  
Storage Temperature Range  
14.5  
TSTG  
TJ  
-65 to 150  
200  
°C  
°C  
Operating Junction Temperature  
Human Body Model ESD Rating (per JESD22-A114)  
Moisture sensitivity level (per IPC/JEDEC J-STD-020)  
HBM  
MSL  
Class 1A  
MSL-1  
Page 2  
NDS-030 Rev. 4, 011414  
NPA1003  
20 - 1500 MHz Broadband Circuit  
(CW, VDS=28V, IDQ=100mA, TC=25C, unless otherwise noted)  
Figure 1. Electrical Schematic of 20 - 1500MHz Broadband Circuit for NPA1003  
(For RF Tuning details see Component Placement Diagram Figure 2)  
Figure 2: Component Placement of 20 - 1500MHz Broadband Circuit for NPA1003  
Reference  
C1  
Value  
Manufacturer  
TDK  
Part Number  
C2012X5R1C106M085AC  
06031C103JAT2A  
10µF  
C2  
0.01µF  
AVX  
C3  
4.7µF  
TDK  
C5750X7R2A475K230KA  
C08BL242X-5UN-X0  
ERJ-6ENF49R9V  
C4, C5  
R1  
2400pF  
Dielectric Labs, Inc.  
Panasonic  
Panasonic  
Coilcraft  
49.9Ω  
R2  
0Ω  
0.9µH  
ERJ-3GEY0R00V  
L1, L2  
PCB  
1008AF-901XJLC  
RO4350, r=3.5, 0.020”  
Rogers  
Nitronex NBD-098r1  
Page 3  
NDS-030 Rev. 4, 011414  
NPA1003  
Typical Performance in 20 - 1500 MHz Broadband Circuit  
(CW, VDS=28V, IDQ=100mA, TC=25C, unless otherwise noted)  
35  
30  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
0
70  
60  
50  
40  
30  
-5  
Gain  
PAE  
-10  
-15  
-20  
-25  
-30  
-35  
S21  
S11  
S22  
0
0
500  
1,000  
Frequency (MHz)  
1,500  
2,000  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
Frequency (GHz)  
Figure 4: Performance vs. Frequency  
Figure 3: Device Small Signal s-parameters  
(s-parameters available at nitronex.com)  
(POUT = 37dBm)  
24  
22  
20  
18  
16  
14  
12  
60  
50  
40  
30  
20  
10  
POUT = 27dBm  
POUT = 36dBm  
POUT = 37dBm  
POUT = 27dBm  
POUT = 36dBm  
POUT = 37dBm  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
Frequency (GHz)  
Frequency (GHz)  
Figure 5: Gain vs. Frequency  
Figure 6: Power Added Efficiency vs. Frequency  
24  
22  
20  
18  
16  
14  
12  
10  
55  
-400C  
250C  
850C  
-400C  
250C  
850C  
50  
45  
40  
35  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
Frequency (GHz)  
Frequency (GHz)  
Figure 7: Gain vs. Frequency  
Figure 8: Power Added Efficiency vs. Frequency  
(POUT = 37dBm)  
(POUT = 37dBm)  
Page 4  
NDS-030 Rev. 4, 011414  
NPA1003  
Typical Performance in 20 - 1500 MHz Broadband Circuit  
(CW, VDS=28V, IDQ=100mA, TC=25C, unless otherwise noted)  
-2  
-4  
24  
-400C  
250C  
850C  
22  
20  
18  
-6  
16  
-8  
14  
100MHz  
500MHz  
12  
-10  
-12  
900MHz  
10  
1.5GHz  
8
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
10  
15  
20  
25  
30  
35  
40  
Frequency (GHz)  
POUT (dBm)  
Figure 9: Input Return Loss vs. Frequency  
Figure 10: Gain vs. POUT  
(POUT = 37dBm)  
-2  
70  
60  
50  
40  
30  
20  
10  
0
100MHz  
500MHz  
900MHz  
1.5GHz  
-4  
-6  
-8  
-10  
-12  
-14  
-16  
-18  
100MHz  
500MHz  
900MHz  
1.5GHz  
10  
15  
20  
25  
30  
35  
40  
10  
15  
20  
25  
30  
35  
40  
POUT (dBm)  
POUT (dBm)  
Figure 11: Power Added Efficiency vs. POUT  
Figure 12: Input Return Loss vs. POUT  
20  
19  
18  
17  
16  
15  
14  
13  
12  
60  
50  
40  
30  
20  
10  
0
VDS = 15V  
VDS = 20V  
VDS = 28V  
VDS = 15V  
VDS = 20V  
VDS = 28V  
10  
15  
20  
25  
30  
35  
40  
10  
15  
20  
25  
30  
35  
40  
POUT (dBm)  
POUT (dBm)  
Figure 13: Gain vs. POUT  
Figure 14: Power Added Efficiency vs. POUT  
(f = 900MHz)  
(f = 900MHz)  
Page 5  
NDS-030 Rev. 4, 011414  
NPA1003  
Typical Performance in 20 - 1500 MHz Broadband Circuit  
(CW, VDS=28V, IDQ=100mA, f=1GHz, TC=25C, unless otherwise noted)  
-1.0  
-1.1  
-1.2  
-1.3  
-1.4  
-1.5  
-1.6  
20  
15  
10  
5
50mA  
100mA  
150mA  
0
-50  
-25  
0
25  
50  
75  
100  
25  
50  
75  
100  
125  
150  
175  
Temperature (oC)  
Case Temperature (oC)  
Figure 16: Power De-rating Curve  
Figure 15: Quiescent VGS vs. Temperature  
(TJ = 200°C, TC > 25°C)  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
22  
25mA  
25mA  
21  
20  
19  
18  
17  
16  
15  
50mA  
50mA  
100mA  
150mA  
100mA  
150mA  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
POUT (W-PEP)  
POUT (W-PEP)  
Figure 17: 2-Tone IMD3 vs. POUT vs. IDQ  
Figure 18: 2-Tone Gain vs. POUT vs. IDQ  
(1MHz Tone Spacing, f = 500MHz)  
(1MHz Tone Spacing, f = 500MHz)  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-55  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-IMD3  
+IMD3  
-IMD5  
+IMD5  
-IMD7  
+IMD7  
-IMD3  
+IMD3  
-IMD5  
+IMD5  
-IMD7  
+IMD7  
0.1  
1
10  
0.1  
1
10  
100  
POUT (W-PEP)  
Tone Spacing (MHz)  
Figure 19: 2-Tone IMD vs. POUT  
(1MHz Tone Spacing, IDQ = 50mA, f = 500MHz)  
Figure 20: 2-Tone IMD vs. Tone Spacing  
(POUT = 6W-PEP, IDQ = 50mA, f = 500MHz)  
Page 6  
NDS-030 Rev. 4, 011414  
NPA1003  
Figure 21 - QFN4X4-16 Plastic Package Dimensions (all dimensions in inches [millimeters])  
Pin  
Function  
2, 3  
Gate — RF Input  
Drain — RF Output  
10, 11  
Exposed Pad Source — Ground  
1, 4-9, 12-16 No Connect*  
* All No Connect pins may be left floating or grounded  
Page 7  
NDS-030 Rev. 4, 011414  
NPA1003  
Nitronex, LLC  
2305 Presidential Drive  
Durham, NC 27703 USA  
+1.919.807.9100 (telephone)  
+1.919.807.9200 (fax)  
info@nitronex.com  
www.nitronex.com  
Additional Information  
This part is lead-free and is compliant with the RoHS directive  
(Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment).  
Important Notice  
Nitronex, LLC reserves the right to make corrections, modifications, enhancements, improvements and other changes to its products and  
services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold subject to Nitronex terms and  
conditions of sale supplied at the time of order acknowledgment. The latest information from Nitronex can be found either by calling  
Nitronex at 1-919-807-9100 or visiting our website at www.nitronex.com.  
Nitronex warrants performance of its packaged semiconductor or die to the specifications applicable at the time of sale in accordance  
with Nitronex standard warranty. Testing and other quality control techniques are used to the extent Nitronex deems necessary to sup-  
port the warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
Nitronex assumes no liability for applications assistance or customer product design. Customers are responsible for their product and  
applications using Nitronex semiconductor products or services. To minimize the risks associated with customer products and applica-  
tions, customers should provide adequate design and operating safeguards.  
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mask work right, or other Nitronex intellectual property right relating to any combination, machine or process in which Nitronex products  
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©Nitronex, LLC 2013 All rights reserved.  
Page 8  
NDS-030 Rev. 4, 011414  

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