NPT1012 [TE]

Gallium Nitride 28V, 25W RF Power Transistor;
NPT1012
型号: NPT1012
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Gallium Nitride 28V, 25W RF Power Transistor

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NPT1012  
Gallium Nitride 28V, 25W RF Power Transistor  
®
Built using the SIGANTIC NRF1 process - A proprietary GaN-on-Silicon technology  
FEATURES  
• Optimized for broadband operation from  
DC-4000MHz  
• 25W P3dB CW power at 3000MHz  
• 16-20W P3dB CW power from 1000-2500MHz in  
application board with >45% drain efficiency  
• 10-20W P3dB CW power from 30-1000MHz in ap-  
plication board with >50% drain efficiency  
• High efficiency from 14 - 28V  
DC – 4000 MHz  
25 Watt, 28 Volt  
GaN HEMT  
• 4.0 °C/W RTH with maximum TJ rating of 200 °C  
• Robust up to 10:1 VSWR mismatch at all angles  
with no device damage at 90 °C flange  
• Subject to EAR99 export control  
RF Specifications (CW, 3000MHz): VDS = 28V, IDQ = 225mA, TC = 25°C, Measured in Nitronex Test Fixture  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
P3dB  
P1dB  
GSS  
h
Average Output Power at 3dB Gain Compression  
Average Output Power at 1dB Gain Compression  
Small Signal Gain  
43  
-
44  
43  
13  
65  
-
-
-
-
dBm  
dBm  
dB  
12  
57  
Drain Efficiency at 3dB Gain Compression  
10:1 VSWR at all phase angles  
%
VSWR  
No damage to the device  
Figure 2 - Typical CW Performance1 in  
Figure 1 - Typical CW Performance in  
Load-Pull, VDS = 28V, IDQ = 225mA  
Load-Pull, VDS = 28V, IDQ = 225mA  
Note 1: 500MHz and 900MHz Load-Pull data collected using a 4.7 Ω resistor in the RF path added for stability  
NPT1012  
Page 1  
NDS-025 Rev. 3, April 2013  
NPT1012  
DC Specifications: TC = 25°C  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Off Characteristics  
Drain-Source Breakdown Voltage  
(VGS = -8V, ID = 8mA)  
VBDS  
IDLK  
100  
-
-
-
-
V
Drain-Source Leakage Current  
(VGS = -8V, VDS = 60V)  
4
mA  
On Characteristics  
Gate Threshold Voltage  
(VDS = 28V, ID = 8mA)  
VT  
-2.3  
-2.0  
-
-1.8  
-1.5  
-1.3  
-1.0  
V
V
W
Gate Quiescent Voltage  
(VDS = 28V, ID = 225mA)  
VGSQ  
RON  
On Resistance  
(VGS = 2V, ID = 60mA)  
0.44  
0.55  
Drain Current  
ID,MAX  
(VDS = 7V pulsed, 300ms pulse width,  
0.2% duty cycle, VGS = 2.0V)  
-
5.4  
-
A
Thermal Resistance Specification  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Thermal Resistance (Junction-to-Case),  
TJ = 180 °C  
qJC  
-
4.0  
-
°C/W  
Absolute Maximum Ratings: Not simultaneous, TC = 25°C unless otherwise noted  
Symbol  
Parameter  
Max  
Units  
VDS  
VGS  
IG  
Drain-Source Voltage  
100  
-10 to 3  
40  
V
V
Gate-Source Voltage  
Gate Current  
mA  
W
PT  
Total Device Power Dissipation (Derated above 25°C)  
Storage Temperature Range  
44  
TSTG  
TJ  
-65 to 150  
200  
°C  
°C  
Operating Junction Temperature  
HBM  
MM  
CDM  
Human Body Model ESD Rating (per JESD22-A114)  
Machine Model ESD Rating (per JESD22-A115)  
Charge Device Model ESD Rating (per JESD22-C101)  
1B (+/-500V)  
A (>100V)  
IV (>1000V)  
NPT1012  
Page 2  
NDS-025 Rev. 3, April 2013  
NPT1012  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =225mA, TA=25°C unless otherwise noted  
DQ  
Table 1: Optimum Source and Load Impedances1 for CW Gain, Drain Efficiency, and Output Power Performance  
Frequency  
V
Z
(W)  
Z
L
(W)  
P
G
Drain Efficiency @ P  
(%)  
DS  
S
SAT  
SS  
SAT  
(W)  
12  
21  
26  
12  
24  
26  
26  
13  
19  
26  
26  
26  
(dB)  
27.8  
29.2  
29.7  
22.4  
23.3  
23.6  
18.4  
13.7  
14.9  
15.2  
13.2  
12.9  
(MHz)  
(V)  
14  
22  
28  
14  
22  
28  
28  
14  
22  
28  
28  
28  
500  
500  
7.0 + j8.2  
7.0 + j8.2  
7.0 + j8.2  
5.8 + j3.1  
5.8 + j3.1  
5.8 + j3.1  
3.5 - j3.6  
3.9 - j7.5  
4.8 - j7.0  
4.8 - j7.0  
5.3 - j8.8  
5.0 - j14.5  
8.6 + j7.4  
9.7+ j11.3  
9.7 + j14.1  
6.8 + j4.7  
9.6 + j5.3  
9.8 + j 7.8  
6.9 + j2.0  
6.2 - j8.0  
5.5 - j4.1  
5.5 - j4.1  
5.3 - j6.4  
7.0 - j9.5  
76  
74  
68  
74  
74  
67  
69  
70  
69  
69  
66  
63  
500  
900  
900  
900  
1800  
2500  
2500  
2500  
3000  
3500  
Note 1: 500MHz and 900MHz Load-Pull data collected using a 4.7 Ω resistor in the RF path added for stability  
Z
is the source impedance  
presented to the device.  
S
Z is the load impedance  
L
presented to the device.  
Figure 3 - Optimum Impedances for CW  
Performance, VDS = 28V  
NPT1012  
Page 3  
NDS-025 Rev. 3, April 2013  
NPT1012  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =225mA, TA=25°C unless otherwise noted  
DQ  
72%  
72%  
43.5dBm  
44.0dBm  
Figure 5 - Load-Pull Contours1, 900MHz,  
PIN = 21.0dBm, ZS = 5.8 + j3.1 Ω  
Figure 4 - Load-Pull Contours1, 500MHz,  
PIN = 14.5dBm, ZS = 7.0 + j8.2 Ω  
Note 1: 500MHz and 900MHz Load-Pull data collected using a 4.7 Ω resistor in the RF path added for stability  
66%  
69%  
44.0dBm  
44.0dBm  
Figure 7 - Load-Pull Contours, 2500MHz,  
PIN = 29.4dBm, ZS = 4.8 - j7.0 Ω  
Figure 6 - Load-Pull Contours, 1800MHz,  
PIN = 26.5dBm, ZS = 3.5 - j3.6 Ω  
NPT1012  
Page 4  
NDS-025 Rev. 3, April 2013  
NPT1012  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =225mA, TA=25°C unless otherwise noted  
DQ  
63%  
44.0dBm  
63%  
44.0dBm  
Figure 8 - Load-Pull Contours, 3000MHz,  
PIN = 31.7dBm, ZS = 5.3 - j8.8 Ω  
Figure 9 - Load-Pull Contours, 3500MHz,  
PIN = 33.5dBm, ZS = 5.0 - j14.5 Ω  
Figure 11 - Typical CW Performance1 Over  
Figure 10 - Typical CW Performance in  
Voltage in Load-Pull, 500MHz  
Load-Pull  
Note 1: 500MHz and 900MHz Load-Pull data collected using a 4.7 Ω resistor in the RF path added for stability  
NPT1012  
Page 5  
NDS-025 Rev. 3, April 2013  
NPT1012  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =225mA, TA=25°C unless otherwise noted  
DQ  
Figure 12 - Typical CW Performance1 Over  
Voltage in Load-Pull, 900MHz  
Figure 13 - Typical CW Performance Over  
Voltage in Load-Pull, 2500MHz  
Note 1: 500MHz and 900MHz Load-Pull data collected using a 4.7 Ω resistor in the RF path added for stability  
Figure 14 - Typical CW Performance Over  
Temperature in Nitronex Test Fixture,  
3000MHz  
Figure 15 - Quiescent Gate Voltage (VGSQ)  
Required to Reach IDQ as a Function of  
Case Temperature, VDS = 28V  
Figure 16 - MTTF of NRF1 Devices as a Function of  
Figure 17 - Power Derating Curve  
Junction Temperature  
NPT1012  
Page 6  
NDS-025 Rev. 3, April 2013  
NPT1012  
Ordering Information  
1
Part Number  
Description  
NPT1012B  
NPT1012 in AC200B-2 Metal-Ceramic Bolt-Down Package  
1: To find a Nitronex contact in your area, visit our website at http://www.nitronex.com  
Figure 18 - AC200B-2 Metal-Ceramic Package Dimensions and Pinout (all dimensions are in inches [mm])  
NPT1012  
Page 7  
NDS-025 Rev. 3, April 2013  
NPT1012  
Nitronex, LLC  
2305 Presidential Drive  
Durham, NC 27703 USA  
+1.919.807.9100 (telephone)  
+1.919.807.9200 (fax)  
info@nitronex.com  
www.nitronex.com  
Additional Information  
This part is lead-free and is compliant with the RoHS directive  
(Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment).  
Important Notice  
Nitronex, LLC reserves the right to make corrections, modifications, enhancements, improvements and other changes to  
its products and services at any time and to discontinue any product or service without notice. Customers should obtain  
the latest relevant information before placing orders and should verify that such information is current and complete. All  
products are sold subject to Nitronex terms and conditions of sale supplied at the time of order acknowledgment. The latest  
information from Nitronex can be found either by calling Nitronex at 1-919-807-9100 or visiting our website at  
www.nitronex.com.  
Nitronex warrants performance of its packaged semiconductor or die to the specifications applicable at the time of sale in  
accordance with Nitronex standard warranty. Testing and other quality control techniques are used to the extent Nitronex  
deems necessary to support the warranty. Except where mandated by government requirements, testing of all parameters  
of each product is not necessarily performed.  
Nitronex assumes no liability for applications assistance or customer product design. Customers are responsible for their  
product and applications using Nitronex semiconductor products or services. To minimize the risks associated with  
customer products and applications, customers should provide adequate design and operating safeguards.  
Nitronex does not warrant or represent that any license, either express or implied, is granted under any Nitronex patent right,  
copyright, mask work right, or other Nitronex intellectual property right relating to any combination, machine or process in  
which Nitronex products or services are used.  
Reproduction of information in Nitronex data sheets is permitted if and only if said reproduction does not alter any of the  
information and is accompanied by all associated warranties, conditions, limitations and notices. Any alteration of the  
contained information invalidates all warranties and Nitronex is not responsible or liable for any such statements.  
Nitronex products are not intended or authorized for use in life support systems, including but not limited to surgical  
implants into the body or any other application intended to support or sustain life. Should Buyer purchase or use Nitronex,  
LLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold Nitronex, LLC, its  
ofcers, employees, subsidiaries, affiliates, distributors, and its successors harmless against all claims, costs, damages,  
and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, notwithstanding if such claim alleges that Nitronex was negligent  
regarding the design or manufacture of said products.  
Nitronex and the Nitronex logo are registered trademarks of Nitronex, LLC.  
All other product or service names are the property of their respective owners.  
©Nitronex, LLC 2012. All rights reserved.  
NPT1012  
Page 8  
NDS-025 Rev. 3, April 2013  

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