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5962-00-515-1176 [TI]

IC,LOGIC GATE,QUAD 2-INPUT NOR,STD-TTL,DIP,14PIN,CERAMIC;
5962-00-515-1176
型号： 5962-00-515-1176
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

IC,LOGIC GATE,QUAD 2-INPUT NOR,STD-TTL,DIP,14PIN,CERAMIC

输入元件
文件： 总16页 (文件大小：704K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
JM38510/00401BCA  
JM38510/00401BDA  
JM38510/00401BDA  
JM38510/07301BCA  
JM38510/07301BCA  
JM38510/07301BDA  
JM38510/07301BDA  
JM38510/30301B2A  
JM38510/30301B2A  
JM38510/30301BCA  
JM38510/30301BCA  
JM38510/30301BDA  
JM38510/30301BDA  
JM38510/30301SCA  
JM38510/30301SCA  
JM38510/30301SDA  
JM38510/30301SDA  
SN5402J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
W
W
J
14  
14  
14  
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
25  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
CFP  
A42  
CDIP  
CDIP  
CFP  
A42 SNPB  
A42 SNPB  
A42  
J
W
W
FK  
FK  
J
CFP  
A42  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
W
W
J
CFP  
A42  
CDIP  
CDIP  
CFP  
A42 SNPB  
A42 SNPB  
A42  
J
W
W
J
CFP  
A42  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
PDIP  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
SN5402J  
J
SN54LS02J  
J
SN54LS02J  
J
SN54S02J  
J
SN54S02J  
J
SN7402N  
N
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN7402N  
ACTIVE  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN7402N3  
SN7402N3  
SN7402NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN7402NE4  
SN74LS02D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
N
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS02D  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS02DE4  
SN74LS02DE4  
SN74LS02DR  
SN74LS02DR  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
Orderable Device  
SN74LS02DRE4  
SN74LS02DRE4  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS02J  
SN74LS02J  
SN74LS02N  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
PDIP  
J
J
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS02N  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS02N3  
SN74LS02N3  
SN74LS02NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS02NE4  
SN74LS02NSR  
SN74LS02NSR  
SN74LS02NSRG4  
SN74LS02NSRG4  
SN74S02D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
NS  
NS  
NS  
NS  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S02D  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S02DE4  
SN74S02DE4  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S02DR  
SN74S02DR  
SN74S02N  
OBSOLETE  
OBSOLETE  
ACTIVE  
SOIC  
SOIC  
PDIP  
D
D
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S02N  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S02N3  
SN74S02N3  
SN74S02NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S02NE4  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SNJ5402J  
SNJ5402J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CFP  
J
J
14  
14  
14  
14  
20  
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
SNJ5402W  
SNJ5402W  
SNJ54LS02FK  
W
W
FK  
CFP  
A42  
LCCC  
POST-PLATE N / A for Pkg Type  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
CDIP  
CFP  
Drawing  
SNJ54LS02FK  
SNJ54LS02J  
SNJ54LS02J  
SNJ54LS02W  
SNJ54LS02W  
SNJ54S02FK  
SNJ54S02FK  
SNJ54S02J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
FK  
J
20  
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
1
1
1
1
1
1
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
W
W
FK  
FK  
J
CFP  
A42  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
SNJ54S02J  
J
SNJ54S02W  
SNJ54S02W  
W
W
CFP  
A42  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to  
discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold  
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent  
TI deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible  
for their products and applications using TI components. To minimize the risks associated with customer  
products and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent  
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,  
or process in which TI products or services are used. Information published by TI regarding third-party  
products or services does not constitute a license from TI to use such products or services or a warranty or  
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