74ACT11244PWRG4 [TI]
OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS; 八路缓冲器/ 3态输出线路驱动器
| 型号： | 74ACT11244PWRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS |
| 文件： | 总14页 (文件大小：625K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
DB, DW, NT, OR PW PACKAGE
(TOP VIEW)
D
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
D
D
Inputs Are TTL-Voltage Compatible
1
24
23
22
21
20
19
18
17
16
15
14
13
1Y1
1Y2
1Y3
1OE
1A1
1A2
1A3
1A4
VCC
VCC
2A1
2A2
2A3
2A4
2OE
Flow-Through Architecture Optimizes
PCB Layout
2
3
D
D
D
D
Center-Pin V and GND Configurations to
4
1Y4
CC
Minimize High-Speed Switching Noise
5
GND
GND
GND
GND
2Y1
2Y2
2Y3
2Y4
6
EPICt (Enhanced-Performance Implanted
CMOS) 1-mm Process
7
8
500-mA Typical Latch-Up Immunity at
125°C
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, and Standard Plastic 300-mil
DIPs (NT)
9
10
11
12
description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the
’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs.
The 74ACT11244 is characterized for operation from −40°C to 85°C.
FUNCTION TABLE
OUTPUT
DATA
OUTPUT
Y
ENABLE
INPUT
A
1OE, 2OE
H
L
L
X
L
Z
L
H
H
logic symbol†
24
13
1OE
2OE
EN
20
EN
23
1A1
22
1
2
3
4
17
16
15
14
9
10
11
12
1Y1
1Y2
1Y3
1Y4
2A1
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
1A2
21
1A3
20
1A4
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright © 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
logic diagram (positive logic)
24
13
1OE
2OE
1
23
9
17
16
15
1A1
1Y1
1Y2
2A1
2A2
2Y1
2Y2
2
3
10
22
1A2
21
11
12
1A3
1Y3
1Y4
2A3
2A4
2Y3
2Y4
20
4
14
1A4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V
I
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V
O
CC
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
OK
O
O
CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
O
O
CC
Continuous current through V or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
CC
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
A
DW package . . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . . 1.3 W
PW package . . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
MIN
4.5
2
MAX
UNIT
V
V
V
V
V
V
Supply voltage
5.5
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
0.8
V
0
0
V
CC
V
CC
V
Output voltage
V
O
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
−24
24
mA
mA
ns/V
°C
OH
OL
Dt/Dv
0
10
T
−40
85
A
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T = 25°C
A
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
4.4
TYP
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
4.4
5.4
I
= −50 mA
OH
5.4
3.94
4.94
3.8
V
OH
V
I
I
I
= −24 mA
= −75 mA
= 50 mA
OH
OH
OL
4.8
{
3.85
0.1
0.1
0.1
0.1
0.44
0.44
1.65
5
0.36
0.36
V
OL
V
I
I
= 24 mA
OL
{
= 75 mA
OL
I
I
I
V
= V or GND
0.5
0.1
8
mA
mA
mA
OZ
O
CC
V = V or GND
1
I
I
CC
V = V or GND,
I = 0
O
80
CC
I
CC
}
One input at 3.4 V,
Other inputs at GND or V
5.5 V
0.9
1
mA
DI
CC
CC
C
C
V = V or GND
5 V
5 V
4
pF
pF
i
I
CC
V
O
= V or GND
10
o
CC
†
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V
.
CC
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
6
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
8.9
t
t
t
t
t
t
1.5
1.5
1.5
1.5
1.5
1.5
9.9
9.2
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
5.4
8.6
6.6
11.3
10.5
9.8
12.5
11.4
10.4
11.2
OE
OE
ns
6.7
7.4
ns
7.8
10.6
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
f = 1 MHz
TYP
27
9
UNIT
Outputs enabled
Outputs disabled
C
Power dissipation capacitance per buffer
C = 50 pF,
pF
pd
L
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
/t
S1
S1
t
t
Open
PLH PHL
t
500 Ω
Open
GND
From Output
Under Test
/t
2 × V
PLZ PZL
CC
/t
GND
PHZ PZH
C = 50 pF
(see Note A)
L
500 Ω
Output
Control
(low-level
enabling)
3 V
0 V
LOAD CIRCUIT
1.5 V
1.5 V
t
PZL
3 V
0 V
t
PLZ
Output
Waveform 1
[ V
Input
CC
1.5 V
1.5 V
50% V
CC
20% V
CC
S1 at 2 × V
CC
V
OL
t
(see Note B)
PLH
t
PHZ
t
PHL
t
PZH
Output
Waveform 2
S1 at GND
V
OH
V
OH
80% V
CC
50% V
50% V
Output
CC
CC
50% V
CC
V
OL
[ 0 V
(see Note B)
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
1-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SSOP
SSOP
Drawing
74ACT11244DBLE
74ACT11244DBR
OBSOLETE
ACTIVE
DB
24
24
TBD
Call TI
Call TI
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11244DBRE4
74ACT11244DBRG4
74ACT11244DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
DB
DB
24
24
24
24
24
24
24
24
24
24
24
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
NT
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11244DWE4
74ACT11244DWG4
74ACT11244DWR
74ACT11244DWRE4
74ACT11244DWRG4
74ACT11244NT
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11244NTE4
74ACT11244PW
PDIP
NT
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
TSSOP
PW
PW
PW
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11244PWE4
74ACT11244PWG4
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11244PWLE
74ACT11244PWR
OBSOLETE TSSOP
PW
PW
24
24
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11244PWRE4
74ACT11244PWRG4
PW
PW
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Apr-2010
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74ACT11244DBR
74ACT11244DWR
74ACT11244PWR
SSOP
SOIC
DB
DW
PW
24
24
24
2000
2000
2000
330.0
330.0
330.0
16.4
24.4
16.4
8.2
10.75 15.7
6.95 8.3
8.8
2.5
2.7
1.6
12.0
12.0
8.0
16.0
24.0
16.0
Q1
Q1
Q1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74ACT11244DBR
74ACT11244DWR
74ACT11244PWR
SSOP
SOIC
DB
DW
PW
24
24
24
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
38.0
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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