74ACT11245DBRE4 [TI]
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS; 八路总线收发器与3态输出
| 型号： | 74ACT11245DBRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS |
| 文件： | 总25页 (文件大小：1342K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
DB, DW, NT, OR PW PACKAGE
(TOP VIEW)
3-State Outputs Drive Bus Lines Directly
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes
PCB Layout
A1
A2
A3
DIR
1
24
2
23 B1
22 B2
Center-Pin V
Minimize High-Speed Switching Noise
and GND Configurations
3
CC
4
21
20
19
18
17
16
15
14
13
A4
B3
B4
V
5
GND
GND
GND
GND
A5
A6
A7
A8
EPIC (Enhanced-Performance Implanted
CMOS) 1- m Process
6
CC
7
V
CC
500-mA Typical Latch-Up Immunity at
125°C
8
B5
B6
B7
B8
OE
9
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, and Standard Plastic 300-mil
DIPs (NT)
10
11
12
description
The octal bus transceiver is designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the
device so that the buses are effectively isolated.
The 74ACT11245 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
OUTPUT
ENABLE
OE
DIRECTION
CONTROL
DIR
OUTPUT
L
L
L
H
X
B data to A bus
A data to B bus
Isolation
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
†
logic symbol
13
24
OE
G3
DIR
3 EN1 [BA]
3 EN2 [AB]
1
23
B1
A1
1
2
2
22
21
20
17
16
15
14
B2
B3
B4
B5
B6
B7
B8
A2
A3
A4
A5
A6
A7
A8
3
4
9
10
11
12
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
24
1
DIR
A1
A2
A3
A4
A5
A6
A7
A8
13
23
22
21
20
17
16
15
14
OE
B1
B2
B3
B4
B5
B6
B7
B8
2
3
4
9
10
11
12
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
A
DW package . . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . . 1.3 W
PW package . . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150 C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
MIN
4.5
2
MAX
UNIT
V
V
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
V
0.8
V
0
0
V
V
V
I
CC
Output voltage
V
O
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
–24
24
mA
mA
ns/V
°C
OH
OL
t/ v
0
10
T
–40
85
A
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
4.4
TYP
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5 V
4.4
5.4
I
= –50 A
OH
5.4
3.94
4.94
3.8
V
V
OH
I
I
I
= –24 mA
= –75 mA
OH
OH
OL
4.8
3.85
0.1
0.1
0.1
0.1
0.44
0.44
1.65
±5
= 50
A
0.36
0.36
V
V
OL
I
I
= 24 mA
= 75 mA
OL
OL
‡
I
I
I
A or B ports
OE or DIR
V
= V or GND
CC
±0.5
±0.1
8
A
A
OZ
O
V = V
or GND
or GND,
±1
I
I
CC
CC
V = V
I = 0
O
80
A
CC
I
I
§
One input at 3.4 V, Other inputs at GND or V
CC
0.9
1
mA
pF
pF
CC
C
C
V = V
or GND
4
i
I
CC
= V or GND
CC
V
5 V
12
o
O
†
‡
§
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
For I/O ports, the parameter I includes the input leakage current.
OZ
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V
.
CC
switching characteristics over recomended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
6.2
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
9.2
t
t
t
t
t
t
1.5
1.5
1.5
1.5
1.5
1.5
10
9.1
PLH
PHL
PZH
PZL
PHZ
PLZ
A or B
B or A
A or B
A or B
5.4
8.6
8.1
12
13.2
12.9
12.9
13.9
ns
OE
OE
8.2
11.7
11.8
12.9
9.3
ns
9.8
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
= 50 pF, f = 1 MHz
L
TYP
66
UNIT
Outputs enabled
Outputs disabled
C
Power dissipation capacitance per transceiver
C
pF
pd
19
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74ACT11245
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS031C – JULY 1987 – REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
GND
TEST
S1
S1
t
/t
Open
PLH PHL
/t
500 Ω
From Output
Under Test
t
2 × V
CC
GND
PLZ PZL
t
/t
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
LOAD CIRCUIT
Output
Control
(low-level
enabling)
3 V
0 V
1.5 V
1.5 V
t
PZL
3 V
0 V
t
PLZ
Output
Waveform 1
V
CC
Input
1.5 V
1.5 V
50% V
CC
20% V
S1 at 2 × V
(see Note B)
CC
CC
CC
V
V
OL
t
PLH
t
PHZ
t
PHL
t
PZH
Output
Waveform 2
S1 at GND
V
OH
OH
0 V
80% V
50% V
50% V
Output
CC
CC
50% V
CC
V
OL
(see Note B)
VOLTAGE WAVEFORMS
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SSOP
SSOP
Drawing
74ACT11245DBLE
74ACT11245DBR
OBSOLETE
ACTIVE
DB
24
24
TBD
Call TI
Call TI
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11245DBRE4
74ACT11245DBRG4
74ACT11245DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
DB
DB
DW
DW
DW
DW
DW
DW
NS
NS
NS
NT
24
24
24
24
24
24
24
24
24
24
24
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11245DWE4
74ACT11245DWG4
74ACT11245DWR
74ACT11245DWRE4
74ACT11245DWRG4
74ACT11245NSR
74ACT11245NSRE4
74ACT11245NSRG4
74ACT11245NT
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
PDIP
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11245NTE4
NT
15
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11245PWLE
74ACT11245PWR
OBSOLETE TSSOP
PW
PW
24
24
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11245PWRE4
74ACT11245PWRG4
PW
PW
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
74ACT11245DBR
74ACT11245DWR
74ACT11245NSR
74ACT11245PWR
SSOP
SOIC
SO
DB
DW
NS
24
24
24
24
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
24.4
16.4
8.2
10.75
8.2
8.8
15.7
15.4
8.3
2.5
2.7
2.5
1.6
12.0
12.0
12.0
8.0
16.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74ACT11245DBR
74ACT11245DWR
74ACT11245NSR
74ACT11245PWR
SSOP
SOIC
SO
DB
DW
NS
24
24
24
24
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
41.0
33.0
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
74ACT11245DBLE
74ACT11245DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
24
24
TBD
Call TI
Call TI
-40 to 85
-40 to 85
DB
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AT245
74ACT11245DBRE4
74ACT11245DBRG4
74ACT11245DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
DB
DB
DW
DW
DW
DW
DW
DW
NS
NS
NS
NT
24
24
24
24
24
24
24
24
24
24
24
24
24
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AT245
Green (RoHS
& no Sb/Br)
AT245
Green (RoHS
& no Sb/Br)
ACT11245
ACT11245
ACT11245
ACT11245
ACT11245
ACT11245
ACT11245
ACT11245
ACT11245
74ACT11245NT
74ACT11245NT
74ACT11245DWE4
74ACT11245DWG4
74ACT11245DWR
74ACT11245DWRE4
74ACT11245DWRG4
74ACT11245NSR
74ACT11245NSRE4
74ACT11245NSRG4
74ACT11245NT
25
Green (RoHS
& no Sb/Br)
25
Green (RoHS
& no Sb/Br)
2000
2000
2000
2000
2000
2000
15
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
PDIP
PDIP
Pb-Free
(RoHS)
74ACT11245NTE4
NT
15
Pb-Free
(RoHS)
N / A for Pkg Type
74ACT11245PWLE
74ACT11245PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
24
24
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AT245
AT245
74ACT11245PWRE4
ACTIVE
TSSOP
PW
24
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
74ACT11245PWRG4
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
TSSOP
PW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AT245
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74ACT11245DBR
74ACT11245DWR
74ACT11245NSR
74ACT11245PWR
SSOP
SOIC
SO
DB
DW
NS
24
24
24
24
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
24.4
16.4
8.2
8.8
2.5
2.7
2.5
1.6
12.0
12.0
12.0
8.0
16.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
10.75 15.7
8.2
15.4
8.3
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74ACT11245DBR
74ACT11245DWR
74ACT11245NSR
74ACT11245PWR
SSOP
SOIC
SO
DB
DW
NS
24
24
24
24
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
45.0
38.0
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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