74AHCT16244DGGRG4 [TI]
16-Bit Buffers/Drivers With 3-State Outputs;
| 型号： | 74AHCT16244DGGRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-Bit Buffers/Drivers With 3-State Outputs |
| 文件： | 总14页 (文件大小：250K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54AHCT16244, SN74AHCT16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS334I – MARCH 1996 – REVISED JANUARY 2000
SN54AHCT16244 . . . WD PACKAGE
SN74AHCT16244 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Members of the Texas Instruments
Widebus Family
EPIC (Enhanced-Performance Implanted
CMOS) Process
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1OE
1Y1
1Y2
GND
1Y3
1Y4
2OE
1A1
1A2
GND
1A3
1A4
Inputs Are TTL-Voltage Compatible
2
3
Distributed V
High-Speed Switching Noise
and GND Pins Minimize
CC
4
5
Flow-Through Architecture Optimizes PCB
Layout
6
7
V
V
CC
CC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
8
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
9
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
V
V
CC
CC
description
4Y1
4Y2
GND
4Y3
4Y4
4A1
4A2
GND
4A3
4A4
3OE
The ’AHCT16244 devices are 16-bit buffers and
line drivers designed specifically to improve the
performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters.
4OE
These devices can be used as four 4-bit buffers,
two8-bitbuffers, orone16-bitbuffer. Theyprovide
true outputs and symmetrical active-low
output-enable (OE) inputs.
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHCT16244 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74AHCT16244 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each 4-bit buffer/driver)
INPUTS
OUTPUT
Y
A
OE
L
H
L
H
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
Copyright 2000, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16244, SN74AHCT16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS334I – MARCH 1996 – REVISED JANUARY 2000
†
logic symbol
1
1OE
EN1
EN2
EN3
EN4
48
2OE
25
3OE
24
4OE
47
1A1
46
2
3
1
1
1
1
1
2
3
4
1Y1
1Y2
1Y3
1Y4
2Y1
2Y2
2Y3
2Y4
3Y1
3Y2
3Y3
3Y4
4Y1
4Y2
4Y3
4Y4
1A2
44
5
1A3
43
6
1A4
41
8
2A1
40
9
2A2
38
11
12
13
14
16
17
19
20
22
23
2A3
37
2A4
36
3A1
35
3A2
33
3A3
32
3A4
30
4A1
29
4A2
27
4A3
26
4A4
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16244, SN74AHCT16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS334I – MARCH 1996 – REVISED JANUARY 2000
logic diagram (positive logic)
1
25
36
1OE
3OE
3A1
47
2
3
5
6
13
1A1
1Y1
1Y2
1Y3
1Y4
3Y1
46
35
33
32
14
1A2
3A2
3A3
3A4
3Y2
44
16
1A3
3Y3
43
17
1A4
3Y4
48
24
30
2OE
4OE
4A1
41
8
9
19
2A1
2Y1
2Y2
2Y3
2Y4
4Y1
40
29
27
26
20
2A2
4A2
4A3
4A4
4Y2
38
11
12
22
2A3
4Y3
37
23
2A4
4Y4
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
O
CC
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
IK
I
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through each V
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
O
O
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
CC
JA
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16244, SN74AHCT16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS334I – MARCH 1996 – REVISED JANUARY 2000
recommended operating conditions (see Note 3)
SN54AHCT16244 SN74AHCT16244
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
5.5
0.8
5.5
V
0
0
0
0
V
I
Output voltage
V
V
V
O
CC
–8
CC
–8
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
mA
mA
ns/V
°C
OH
OL
8
8
20
85
∆t/∆v
20
T
A
–55
125
–40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
TYP
SN54AHCT16244 SN74AHCT16244
PARAMETER
TEST CONDITIONS
= –50
V
UNIT
V
CC
MIN
4.4
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
A
4.5
OH
OH
OL
OL
V
4.5 V
4.5 V
OH
OL
= –8 mA
= 50
= 8 mA
3.94
3.8
3.8
A
0.1
0.36
±0.1
±0.25
4
0.1
0.44
±1*
0.1
0.44
±1
V
V
I
I
I
V = V
or GND
0 V to 5.5 V
5.5 V
A
A
A
I
I
CC
V
= V
or GND
±2.5
40
±2.5
40
OZ
CC
O
CC
V = V
or GND,
I
O
= 0
5.5 V
I
CC
One input at 3.4 V,
Other inputs at V
†
5.5 V
1.35
10
1.5
1.5
10
mA
∆I
CC
or GND
CC
or GND
C
C
V = V
5 V
5 V
2.5
3
pF
pF
i
I
CC
= V or GND
CC
V
o
O
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or V
CC
= 0 V.
CC
†
.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16244, SN74AHCT16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS334I – MARCH 1996 – REVISED JANUARY 2000
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
T
A
= 25°C
TYP
SN54AHCT16244 SN74AHCT16244
UNIT
FROM
(INPUT)
TO
LOAD
PARAMETER
(OUTPUT) CAPACITANCE
MIN
MAX
8.5*
8.5*
MIN
1*
1*
1*
1*
1*
1*
1
MAX
10*
10*
12*
12*
12*
12*
11
MIN
MAX
9.5
9.5
12
t
t
t
t
t
t
t
t
t
t
t
t
t
5.4*
1
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
sk(o)
A
Y
Y
Y
Y
Y
Y
C
C
C
C
C
= 15 pF
= 15 pF
= 15 pF
= 50 pF
= 50 pF
ns
ns
ns
ns
ns
L
L
L
L
L
5.4*
1
7.7* 10.4*
7.7* 10.4*
5* 10.4*
5* 10.4*
1
OE
OE
1
12
1
12
1
12
7
5.9
8.2
8.2
8.8
8.8
9.5
9.5
1
10.5
10.5
13
A
1
11
1
11.4
11.4
11.4
11.4
1
13
1
OE
OE
1
13
1
13
1
13
1
13
C
C
= 50 pF
= 50 pF
ns
ns
L
L
1
13
1
13
**
1
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
** On products compliant to MIL-PRF-38535, this parameter does not apply.
noise characteristics, V
= 5 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
SN74AHCT16244
PARAMETER
UNIT
MIN
TYP
0.7
MAX
V
V
V
V
V
Quiet output, maximum dynamic V
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
–0.7
4.8
OL
OH
2
0.8
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
No load, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
8.2
pF
pd
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16244, SN74AHCT16244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS334I – MARCH 1996 – REVISED JANUARY 2000
PARAMETER MEASUREMENT INFORMATION
V
CC
Open
GND
S1
R
= 1 kΩ
L
TEST
S1
From Output
Under Test
Test
Point
From Output
Under Test
t
t
/t
Open
PLH PHL
/t
C
C
L
t
V
CC
L
PLZ PZL
/t
(see Note A)
(see Note A)
GND
PHZ PZH
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
3 V
0 V
1.5 V
Timing Input
t
w
t
h
3 V
t
su
3 V
0 V
1.5 V
1.5 V
Input
Input
1.5 V
1.5 V
Data Input
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
0 V
t
t
t
t
t
PZL
PLZ
PLH
PHL
Output
Waveform 1
V
≈V
OH
CC
In-Phase
Output
50% V
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
(see Note B)
CC
V
V
+ 0.3 V
OL
V
OL
OL
t
t
t
PHL
PLH
PZH
PHZ
Output
Waveform 2
S1 at GND
V
OH
V
OH
Out-of-Phase
Output
– 0.3 V
OH
50% V
50% V
CC
CC
CC
V
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
74AHCT16244DGGRE4
74AHCT16244DGVRE4
74AHCT16244DLRG4
SN74AHCT16244DGGR
SN74AHCT16244DGVR
SN74AHCT16244DL
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
SSOP
TSSOP
TVSOP
SSOP
SSOP
SSOP
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AHCT16244DLG4
SN74AHCT16244DLR
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
24
SN74AHCT16244DGGR
SN74AHCT16244DGVR
SN74AHCT16244DLR
DGG
DGV
DL
48
48
48
MLA
MLA
MLA
8.6
6.8
15.8
10.1
16.2
1.8
1.6
3.1
12
12
16
24
24
32
Q1
Q1
Q1
330
24
330
32
11.35
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74AHCT16244DGGR
SN74AHCT16244DGVR
SN74AHCT16244DLR
DGG
DGV
DL
48
48
48
MLA
MLA
MLA
333.2
333.2
336.6
333.2
333.2
342.9
31.75
31.75
41.3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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