74ALVCH16821DLRG4 [TI]
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS; 3.3 -V 20位总线接口触发器具有三态输出
| 型号： | 74ALVCH16821DLRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS |
| 文件： | 总12页 (文件大小：312K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F–JULY 1995–REVISED SEPTEMBER 2004
FEATURES
DGG OR DL PACKAGE
(TOP VIEW)
•
•
•
•
Member of the Texas Instruments Widebus™
Family
1
1OE
1Q1
1Q2
GND
1Q3
1Q4
1CLK
1D1
1D2
GND
1D3
1D4
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
2
3
Latch-Up Performance Exceeds 250 mA Per
JESD 17
4
5
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
6
7
V
CC
V
CC
8
1Q5
1Q6
1Q7
GND
1Q8
1Q9
1Q10
2Q1
2Q2
2Q3
GND
2Q4
2Q5
2Q6
1D5
1D6
1D7
GND
1D8
1D9
1D10
2D1
2D2
2D3
GND
2D4
2D5
2D6
9
DESCRIPTION/ORDERING INFORMATION
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
This 20-bit bus-interface flip-flop is designed for
1.65-V to 3.6-V VCC operation.
The SN74ALVCH16821 can be used as two 10-bit
flip-flops or one 20-bit flip-flop. The 20 flip-flops are
edge-triggered D-type flip-flops. On the positive
transition of the clock (CLK) input, the device
provides true data at the Q outputs.
A buffered output-enable (OE) input can be used to
place the ten outputs in either a normal logic state
(high or low logic levels) or the high-impedance state.
In the high-impedance state, the outputs neither load
nor drive the bus lines significantly. The
high-impedance state and increased drive provide the
capability to drive bus lines without need for interface
or pullup components.
V
CC
V
CC
2Q7
2Q8
2D7
2D8
GND
2Q9
2Q10
2OE
GND
2D9
2D10
2CLK
OE does not affect the internal operation of the
flip-flops. Old data can be retained or new data can
be entered while the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
SN74ALVCH16821DL
TOP-SIDE MARKING
ALVCH16821
ALVCH16821
Tube
SSOP - DL
TSSOP - DGG
-40°C to 85°C
Tape and reel
Tape and reel
SN74ALVCH16821DLR
SN74ALVCH16821DGGR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1995–2004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F–JULY 1995–REVISED SEPTEMBER 2004
FUNCTION TABLE
(each 10-bit flip-flop)
INPUTS
OUTPUT
OE
L
CLK
D
H
L
Q
H
↑
L
↑
H or L
X
L
L
X
X
Q0
Z
H
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1OE
56
1CLK
One of Ten
Channels
C1
2
55
1Q1
1D1
1D
To Nine Other Channels
28
29
2OE
2CLK
One of Ten
Channels
C1
15
42
2Q1
2D1
1D
To Nine Other Channels
2
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F–JULY 1995–REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
-0.5
-0.5
-0.5
MAX
4.6
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Output voltage range(2)(3)
4.6
V
VO
IIK
VCC + 0.5
-50
V
Input clamp current
VI < 0
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
-50
Continuous output current
Continuous current through each VCC or GND
±50
±100
48
DGG package
DL package
θJA
Package thermal impedance(4)
Storage temperature range
°C/W
°C
56
Tstg
-65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) This value is limited to 4.6 V maximum.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
MIN
MAX
UNIT
VCC
Supply voltage
1.65
3.6
V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
0.65 × VCC
VIH
High-level input voltage
1.7
2
V
V
0.35 × VCC
0.7
0.8
VCC
VCC
-4
VIL
Low-level input voltage
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
VCC = 2.7 V
VCC = 3 V
-12
-12
-24
4
IOH
High-level output current
Low-level output current
mA
mA
VCC = 1.65 V
VCC = 2.3 V
VCC = 2.7 V
VCC = 3 V
12
IOL
12
24
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
10
ns/V
TA
-40
85
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F–JULY 1995–REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP(1)
MAX UNIT
IOH = -100 µA
IOH = -4 mA
IOH = -6 mA
1.65 V to 3.6 V VCC - 0.2
1.65 V
2.3 V
1.2
2
VOH
2.3 V
1.7
2.2
2.4
2
V
IOH = -12 mA
2.7 V
3 V
IOH = -24 mA
IOL = 100 µA
IOL = 4 mA
IOL = 6 mA
3 V
1.65 V to 3.6 V
1.65 V
2.3 V
0.2
0.45
0.4
V
VOL
2.3 V
0.7
IOL = 12 mA
2.7 V
0.4
IOL = 24 mA
VI = VCC or GND
VI = 0.58 V
3 V
0.55
II
3.6 V
±5
µA
µA
1.65 V
1.65 V
2.3 V
25
-25
45
VI = 1.07 V
VI = 0.7 V
II(hold)
VI = 1.7 V
2.3 V
-45
75
VI = 0.8 V
3 V
VI = 2 V
3 V
-75
VI = 0 to 3.6 V(2)
3.6 V
±500
±10
40
IOZ
VO = VCC or GND
3.6 V
µA
µA
µA
ICC
VI = VCC or GND, IO = 0
3.6 V
∆ICC
One input at VCC - 0.6 V, Other inputs at VCC or GND
3 V to 3.6 V
750
Control inputs
Data Inputs
Outputs
3.5
6
Ci
VI = VCC or GND
VO = VCC or GND
3.3 V
3.3 V
pF
pF
Co
7
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 1.8 V
VCC = 2.7 V
UNIT
MIN MAX
MIN MAX
MIN MAX
MIN MAX
(1)
fclock
tw
Clock frequency
150
150
150
MHz
ns
(1)
(1)
(1)
Pulse duration, CLK high or low
Setup time, data before CLK↑
Hold time, data after CLK↑
3.3
4.4
0
3.3
3.9
0
3.3
3.4
0
tsu
th
ns
ns
(1) This information was not available at the time of publication.
4
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F–JULY 1995–REVISED SEPTEMBER 2004
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 1.8 V
VCC = 2.7 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
TYP
MIN
MAX
MIN
MAX
MIN
150
1
MAX
(1)
fmax
tpd
150
1
150
MHz
ns
(1)
(1)
(1)
CLK
OE
Q
Q
Q
5.8
6.6
5.7
5.3
6.2
5
4.5
5.1
4.6
ten
1
1
ns
tdis
OE
1
1
ns
(1) This information was not available at the time of publication.
OPERATING CHARACTERISTICS
TA = 25°C
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
PARAMETER
TEST CONDITIONS
UNIT
TYP
TYP
36
TYP
40
(1)
Outputs enabled
Outputs disabled
Power dissipation
capacitance
Cpd
CL = 50 pF, f = 10 MHz
pF
(1)
22
24
(1) This information was not available at the time of publication.
5
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F–JULY 1995–REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
S1
GND
t
Open
V
LOAD
GND
pd
/t
/t
C
t
t
L
PLZ PZL
R
L
(see Note A)
PHZ PZH
LOAD CIRCUIT
INPUT
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
1.8 V
V
V
2.7 V
2.7 V
V
/2
/2
2 × V
2 × V
6 V
6 V
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
30 pF
30 pF
50 pF
50 pF
CC
CC
CC
2.5 V ± 0.2 V
2.7 V
V
CC
CC
CC
1.5 V
1.5 V
3.3 V ± 0.3 V
0.3 V
t
w
V
I
V
I
V
M
V
M
Input
Timing
Input
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
t
su
t
h
V
I
Output
Control
(low-level
enabling)
Data
Input
V
I
V
V
M
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
t
PLZ
PZL
Output
Waveform 1
S1 at V
LOAD
(see Note B)
V
V
/2
LOAD
V
I
V
M
Input
V
M
V
M
V + V
∆
OL
0 V
OL
t
t
PZH
PHZ
t
t
PHL
PLH
Output
Waveform 2
S1 at GND
V
OH
V
V
OH
V
OH
− V
∆
V
M
Output
V
M
V
M
0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
74ALVCH16821DGGRE4
74ALVCH16821DGGRG4
74ALVCH16821DLG4
74ALVCH16821DLRG4
SN74ALVCH16821DGGR
SN74ALVCH16821DL
SN74ALVCH16821DLR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
56
56
56
56
56
56
56
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
SSOP
SSOP
TSSOP
SSOP
SSOP
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74ALVCH16821DGGR TSSOP
SN74ALVCH16821DLR SSOP
DGG
DL
56
56
2000
1000
330.0
330.0
24.4
32.4
8.6
15.6
1.8
3.1
12.0
16.0
24.0
32.0
Q1
Q1
11.35
18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74ALVCH16821DGGR
SN74ALVCH16821DLR
TSSOP
SSOP
DGG
DL
56
56
2000
1000
346.0
346.0
346.0
346.0
41.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
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