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74AUP1G126DBVRE4 [TI]

LOW-POWER SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT; 低功耗单路总线缓冲器具有三态输出门
74AUP1G126DBVRE4
型号： 74AUP1G126DBVRE4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

LOW-POWER SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT
低功耗单路总线缓冲器具有三态输出门

总线驱动器 总线收发器 逻辑集成电路 光电二极管 输出元件
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SN74AUP1G126  
www.ti.com  
SCES596F –JULY 2004–REVISED MAY 2010  
LOW-POWER SINGLE BUS BUFFER GATE  
WITH 3-STATE OUTPUT  
Check for Samples: SN74AUP1G126  
1
FEATURES  
•
•
•
Available in the Texas Instruments NanoStar™  
Package  
•
Input Hysteresis Allows Slow Input Transition  
and Better Switching Noise Immunity at Input  
Wide Operating VCC Range of 0.8 V to 3.6 V  
Optimized for 3.3-V Operation  
Low Static-Power Consumption  
(ICC = 0.9 mA Max)  
•
•
•
Low Dynamic-Power Consumption  
(Cpd = 4 pF Typ at 3.3 V)  
3.6-V I/O Tolerant to Support Mixed-Mode  
Signal Operation  
•
•
Low Input Capacitance (Ci = 1.5 pF Typ)  
•
•
•
tpd = 4.6 ns Max at 3.3 V  
Low Noise – Overshoot and Undershoot  
<10% of VCC  
Suitable for Point-to-Point Applications  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
Input-Disable Feature Allows Floating Input  
Conditions  
•
ESD Performance Tested Per JESD 22−  
Ioff Supports Partial-Power-Down Mode  
Operation  
–
2000-V Human-Body Model  
(A114-B, Class II)  
–
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
VCC  
1
2
3
5
VCC  
OE  
A
1
2
3
5
4
OE  
A
VCC  
1
2
3
5
OE  
A
4
GND  
Y
GND  
Y
4
GND  
Y
DRY PACKAGE  
(TOP VIEW)  
DSF PACKAGE  
(TOP VIEW)  
YFP PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(TOP VIEW)  
A2  
A2  
A1  
1
2
6
5
4
A1  
1
2
5
VCC  
N.C.  
Y
OE  
A
VCC  
OE  
A
1
2
3
6
5
4
1
2
3
6
5
4
OE  
A
OE  
VCC  
VCC  
N.C.  
Y
B1  
B2  
C2  
B1  
N.C.  
Y
A
C1 3  
C1 3  
4
C2  
Y
GND  
GND  
GND  
GND  
N.C. – No internal connection.  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable  
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range  
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see  
Figure 1 and Figure 2 ).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2010, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
 
SN74AUP1G126  
SCES596F –JULY 2004–REVISED MAY 2010  
www.ti.com  
Switching Characteristics  
at 25 MHz(1)  
3.3-V  
Logic(1)  
3.3-V  
Logic(1)  
(1) Single, dual, and triple gates  
(1) AUP1G08 data at CL = 15 pF  
Figure 1. AUP – The Lowest-Power Family  
Figure 2. Excellent Signal Integrity  
This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable  
(OE) input is low. This device has the input-disable feature, which allows floating input signals.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.  
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
ORDERABLE PART  
NUMBER  
TOP-SIDE  
TA  
PACKAGE(2)  
MARKING(3)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YFP  
Reel of 3000  
Reel of 3000  
SN74AUP1G126YFPR  
SN74AUP1G126YZPR  
_ _ _ HN _  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
_ _ _ HN _  
QFN – DRY  
Reel of 5000  
Reel of 5000  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 4000  
SN74AUP1G126DRYR  
SN74AUP1G126DSFR  
SN74AUP1G126DBVR  
SN74AUP1G126DBVT  
SN74AUP1G126DCKR  
SN74AUP1G126DCKT  
SN74AUP1G126DRLR  
HN  
HN  
mQFN – DSF  
–40°C to 85°C  
SOT (SOT-23) – DBV  
H26_  
SOT (SC-70) – DCK  
HN_  
HN_  
SOT (SOT-553) – DRL  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
YZP/YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
OE  
H
A
H
H
L
H
L
L
X(1)  
Z
(1) Floating inputs allowed  
2
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Copyright © 2004–2010, Texas Instruments Incorporated  
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
www.ti.com  
SCES596F –JULY 2004–REVISED MAY 2010  
LOGIC DIAGRAM (POSITIVE LOGIC)  
Copyright © 2004–2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
SCES596F –JULY 2004–REVISED MAY 2010  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX UNIT  
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Output voltage range in the high or low state(2)  
4.6  
4.6  
4.6  
V
V
VO  
VO  
IIK  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–50  
–50  
±20  
±50  
206  
252  
142  
TBD  
234  
132  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
DBV package  
DCK package  
DRL package  
qJA  
Package thermal impedance(3)  
°C/W  
°C  
DSF package  
DRY package  
YFP/YZP/YZT package  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The package thermal impedance is calculated in accordance with JESD 51-7.  
4
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Copyright © 2004–2010, Texas Instruments Incorporated  
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
www.ti.com  
SCES596F –JULY 2004–REVISED MAY 2010  
RECOMMENDED OPERATING CONDITIONS(1)  
MIN  
MAX  
3.6  
UNIT  
VCC  
Supply voltage  
0.8  
V
VCC = 0.8 V  
VCC  
3.6  
VCC = 1.1 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 0.8 V  
0.65 × VCC  
3.6  
VIH  
High-level input voltage  
V
V
1.6  
2
3.6  
3.6  
0
VCC = 1.1 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
Active state  
0
0
0
0
0
0.35 × VCC  
0.7  
VIL  
Low-level input voltage  
Output voltage  
0.9  
VCC  
3.6  
VO  
V
3-state  
VCC = 0.8 V  
–20  
–1.1  
–1.7  
–1.9  
–3.1  
–4  
mA  
VCC = 1.1 V  
VCC = 1.4 V  
IOH  
High-level output current  
VCC = 1.65 V  
VCC = 2.3 V  
mA  
mA  
VCC = 3 V  
VCC = 0.8 V  
20  
VCC = 1.1 V  
1.1  
VCC = 1.4 V  
1.7  
IOL  
Low-level output current  
VCC = 1.65 V  
VCC = 2.3 V  
1.9  
mA  
3.1  
VCC = 3 V  
4
Δt/Δv  
Input transition rise or fall rate  
Operating free-air temperature  
VCC = 0.8 V to 3.6 V  
200  
85  
ns/V  
°C  
TA  
–40  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow of Floating CMOS Inputs, literature number SCBA004.  
Copyright © 2004–2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
SCES596F –JULY 2004–REVISED MAY 2010  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
over recommended operating free-air temperature range (unless otherwise noted)  
TA = 25°C  
TYP  
TA = –40°C to 85°C  
PARAMETER  
TEST CONDITIONS  
VCC  
UNIT  
MIN  
VCC – 0.1  
0.75 × VCC  
1.11  
MAX  
MIN  
VCC – 0.1  
0.7 × VCC  
1.03  
MAX  
IOH = –20 mA  
0.8 V to 3.6 V  
1.1 V  
IOH = –1.1 mA  
IOH = –1.7 mA  
IOH = –1.9 mA  
IOH = –2.3 mA  
IOH = –3.1 mA  
IOH = –2.7 mA  
IOH = –4 mA  
IOL = 20 mA  
1.4 V  
1.65 V  
1.32  
1.3  
VOL  
V
2.05  
1.97  
2.3 V  
3 V  
1.9  
1.85  
2.72  
2.67  
2.6  
2.55  
0.8 V to 3.6 V  
1.1 V  
0.1  
0.3 × VCC  
0.31  
0.1  
0.3 × VCC  
0.37  
IOL = 1.1 mA  
IOL = 1.7 mA  
IOL = 1.9 mA  
IOL = 2.3 mA  
IOL = 3.1 mA  
IOL = 2.7 mA  
IOL = 4 mA  
1.4 V  
1.65 V  
0.31  
0.35  
VOL  
V
0.31  
0.33  
2.3 V  
0.44  
0.45  
0.31  
0.33  
3 V  
0.44  
0.45  
A or OE  
input  
II  
VI = GND to 3.6 V  
0 V to 3.6 V  
0.1  
0.5  
mA  
Ioff  
VI or VO = 0 V to 3.6 V  
VI or VO = 0 V to 3.6 V  
VO = VCC or GND  
0 V  
0 V to 0.2 V  
3.6 V  
0.2  
0.2  
0.6  
0.6  
0.5  
mA  
mA  
mA  
ΔIoff  
IOZ  
VI = GND or (VCC to 3.6 V),  
OE = GND, IO = 0  
ICC  
0.8 V to 3.6 V  
3.3 V  
0.5  
0.9  
mA  
VI = VCC – 0.6 V(1)  
IO = 0  
,
A input  
40  
50  
OE input  
110  
120  
ΔICC  
mA  
VI = GND to 3.6 V,  
OE = VCC  
All inputs  
0.8 V to 3.6 V  
0
0
(2)  
0 V  
1.5  
1.5  
3
Ci  
VI = VCC or GND  
VO = VCC or GND  
pF  
pF  
3.6 V  
3.6 V  
Co  
(1) One input at VCC – 0.6 V, other input at VCC or GND  
(2) To show ICC is very low when the input-disable feature is enabled  
6
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Copyright © 2004–2010, Texas Instruments Incorporated  
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
www.ti.com  
SCES596F –JULY 2004–REVISED MAY 2010  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4)  
TA = –40°C  
to 85°C  
TA = 25°C  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
VCC  
UNIT  
MIN  
TYP  
18.1  
7.4  
5.2  
4.1  
2.9  
2.4  
19.1  
9.3  
6.6  
5.3  
3.8  
3.2  
12.1  
4.1  
2.9  
2.9  
1.8  
2.2  
MAX  
MIN  
MAX  
0.8 V  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
4.3  
3.3  
2.6  
2
12.6  
8.5  
6.8  
4.7  
3.8  
2.7  
1
15.3  
10.2  
8.3  
tpd  
A
Y
Y
Y
ns  
1.3  
1.1  
1
5.8  
1.7  
4.6  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
5.1  
4.1  
3.2  
2.5  
2.1  
15.9  
10.5  
8.7  
6
3.6  
2.5  
2.1  
1.6  
1.4  
19.2  
12.7  
10.3  
7.2  
ten  
OE  
OE  
ns  
ns  
4.9  
5.9  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
2.4  
1.8  
1
6.9  
4.5  
4.3  
2.7  
3.2  
2.2  
1.7  
1.5  
1
7.7  
5.1  
4.7  
3.3  
4
tdis  
1
1.2  
1.1  
Copyright © 2004–2010, Texas Instruments Incorporated  
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Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
SCES596F –JULY 2004–REVISED MAY 2010  
www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4)  
TA = –40°C  
to 85°C  
TA = 25°C  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
VCC  
UNIT  
MIN  
TYP  
20.5  
8.4  
5.9  
4.7  
3.4  
2.8  
21.8  
10.2  
7.3  
5.8  
4.3  
3.7  
13  
MAX  
13.7  
9.3  
MIN  
MAX  
0.8 V  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
4.6  
3.5  
3.9  
2.3  
2.1  
3.6  
2.4  
1.3  
1.6  
1.4  
16.6  
11.1  
9.1  
7.5  
tpd  
A or B  
Y
Y
Y
ns  
5.3  
4.3  
6.4  
5.2  
16.8  
11.2  
9.2  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
4.9  
3.9  
3.4  
2.5  
2.1  
4.4  
3.3  
2.7  
2.1  
1.9  
20.2  
13.5  
11  
ten  
OE  
ns  
ns  
6.4  
5.4  
7.8  
6.4  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
3.8  
2.2  
2.4  
1.3  
1.9  
6.6  
4.7  
4.4  
3.1  
3.4  
11.7  
7.9  
6.4  
4.9  
5
1.2  
1.3  
2.2  
1.2  
1.9  
14  
9.3  
7.5  
5.4  
5.6  
tdis  
OE  
8
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Copyright © 2004–2010, Texas Instruments Incorporated  
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
www.ti.com  
SCES596F –JULY 2004–REVISED MAY 2010  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4)  
TA = –40°C  
to 85°C  
TA = 25°C  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
VCC  
UNIT  
MIN  
TYP  
22.5  
9.3  
6.6  
5.3  
3.9  
3.2  
25.2  
11.3  
8.1  
6.5  
4.8  
4.1  
14  
MAX  
MIN  
MAX  
0.8 V  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
5.8  
4.4  
3.5  
2.7  
2.4  
15.1  
10.2  
8.3  
4.3  
3
17.9  
12.1  
9.9  
7
tpd  
A or B  
Y
Y
Y
ns  
2.3  
1.9  
1.8  
5.8  
4.7  
5.7  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
7
5.5  
4.3  
3.4  
2.9  
18.1  
12.2  
10.1  
7.1  
5.4  
4.1  
3.3  
2.6  
2.3  
21.4  
14.5  
12  
ten  
OE  
ns  
ns  
8.4  
5.9  
6.9  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
3.7  
5.5  
3.3  
2.3  
2.4  
5.8  
3.9  
4.5  
3.2  
4.8  
8.2  
5.9  
6.6  
4.3  
6.2  
3.3  
2.1  
2.9  
1.8  
3.1  
11  
8
tdis  
OE  
7.4  
5.1  
6.7  
Copyright © 2004–2010, Texas Instruments Incorporated  
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Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
SCES596F –JULY 2004–REVISED MAY 2010  
www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4)  
TA = –40°C  
to 85°C  
TA = 25°C  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
VCC  
UNIT  
MIN  
TYP  
29  
MAX  
MIN  
MAX  
0.8 V  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
7.4  
5.7  
4.8  
3.9  
3.5  
12  
18.7  
12.5  
10.1  
7.2  
6.6  
4.9  
3.1  
3.3  
3
21.4  
14.7  
12  
8.6  
6.9  
5.1  
4.8  
33.4  
14.1  
10.1  
8.1  
6.1  
5.2  
17.7  
10  
tpd  
A or B  
Y
Y
Y
ns  
8.7  
7
6
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
8.8  
6.9  
5.6  
4.3  
3.7  
21.8  
14.6  
12  
7.4  
5.6  
4.7  
3.8  
3.4  
25.5  
17.4  
14.1  
10  
ten  
OE  
ns  
ns  
8.5  
7.1  
8.3  
1.2 V ± 0.1 V  
1.5 V ± 0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5.8  
5.7  
4.5  
3.9  
3.3  
16  
10.9  
9.8  
3.7  
1
16  
10.7  
12.5  
9
7.7  
7.7  
5.6  
8.4  
tdis  
OE  
4.4  
3.2  
6.6  
7.4  
10.7  
10.8  
OPERATING CHARACTERISTICS  
TA = 25°C  
PARAMETER  
TEST CONDITIONS  
VCC  
0.8 V  
TYP  
UNIT  
3.8  
3.7  
3.7  
3.7  
3.9  
4
1.2 V ± 0.1 V  
1.5 V ±0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0.8 V  
Outputs enabled  
f = 10 MHz  
Power dissipation  
capacitance  
Cpd  
0
pF  
1.2 V ± 0.1 V  
1.5 V ±0.1 V  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
0
0
Outputs disable  
f = 10 MHz  
0
0
0
0
10  
Submit Documentation Feedback  
Copyright © 2004–2010, Texas Instruments Incorporated  
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
www.ti.com  
SCES596F –JULY 2004–REVISED MAY 2010  
PARAMETER MEASUREMENT INFORMATION  
(Propagation Delays, Setup and Hold Times, and Pulse Width)  
From Output  
Under Test  
C
L
1 MΩ  
(see Note A)  
LOAD CIRCUIT  
V
= 1.2 V  
V
= 1.5 V  
V
= 1.8 V  
V
= 2.5 V  
V
= 3.3 V  
CC  
CC  
CC  
CC  
CC  
V
CC  
= 0.8 V  
± 0.1 V  
5, 10, 15, 30 pF 5, 10, 15, 30 pF 5, 10, 15, 30 pF  
/2 /2 /2  
± 0.1 V  
± 0.15 V  
± 0.2 V  
± 0.3 V  
C
L
5, 10, 15, 30 pF 5, 10, 15, 30 pF 5, 10, 15, 30 pF  
V
M
V
CC  
V
CC  
V
V /2  
CC  
V
/2  
CC  
V
/2  
CC  
CC  
V
I
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
t
w
V
CC  
V /2  
CC  
V /2  
CC  
Input  
V
I
0 V  
V
M
V
M
Input  
VOLTAGE WAVEFORMS  
PULSE DURATION  
0 V  
t
t
t
PHL  
PLH  
V
V
OH  
V
CC  
V
V
V
M
M
Output  
Output  
Timing Input  
Data Input  
V /2  
CC  
OL  
0 V  
t
PHL  
PLH  
t
su  
t
h
V
V
OH  
V
CC  
V
M
M
V /2  
CC  
V
/2  
CC  
OL  
0 V  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t /t = 3 ns.  
O
r f  
C. The outputs are measured one at a time, with one transition per measurement.  
D. and t are the same as t  
E. All parameters and waveforms are not applicable to all devices.  
t
.
pd  
PLH  
PHL  
Figure 3. Load Circuit and Voltage Waveforms  
Copyright © 2004–2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): SN74AUP1G126  
SN74AUP1G126  
SCES596F –JULY 2004–REVISED MAY 2010  
www.ti.com  
PARAMETER MEASUREMENT INFORMATION (continued)  
(Enable and Disable Times)  
2 × V  
CC  
S1  
5 kΩ  
From Output  
Under Test  
GND  
TEST  
S1  
t
/t  
2 × V  
C
PLZ PZL  
CC  
L
5 kΩ  
(see Note A)  
t
/t  
GND  
PHZ PZH  
LOAD CIRCUIT  
V
= 1.2 V  
V
= 1.5 V  
V
= 1.8 V  
V
= 2.5 V  
V
= 3.3 V  
CC  
CC  
CC  
CC  
CC  
V
CC  
= 0.8 V  
± 0.1 V  
5, 10, 15, 30 pF 5, 10, 15, 30 pF 5, 10, 15, 30 pF  
/2 /2 /2  
± 0.1 V  
± 0.15 V  
5, 10, 15, 30 pF 5, 10, 15, 30 pF 5, 10, 15, 30 pF  
/2 /2 /2  
± 0.2 V  
± 0.3 V  
C
L
V
M
V
CC  
V
CC  
V
V
CC  
V
V
CC  
CC  
CC  
V
I
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
∆
0.1 V  
0.1 V  
0.1 V  
0.15 V  
0.15 V  
0.3 V  
V
CC  
Output  
Control  
V /2  
CC  
V /2  
CC  
0 V  
t
t
PZL  
PLZ  
Output  
V
V
CC  
Waveform 1  
V
/2  
/2  
CC  
S1 at 2 × V  
V
+ V  
CC  
∆
OL  
OL  
(see Note B)  
t
t
PHZ  
PZH  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
OH  
− V  
∆
V
CC  
≈0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t /t = 3 ns.  
O
r f  
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
t
t
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PHZ  
are the same as t  
PZL  
PZH  
en  
G. All parameters and waveforms are not applicable to all devices.  
Figure 4. Load Circuit and Voltage Waveforms  
12  
Submit Documentation Feedback  
Copyright © 2004–2010, Texas Instruments Incorporated  
Product Folder Link(s): SN74AUP1G126  
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Apr-2010  
PACKAGING INFORMATION  
Orderable Device  
74AUP1G126DBVRE4  
74AUP1G126DBVRG4  
74AUP1G126DBVTE4  
74AUP1G126DBVTG4  
74AUP1G126DCKRE4  
74AUP1G126DCKRG4  
74AUP1G126DCKTE4  
74AUP1G126DCKTG4  
74AUP1G126DRLRG4  
SN74AUP1G126DBVR  
SN74AUP1G126DBVT  
SN74AUP1G126DCKR  
SN74AUP1G126DCKT  
SN74AUP1G126DRLR  
SN74AUP1G126DRYR  
SN74AUP1G126DSFR  
SN74AUP1G126YFPR  
SN74AUP1G126YZPR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DRL  
DBV  
DBV  
DCK  
DCK  
DRL  
DRY  
DSF  
YFP  
YZP  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
5000 Green (RoHS &  
no Sb/Br)  
NIPDAU  
NIPDAU  
SNAGCU  
SNAGCU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
SON  
5000 Green (RoHS &  
no Sb/Br)  
DSBGA  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS &  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Apr-2010  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
27-Apr-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74AUP1G126DBVR SOT-23  
SN74AUP1G126DBVT SOT-23  
DBV  
DBV  
DCK  
DCK  
DRL  
YZP  
5
5
5
5
5
5
3000  
250  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
9.2  
9.2  
9.2  
9.2  
9.2  
8.4  
3.23  
3.23  
2.24  
2.24  
1.78  
1.02  
3.17  
3.17  
2.34  
2.34  
1.78  
1.52  
1.37  
1.37  
1.22  
1.22  
0.69  
0.63  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q1  
SN74AUP1G126DCKR  
SN74AUP1G126DCKT  
SN74AUP1G126DRLR  
SC70  
SC70  
SOT  
3000  
250  
4000  
3000  
SN74AUP1G126YZPR DSBGA  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
27-Apr-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74AUP1G126DBVR  
SN74AUP1G126DBVT  
SN74AUP1G126DCKR  
SN74AUP1G126DCKT  
SN74AUP1G126DRLR  
SN74AUP1G126YZPR  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DCK  
DCK  
DRL  
YZP  
5
5
5
5
5
5
3000  
250  
202.0  
202.0  
202.0  
202.0  
202.0  
220.0  
201.0  
201.0  
201.0  
201.0  
201.0  
220.0  
28.0  
28.0  
28.0  
28.0  
28.0  
34.0  
3000  
250  
SC70  
SOT  
4000  
3000  
DSBGA  
Pack Materials-Page 2  
X: Max = 930 µm, Min = 870 µm  
Y: Max = 1430 µm, Min = 1370 µm  
X: Max = 930 µm, Min = 870 µm  
Y: Max = 1430 µm, Min = 1370 µm  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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Applications  
Audio  
Amplifiers  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
Automotive  
www.ti.com/automotive  
www.ti.com/communications  
Communications and  
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DSP  
dsp.ti.com  
Computers and  
Peripherals  
www.ti.com/computers  
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Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Consumer Electronics  
Energy  
www.ti.com/consumer-apps  
www.ti.com/energy  
Logic  
Industrial  
www.ti.com/industrial  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Medical  
www.ti.com/medical  
microcontroller.ti.com  
www.ti-rfid.com  
Security  
www.ti.com/security  
Space, Avionics &  
Defense  
www.ti.com/space-avionics-defense  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2010, Texas Instruments Incorporated  

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