74AVC16373DGVRG4 [TI]

16-Bit Transparent D-Type Latch With 3-State Outputs 48-TVSOP -40 to 85;
74AVC16373DGVRG4
型号: 74AVC16373DGVRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Bit Transparent D-Type Latch With 3-State Outputs 48-TVSOP -40 to 85

驱动 光电二极管 逻辑集成电路 电视
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SN74AVC16373  
www.ti.com ..................................................................................................................................... SCES156HDECEMBER 1998REVISED SEPTEMBER 2008  
16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS  
1
FEATURES  
2
Member of the Texas Instruments Widebus™  
Family  
Overvoltage-Tolerant Inputs/Outputs Allow  
Mixed-Voltage-Mode Data Communications  
EPIC™ (Enhanced-Performance Implanted  
CMOS) Submicron Process  
Ioff Supports Partial-Power-Down Mode  
Operation  
DOC™ (Dynamic Output Control) Circuit  
Dynamically Changes Output Impedance,  
Resulting in Noise Reduction Without Speed  
Degradation  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Dynamic Drive Capability Is Equivalent to  
Standard Outputs With IOH and IOL of ±24 mA at  
2.5-V VCC  
Package Options Include Plastic Thin Shrink  
Small-Outline (DGG) and Thin Very  
Small-Outline (DGV) Packages  
DESCRIPTION  
A Dynamic Output Control (DOC™) circuit is implemented, which, during the transition, initially lowers the output  
impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows  
typical VOL vs IOL and VOH vs IOH curves to illustrate the output impedance and drive capability of the circuit. At  
the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a  
high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family  
Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOC) Circuitry  
Technology and Applications, literature number SCEA009.  
3.2  
T
A
= 25°C  
T
A
= 25°C  
Process = Nominal  
Process = Nominal  
2.8  
2.4  
2.0  
2.8  
2.4  
2.0  
V
CC  
= 3.3 V  
1.6  
1.2  
0.8  
0.4  
1.6  
1.2  
0.8  
0.4  
V
CC  
= 2.5 V  
V
CC  
= 1.8 V  
V
CC  
= 3.3 V  
V
CC  
= 2.5 V  
V
CC  
= 1.8 V  
0
17  
34  
51  
68  
85 102 119 136 153 170  
-160 -144 -128 -112 -96 -80 -64 -48 -32 -16  
- Output Current - mA  
0
I
- Output Current - mA  
I
OH  
OL  
Figure 1. Output Voltage vs Output Current  
This 16-bit transparent D-type latch is operational at 1.2-V to 3.6-V VCC, but is designed specifically for 1.65-V to  
3.6-V VCC operation.  
The SN74AVC16373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers,  
and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable  
(LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at  
the levels set up at the D inputs.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
Widebus, EPIC, DOC are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1998–2008, Texas Instruments Incorporated  
SN74AVC16373  
SCES156HDECEMBER 1998REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com  
DESCRIPTION (CONTINUED)  
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or  
low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the  
bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines  
without need for interface or pullup components. OE does not affect internal operations of the latch. Old data can  
be retained or new data can be entered while the outputs are in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
The SN74AVC16373 is characterized for operation from –40°C to 85°C.  
GQL/ZQL PACKAGE  
(TOP VIEW)  
TERMINAL ASSIGNMENTS  
DGG OR DGV PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
A
B
C
D
E
F
1OE  
1Q1  
1Q2  
GND  
1Q3  
1Q4  
VCC  
1Q5  
1Q6  
1LE  
1D1  
1
2
3
4
5
6
7
8
9
48  
47  
46 1D2  
GND  
1D3  
1D4  
VCC  
45  
44  
43  
42  
G
H
J
41 1D5  
40 1D6  
39 GND  
GND 10  
1Q7  
1Q8  
2Q1  
1D7  
1D8  
2D1  
K
11  
12  
13  
38  
37  
36  
TERMINAL ASSIGNMENTS  
(56-Ball GQL/ZQL Package)(1)  
2Q2 14  
GND 15  
2Q3 16  
2Q4 17  
35 2D2  
34 GND  
33 2D3  
32 2D4  
1
2
3
4
5
6
A
B
C
D
E
F
1DIR  
1B2  
1B4  
1B6  
1B8  
2B1  
2B3  
2B5  
2B7  
2DIR  
NC  
NC  
NC  
NC  
1OE  
1A2  
1A4  
1A6  
1A8  
2A1  
2A3  
2A5  
2A7  
2OE  
1B1  
1B3  
1B5  
1B7  
2B2  
2B4  
2B6  
2B8  
NC  
GND  
VCCB  
GND  
GND  
VCCA  
GND  
1A1  
1A3  
1A5  
1A7  
2A2  
2A4  
2A6  
2A8  
NC  
VCC  
VCC  
18  
31  
2Q5 19  
2Q6 20  
GND 21  
2Q7 22  
2Q8 23  
2OE 24  
30 2D5  
29 2D6  
28 GND  
27 2D7  
26 2D8  
25 2LE  
G
H
J
GND  
VCCB  
GND  
NC  
GND  
VCCA  
GND  
NC  
K
(1) NC - No internal connection  
2
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Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
www.ti.com ..................................................................................................................................... SCES156HDECEMBER 1998REVISED SEPTEMBER 2008  
FUNCTION TABLE  
(EACH 8-BIT LATCH)  
INPUTS  
OUTPUT  
Q
OE  
L
LE  
H
H
L
D
H
L
H
L
L
L
X
X
Q0  
Z
H
X
LOGIC SYMBOL(1)  
1
1OE  
1LE  
2OE  
2LE  
1EN  
C3  
48  
24  
25  
2EN  
C4  
47  
46  
44  
43  
41  
40  
38  
37  
36  
35  
33  
32  
30  
29  
27  
26  
2
3
1D1  
1D2  
1D3  
1D4  
1D5  
1D6  
1D7  
1D8  
2D1  
2D2  
2D3  
2D4  
2D5  
2D6  
2D7  
2D8  
3D  
1
1Q1  
1Q2  
1Q3  
1Q4  
1Q5  
1Q6  
1Q7  
1Q8  
2Q1  
2Q2  
2Q3  
2Q4  
2Q5  
2Q6  
2Q7  
2Q8  
5
6
8
9
11  
12  
13  
14  
16  
17  
19  
20  
22  
23  
4D  
2
(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
24  
2OE  
2LE  
1OE  
1LE  
25  
48  
C1  
1D  
C1  
1D  
2
13  
2Q1  
1Q1  
47  
36  
2D1  
1D1  
To Seven Other Channels  
To Seven Other Channels  
Copyright © 1998–2008, Texas Instruments Incorporated  
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3
Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
SCES156HDECEMBER 1998REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX UNIT  
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
4.6  
4.6  
4.6  
V
V
VO  
VO  
IIK  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–50  
–50  
±50  
±100  
70  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through each VCC or GND  
DGG package  
θJA  
Package thermal impedance(4)  
DGV package  
58 °C/W  
42  
GQL/ZQL package  
Tstg  
Storage temperature range  
–65  
150  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.  
(4) The package thermal impedance is calculated in accordance with JESD 51.  
4
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Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
www.ti.com ..................................................................................................................................... SCES156HDECEMBER 1998REVISED SEPTEMBER 2008  
Recommended Operating Conditions(1)  
MIN  
MAX UNIT  
Operating  
1.4  
1.2  
3.6  
V
VCC  
Supply voltage  
Data retention only  
VCC = 1.2 V  
VCC  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 1.2 V  
0.65 × VCC  
0.65 × VCC  
1.7  
VIH  
High-level input voltage  
V
2
GND  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
0.35 × VCC  
VIL  
Low-level input voltage  
0.35 × VCC  
V
0.7  
0.8  
3.6  
VCC  
3.6  
–2  
–4  
–8  
–12  
2
VI  
Input voltage  
0
0
0
V
V
Active state  
VO  
Output voltage  
3-state  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 1.4 V to 3.6 V  
IOHS  
Static high-level output current(2)  
Static low-level output current(2)  
mA  
mA  
4
IOLS  
8
12  
5
Δt/Δv  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
°C  
TA  
–40  
85  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
(2) Dynamic drive capability is equivalent to standard outputs with IOH and IOL of ±24 mA at 2.5-V VCC. See Figure 1 for VOL vs IOL and VOH  
vs IOH characteristics. Refer to the TI application reports, AVC Logic Family Technology and Applications, literature number SCEA066,  
and Dynamic Output Control (DOC™) Circuitry Technology and Applications, literature number SCEA009.  
Copyright © 1998–2008, Texas Instruments Incorporated  
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5
Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
SCES156HDECEMBER 1998REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.4 V to 3.6 V  
1.4 V  
MIN TYP(1)  
VCC – 0.2  
MAX UNIT  
IOHS = –100 µA  
IOHS = –2 mA,  
IOHS = –4 mA,  
IOHS = –8 mA,  
IOHS = –12 mA,  
IOLS = 100 µA  
IOLS = 2 mA,  
IOLS = 4 mA,  
IOLS = 8 mA,  
IOLS = 12 mA,  
VIH = 0.91 V  
VIH = 1.07 V  
VIH = 1.7 V  
VIH = 2 V  
1.05  
1.2  
VOH  
1.65 V  
2.3 V  
V
1.75  
2.3  
3 V  
1.4 V to 3.6 V  
1.4 V  
0.2  
0.4  
VIL = 0.49 V  
VIL = 0.57 V  
VIL = 0.7 V  
VIL = 0.8 V  
VOL  
1.65 V  
2.3 V  
0.45  
0.55  
0.7  
V
3 V  
II  
VI = VCC or GND  
VI or VO = 3.6 V  
VO = VCC or GND  
VI = VCC or GND,  
3.6 V  
±2.5  
±10  
±10  
40  
µA  
µA  
µA  
µA  
Ioff  
IOZ  
ICC  
0
3.6 V  
IO = 0  
3.6 V  
2.5 V  
3
3
Control inputs  
Data inputs  
Outputs  
VI = VCC or GND  
VI = VCC or GND  
VO = VCC or GND  
3.3 V  
Ci  
pF  
pF  
2.5 V  
2.5  
2.5  
6.5  
6.5  
3.3 V  
2.5 V  
Co  
3.3 V  
(1) Typical values are measured at VCC = 2.5 V and 3.3 V, TA = 25°C.  
Timing Requirements  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2 through Figure 5)  
VCC = 1.5 V  
± 0.1 V  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 1.2 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
2.2  
1.1  
1.1  
MAX  
MIN  
2
MAX  
MIN  
1.8  
0.8  
1
MAX  
tw  
tsu  
th  
Pulse duration, LE high  
Setup time, data before LE↓  
Hold time, data after LE↓  
ns  
ns  
ns  
1.7  
2
1.2  
1.1  
0.9  
1.1  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2 through Figure 5)  
VCC = 1.5 V  
± 0.1 V  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 1.2 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
TYP  
5.8  
7.2  
7.4  
8.4  
MIN  
1.2  
1.4  
1.6  
2.5  
MAX  
MIN  
1
MAX  
MIN  
0.8  
0.8  
1.4  
1.3  
MAX  
MIN  
0.7  
0.7  
0.7  
1.2  
MAX  
D
6.8  
8.3  
8.8  
9.4  
5.7  
6.6  
6.7  
7.8  
3.3  
4
2.8  
3.2  
3.4  
3.9  
tpd  
Q
ns  
LE  
OE  
OE  
1.1  
1.6  
2.3  
ten  
Q
Q
4.3  
4.2  
ns  
ns  
tdis  
6
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Copyright © 1998–2008, Texas Instruments Incorporated  
Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
www.ti.com ..................................................................................................................................... SCES156HDECEMBER 1998REVISED SEPTEMBER 2008  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
PARAMETER  
TEST CONDITIONS  
UNIT  
TYP  
40  
TYP  
43  
TYP  
47  
Outputs enabled  
Outputs disabled  
Power dissipation  
capacitance  
Cpd  
CL = 0,  
f = 10 MHz  
pF  
20  
22  
24  
Copyright © 1998–2008, Texas Instruments Incorporated  
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Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
SCES156HDECEMBER 1998REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
VCC = 1.2 V AND 1.5 V ± 0.1 V  
2 × V  
CC  
S1  
Open  
GND  
2 kΩ  
From Output  
Under Test  
TEST  
S1  
t
pd  
Open  
C = 15 pF  
(see Note A)  
L
t
/t  
/t  
2 × V  
CC  
GND  
PLZ PZL  
2 kΩ  
t
PHZ PZH  
LOAD CIRCUIT  
t
w
V
CC  
V
CC  
V /2  
CC  
V /2  
CC  
Input  
Timing  
Input  
V
/2  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
t
su  
t
h
V
CC  
Output  
Control  
(low-level  
enabling)  
Data  
Input  
V
CC  
V
/2  
CC  
V /2  
CC  
V /2  
CC  
V /2  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
t
t
PLZ  
PZL  
Output  
Waveform 1  
V
V
CC  
V
CC  
V /2  
CC  
Input  
V /2  
CC  
V /2  
CC  
S1 at 2 × V  
V
OL  
+ 0.1 V  
CC  
(see Note B)  
OL  
0 V  
t
t
PZH  
PHZ  
t
t
PLH  
PHL  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
V
OH  
− 0.1 V  
V /2  
CC  
Output  
V /2  
CC  
V /2  
CC  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2 ns, t 2 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
Figure 2. Load Circuit and Voltage Waveforms  
8
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Copyright © 1998–2008, Texas Instruments Incorporated  
Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
www.ti.com ..................................................................................................................................... SCES156HDECEMBER 1998REVISED SEPTEMBER 2008  
PARAMETER MEASUREMENT INFORMATION  
VCC = 1.8 V ± 0.15 V  
2 × V  
CC  
S1  
Open  
GND  
1 kΩ  
From Output  
Under Test  
TEST  
S1  
t
pd  
Open  
C = 30 pF  
(see Note A)  
L
t
/t  
/t  
2 × V  
CC  
GND  
PLZ PZL  
1 kΩ  
t
PHZ PZH  
LOAD CIRCUIT  
t
w
V
CC  
V
CC  
V /2  
CC  
V /2  
CC  
Input  
Timing  
Input  
V
/2  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
t
su  
t
h
V
CC  
Output  
Control  
(low-level  
enabling)  
Data  
Input  
V
CC  
V
/2  
CC  
V /2  
CC  
V /2  
CC  
V /2  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
t
t
PLZ  
PZL  
Output  
Waveform 1  
V
CC  
V
CC  
V /2  
CC  
Input  
V /2  
CC  
V /2  
CC  
S1 at 2 × V  
V
OL  
+ 0.15 V  
CC  
V
OL  
(see Note B)  
0 V  
t
t
PHZ  
PZH  
t
t
PLH  
PHL  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
V
OH  
− 0.15 V  
V /2  
CC  
Output  
V /2  
CC  
V /2  
CC  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2 ns, t 2 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
Figure 3. Load Circuit and Voltage Waveforms  
Copyright © 1998–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
SCES156HDECEMBER 1998REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
VCC = 2.5 V ± 0.2 V  
2 × V  
CC  
S1  
Open  
GND  
500 Ω  
From Output  
Under Test  
TEST  
S1  
t
pd  
Open  
C = 30 pF  
(see Note A)  
L
t
/t  
/t  
2 × V  
CC  
GND  
PLZ PZL  
500 Ω  
t
PHZ PZH  
LOAD CIRCUIT  
t
w
V
CC  
V
CC  
V /2  
CC  
V /2  
CC  
Input  
Timing  
Input  
V
/2  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
t
su  
t
h
V
CC  
Output  
Control  
(low-level  
enabling)  
Data  
Input  
V
CC  
V
/2  
CC  
V /2  
CC  
V /2  
CC  
V /2  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
t
t
PLZ  
PZL  
Output  
Waveform 1  
V
CC  
V
CC  
V /2  
CC  
Input  
V /2  
CC  
V /2  
CC  
S1 at 2 × V  
V
OL  
+ 0.15 V  
CC  
V
OL  
(see Note B)  
0 V  
t
t
PHZ  
PZH  
t
t
PLH  
PHL  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
V
OH  
V
OH  
− 0.15 V  
V /2  
CC  
Output  
V /2  
CC  
V /2  
CC  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2 ns, t 2 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
Figure 4. Load Circuit and Voltage Waveforms  
10  
Submit Documentation Feedback  
Copyright © 1998–2008, Texas Instruments Incorporated  
Product Folder Link(s): SN74AVC16373  
SN74AVC16373  
www.ti.com ..................................................................................................................................... SCES156HDECEMBER 1998REVISED SEPTEMBER 2008  
PARAMETER MEASUREMENT INFORMATION  
VCC = 3.3 V ± 0.3 V  
2 × V  
CC  
TEST  
S1  
S1  
500 Ω  
Open  
GND  
From Output  
Under Test  
t
pd  
Open  
t
t
/t  
2 × V  
CC  
GND  
PLZ PZL  
/t  
C = 30 pF  
(see Note A)  
PHZ PZH  
L
500 Ω  
t
w
LOAD CIRCUIT  
V
CC  
V /2  
CC  
V /2  
CC  
Input  
V
CC  
Timing  
Input  
0 V  
V
/2  
CC  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
t
su  
t
h
V
CC  
Data  
Input  
Output  
V
CC  
V /2  
CC  
V /2  
CC  
Control  
(low-level  
enabling)  
0 V  
V /2  
CC  
V /2  
CC  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
0 V  
t
t
PLZ  
PZL  
Output  
Waveform 1  
V
V
CC  
V
CC  
V /2  
CC  
Input  
V
OL  
+ 0.3 V  
S1 at 2 × V  
V /2  
CC  
V /2  
CC  
CC  
(see Note B)  
OL  
0 V  
t
t
PHZ  
PZH  
t
t
PLH  
PHL  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
OH  
V
OH  
− 0.3 V  
V /2  
CC  
V /2  
CC  
Output  
V /2  
CC  
0 V  
(see Note B)  
V
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2 ns, t 2 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
Figure 5. Load Circuit and Voltage Waveforms  
Copyright © 1998–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): SN74AVC16373  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Nov-2007  
PACKAGING INFORMATION  
Orderable Device  
74AVC16373DGGRG4  
74AVC16373DGVRE4  
74AVC16373DGVRG4  
SN74AVC16373DGGR  
SN74AVC16373DGVR  
SN74AVC16373GQLR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
DGG  
48  
48  
48  
48  
48  
56  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TVSOP  
TVSOP  
TSSOP  
TVSOP  
DGV  
DGV  
DGG  
DGV  
GQL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BGA MI  
CROSTA  
R JUNI  
OR  
1000  
TBD  
SNPB  
Level-1-240C-UNLIM  
SN74AVC16373ZQLR  
ACTIVE  
BGA MI  
CROSTA  
R JUNI  
OR  
ZQL  
56  
1000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Aug-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74AVC16373DGGR TSSOP  
SN74AVC16373DGVR TVSOP  
DGG  
DGV  
GQL  
48  
48  
56  
2000  
2000  
1000  
330.0  
330.0  
330.0  
24.4  
16.4  
16.4  
8.6  
7.1  
4.8  
15.8  
10.2  
7.3  
1.8  
1.6  
12.0  
12.0  
8.0  
24.0  
16.0  
16.0  
Q1  
Q1  
Q1  
SN74AVC16373GQLR BGA MI  
1.45  
CROSTA  
R JUNI  
OR  
SN74AVC16373ZQLR BGA MI  
ZQL  
56  
1000  
330.0  
16.4  
4.8  
7.3  
1.45  
8.0  
16.0  
Q1  
CROSTA  
R JUNI  
OR  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Aug-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74AVC16373DGGR  
SN74AVC16373DGVR  
TSSOP  
TVSOP  
DGG  
DGV  
GQL  
48  
48  
56  
2000  
2000  
1000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
41.0  
33.0  
33.0  
SN74AVC16373GQLR BGA MICROSTAR  
JUNIOR  
SN74AVC16373ZQLR BGA MICROSTAR  
JUNIOR  
ZQL  
56  
1000  
346.0  
346.0  
33.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
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