74FCT162543ETPACT [TI]

16-Bit Latched Transceivers; 16位锁存收发器
74FCT162543ETPACT
型号: 74FCT162543ETPACT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Bit Latched Transceivers
16位锁存收发器

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总8页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
SCCS059 - August 1994 - Revised March 2000  
16-Bit Latched Transceivers  
Features  
Functional Description  
• FCT-E speed at 3.4 ns  
• Power-off disable outputs permits live insertion  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
• Typical output skew < 250 ps  
• ESD > 2000V  
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)  
packages  
• Industrial temperature range of 40˚C to +85˚C  
• VCC = 5V ± 10%  
The CY74FCT16543T and CY74FCT162543T are 16-bit,  
high-speed, low power latched transceivers that are organized as two  
independent 8-bit D-type latched transceivers containing two sets of  
eight D-type latches with separate Latch Enable (LEAB, LEAB) and  
Output Enable (OEAB, OEAB) controls for each set to permit  
independent control of inputting and outputting in either direction of  
data flow. For data flow from A to B, for example, the A-to-B input  
Enable (CEAB) must be LOW in order to enter data from A or to take  
data from B as indicated in the truth table. With CAEB LOW, a LOW  
signal on the A-to-B Latch Enable (LEAB) makes the A-to-B latches  
transparent; a subsequent LOW-to-HIGH transition of the LEAB  
signal puts the A latches in the storage mode and their outputs no  
longer change with the A inputs. With CEAB and OEAB both LOW,  
the three-state B output buffers are active and reflect the data present  
at the output of the A latches. Control of data from B to A is similar,  
but uses CEAB, LEAB, and OEAB inputs flow-through pinout and  
small shrink packaging and in simplifying board design. The output  
buffers are designed with a power-off disable feature to allow live  
insertion of boards.  
CY74FCT16543T Features:  
• 64 mA sink current, 32 mA source current  
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,  
TA = 25˚C  
CY74FCT162543T Features:  
• Balanced 24 mA output drivers  
• Reduced system switching noise  
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,  
TA= 25˚C  
The CY74FCT16543T is ideally suited for driving  
high-capacitance loads and low-impedance backplanes.  
The CY74FCT162543T has 24-mA balanced output drivers  
with current limiting resistors in the outputs. This reduces the  
need for external terminating resistors and provides for  
minimal undershoot and reduced ground bounce. The  
CY74FCT162543T is ideal for driving transmission lines.  
CY74FCT162H543T Features:  
• Bus hold retains last active state  
• Eliminates the need for external pull-up or pull-down  
resistors  
The CY74FCT162H543T is a 24-mA balanced output part that  
has “bus hold” on the data inputs. The device retains the  
input’s last state whenever the input goes to high impedance.  
This eliminates the need for pull-up/down resistors and  
prevents floating inputs.  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
Logic Block Diagrams  
PinConfiguration  
OEBA  
1
Top View  
SSOP/TSSOP  
CEBA  
1
LEBA  
1
OEAB  
OEBA  
1
2
56  
55  
1
1
OEAB  
1
LEAB  
LEBA  
1
1
CEAB  
1
CEAB  
1
3
4
54  
53  
CEBA  
1
LEAB  
1
GND  
A
GND  
B
C
D
5
6
7
52  
51  
50  
1
1
1
1
2
A
1
1
B
1
1
A
1
B
1
2
V
V
CC  
CC  
C
D
A
B
1
3
4
5
8
9
49  
48  
1
3
4
5
A
1
B
1
A
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
B
1
1
GND  
A
GND  
B
1
6
1
6
TO 7 OTHER CHANNELS  
A
1
B
1
7
8
7
8
FCT16543T-1  
A
1
B
1
OEBA  
2
A
2
B
2
1
1
CEBA  
2
A
B
2
B
2
2
2
3
2
3
A
2
LEBA  
2
GND  
A
GND  
B
OEAB  
2
2
4
5
2
4
5
A
2
B
2
CEAB  
2
A
B
2
6
2
6
LEAB  
2
V
V
CC  
CC  
C
D
A
2
1
A
2
B
2
7
8
7
8
B
2
1
A
2
B
2
24  
25  
26  
27  
28  
33  
32  
31  
30  
29  
GND  
GND  
C
D
CEAB  
LEAB  
OEAB  
CEBA  
2
LEBA  
2
OEBA  
2
2
2
2
FCT16543T-3  
FCT16543T-2  
TO 7 OTHER CHANNELS  
Pin Description  
Function Table[1]  
Name  
Description  
Latch  
Output  
Buffers  
Inputs  
Status  
OEAB A-to-B Output Enable Input (Active LOW)  
OEBA B-to-A Output Enable Input (Active LOW)  
CEAB A-to-B Enable Input (Active LOW)  
CEAB LEAB OEAB  
A to B  
B
H
X
X
L
X
H
X
L
X
X
H
L
Storing  
Storing  
X
High Z  
X
CEBA B-to-A Enable Input (Active LOW)  
High Z  
LEAB A-to-B Latch Enable Input (Active LOW)  
Transparent  
Current A  
Inputs  
LEBA B-to-A Latch Enable Input (Active LOW)  
A
B
A-to-B Data Inputs or B-to-A Three-State Outputs[9]  
B-to-A Data Inputs or A-to-B Three-State Outputs[9]  
L
H
L
Storing  
Previous A  
Inputs[2]  
Maximum Ratings[3, 4]  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Power Dissipation..........................................................1.0W  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .....................Com’l 55°C to +125°C  
Ambient Temperature with  
Power Applied.................................Com’l 55°C to +125°C  
Operating Range  
Ambient  
DC Input Voltage .................................................−0.5V to +7.0V  
DC Output Voltage..............................................−0.5V to +7.0V  
Range  
Industrial  
Temperature  
VCC  
40°C to +85°C  
5V ± 10%  
DC Output Current  
(Maximum Sink Current/Pin) ...........................60 to +120 mA  
2
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Input HIGH Voltage  
Input LOW Voltage  
Input Hysteresis[6]  
Test Conditions  
Min.  
Typ.[5]  
Max.  
Unit  
V
VIH  
VIL  
VH  
VIK  
IIH  
2.0  
0.8  
V
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=18 mA  
0.7  
1.2  
±1  
VCC=Max., VI=VCC  
VCC=Max., VI=GND  
VCC=Max., VOUT=2.7V  
µA  
µA  
µA  
IIL  
±1  
IOZH  
High Impedance Output Cur-  
rent (Three-State Output pins)  
±1  
IOZL  
High Impedance Output Cur-  
rent (Three-State Output pins)  
VCC=Max., VOUT=0.5V  
±1  
µA  
IOS  
IO  
Short Circuit Current[7]  
Output Drive Current[7]  
Power-Off Disable  
VCC=Max., VOUT=GND  
VCC=Max., VOUT=2.5V  
VCC=0V, VOUT4.5V[8]  
80  
50  
140  
200  
180  
±1  
mA  
mA  
µA  
IOFF  
Notes:  
1. A-to-B data flow shown; B-to-A flow control is the same, except using CEBA, LEBA, and OEBA.  
2. Data prior to LEAB LOW-to-HIGH Transition  
H = HIGH Voltage Level. L = LOW Voltage Level.  
X = Don’t Care. Z = High Impedance.  
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature  
range.  
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
5. Typical values are at VCC= 5.0V, TA= +25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
8. Tested at +25˚C.  
9. On the 74FCT162H543T, these pins have bus hold.  
3
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
Output Drive Characteristics for CY74FCT16543T  
Parameter  
Description  
Test Conditions  
VCC=Min., IOH=3 mA  
Min.  
2.5  
Typ.[5]  
3.5  
Max.  
Unit  
VOH  
Output HIGH Voltage  
V
VCC=Min., IOH=15 mA  
VCC=Min., IOH=32 mA  
VCC=Min., IOL=64 mA  
2.4  
3.5  
2.0  
3.0  
VOL  
Output LOW Voltage  
0.2  
0.55  
V
Output Drive Characteristics for CY74FCT162543T, CY74FCT162H543T  
Parameter  
IODL  
Description  
Output LOW Current[7]  
Output HIGH Current[7]  
Output HIGH Voltage  
Output LOW Voltage  
Test Conditions  
VCC=5V, VIN=VIH or VIL, VOUT=1.5V  
VCC=5V, VIN=VIH or VIL, VOUT=1.5V  
VCC=Min., IOH=24 mA  
Min.  
60  
Typ.[5]  
115  
Max.  
150  
Unit  
mA  
mA  
V
IODH  
60  
2.4  
115  
3.3  
150  
VOH  
VOL  
VCC=Min., IOL=24 mA  
0.3  
0.55  
V
Capacitance[6] (TA = +25˚C, f = 1.0 MHz)  
Parameter  
CIN  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
VIN = 0V  
Typ.[5] Max.  
Unit  
pF  
4.5  
5.5  
6.0  
8.0  
COUT  
VOUT = 0V  
pF  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
Typ.[5]  
Max.  
Unit  
ICC  
Quiescent Power Supply Current VCC=Max.  
V
V
IN0.2V,  
INVCC0.2V  
5
500  
µA  
ICC  
QuiescentPowerSupplyCurrent VCC=Max.  
(TTL inputs HIGH)  
VIN=3.4V[10]  
0.5  
60  
1.5  
mA  
ICCD  
Dynamic Power Supply  
Current[11]  
VCC=Max., One Input  
Toggling, 50% Duty Cycle,  
Outputs Open, OE=GND  
VIN=VCC or  
VIN=GND  
100  
µA/MHz  
IC  
Total Power Supply Current[12]  
VCC=Max., f1=10 MHz,  
50% Duty Cycle, Outputs  
Open, One Bit Toggling,  
OE=GND  
VIN=VCC or  
VIN=GND  
0.6  
0.9  
2.4  
6.4  
1.5  
2.3  
mA  
mA  
mA  
mA  
VIN=3.4V or  
VIN=GND  
VCC=Max., f1=2.5 MHz,  
50% Duty Cycle, Outputs  
Open, Sixteen Bits Toggling,  
OE=GND  
VIN=VCC or  
VIN=GND  
4.5[13]  
16.5[13]  
VIN=3.4V or  
VIN=GND  
Notes:  
10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
12. IC  
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input  
(VIN=3.4V)  
IC  
ICC  
ICC  
DH  
NT  
ICCD  
=
=
=
Duty Cycle for TTL inputs HIGH  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair  
(HLH or LHL)  
f0  
f1  
N1  
=
=
=
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
4
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
Switching Characteristics Over the Operating Range[14]  
CY74FCT16543T  
CY74FCT162543T  
CY74FCT16543AT  
CY74FCT162543AT  
Fig.  
Parameter  
Description  
Propagation Delay  
Transparent Mode  
A to B or B to A  
Min.  
Max.  
Min.  
Max.  
Unit  
No.[15]  
tPLH  
tPHL  
1.5  
8.5  
1.5  
6.5  
ns  
1, 3  
tPLH  
tPHL  
Propagation Delay  
LEBA to A, LEAB to B  
1.5  
1.5  
12.5  
12.0  
1.5  
1.5  
8.0  
9.0  
ns  
ns  
1, 5  
tPZH  
tPZL  
Output Enable Time  
OEBA or OEAB to A or B  
CEBA or CEAB to A or B  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
OEBA or OEAB to A or B  
CEBA or CEAB to A or B  
1.5  
9.0  
1.5  
7.5  
ns  
1, 7, 8  
tSU  
tH  
Set-up Time HIGH or LOW  
A or B to LEAB or LEBA  
2.0  
2.0  
2.0  
2.0  
ns  
ns  
4
4
Hold Time HIGH or LOW  
A or B to LEAB or LEBA  
tW  
LEBA or LEAB Pulse Width LOW  
Output Skew[16]  
4.0  
4.0  
ns  
ns  
5
tSK(O)  
0.5  
0.5  
CY74FCT16543CT  
CY74FCT162543CT  
CY74FCT162H543CT  
CY74FCT16543ET  
CY74FCT162543ET  
Fig.  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Unit No.[15]  
tPLH  
tPHL  
Propagation Delay  
Transparent Mode  
A to B or B to A  
1.5  
5.1  
1.5  
3.4  
ns  
1, 3  
tPLH  
tPHL  
Propagation Delay  
LEBA to A, LEAB to B  
1.5  
1.5  
5.6  
7.8  
1.5  
1.5  
3.7  
4.8  
ns  
ns  
1, 5  
tPZH  
tPZL  
Output Enable Time  
OEBA or OEAB to A or B  
CEBA or CEAB to A or B  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
OEBA or OEAB to A or B  
CEBA or CEAB to A or B  
1.5  
6.5  
1.5  
4.0  
ns  
1, 7, 8  
tSU  
tH  
Set-up Time HIGH or LOW  
A or B to LEAB or LEBA  
2.0  
2.0  
1.0  
1.0  
ns  
ns  
4
4
Hold Time HIGH or LOW  
A or B to LEAB or LEBA  
tW  
LEBA or LEAB Pulse Width LOW  
Output Skew[16]  
4.0  
3.0  
ns  
ns  
5
tSK(O)  
0.5  
0.5  
Notes:  
14. Minimum limits are specified but not tested on Propagation Delays.  
15. See “Parameter Measurement Information” in the General Information section.  
16. Skew between any two outputs of the same package switching in the same directional. This parameter is ensured by design.  
5
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
Ordering Information CY74FCT16543  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT16543ETPACT  
Package Type  
56-Lead (240-Mil) TSSOP  
3.4  
Z56  
O56  
O56  
Z56  
O56  
Industrial  
CY74FCT16543ETPVC/PVCT  
CY74FCT16543CTPVC/PVCT  
CY74FCT16543ATPACT  
56-Lead (300-Mil) SSOP  
56-Lead (300-Mil) SSOP  
56-Lead (240-Mil) TSSOP  
56-Lead (300-Mil) SSOP  
5.1  
6.5  
8.5  
Industrial  
Industrial  
Industrial  
CY74FCT16543TPVC/PVCT  
Ordering Information CY74FCT162543  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
74FCT162543ETPACT  
CY74FCT162543ETPVC  
74FCT162543ETPVCT  
74FCT162543CTPACT  
CY74FCT162543CTPVC  
74FCT162543CTPVCT  
74FCT162543ATPACT  
CY74FCT162543TPVC/PVCT  
Package Type  
3.4  
Z56  
O56  
O56  
Z56  
O56  
O56  
Z56  
O56  
56-Lead (240-Mil) TSSOP  
56-Lead (300-Mil) SSOP  
56-Lead (300-Mil) SSOP  
56-Lead (240-Mil) TSSOP  
56-Lead (300-Mil) SSOP  
56-Lead (300-Mil) SSOP  
56-Lead (240-Mil) TSSOP  
56-Lead (300-Mil) SSOP  
Industrial  
5.1  
Industrial  
6.5  
8.5  
Industrial  
Industrial  
Ordering Information CY74FCT162H543T  
Speed  
(ns)  
Package  
Operating  
Range  
Ordering Code  
Name  
Package Type  
56-Lead (240-Mil) TSSOP  
5.1  
74FCT162H543CTPACT  
Z56  
Industrial  
6
CY74FCT16543T  
CY74FCT162543T  
CY74FCT162H543T  
Package Diagrams  
56-Lead Shrunk Small Outline Package O56  
56-Lead Thin Shrunk Small Outline Package Z56  
7
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any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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