74FCT16827CTPACTG4 [TI]
FCT SERIES, DUAL 10-BIT DRIVER, TRUE OUTPUT, PDSO56, 0.240 INCH, 0.50 MM PITCH, GREEN, PLASTIC, TSSOP-56;
| 型号： | 74FCT16827CTPACTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | FCT SERIES, DUAL 10-BIT DRIVER, TRUE OUTPUT, PDSO56, 0.240 INCH, 0.50 MM PITCH, GREEN, PLASTIC, TSSOP-56 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总14页 (文件大小：694K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1CY74FCT162827T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16827T
CY74FCT162827T
SCCS064B - August 1994 - Revised September 2001
20-Bit Buffers/Line Drivers
Features
Functional Description
• Ioff Supports Partial-Power-Down Mode Operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
The CY74FCT16827T 20-bit buffer/line driver and the
CY74FCT162827T 20-bit buffer/line driver provide
high-performance bus interface buffering for wide data/address
paths or buses carrying parity. These parts can be used as a single
20-bit buffer or two 10-bit buffers. Each 10-bit buffer has a pair of
NANDed OE for increased flexibility.
• Industrial temperature range of −40˚C to +85˚C
• VCC = 5V ± 10%
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
CY74FCT16827T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
The CY74FCT16827T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162827T has 24-mA balanced output drivers
with current-limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162827T is ideal for driving transmission lines.
CY74FCT162827T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA = 25˚C
Logic Block Diagrams
Pin Configuration
SSOP/TSSOP
Top View
OE
1
1
OE
56
1
2
3
4
OE
2
1
1
1
1
1
OE
1
2
Y
A
A
1
1
1
55
54
53
52
1
2
Y
2
GND
Y
GND
A
1
3
5
1
1
3
4
Y
4
A
1
6
51
50
49
48
Y
A
1
1
1
1
V
CC
V
CC
7
Y
1
1
1
5
A
A
1
1
5
6
8
Y
6
9
Y
7
A
10
11
1
7
47
46
GND
GND
FCT16827-1
TO 9 OTHER CHANNELS
Y
8
1
A
A
1
1
8
9
45
44
43
42
41
12
13
Y
9
1
A
Y
10
14
15
16
17
18
1
10
1
Y
A
A
A
2
2
2
1
OE
2
2
2
1
2
3
2
1
Y
2
OE
2
2
Y
3
40
39
38
37
36
35
34
GND
Y
GND
A
19
20
21
22
23
2
2
2
4
2
2
2
4
5
6
Y
5
A
A
A
Y
Y
6
2
1
2
1
V
CC
V
CC
Y
7
A
7
2
2
2
2
Y
8
A
8
24
25
33
32
31
GND
Y
GND
A
FCT16827-2
26
27
28
2
2
9
TO 9 OTHER CHANNELS
2
2
2
9
Y
10
A
10
30
29
OE
1
OE
2
2
FCT16827-3
Copyright © 2001, Texas Instruments Incorporated
CY74FCT16827T
CY74FCT162827T
Maximum Ratings[2, 3]
Pin Description
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Name
Description
OE
A
Output Enable Inputs (Active LOW)
Data Inputs
Storage Temperature............................... −55°C to +125°C
Ambient Temperature with
Power Applied.......................................... −55°C to +125°C
Y
Three-State Outputs
DC Input Voltage .................................................−0.5V to +7.0V
DC Output Voltage ..............................................−0.5V to +7.0V
Function Table[1]
DC Output Current
Inputs
Outputs
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
OE1
L
OE2
L
A
L
Y
L
Power Dissipation..........................................................1.0W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
L
L
H
X
X
H
Z
Z
H
X
Operating Range
X
H
Ambient
Range
Industrial
Temperature
VCC
−40°C to +85°C
5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter
Description
Input HIGH Voltage
Test Conditions
Min.
Typ.[4]
Max.
Unit
VIH
VIL
VH
VIK
IIH
2.0
V
V
Input LOW Voltage
Input Hysteresis[5]
0.8
100
mV
V
Input Clamp Diode Voltage
Input HIGH Current
Input LOW Current
VCC=Min., IIN=−18 mA
VCC=Max., VI=VCC
−0.7
−1.2
±1
µA
µA
µA
IIL
VCC=Max., VI=GND
VCC=Max., VOUT=2.7V
±1
IOZH
High Impedance Output
±1
Current (Three-State Output pins)
IOZL
High Impedance Output
Current (Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
IO
Short Circuit Current[6]
Output Drive Current[6]
Power-Off Disable
VCC=Max., VOUT=GND
VCC=Max., VOUT=2.5V
VCC=0V, VOUT≤4.5V[7]
−80
−50
−140
−200
−180
±1
mA
mA
µA
IOFF
Output Drive Characteristics for CY74FCT16827T
Parameter
Description
Test Conditions
VCC=Min., IOH=−3 mA
Min.
2.5
Typ.[4]
3.5
Max.
Unit
VOH
Output HIGH Voltage
V
VCC=Min., IOH=−15 mA
VCC=Min., IOH=−32 mA
VCC=Min., IOL=64 mA
2.4
3.5
2.0
3.0
VOL
Output LOW Voltage
0.2
0.55
V
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.Z = HIGH Impedance.
2. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
5. This parameter is specified but not tested.
6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
7. Tested at +25˚C.
2
CY74FCT16827T
CY74FCT162827T
Output Drive Characteristics for CY74FCT162827T
Parameter
IODL
Description
Output LOW Current[6]
Output HIGH Current[6]
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=Min., IOH=−24 mA
Min.
60
Typ.[4]
115
Max.
150
Unit
mA
mA
V
IODH
−60
2.4
−115
3.3
−150
VOH
VOL
VCC=Min., IOL=24 mA
0.3
0.55
V
Capacitance[5] (TA = +25˚C, f = 1.0 MHz)
Parameter
CIN
Description
Input Capacitance
Output Capacitance
Test Conditions
Typ.[4] Max.
Unit
VIN = 0V
4.5
5.5
6.0
8.0
pF
pF
COUT
VOUT = 0V
Power Supply Characteristics
Parameter
Description
Test Conditions
VIN<0.2V,
Min.
Typ.[4]
Max.
Unit
ICC
Quiescent Power Supply
Current
VCC=Max.
VCC=Max.
—
—
—
5
500
µA
VIN>VCC−0.2V
VIN=3.4V[8]
∆ICC
Quiescent Power Supply
Current (TTL inputs HIGH)
0.5
60
1.5
mA
ICCD
Dynamic Power Supply
Current[9]
VCC=Max.,
VIN=VCC or
VIN=GND
100
µA/MHz
One Input Toggling,
50% Duty Cycle,
Outputs Open,
OE1=OE2=GND,
IC
Total Power Supply Current[10] VCC=Max.,
f1=10 MHz,
VIN=VCC or
VIN=GND
—
—
0.6
0.9
1.5
2.3
mA
50% Duty Cycle,
VIN=3.4V or
VIN=GND
Outputs Open,
One Bit Toggling,
OE1=OE2=GND
VCC=Max.,
f1=2.5 MHz,
50% Duty Cycle,
Outputs Open,
Twenty Bits Toggling,
OE1=OE2=GND
VIN=VCC or
VIN=GND
—
—
3.0
8.0
5.5[11]
VIN=3.4V or
VIN=GND
20.5[11]
Notes:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. IC
IC
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC
ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
Quiescent Current with CMOS input levels
Power Supply Current for a TTL HIGH input (VIN=3.4V)
Duty Cycle for TTL inputs HIGH
ICC
∆ICC
DH
NT
ICCD
f0
f1
N1
Number of TTL inputs at DH
Dynamic Current caused by an input transition pair (HLH or LHL)
Clock frequency for registered devices, otherwise zero
Input signal frequency
Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
3
CY74FCT16827T
CY74FCT162827T
Switching Characteristics Over the Operating Range[12]
CY74FCT16827AT
CY74FCT162827AT
CY74FCT162827BT
Parameter
tPLH
tPHL
Description
Condition[13]
Min.
Max.
Min.
Max.
Unit Fig. No.[13]
Propagation Delay
A to Y
CL=50 pF
RL=500Ω
1.5
8.0
1.5
5.0
ns
ns
ns
ns
1, 3
1, 7, 8
1, 7, 8
—
CL=300 pF
RL=500Ω
1.5
1.5
1.5
1.5
1.5
—
15.0
12.0
23.0
9.0
1.5
1.5
1.5
1.5
1.5
—
13.0
8.0
tPZH
tPZL
Output Enable Time
OE to Y
CL=50 pF
RL=500Ω
CL=300 pF
RL=500Ω
15.0
6.0
tPHZ
tPLZ
Output Disable Time
OE to Y
CL=5 pF
RL=500Ω
CL=50 pF
RL=500Ω
10.0
0.5
7.0
tSK(O)
Output Skew[14]
0.5
CY74FCT16827CT
CY74FCT162827CT
Parameter
tPLH
tPHL
Description
Condition[12]
Min.
Max.
Unit Fig. No.[13]
Propagation Delay
A to Y
CL=50 pF
RL=500Ω
1.5
4.2
ns
ns
ns
ns
1, 3
1, 7, 8
1, 7, 8
—
CL=300 pF
RL=500Ω
1.5
1.5
1.5
1.5
1.5
—
10.0
5.6
tPZH
tPZL
Output Enable Time
OE to Y
CL=50 pF
RL=500Ω
CL=300 pF
RL=500Ω
14.0
5.7
tPHZ
tPLZ
Output Disable Time
OE to Y
CL=5 pF
RL=500Ω
CL=50 pF
RL=500Ω
6.0
tSK(O)
Output Skew[14]
0.5
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
4
CY74FCT16827T
CY74FCT162827T
Ordering Information CY74FCT16827
Speed
Package
Name
Operating
Range
(ns)
Ordering Code
Package Type
56-Lead (240-Mil) TSSOP
4.2
CY74FCT16827CTPACT
Z56
O56
Z56
Industrial
CY74FCT16827CTPVC/PVCT
CY74FCT16827ATPVC/PVCT
56-Lead (300-Mil) SSOP
56-Lead (240-Mil) SSOP
8.0
Industrial
Document #: 38−00393–C
Ordering Information CY74FCT162827
Speed
Package
Name
Operating
Range
(ns)
Ordering Code
74FCT162827CTPACT
CY74FCT162827CTPVC
74FCT162827CTPVCT
CY74FCT162827BTPVC
74FCT162827BTPVCT
CY74FCT162827ATPVC
74FCT162827ATPVCT
Package Type
4.2
Z56
Z56
Z56
O56
O56
O56
O56
56-Lead (240-Mil) TSSOP
56-Lead (240-Mil) SSOP
56-Lead (240-Mil) SSOP
56-Lead (300-Mil) SSOP
56-Lead (300-Mil) SSOP
56-Lead (300-Mil) SSOP
56-Lead (300-Mil) SSOP
Industrial
5.0
8.0
Industrial
Industrial
5
CY74FCT16827T
CY74FCT162827T
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
6
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
PACKAGING INFORMATION
Orderable Device
74FCT162827ATPACT
74FCT162827ATPVCG4
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
TSSOP
SSOP
DGG
56
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
FCT162827A
ACTIVE
DL
20
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
FCT162827A
74FCT162827BTPVCG4
74FCT162827CTPACT
ACTIVE
ACTIVE
SSOP
DL
56
56
TBD
Call TI
Call TI
-40 to 85
-40 to 85
FCT162827B
FCT162827C
TSSOP
DGG
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162827ETPACT
74FCT162827ETPVCT
74FCT16827ATPACTE4
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
SSOP
DGG
DL
56
56
56
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
TSSOP
DGG
2000
2000
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT16827A
FCT16827A
FCT16827A
FCT16827C
FCT16827C
FCT16827C
FCT16827C
FCT162827A
74FCT16827ATPACTG4
74FCT16827ATPVCG4
74FCT16827CTPACTE4
74FCT16827CTPACTG4
74FCT16827CTPVCG4
74FCT16827CTPVCTG4
CY74FCT162827ATPVC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
SSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
DGG
DL
56
56
56
56
56
56
56
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
DGG
DGG
DL
2000
2000
20
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
DL
1000
20
Green (RoHS
& no Sb/Br)
DL
Green (RoHS
& no Sb/Br)
CY74FCT162827ETPAC
CY74FCT162827ETPVC
CY74FCT16827ATPACT
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
SSOP
DGG
DL
56
56
56
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
TSSOP
DGG
2000
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT16827A
FCT16827A
FCT16827C
CY74FCT16827ATPVC
CY74FCT16827CTPACT
ACTIVE
ACTIVE
SSOP
DL
56
56
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
TSSOP
DGG
2000
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CY74FCT16827CTPVC
CY74FCT16827CTPVCT
ACTIVE
SSOP
SSOP
DL
56
56
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
FCT16827C
ACTIVE
DL
1000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
FCT16827C
CY74FCT16827ETPAC
CY74FCT16827ETPACT
CY74FCT16827ETPVC
CY74FCT16827ETPVCT
FCT162827ATPACTE4
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
TSSOP
SSOP
DGG
DGG
DL
56
56
56
56
56
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Call TI
Call TI
SSOP
DL
Call TI
Call TI
TSSOP
DGG
2000
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162827A
FCT162827A
FCT162827C
FCT162827C
FCT162827ATPACTG4
FCT162827CTPACTE4
FCT162827CTPACTG4
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
DGG
DGG
DGG
56
56
56
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74FCT162827ATPACT TSSOP
74FCT162827CTPACT TSSOP
CY74FCT16827ATPACT TSSOP
CY74FCT16827CTPACT TSSOP
CY74FCT16827CTPVCT SSOP
DGG
DGG
DGG
DGG
DL
56
56
56
56
56
2000
2000
2000
2000
1000
330.0
330.0
330.0
330.0
330.0
24.4
24.4
24.4
24.4
32.4
8.6
8.6
8.6
8.6
15.6
15.6
15.6
15.6
1.8
1.8
1.8
1.8
3.1
12.0
12.0
12.0
12.0
16.0
24.0
24.0
24.0
24.0
32.0
Q1
Q1
Q1
Q1
Q1
11.35 18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74FCT162827ATPACT
74FCT162827CTPACT
CY74FCT16827ATPACT
CY74FCT16827CTPACT
CY74FCT16827CTPVCT
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
DGG
DGG
DGG
DGG
DL
56
56
56
56
56
2000
2000
2000
2000
1000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
45.0
45.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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