A65240 [TI]
USB PORT TRANSIENT SUPPRESSORS; USB端口瞬态抑制器
| 型号： | A65240 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | USB PORT TRANSIENT SUPPRESSORS |
| 文件： | 总9页 (文件大小：224K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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www.ti.com
SLLS266F − FEBRUARY 1997 − REVISED JULY 2004
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FEATURES
APPLICATIONS
D
D
Design to Protect Submicron 3-V or 5-V
Circuits from Noise Transients
Port ESD Protection Capability Exceeds:
− 15-kV Human Body Model
− 2-kV Machine Model
Available in a WCSP Chip-Scale Package
Stand-Off Voltage . . . 6.0 V Min
Low Current Leakage . . . 1 µA Max at 6 V
Low Capacitance . . . 35 pF Typ
D
USB 1.1 Host, Hub, or Peripheral Ports
SN65220YZB
(Size: 925 mm x 925 mm + 6 mm)
(TOP VIEW)
SN65220DBV
(TOP VIEW)
†
D
D
D
D
1
2
3
6
5
4
A
NC
GND
NC
A
GND
B
A1
B1
A2
B2
GND
GND
B
DESCRIPTION
NC − No internal connection
†
When read horizontally, Pin 1 is the bottom left pin.
The SN65220 is a single transient voltage suppressor and
the SN65240 and SN75240 are dual transient voltage
suppressors designed to provide electrical noise transient
protection to Universal Serial Bus (USB) 1.1 ports. Note
that the input capacitance of the device makes it
unsuitable for high-speed USB 2.0 applications.
SN65240P, SN65240PW
SN75240P, SN75240PW
(TOP VIEW)
1
2
3
4
8
7
6
5
GND
C
GND
D
A
GND
B
Any cabled I/O can be subjected to electrical noise
transients from various sources. These noise transients
can cause damage to the USB transceiver and/or the USB
ASIC if they are of sufficient magnitude and duration.
GND
USB ports are typically implemented in 3-V or 5-V digital
CMOS with very limited ESD protection. The SN65220,
SN65240, and SN75240 can significantly increase the
port ESD protection level and reduce the risk of damage
to the circuits of the USB port.
CURRENT vs VOLTAGE
7.5
The IEC1000-4-2 ESD performance of the SN65220,
SN65240, and SN75240 is measured at the system level.
Therefore, system design impacts the results of these
tests. A high compliance level may be attained with proper
board design and layout.
5
2.5
0
EQUIVALENT SCHEMATIC DIAGRAM
A or C
−2.5
−5
−7.5
−10
GND
−10
−5
0
5
10
15
Voltage − V
B or D
NOTE A: Typical current versus voltage curve was derived
using the IEC 1.2/50-µs surge waveform.
(One Suppressor Shown)
NOTE All GND terminals should be connected to ground.
:
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢊꢌ ꢋ ꢔꢈ ꢘ ꢍꢏ ꢋꢁ ꢔ ꢎꢍꢎ ꢙꢚ ꢛꢜ ꢝ ꢞꢟ ꢠꢙꢜꢚ ꢙꢡ ꢢꢣ ꢝ ꢝ ꢤꢚꢠ ꢟꢡ ꢜꢛ ꢥꢣꢦ ꢧꢙꢢ ꢟꢠꢙ ꢜꢚ ꢨꢟ ꢠꢤꢩ ꢊꢝ ꢜꢨꢣ ꢢꢠꢡ
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ꢊꢝ ꢜ ꢨꢣꢢ ꢠ ꢙꢜ ꢚ ꢥꢝ ꢜ ꢢ ꢤ ꢡ ꢡ ꢙꢚ ꢮ ꢨꢜ ꢤ ꢡ ꢚꢜꢠ ꢚꢤ ꢢꢤ ꢡꢡ ꢟꢝ ꢙꢧ ꢭ ꢙꢚꢢ ꢧꢣꢨ ꢤ ꢠꢤ ꢡꢠꢙ ꢚꢮ ꢜꢛ ꢟꢧ ꢧ ꢥꢟ ꢝ ꢟꢞ ꢤꢠꢤ ꢝ ꢡꢩ
Copyright 1997 − 2003, Texas Instruments Incorporated
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www.ti.com
SLLS266F − FEBRUARY 1997 − REVISED JULY 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
IEC1000-4-2 COMPLIANCE LEVEL
MAXIMUM TEST VOLTAGE
IEC1000-4-2
CONTACT
DISCHARGE
(kV)
AIR
DISCHARGE
(kV)
COMPLIANCE
LEVEL
1
2
3
4
2
4
6
8
2
4
8
15
PACKAGE/ORDERING INFORMATION
PACKAGE
DESIGNATOR
MARKED
AS
PRODUCT
SUPRESSORS
T
A
PACKAGE
ORDER NUMBER
SN65220YZBR (Reel)
SN65220YZBT (Mini Reel)
SN65220DBVR (Mini Reel)
SN65220DBVT (Mini Reel)
SN65240P (Rail)
NWP or
65220
WCSP−4
YZB
SN65220
1
−40°C to 85°C
SOT23−6
DIP−8
DBV
P
SADI
SN65240PW (Rail)
SN65240
SN75240
2
2
−40°C to 85°C
0°C to 70°C
A65240
TSSOP−8
DIP−8
PW
P
SN65240PWR (Reel)
SN75240P (Rail)
SN75240PW (Rail)
A75240
TSSOP−8
PW
SN75240PWR (Reel)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
UNIT
Continuous power dissipation
Electrostatic discharge
See Dissipation Rating Table
(2)
(3)
15 kV , 2 kV
Peak power dissipation, P
D(peak)
60 W
3 A
Peak forward surge current, I
Peak reverse surge current, I
FSM
RSM
−9 A
Storage temperature range, T
stg
−65°C to 150°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is
not implied.
(2)
(3)
Human Body Model − Tested in accordance with JEDEC Standard 22, Test Method A114−A.
Charged Device Model − Tested in accordance with JEDEC Standard 22, Test Method C101.
2
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www.ti.com
SLLS266F − FEBRUARY 1997 − REVISED JULY 2004
DISSIPATION RATING TABLE
T
≤ 25°C
DERATING FACTOR
‡
T
= 70°C
T = 85°C
A
A
A
PACKAGE
POWER RATING
ABOVE T = 25°C
POWER RATING POWER RATING
A
DBV
P
385 mW
3.1 mW/°C
9.2 mW/°C
4.2 mW/°C
246 mW
736 mW
331 mW
200 mW
598 mW
268 mW
1150 mW
PW
520 mW
‡
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
recommended operating conditions
MIN
0
MAX
70
UNIT
SN75240
Operating free-air temperature, T
°C
A
SN65220, SN65240
−40
85
electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER
Leakage current
TEST CONDITIONS
V = 6 V at A, B, C, or D terminals
MIN
TYP
MAX
UNIT
µA
V
I
1
8
lkg
I
V
Breakdown voltage
V = 1 mA at A, B, C, or D terminals
I
6.5
7
(BR)
C
IN
Input capacitance to ground
V = 0.4 sin (4E6πt) + 0.5 V
I
35
pF
APPLICATION INFORMATION
Full-Speed or
Low-Speed USB
Down Stream
Transceiver
Full-Speed or
Low-Speed USB
Host-or-Hub Port
Transceiver
1.5 kΩ
(Full Speed Only)
27 Ω
27 Ω
D+
D+
A
A
15 kΩ
15 kΩ
GND
SN75220 or
1/2 SNx5240
SN75220 or
1/2 SNx5240
GND
1.5 kΩ
(Low Speed
Only)
B
B
D−
D−
27 Ω
27 Ω
3
PACKAGE OPTION ADDENDUM
www.ti.com
1-Mar-2005
PACKAGING INFORMATION
Orderable Device
SN65220DBVR
SN65220DBVT
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
DBV
6
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65220YZBR
SN65220YZBT
SN65240P
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
PDIP
YZB
YZB
P
4
4
8
3000
250
50
None
None
Call TI
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN65240PW
SN65240PWR
SN75240P
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
PDIP
PW
PW
P
8
8
8
150
2000
50
None
None
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-NC-NC-NC
Pb-Free
(RoHS)
SN75240PW
SN75240PWLE
SN75240PWR
SN75240PWRG4
ACTIVE
TSSOP
PW
PW
PW
PW
8
8
8
8
150
None
None
None
None
CU NIPDAU Level-1-220C-UNLIM
OBSOLETE TSSOP
Call TI
CU NIPDAU Level-1-220C-UNLIM
Call TI Call TI
Call TI
ACTIVE
TSSOP
TSSOP
2000
2000
PREVIEW
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
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