ADC3241IRGZT [TI]
双通道、14 位、25MSPS 模数转换器 (ADC) | RGZ | 48 | -40 to 85;型号: | ADC3241IRGZT |
厂家: | TEXAS INSTRUMENTS |
描述: | 双通道、14 位、25MSPS 模数转换器 (ADC) | RGZ | 48 | -40 to 85 转换器 模数转换器 |
文件: | 总83页 (文件大小:4470K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
ADC324x 双通道、14 位、25MSPS 至 125MSPS 模数转换器
1 特性
3 说明
1
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双通道
ADC324x 属于高线性度、超低功耗、双通道、14 位、
25MSPS 至 125MSPS 模数转换器 (ADC) 系列。此类
器件专门设计用于支持具有宽动态范围需求且要求苛刻
的高输入频率信号。当 SYSREF 输入实现整个系统同
步时,时钟输入分频器将给予系统时钟架构设计更高的
灵活性。ADC324x 系列支持串行低压差分信令
14 位分辨率
单电源:1.8V
串行 LVDS 接口 (SLVDS)
支持 1 分频,2 分频和 4 分频的灵活输入时钟缓冲
器
•
•
fIN = 70MHz 时,信噪比 (SNR) = 72.4dBFS,无杂
散动态范围 (SFDR) = 87dBc
(LVDS),从而减少接口线路的数量,实现高系统集成
度。串行 LVDS 接口为双线制,通过两个 LVDS 对串
行输出每个 ADC 数据。内部锁相环 (PLL) 会将传入的
ADC 采样时钟加倍,以获得串行输出各通道的 14 位
输出数据时所使用的位时钟。除了串行数据流之外,数
据帧和位时钟也作为 LVDS 输出进行传送。
超低功耗:
–
125MSPS 时为每通道 116mW
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•
通道隔离:105dB
内部抖动和斩波
支持多芯片同步
器件信息(1)
与 12 位版本器件引脚到引脚兼容
器件型号
ADC324x
封装
VQFN (48)
封装尺寸(标称值)
封装:超薄四方扁平无引线 (VQFN)-48 (7mm x
7mm)
7.00mm x 7.00mm
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。
2 应用
空白
空白
空白
空白
空白
空白
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多载波、多模式蜂窝基站
雷达和智能天线阵列
炮弹制导
电机控制反馈
网络和矢量分析器
通信测试设备
无损检测
微波接收器
软件定义无线电 (SDR)
正交和分集无线电接收器
手持式无线电和仪表
fS = 125MSPS、fIN = 10MHz 时的性能
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
12.5
25
37.5
50
62.5
Frequency (MHz)
D101
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBAS671
ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
目录
7.19 Typical Characteristics: Common ......................... 43
7.20 Typical Characteristics: Contour ........................... 44
Parameter Measurement Information ................ 45
8.1 Timing Diagrams..................................................... 45
Detailed Description ............................................ 47
9.1 Overview ................................................................. 47
9.2 Functional Block Diagram ....................................... 47
9.3 Feature Description................................................. 48
9.4 Device Functional Modes........................................ 52
9.5 Programming........................................................... 53
9.6 Register Maps......................................................... 57
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 4
Pin Configuration and Functions......................... 4
Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics: ADC3241, ADC3242 ....... 7
7.6 Electrical Characteristics: ADC3243, ADC3244 ....... 7
7.7 Electrical Characteristics: General............................ 8
7.8 AC Performance: ADC3241...................................... 9
7.9 AC Performance: ADC3242.................................... 11
7.10 AC Performance: ADC3243.................................. 13
7.11 AC Performance: ADC3244.................................. 15
7.12 Digital Characteristics ........................................... 17
7.13 Timing Requirements: General ............................. 17
7.14 Timing Requirements: LVDS Output..................... 18
7.15 Typical Characteristics: ADC3241 ........................ 19
7.16 Typical Characteristics: ADC3242 ........................ 25
7.17 Typical Characteristics: ADC3243 ........................ 31
7.18 Typical Characteristics: ADC3244 ........................ 37
8
9
10 Applications and Implementation...................... 69
10.1 Application Information.......................................... 69
10.2 Typical Applications .............................................. 70
11 Power-Supply Recommendations ..................... 72
12 Layout................................................................... 73
12.1 Layout Guidelines ................................................. 73
12.2 Layout Example .................................................... 73
13 器件和文档支持 ..................................................... 74
13.1 相关链接................................................................ 74
13.2 社区资源................................................................ 74
13.3 商标....................................................................... 74
13.4 静电放电警告......................................................... 74
13.5 Glossary................................................................ 74
14 机械、封装和可订购信息....................................... 74
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision B (March 2015) to Revision C
Page
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•
Added Digital Inputs section to Digital Characteristics table ................................................................................................ 17
Changed Wake-up time parameter maximum specifications in Timing Requirements: General table ................................ 17
Updated Figure 19, Figure 20, Figure 23, Figure 24 , Figure 25, and Figure 26................................................................. 22
Updated Figure 50 , Figure 51, Figure 54, Figure 55, Figure 56, and Figure 57................................................................. 28
Updated Figure 81, Figure 82, Figure 85, Figure 86, Figure 87, and Figure 88 . ............................................................... 34
Updated Figure 112, Figure 113, Figure 116, Figure 117, Figure 118, and Figure 119...................................................... 40
Changed Figure 133. ........................................................................................................................................................... 45
Changed SNR and Clock Jitter section: changed typical thermal noise value and changed Figure 141 to reflect
updated thermal noise value ................................................................................................................................................ 49
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•
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•
Changed Table 3 .................................................................................................................................................................. 50
Changed Changed Figure 142 ............................................................................................................................................. 51
Added Improving Wake-Up Time From Global Power-Down section .................................................................................. 53
Changed Table 8: changed FLIP BITS to FLIP WIRE in register 4h, changed bit D7 in row 70A, and added register
13 row................................................................................................................................................................................... 57
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Changed Summary of Special Mode Registers section: changed title, moved section to correct location ......................... 58
Changed register 04h description......................................................................................................................................... 59
Changed register 0Ah and 0Bh descriptions........................................................................................................................ 61
Added register 13h ............................................................................................................................................................... 63
Changed register 70Ah to include DIS CLK FILT bit ........................................................................................................... 68
2
版权 © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Changes from Revision A (December 2014) to Revision B
Page
•
已将文档状态由“混合状态”更改为“量产数据”:将 ADC3241 和 ADC3242 发布为量产数据;已对产品预览器件进行了更改 1
Changes from Original (July 2014) to Revision A
Page
•
•
已将文档状态更改为“混合状态”............................................................................................................................................... 1
更改了产品预览数据表............................................................................................................................................................ 1
Copyright © 2014–2016, Texas Instruments Incorporated
3
ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
5 Device Comparison Table
RESOLUTION
INTERFACE
(Bits)
25 MSPS
ADC3221
ADC3241
—
50 MSPS
ADC3222
ADC3242
ADC32J22
ADC32J42
80 MSPS
ADC3223
ADC3243
ADC32J23
ADC32J43
125 MSPS
ADC3224
ADC3244
ADC32J24
ADC32J44
160 MSPS
—
12
Serial LVDS
14
—
12
ADC32J25
ADC32J45
JESD204B
14
—
6 Pin Configuration and Functions
RGZ Package
48-Pin VQFN
Top View
48
47
46
45
44
43
42
41
40
39
38
37
1
2
36
35
34
33
32
31
30
29
28
27
26
25
GND
DVDD
GND
GND
DVDD
GND
3
4
DVDD
GND
DVDD
GND
5
GND Pad
6
AVDD
AVDD
AVDD
AVDD
INAP
PDN
(Back Side)
7
AVDD
AVDD
AVDD
INBP
INBM
AVDD
8
9
10
11
12
INAM
AVDD
13
14
15
16
17
18
19
20
21
22
23
24
4
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
6-9, 12, 17, 20, 25,
28-30
AVDD
I
Analog 1.8-V power supply
CLKM
CLKP
18
I
Negative differential clock input for the ADC
Positive differential clock input for the ADC
Negative serial LVDS output for channel A0
Positive serial LVDS output for channel A0
Negative serial LVDS output for channel A1
Positive serial LVDS output for channel A1
Negative serial LVDS output for channel B0
Positive serial LVDS output for channel B0
Negative serial LVDS output for channel B1
Positive serial LVDS output for channel B1
Negative bit clock output
19
I
DA0M
DA0P
48
O
O
O
O
O
O
O
O
O
O
I
47
DA1M
DA1P
46
45
DB0M
DB0P
40
39
DB1M
DB1P
38
37
DCLKM
DCLKP
DVDD
FCLKM
FCLKP
44
43
2, 4, 33, 35
42
Positive bit clock output
Digital 1.8-V power supply
O
O
Negative frame clock output
41
Positive frame clock output
1, 3, 5, 32, 34, 36,
PowerPAD™
GND
I
Ground, 0 V
INAM
INAP
INBM
INBP
11
10
26
27
I
I
I
I
Negative differential analog input for channel A
Positive differential analog input for channel A
Negative differential analog input for channel B
Positive differential analog input for channel B
Power-down control. This pin can be configured via the SPI.
This pin has an internal 150-kΩ pull-down resistor.
PDN
31
I
RESET
SCLK
21
13
14
16
I
I
Hardware reset; active high. This pin has an internal 150-kΩ pull-down resistor.
Serial interface clock input. This pin has an internal 150-kΩ pull-down resistor.
Serial interface data input. This pin has an internal 150-kΩ pull-down resistor.
Serial interface data output
SDATA
SDOUT
I
O
Serial interface enable; active low.
This pin has an internal 150-kΩ pull-up resistor to AVDD.
SEN
15
I
SYSREFM
SYSREFP
VCM
23
22
24
I
I
Negative external SYSREF input
Positive external SYSREF input
O
Common-mode voltage for analog inputs
Copyright © 2014–2016, Texas Instruments Incorporated
5
ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–40
MAX
UNIT
V
Analog supply voltage range, AVDD
Digital supply voltage range, DVDD
INAP, INBP, INAM, INBM
2.1
2.1
V
min (1.9, AVDD + 0.3)
CLKP, CLKM
Voltage applied to input pins
AVDD + 0.3
V
SYSREFP, SYSREFM
AVDD + 0.3
SCLK, SEN, SDATA, RESET, PDN
Operating free-air, TA
3.9
85
Temperature
Operating junction, TJ
Storage, Tstg
125
150
ºC
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions(1)
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
SUPPLIES
AVDD
Analog supply voltage range
Digital supply voltage range
1.7
1.7
1.8
1.8
1.9
1.9
V
V
DVDD
ANALOG INPUT
For input frequencies < 450 MHz
For input frequencies < 600 MHz
2
1
VID
Differential input voltage
VPP
V
VIC
Input common-mode voltage
VCM ± 0.025
CLOCK INPUT
Input clock frequency
Sampling clock frequency
Sine wave, ac-coupled
LVPECL, ac-coupled
LVDS, ac-coupled
10
125(2)
MSPS
VPP
0.2
1.5
1.6
Input clock amplitude (differential)
0.7
Input clock duty cycle
35%
50%
0.95
65%
Input clock common-mode voltage
V
DIGITAL OUTPUTS
Maximum external load capacitance
from each output pin to GND
CLOAD
RLOAD
3.3
pF
Differential load resistance placed
externally
100
Ω
(1) After power-up, to reset the device for the first time, only use the RESET pin; see the Register Initialization section.
(2) With the clock divider enabled by default for divide-by-1. Maximum sampling clock frequency for the divide-by-4 option is 500 MSPS.
6
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
7.4 Thermal Information
ADC324x
THERMAL METRIC(1)
RGZ (VQFN)
UNIT
48 PINS
25.7
18.9
3.0
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ψJB
3
RθJC(bot)
0.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics: ADC3241, ADC3242
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3241
TYP
ADC3242
TYP
PARAMETER
ADC clock frequency
MIN
MAX
125
71
MIN
MAX
125
81
UNIT
MSPS
mA
1.8-V analog supply current
1.8-V digital supply current
Total power dissipation
31
35
118
5
39
43
147
5
65
75
mA
205
17
245
17
mW
Global power-down dissipation
Standby power-down dissipation
mW
78
103
78
103
mW
7.6 Electrical Characteristics: ADC3243, ADC3244
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3243
TYP
ADC3244
TYP
PARAMETER
ADC clock frequency
MIN
MAX
80
MIN
MAX
125
106
95
UNIT
MSPS
mA
1.8-V analog supply current
1.8-V digital supply current
Total power dissipation
50
52
183
5
91
65
64
233
5
85
mA
285
17
325
17
mW
Global power-down dissipation
Standby power-down dissipation
mW
72
103
78
103
mW
Copyright © 2014–2016, Texas Instruments Incorporated
7
ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
7.7 Electrical Characteristics: General
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RESOLUTION
Resolution
ANALOG INPUT
14
Bits
Differential input full-scale
Input resistance
2.0
6.6
3.7
0.95
10
VPP
kΩ
RIN
Differential at dc
CIN
Input capacitance
Differential at dc
pF
VOC(VCM)
VCM common-mode voltage output
VCM output current capability
Input common-mode current
V
mA
Per analog input pin
1.5
µA/MSPS
50-Ω differential source driving 50-Ω
termination across INP and INM
Analog input bandwidth (3 dB)
540
MHz
DC ACCURACY
EO
Offset error
–25
–2
25
2
mV
°C
Temperature coefficient of offset
error
αEO
±0.024
Gain error as a result of internal
reference inaccuracy alone
EG(REF)
%FS
EG(CHAN)
Gain error of channel alone
–2
%FS
α(EGCHAN) Temperature coefficient of EG(CHAN)
±0.008
Δ%FS/°C
CHANNEL-TO-CHANNEL ISOLATION
fIN = 10 MHz
fIN = 100 MHz
fIN = 200 MHz
fIN = 230 MHz
fIN = 300 MHz
105
105
105
105
105
Crosstalk(1)
dB
(1) Crosstalk is measured with a –1-dBFS input signal on one channel and no input on the other channel.
8
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
7.8 AC Performance: ADC3241
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3241 (fS = 25 MSPS)
DITHER ON
DITHER OFF
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
DYNAMIC AC CHARACTERISTICS
fIN = 10 MHz
73.3
73.4
72.8
72.4
71.3
70.1
72.2
72.3
71.8
71.5
70.5
69.3
–143.9
73.7
73.7
73.2
72.8
71.6
70.4
72.6
72.6
72.2
71.9
70.8
69.6
–144.3
–144.3
–143.8
–143.4
–142.2
–141.0
73.5
73.5
72.9
72.4
71.2
69.7
11.9
11.9
11.8
11.7
11.5
11.3
87
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
69.7
Signal-to-noise ratio
(from 1-MHz offset)
dBFS
SNR
Signal-to-noise ratio
(full Nyquist band)
dBFS
dBFS/Hz
dBFS
Bits
–144.0 –140.7
–143.4
–143.0
–141.9
–140.7
73.3
73.1
72.8
72.2
71.2
69.7
11.9
11.8
11.8
11.7
11.5
11.3
95
Noise spectral density
NSD(1)
(averaged across Nyquist zone)
69.1
11.2
84
Signal-to-noise and distortion
ratio
SINAD(1)
ENOB(1)
SFDR
Effective number of bits
94
89
92
86
Spurious-free dynamic range
dBc
85
81
86
83
81
79
(1) Reported from a 1-MHz offset.
Copyright © 2014–2016, Texas Instruments Incorporated
9
ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
AC Performance: ADC3241 (continued)
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3241 (fS = 25 MSPS)
DITHER ON
DITHER OFF
MIN
PARAMETER
TEST CONDITIONS
fIN = 10 MHz
MIN
TYP
104
100
100
95
MAX
TYP
96
95
95
93
87
81
88
92
86
82
83
80
92
92
92
92
92
92
85
85
84
82
81
76
MAX
UNIT
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
84
Second-order harmonic
distortion
HD2
dBc
87
81
95
84
94
92
HD3
Non
Third-order harmonic distortion
dBc
dBc
85
87
82
100
101
100
98
87
Spurious-free dynamic range
HD2, HD3 (excluding HD2, HD3)
100
96
94
80.5
92
91
THD
Total harmonic distortion
dBc
86
84
78
fIN1 = 45 MHz,
fIN2 = 50 MHz
–94
–92
–93
–90
Two-tone, third-order
intermodulation distortion
IMD3
dBFS
fIN1 = 185 MHz,
fIN2 = 190 MHz
10
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7.9 AC Performance: ADC3242
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3242 (fS = 50 MSPS)
DITHER ON
DITHER OFF
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
DYNAMIC AC CHARACTERISTICS
fIN = 10 MHz
73.3
73.3
73
73.7
73.8
73.3
73.1
72.1
71.2
72.9
73.1
72.6
72.4
71.5
70.6
–147.5
–147.6
–147.1
–146.9
–145.9
–145
73.6
73.6
73.2
72.9
71.7
70.6
11.9
11.9
11.9
11.8
11.6
11.4
95
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
70.5
Signal-to-noise ratio
(from 1-MHz offset)
72.6
71.7
70.9
72.5
72.6
72.3
71.9
71.1
70.3
–147.1
SNR
dBFS
Signal-to-noise ratio
(full Nyquist band)
–147.1 –144.5
–146.8
–146.4
–145.5
–144.7
73.2
73.4
72.9
72.5
71.5
70.5
11.9
11.9
11.8
11.7
11.6
11.4
89
Noise spectral density
NSD(1)
dBFS/Hz
dBFS
Bits
(averaged across Nyquist zone)
69.6
11.3
83
Signal-to-noise and distortion
ratio
SINAD(1)
ENOB(1)
SFDR
Effective number of bits
93
91
94
93
Spurious-free dynamic range
dBc
88
86
85
82
82
80
(1) Reported from a 1-MHz offset.
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AC Performance: ADC3242 (continued)
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3242 (fS = 50 MSPS)
DITHER ON
MIN
DITHER OFF
MIN
PARAMETER
TEST CONDITIONS
fIN = 10 MHz
TYP
103
99
96
94
88
82
89
93
94
88
85
82
99
101
100
99
99
97
88
92
92
89
83
79
MAX
TYP
97
95
94
92
89
83
97
95
93
86
82
80
96
93
94
94
93
93
90
87
88
86
81
78
MAX
UNIT
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 20 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
83
83
87
79
Second-order harmonic
distortion
HD2
dBc
HD3
Non
Third-order harmonic distortion
dBc
dBc
Spurious-free dynamic range
HD2, HD3 (excluding HD2, HD3)
THD
Total harmonic distortion
dBc
fIN1 = 45 MHz,
fIN2 = 50 MHz
–95
–92
–95
–89
Two-tone, third-order
intermodulation distortion
IMD3
dBFS
fIN1 = 185 MHz,
fIN2 = 190 MHz
12
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7.10 AC Performance: ADC3243
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3243 (fS = 80 MSPS)
DITHER ON
DITHER OFF
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
DYNAMIC AC CHARACTERISTICS
fIN = 10 MHz
73.1
72.9
72.7
72
73.5
73.3
73
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
70.7
Signal-to-noise ratio
(from 1-MHz offset)
72.4
71.7
72.8
72.6
72.3
71.7
71.2
–149.4
–149.2
–148.9
–148.3
–147.6
73.4
73.2
72.9
72.2
71.3
11.9
11.9
11.8
11.7
11.6
94
71.4
72.4
72.3
72.1
71.4
70.9
–149.0
SNR
dBFS
Signal-to-noise ratio
(full Nyquist band)
–148.8 –146.7
–148.6
–147.9
–147.3
73.1
Noise spectral density
NSD(1)
dBFS/Hz
dBFS
Bits
(averaged across Nyquist zone)
69.6
11.3
82
72.9
Signal-to-noise and distortion
ratio
SINAD(1)
ENOB(1)
SFDR
72.7
71.9
71.2
11.8
11.8
Effective number of bits
11.8
11.6
11.5
89
93
93
Spurious-free dynamic range
93
91
dBc
87
87
85
83
(1) Reported from a 1-MHz offset.
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AC Performance: ADC3243 (continued)
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless
otherwise noted.
ADC3243 (fS = 80 MSPS)
DITHER ON
DITHER OFF
MIN
PARAMETER
TEST CONDITIONS
fIN = 10 MHz
MIN
TYP
102
95
MAX
TYP
98
93
93
87
85
95
94
96
90
84
95
95
95
95
94
91
89
88
84
81
MAX
UNIT
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
82
83
86
76
Second-order harmonic
distortion
HD2
95
dBc
87
85
89
94
HD3
Non
Third-order harmonic distortion
Spurious-free dynamic range
95
dBc
dBc
92
89
93
100
100
99
HD2, HD3 (excluding HD2, HD3)
98
88
91
THD
Total harmonic distortion
91
dBc
85
83
fIN1 = 45 MHz,
fIN2 = 50 MHz
–93
–91
–92
–89
Two-tone, third-order
intermodulation distortion
IMD3
dBFS
fIN1 = 185 MHz,
fIN2 = 190 MHz
14
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7.11 AC Performance: ADC3244
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input,
unless otherwise noted.
ADC3244 (fS = 125 MSPS)
DITHER ON
DITHER OFF
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
DYNAMIC AC CHARACTERISTICS
fIN = 10 MHz
72.9
72.6
72.4
71.7
71
73.3
73
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
71
Signal-to-noise ratio
(from 1-MHz offset)
72.8
72.2
71.6
72.9
72.6
72.5
71.9
71.3
–151.1
–150.9
–150.7
–150.1
–149.5
73
SNR
dBFS
72.5
72.2
72.1
71.4
70.7
–150.8
Signal-to-noise ratio
(full Nyquist band)
–150.5 –148.9
–150.3
–149.6
–148.9
72.8
Noise spectral density
NSD(1)
dBFS/Hz
dBFS
Bits
(averaged across Nyquist zone)
69.6
11.3
82
72.6
72.9
72.5
71.9
71.1
11.8
11.8
11.8
11.6
11.5
86
Signal-to-noise and distortion
ratio
SINAD(1)
ENOB(1)
SFDR
72.3
71.5
70.7
11.8
11.8
Effective number of bits
11.7
11.6
11.5
93
94
89
Spurious-free dynamic range
89
85
dBc
85
85
83
82
(1) Reported from a 1-MHz offset.
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AC Performance: ADC3244 (continued)
Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX
= 85°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input,
unless otherwise noted.
ADC3244 (fS = 125 MSPS)
DITHER ON
MIN
DITHER OFF
MIN
PARAMETER
TEST CONDITIONS
fIN = 10 MHz
TYP
95
96
91
85
83
94
94
91
97
87
100
99
99
100
96
91
91
87
84
81
MAX
TYP
96
95
90
85
83
86
89
85
89
85
95
95
95
91
92
85
86
83
82
80
MAX
UNIT
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
fIN = 10 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 170 MHz
fIN = 230 MHz
82
83
86
76
Second-order harmonic
distortion
HD2
dBc
HD3
Non
Third-order harmonic distortion
Spurious-free dynamic range
dBc
dBc
HD2, HD3 (excluding HD2, HD3)
THD
Total harmonic distortion
dBc
fIN1 = 45 MHz,
fIN2 = 50 MHz
–97
–91
–95
–90
Two-tone, third-order
intermodulation distortion
IMD3
dBFS
fIN1 = 185 MHz,
fIN2 = 190 MHz
16
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7.12 Digital Characteristics
The dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic
level 0 or 1. AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS (RESET, SCLK, SDATA, SEN, PDN)
All digital inputs support 1.8-V and
3.3-V CMOS logic levels
VIH
VIL
High-level input voltage
Low-level input voltage
1.3
V
V
All digital inputs support 1.8-V and
3.3-V CMOS logic levels
0.4
RESET, SDATA, SCLK,
PDN
SEN(1)
VHIGH = 1.8 V
VHIGH = 1.8 V
VLOW = 0 V
10
0
High-level input
current
IIH
µA
µA
RESET, SDATA, SCLK,
PDN
0
Low-level input
current
IIL
SEN
VLOW = 0 V
10
DIGITAL INPUTS (SYSREFP, SYSREFM)
VIH
VIL
High-level input voltage
1.3
0.5
0.9
V
V
V
Low-level input voltage
Common-mode voltage for SYSREF
DIGITAL OUTPUTS, CMOS INTERFACE (SDOUT)
VOH
VOL
High-level output voltage
Low-level output voltage
DVDD – 0.1
DVDD
0
V
V
0.1
DIGITAL OUTPUTS, LVDS INTERFACE
VODH
VODL
VOCM
High-level output differential voltage
Low-level output differential voltage
Output common-mode voltage
With an external 100-Ω termination
With an external 100-Ω termination
280
410
–410
1.05
460
mV
mV
V
–460
–280
(1) SEN has an internal 150-kΩ pull-up resistor to AVDD. Because the pull-up resistor is weak, SEN can also be driven by 1.8-V or 3.3-V
CMOS buffers.
7.13 Timing Requirements: General
Typical values are at TA = 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. Minimum
and maximum values are across the full temperature range: TMIN = –40°C to TMAX = 85°C.
MIN
TYP
1.44
±70
±150
130
35
MAX
UNIT
tA
Aperture delay
1.24
1.64
ns
Aperture delay matching between two channels of the same device
Variation of aperture delay between two devices at the same temperature and supply voltage
Aperture jitter
ps
ps
tJ
fS rms
Time to valid data after exiting standby power-down mode
65
Wake-up time
µs
Time to valid data after exiting global power-down mode
(in this mode, both channels power down)
85
140
2-wire mode (default)
9
8
Clock
cycles
ADC latency(1)
1-wire mode
tSU_SYSREF
tH_SYSREF
Setup time for SYSREF referenced to input clock rising edge
SYSREF reference time
1000
100
ps
Hold time for SYSREF referenced to input clock rising edge
(1) Overall latency = ADC latency + tPDI
.
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7.14 Timing Requirements: LVDS Output
Typical values are at 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, 7x serialization, CLOAD = 3.3 pF(1), and
RLOAD = 100 Ω(2), unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C
to TMAX = 85°C.(3)(4)
MIN
TYP
MAX
UNIT
Data setup time: data valid to zero-crossing of differential output clock
(CLKOUTP – CLKOUTM)(5)
tSU
tHO
0.36
0.42
ns
Data hold time: zero-crossing of differential output clock (CLKOUTP – CLKOUTM) to data
becoming invalid(5)
0.36
0.47
ns
LVDS bit clock duty cycle: duty cycle of differential clock (CLKOUTP – CLKOUTM)
49%
4.5
Clock propagation delay: input clock falling edge cross-over to frame 1-wire mode
clock rising edge cross-over 10 MSPS < sampling frequency <
2.7
6.5
tPDI
ns
2-wire mode
125 MSPS
0.44 × tS + tDELAY
tDELAY
Delay time
3
4.5
5.9
ns
ns
tFALL
tRISE
,
Data fall time, data rise time: rise time measured from –100 mV to 100 mV,
10 MSPS ≤ Sampling frequency ≤ 125 MSPS
0.11
tCLKRISE
tCLKFALL
,
Output clock rise time, output clock fall time: rise time measured from –100 mV to 100 mV,
10 MSPS ≤ Sampling frequency ≤ 125 MSPS
0.11
ns
(1) CLOAD is the effective external single-ended load capacitance between each output pin and ground
(2) RLOAD is the differential load resistance between the LVDS output pair.
(3) Measurements are done with a transmission line of a 100-Ω characteristic impedance between the device and load. Setup and hold time
specifications take into account the effect of jitter on the output data and clock.
(4) Timing parameters are ensured by design and characterization and are not tested in production.
(5) Data valid refers to a logic high of +100 mV and a logic low of –100 mV.
Table 1. LVDS Timings at Lower Sampling Frequencies: 7x Serialization (2-Wire Mode)
SETUP TIME
(tSU, ns)
HOLD TIME
(tHO, ns)
SAMPLING FREQUENCY
(MSPS)
MIN
2.27
1.44
1.2
TYP
MAX
MIN
2.41
1.51
1.24
0.97
0.72
0.53
TYP
MAX
25
40
2.6
1.6
2.6
1.7
50
1.32
1.04
0.75
0.57
1.4
60
0.95
0.68
0.5
1.09
0.81
0.62
80
100
Table 2. LVDS Timings at Lower Sampling Frequencies: 14x Serialization (1-Wire Mode)
SETUP TIME
(tSU, ns)
HOLD TIME
(tHO, ns)
SAMPLING FREQUENCY
(MSPS)
MIN
1.1
TYP
MAX
MIN
1.19
0.74
0.54
0.42
0.3
TYP
MAX
25
40
50
60
80
1.24
0.72
0.55
0.41
0.24
1.34
0.82
0.64
0.51
0.38
0.66
0.48
0.35
0.17
18
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7.15 Typical Characteristics: ADC3241
Typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D701
D702
SFDR = 97.9 dBc, SNR = 73.8 dBFS, SINAD = 73.8 dBFS,
THD = 96.8 dBc, HD2 = –110.0 dBc, HD3 = –97.9 dBc
SFDR = 89.8 dBc, SNR = 74.5 dBFS, SINAD = 74.3 dBFS,
THD = 88.3 dBc, HD2 = –89.8 dBc, HD3 = –100.3 dBc
Figure 1. FFT for 10-MHz Input Signal (Dither On)
Figure 2. FFT for 10-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D703
D704
SFDR = 91.8 dBc, SNR = 73.4 dBFS, SINAD = 73.4 dBFS,
THD = 91.4 dBc, HD2 = –108.2 dBc, HD3 = –91.8 dBc
SFDR = 90.2 dBc, SNR = 74.1 dBFS, SINAD = 73.9 dBFS,
THD = 88.7 dBc, HD2 = –90.2 dBc, HD3 = –100.5 dBc
Figure 3. FFT for 70-MHz Input Signal (Dither On)
Figure 4. FFT for 70-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D705
D706
SFDR = 86.6 dBc, SNR = 72.1 dBFS, SINAD = 71.9 dBFS,
THD = 84.7 dBc, HD2 = –89.8 dBc, HD3 = –86.6 dBc
SFDR = 87.7 dBc, SNR = 72.5 dBFS, SINAD = 72.3 dBFS,
THD = 85 dBc, HD2 = –87.7 dBc, HD3 = –91.2 dBc
Figure 5. FFT for 170-MHz Input Signal (Dither On)
Figure 6. FFT for 170-MHz Input Signal (Dither Off)
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Typical Characteristics: ADC3241 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D707
D708
SFDR = 75.6 dBc, SNR = 69.8 dBFS, SINAD = 68.8 dBFS,
THD = 74.8 dBc, HD2 = –75.6 dBc, HD3 = –82.5 dBc
SFDR = 75.3 dBc, SNR = 70.0 dBFS, SINAD = 68.8 dBFS,
THD = 73.8 dBc, HD2 = –75.3 dBc, HD3 = –79.6 dBc
Figure 7. FFT for 270-MHz Input Signal (Dither On)
Figure 8. FFT for 270-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D709
D710
SFDR = 68.4 dBc, SNR = 67.2 dBFS, SINAD = 67.2 dBFS,
THD = 92.6 dBc, HD2 = –68.4 dBc, HD3 = –89.5 dBc
SFDR = 67.9 dBc, SNR = 67.2 dBFS, SINAD = 67.2 dBFS,
THD = 87.6 dBc, HD2 = –67.9 dBc, HD3 = –96.9 dBc
Figure 9. FFT for 450-MHz Input Signal (Dither On)
Figure 10. FFT for 450-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D711
D712
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 82.4 dBFS,
each tone at –7 dBFS
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 90 dBFS,
each tone at –36 dBFS
Figure 11. FFT for Two-Tone Input Signal
(–7 dBFS at 46 MHz and 50 MHz)
Figure 12. FFT for Two-Tone Input Signal
(–36 dBFS at 46 MHz and 50 MHz)
20
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Typical Characteristics: ADC3241 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
2.5
5
7.5
10
12.5
0
2.5
5
7.5
10
12.5
Frequency (MHz)
Frequency (MHz)
D713
D714
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 78 dBFS,
each tone at –7 dBFS
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 89 dBFS,
each tone at –36 dBFS
Figure 13. FFT for Two-Tone Input Signal
Figure 14. FFT for Two-Tone Input Signal
(–7 dBFS at 185 MHz and 190 MHz)
(–36 dBFS at 185 MHz and 190 MHz)
-90
-80
-85
-90
-95
-95
-100
-105
-110
-115
-100
-105
-110
-35
-31
-27
-23
-19
-15
-11
-7
-35
-31
-27
-23
-19
-15
-11
-7
Each Tone Amplitude (dBFS)
Each Tone Amplitude (dBFS)
D715
D716
Figure 15. Intermodulation Distortion vs Input Amplitude
(46 MHz and 50 MHz)
Figure 16. Intermodulation Distortion vs Input Amplitude
(185 MHz and 190 MHz)
75
104
Dither_EN
Dither_EN
Dither_DIS
Dither_DIS
74
73
72
71
70
69
68
67
96
88
80
72
64
56
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
Frequency (MHz)
Frequency (MHz)
D717
D718
Figure 17. Signal-to-Noise Ratio vs Input Frequency
Figure 18. Spurious-Free Dynamic Range vs
Input Frequency
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3241 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
75
74.5
74
180
160
140
120
100
80
75.5
74.5
73.5
72.5
71.5
70.5
69.5
68.5
280
240
200
160
120
80
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
73.5
73
72.5
72
60
40
71.5
71
40
20
0
-70
-60
-50
-40
-30
-20
-10
0
-70
-60
-50
-40
-30
-20
-10
0
Amplitude (dBFS)
Amplitude (dBFS)
D719
D720
.
Figure 19. Performance vs Input Amplitude (30 MHz)
Figure 20. Performance vs Input Amplitude (170 MHz)
80
78
76
74
72
70
97.5
SNR
SFDR
78
76
74
72
70
68
87.5
SNR
SFDR
95
85
92.5
90
82.5
80
87.5
77.5
85
75
0.85
0.9
0.95
1
1.05
1.1
0.85
0.9
0.95
1
1.05
1.1
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
D721
D722
Figure 21. Performance vs Input Common-Mode Voltage
(30 MHz)
Figure 22. Performance vs Input Common-Mode Voltage
(170 MHz)
106
74
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
104
102
100
98
73.7
73.4
73.1
72.8
72.5
96
94
92
90
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D723
D724
Figure 23. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature (30 MHz)
Figure 24. Signal-to-Noise Ratio vs
AVDD Supply and Temperature (30 MHz)
22
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Typical Characteristics: ADC3241 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
98
97
96
95
94
93
74.5
74.1
73.7
73.3
72.9
72.5
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D725
D726
Figure 25. Spurious-Free Dynamic Range vs
DVDD Supply and Temperature (30 MHz)
Figure 26. Signal-to-Noise Ratio vs
DVDD Supply and Temperature (30 MHz)
78
92.5
75.4
112
SNR
SFDR
SNR
SFDR
76
74
72
70
68
66
64
62
60
90
74.6
73.8
73
104
96
88
80
72
64
56
48
87.5
85
82.5
80
72.2
71.4
70.6
69.8
69
77.5
75
72.5
70
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
Differential Clock Amplitude (Vpp)
Differential Clock Amplitude (Vpp)
D727
D728
Figure 27. Performance vs Clock Amplitude (40 MHz)
Figure 28. Performance vs Clock Amplitude (150 MHz)
74
99
74
73.2
72.4
71.6
70.8
70
90
88
86
84
82
80
SNR
SFDR
SNR
SFDR
73.8
73.6
73.4
73.2
73
97.5
96
94.5
93
91.5
72.8
90
30
35
40
45
50
55
60
65
70
30
35
40
45
50
55
60
65
70
Input Clock Duty Cycle (%)
Input Clock Duty Cycle (%)
D729
D730
Figure 29. Performance vs Clock Duty Cycle (30 MHz)
Figure 30. Performance vs Clock Duty Cycle (150 MHz)
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3241 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
15
12.5
10
7.5
5
2.5
0
D731
Output Code (LSB)
RMS Noise = 1.33 LSBs
Figure 31. Idle Channel Histogram
24
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
7.16 Typical Characteristics: ADC3242
Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D501
D502
SFDR = 88.9 dBc, SFDR = 99.8 dBc (non 23), SNR = 73.6 dBFS,
SINAD = 73.5 dBFS, THD = 88.8 dBc, HD2 = –111.4 dBc,
HD3 = –88.9 dBc
SFDR = 84.7 dBc, SFDR = 96.1 dBc (non 23), SNR = 74.1 dBFS,
SINAD = 73.8 dBFS, THD = 83.5 dBc, HD2 = –92.2 dBc,
HD3 = –84.7 dBc
Figure 32. FFT for 10-MHz Input Signal (Dither On)
Figure 33. FFT for 10-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D503
D504
SFDR = 85.8 dBc, SFDR = 100.3 dBc (non 23),
SNR = 72.4 dBFS, SINAD = 72.2 dBFS, THD = 84.8 dBc,
HD2 = –92.3 dBc, HD3 = –85.8 dBc
SFDR = 90.4 dBc, SFDR = 94.7 dBc (non 23), SNR = 73.9 dBFS,
SINAD = 73.7 dBFS, THD = 87.5 dBc, HD2 = –91.9 dBc,
HD3 = –90.4 dBc
Figure 35. FFT for 70-MHz Input Signal (Dither Off)
Figure 34. FFT for 70-MHz Input Signal (Dither On)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D505
D506
SFDR = 85.8 dBc, SFDR = 99.1 dBc (non 23), SNR = 72.4 dBFS,
SINAD = 72.2 dBFS, THD = 84.8 dBc, HD2 = –92.3 dBc,
HD3 = –85.8 dBc
SFDR = 89.7 dBc, SFDR = 93 dBc (non 23), SNR = 72.9 dBFS,
SINAD = 72.8 dBFS, THD = 86.6 dBc, HD2 = –89.7 dBc,
HD3 = –107.7 dBc
Figure 36. FFT for 170-MHz Input Signal (Dither On)
Figure 37. FFT for 170-MHz Input Signal (Dither Off)
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3242 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D507
D508
SFDR = 74.7 dBc, SFDR = 95.2 dBc (non 23), SNR = 70.7 dBFS,
SINAD = 69.3 dBFS, THD = 73.8 dBc, HD2 = –74.7 dBc,
HD3 = –81.1 dBc
SFDR = 74.6 dBc, SFDR = 91.1 dBc (non 23), SNR = 70.9 dBFS,
SINAD = 69.2 dBFS, THD = 72.9 dBc, HD2 = –74.6 dBc,
HD3 = –78.0 dBc
Figure 38. FFT for 270-MHz Input Signal (Dither On)
Figure 39. FFT for 270-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D509
D510
SFDR = 68.2 dBc, SNR = 69.0 dBFS, SINAD = 69.0 dBFS,
THD = –85.7 dBc, HD2 = –68.2 dBc, HD3 = –86.5 dBc
SFDR = 68.2 dBc, SNR = 69.2 dBFS, SINAD = 69.2 dBFS,
THD = –86.4 dBc, HD2 = 68.2 dBc, HD3 = –90.3 dBc
Figure 40. FFT for 450-MHz Input Signal (Dither On)
Figure 41. FFT for 450-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D511
D5112
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 87 dBFS,
each tone at –7 dBFS
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 88 dBFS,
each tone at –36 dBFS
Figure 42. FFT for Two-Tone Input Signal
(–7 dBFS at 46 MHz and 50 MHz)
Figure 43. FFT for Two-Tone Input Signal
(–36 dBFS at 46 MHz and 50 MHz)
26
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Typical Characteristics: ADC3242 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
5
10
15
20
25
0
5
10
15
20
25
Frequency (MHz)
Frequency (MHz)
D513
D514
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 83 dBFS,
each tone at –7 dBFS
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 85 dBFS,
each tone at –36 dBFS
Figure 44. FFT for Two-Tone Input Signal
Figure 45. FFT for Two-Tone Input Signal
(–7 dBFS at 185 MHz and 190 MHz)
(–36 dBFS at 185 MHz and 190 MHz)
-85
-80
-85
-90
-95
-90
-95
-100
-100
-105
-105
-110
-110
-35
-31
-27
-23
-19
-15
-11
-7
-35
-31
-27
-23
-19
-15
-11
-7
Each Tone Amplitude (dBFS)
Each Tone Amplitude (dBFS)
D515
D516
Figure 46. Intermodulation Distortion vs Input Amplitude
(46 MHz and 50 MHz)
Figure 47. Intermodulation Distortion vs Input Amplitude
(185 MHz and 190 MHz)
74.5
104
Dither_EN
Dither_EN
Dither_DIS
Dither_DIS
73.5
96
72.5
71.5
70.5
69.5
68.5
88
80
72
64
56
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
Frequency (MHz)
Frequency (MHz)
D517
D518
Figure 48. Signal-to-Noise Ratio vs Input Frequency
Figure 49. Spurious-Free Dynamic Range vs
Input Frequency
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
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www.ti.com.cn
Typical Characteristics: ADC3242 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
74.5
180
160
140
120
100
80
75.5
74.5
73.5
72.5
71.5
70.5
69.5
68.5
280
240
200
160
120
80
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
74
73.5
73
72.5
72
71.5
71
60
40
40
70.5
20
0
-70
-60
-50
-40
-30
-20
-10
0
-70
-60
-50
-40
-30
-20
-10
0
Amplitude (dBFS)
Amplitude (dBFS)
D519
D520
Figure 50. Performance vs Input Amplitude (30 MHz)
Figure 51. Performance vs Input Amplitude (170 MHz)
80
78
76
74
72
70
95
SNR
SFDR
78
76
74
72
70
68
90
SNR
SFDR
92.5
90
87.5
85
87.5
85
82.5
80
82.5
77.5
0.85
0.9
0.95
1
1.05
1.1
0.85
0.9
0.95
1
1.05
1.1
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
D521
D522
Figure 52. Performance vs Input Common-Mode Voltage
(30 MHz)
Figure 53. Performance vs Input Common-Mode Voltage
(170 MHz)
96
74
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
94
92
90
88
86
84
82
80
73.7
73.4
73.1
72.8
72.5
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D523
D524
Figure 54. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature (30 MHz)
Figure 55. Signal-to-Noise Ratio vs
AVDD Supply and Temperature (30 MHz)
28
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Typical Characteristics: ADC3242 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
92
91
90
89
88
87
86
85
74.5
74.1
73.7
73.3
72.9
72.5
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D525
D526
Figure 56. Spurious-Free Dynamic Range vs
DVDD Supply and Temperature (30 MHz)
Figure 57. Signal-to-Noise Ratio vs
DVDD Supply and Temperature (30 MHz)
78
90
76
96
SNR
SNR
SFDR
SFDR
75
74
73
72
71
70
69
94
75
72
69
66
63
60
87
84
81
78
75
72
92
90
88
86
84
82
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
Differential Clock Amplitude (Vpp)
Differential Clock Amplitude (Vpp)
D528
Figure 58. Performance vs Clock Amplitude (40 MHz)
Figure 59. Performance vs Clock Amplitude (150 MHz)
74.2
94.5
72.4
90
88
86
84
82
80
SNR
SFDR
SNR
SFDR
73.8
73.4
73
93
72.2
72
91.5
90
71.8
71.6
71.4
72.6
88.5
72.2
87
30
35
40
45
50
55
60
65
70
30
35
40
45
50
55
60
65
70
Input Clock Duty Cycle (%)
Input Clock Duty Cycle (%)
D529
D530
Figure 60. Performance vs Clock Duty Cycle (30 MHz)
Figure 61. Performance vs Clock Duty Cycle (150 MHz)
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3242 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
20
16
12
8
4
0
D531
Output Code (LSB)
RMS Noise = 1.3 LSBs
Figure 62. Idle Channel Histogram
30
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
7.17 Typical Characteristics: ADC3243
Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D301
D302
SFDR = 88.9 dBc, SNR = 73.4 dBFS, SINAD = 73.3 dBFS,
THD = 88.8 dBc, HD2 = –109.9 dBc, HD3 = –88.9 dBc
SFDR = 84.2 dBc, SNR = 73.8 dBFS, SINAD = 73.4 dBFS,
THD = 83.2 dBc, HD2 = –93.6 dBc, HD3 = –84.2 dBc
Figure 63. FFT for 10-MHz Input Signal (Dither On)
Figure 64. FFT for 10-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D303
D304
SFDR = 91.3 dBc, SNR = 73.2 dBFS, SINAD = 73.1 dBFS,
THD = 91 dBc, HD2 = –109.5 dBc, HD3 = –91.3 dBc
SFDR = 85.4 dBc, SNR = 73.6 dBFS, SINAD = 73.3 dBFS,
THD = 83.7 dBc, HD2 = –91.2 dBc, HD3 = –85.4 dBc
Figure 65. FFT for 70-MHz Input Signal (Dither On)
Figure 66. FFT for 70-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D305
D306
SFDR = 94.9 dBc, SNR = 72.4 dBFS, SINAD = 72.4 dBFS,
THD = 93.2 dBc, HD2 = –106.1 dBc, HD3 = –94.9 dBc
SFDR = 92.3 dBc, SNR = 72.9 dBFS, SINAD = 72.8 dBFS,
THD = 88 dBc, HD2 = –92.3 dBc, HD3 = –95.4 dBc
Figure 67. FFT for 170-MHz Input Signal (Dither On)
Figure 68. FFT for 170-MHz Input Signal (Dither Off)
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3243 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D307
D308
SFDR = 75.4 dBc, SNR = 70.9 dBFS, SINAD = 69.6 dBFS,
THD = 74.3 dBc, HD2 = –75.4 dBc, HD3 = –81.0 dBc
SFDR = 75.4 dBc, SNR = 71.2 dBFS, SINAD = 69.8 dBFS,
THD = 74.2 dBc, HD2 =–75.4 dBc, HD3 = –81.2 dBc
Figure 69. FFT for 270-MHz Input Signal (Dither On)
Figure 70. FFT for 270-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D309
D310
SFDR = 77.8 dBc, SNR = 68.8 dBFS, SINAD = 68.3 dBFS,
THD = 77.5 dBc, HD2 = –77.8 dBc, HD3 = –91.8 dBc
SFDR = 77.8 dBc, SNR = 68.8 dBFS, SINAD = 68.3 dBFS,
THD = 77.5 dBc, HD2 = –77.8 dBc, HD3 = –91.8 dBc
Figure 71. FFT for 450-MHz Input Signal (Dither On)
Figure 72. FFT for 450-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D311
D312
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 87 dBFS,
each tone at –7 dBFS
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 92.8 dBFS,
each tone at –36 dBFS
Figure 73. FFT for Two-Tone Input Signal
(–7 dBFS at 46 MHz and 50 MHz)
Figure 74. FFT for Two-Tone Input Signal
(–36 dBFS at 46 MHz and 50 MHz)
32
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Typical Characteristics: ADC3243 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
8
16
24
32
40
0
8
16
24
32
40
Frequency (MHz)
Frequency (MHz)
D313
D314
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 78.8 dBFS,
each tone at –7 dBFS
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 91 dBFS,
each tone at –36 dBFS
Figure 75. FFT FOR Two-Tone Input Signal
Figure 76. FFT FOR Two-Tone Input Signal
(–36 dBFS at 185 MHz and 190 MHz)
(–7 dBFS at 185 MHz and 190 MHz)
-85
-80
-85
-90
-95
-90
-95
-100
-105
-110
-100
-105
-110
-35
-31
-27
-23
-19
-15
-11
-7
-35
-31
-27
-23
-19
-15
-11
-7
Each Tone Amplitude (dBFS)
Each Tone Amplitude (dBFS)
D315
D316
Figure 77. Intermodulation Distortion vs Input Amplitude
(46 MHz and 50 MHz)
Figure 78. Intermodulation Distortion vs Input Amplitude
(185 MHz and 190 MHz)
74.5
100
Dither_EN
Dither_EN
Dither_DIS
Dither_DIS
73.5
95
72.5
71.5
70.5
69.5
68.5
90
85
80
75
70
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
Frequency (MHz)
Frequency (MHz)
D317
D318
Figure 79. Signal-to-Noise Ratio vs Input Frequency
Figure 80. Spurious-Free Dynamic Range vs
Input Frequency
Copyright © 2014–2016, Texas Instruments Incorporated
33
ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3243 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
74.5
180
160
140
120
100
80
74.5
180
160
140
120
100
80
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
74
74
73.5
73
73.5
73
72.5
72
72.5
72
71.5
71
60
71.5
71
60
40
40
70.5
20
70.5
20
-70
-60
-50
-40
-30
-20
-10
0
-70
-60
-50
-40
-30
-20
-10
0
Amplitude (dBFS)
Amplitude (dBFS)
D319
D320
Figure 81. Performance vs Input Amplitude (30 MHz)
Figure 82. Performance vs Input Amplitude (170 MHz)
78
92
90
88
86
84
82
78
92
90
88
86
84
82
SNR
SFDR
SNR
SFDR
76
74
72
70
68
76
74
72
70
68
0.85
0.9
0.95
1
1.05
1.1
0.85
0.9
0.95
1
1.05
1.1
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
D321
D322
Figure 83. Performance vs Input Common-Mode Voltage
(30 MHz)
Figure 84. Performance vs Input Common-Mode Voltage
(170 MHz)
95
74
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
73.5
73
93
91
89
87
85
72.5
72
71.5
71
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D323
D324
Figure 85. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature (170 MHz)
Figure 86. Signal-to-Noise Ratio vs
AVDD Supply and Temperature (170 MHz)
34
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
Typical Characteristics: ADC3243 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
95
93
91
89
87
85
74
73.5
73
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
72.5
72
71.5
71
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D325
D326
Figure 87. Spurious-Free Dynamic Range vs
DVDD Supply and Temperature (170 MHz)
Figure 88. Signal-to-Noise Ratio vs
DVDD Supply and Temperature (170 MHz)
74.5
104
80
94
SNR
SNR
SFDR
SFDR
78
76
74
72
70
68
66
64
92
74
73.5
73
102
100
98
90
88
86
84
82
80
78
72.5
72
96
94
71.5
92
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
Differential Clock Amplitude (Vpp)
Differential Clock Amplitude (Vpp)
D327
D328
Figure 89. Performance vs Clock Amplitude (40 MHz)
Figure 90. Performance vs Clock Amplitude (150 MHz)
74.2
90
89
88
87
86
85
72.8
92
90
88
86
84
82
SNR
SFDR
SNR
SFDR
73.8
73.4
73
72.6
72.4
72.2
72
72.6
72.2
71.8
30
35
40
45
50
55
60
65
70
30
35
40
45
50
55
60
65
70
Input Clock Duty Cycle (%)
Input Clock Duty Cycle (%)
D329
D330
Figure 91. Performance vs Clock Duty cycle (30 MHz)
Figure 92. Performance vs Clock Duty Cycle (150 MHz)
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3243 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
24
22
20
18
16
14
12
10
8
6
4
2
0
D331
Output Code (LSB)
RMS Noise = 1.28 LSBs
Figure 93. Idle Channel Histogram
36
Copyright © 2014–2016, Texas Instruments Incorporated
ADC3241, ADC3242, ADC3243, ADC3244
www.ti.com.cn
ZHCSD67C –JULY 2014–REVISED MARCH 2016
7.18 Typical Characteristics: ADC3244
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D101
D102
SFDR = 102.6 dBc, SNR = 72.9 dBFS, SINAD = 72.8 dBFS,
THD = 99.8 dBc, HD2 = –108.6 dBc, HD3 = –104.0 dBc
SFDR = 91.8 dBc, SNR = 73.5 dBFS, SINAD = 73.4 dBFS,
THD = 87.3 dBc, HD2 = –93.8 dBc, HD3 = –91.8 dBc
Figure 94. FFT for 10-MHz Input Signal
(Chopper On, Dither On)
Figure 95. FFT for 10-MHz Input Signal
(Chopper On, Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D103
D104
SFDR = 95.9 dBc, SNR = 72.7 dBFS, SINAD = 72.7 dBFS,
THD = 93.6 dBc, HD2 = –100.6 dBc, HD3 = –95.9 dBc
SFDR = 90.9 dBc, SNR = 73.3 dBFS, SINAD = 73.1 dBFS,
THD = 87 dBc, HD2 = –90.9 dBc, HD3 = –94.9 dBc
Figure 96. FFT for 70-MHz Input Signal (Dither On)
Figure 97. FFT for 70-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D105
D106
SFDR = 96.4 dBc, SNR = 72.1 dBFS, SINAD = 72.0 dBFS,
THD = 92.6 dBc, HD2 = –96.4 dBc, HD3 = –98.8 dBc
SFDR = 89.9 dBc, SNR = 72.8 dBFS, SINAD = 72.6 dBFS,
THD = 87.1 dBc, HD2 = –97.2 dBc, HD3 = –89.9 dBc
Figure 98. FFT for 170-MHz Input Signal (Dither On)
Figure 99. FFT for 170-MHz Input Signal (Dither Off)
Copyright © 2014–2016, Texas Instruments Incorporated
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ADC3241, ADC3242, ADC3243, ADC3244
ZHCSD67C –JULY 2014–REVISED MARCH 2016
www.ti.com.cn
Typical Characteristics: ADC3244 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D107
D108
SFDR = 76.1 dBc, SNR = 70.8 dBFS, SINAD = 69.8 dBFS,
THD = 74.8 dBc, HD2 = –76.1 dBc, HD3 = –80.9 dBc
SFDR = 76.1 dBc, SNR = 71.2 dBFS, SINAD = 70.2 dBFS,
THD = 74.9 dBc, HD2 = –76.1 dBc, HD3 = –81.6 dBc
Figure 100. FFT for 270-MHz Input Signal (Dither On)
Figure 101. FFT for 270-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D109
D110
SFDR = 76.2 dBc, SNR = 68.3 dBFS, SINAD = 67.5 dBFS,
THD = 74.3 dBc, HD2 = –76.2 dBc, HD3 = –79.2 dBc
SFDR = 75.3 dBc, SNR = 69.1 dBFS, SINAD = 67.8 dBFS,
THD = 72.7 dBc, HD2 = –76.7 dBc, HD3 = –75.3 dBc
Figure 102. FFT for 450-MHz Input Signal (Dither On)
Figure 103. FFT for 450-MHz Input Signal (Dither Off)
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D111
D112
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 88.3 dBFS,
each tone at –7 dBFS
fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 90.8 dBFS,
each tone at –36 dBFS
Figure 104. FFT for Two-Tone Input Signal
(–7 dBFS at 46 MHz and 50 MHz)
Figure 105. FFT for Two-Tone Input Signal
(–36 dBFS at 46 MHz and 50 MHz)
38
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Typical Characteristics: ADC3244 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D113
D114
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 86.4 dBFS,
each tone at –7 dBFS
fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 87.28 dBFS,
each tone at –36 dBFS
Figure 106. FFT for Two-Tone Input Signal
Figure 107. FFT for Two-Tone Input Signal
(–7 dBFS at 185 MHz and 190 MHz)
(–36 dBFS at 185 MHz and 190 MHz)
-85
-80
-85
-90
-90
-95
-95
-100
-105
-110
-100
-105
-110
-35
-31
-27
-23
-19
-15
-11
-7
-35
-31
-27
-23
-19
-15
-11
-7
Each Tone Amplitude (dBFS)
Each Tone Amplitude (dBFS)
D115
D116
Figure 108. Intermodulation Distortion vs Input Amplitude
(46 MHz and 50 MHz)
Figure 109. Intermodulation Distortion vs Input Amplitude
(185 MHz and 190 MHz)
74
100
Dither_EN
Dither_EN
Dither_DIS
Dither_DIS
73
95
72
71
70
69
68
90
85
80
75
70
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
Frequency (MHz)
Frequency (MHz)
D117
D118
Figure 110. Signal-to-Noise Ratio vs Input Frequency
Figure 111. Spurious-Free Dynamic Range vs
Input Frequency
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Typical Characteristics: ADC3244 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
74.5
180
160
140
120
100
80
74
73.5
73
180
160
140
120
100
80
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS)
74
73.5
73
72.5
72
72.5
72
71.5
71
71.5
71
60
60
40
70.5
70
40
70.5
20
20
-70
-60
-50
-40
-30
-20
-10
0
-70
-60
-50
-40
-30
-20
-10
0
Amplitude (dBFS)
Amplitude (dBFS)
D119
D120
Figure 112. Performance vs Input Amplitude (30 MHz)
Figure 113. Performance vs Input Amplitude (170 MHz)
78
96
94
92
90
88
86
78
76
74
72
70
68
92
90
88
86
84
82
SNR
SFDR
SNR
SFDR
76
74
72
70
68
0.85
0.9
0.95
1
1.05
1.1
0.85
0.9
0.95
1
1.05
1.1
Input Common-Mode Voltage (V)
Input Common-Mode Voltage (V)
D121
Figure 115. Performance vs Input Common-Mode Voltage
(170 MHz)
Figure 114. Performance vs Input Common-Mode Voltage
(30 MHz)
92
73
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
72.5
72
90
88
86
84
82
71.5
71
70.5
70
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D123
D124
Figure 116. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature (170 MHz)
Figure 117. Signal-to-Noise Ratio vs
AVDD Supply and Temperature (170 MHz)
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Typical Characteristics: ADC3244 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
92
90
88
86
84
82
73
72.6
72.2
71.8
71.4
71
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
DVDD = 1.7 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
D125
D126
Figure 118. Spurious-Free Dynamic Range vs
DVDD Supply and Temperature (170 MHz)
Figure 119. Signal-to-Noise Ratio vs
DVDD Supply and Temperature (170 MHz)
74.5
94
77
95
SNR
SNR
SFDR
SFDR
74
73.5
73
93
92
91
90
89
75
73
71
69
67
65
90
85
80
75
70
72.5
72
71.5
88
65
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
Differential Clock Amplitude (Vpp)
Differential Clock Amplitude (Vpp)
D127
D128
Figure 120. Performance vs Clock Amplitude (40 MHz)
Figure 121. Performance vs Clock Amplitude (150 MHz)
74.2
95
94
93
92
91
90
72.4
90
SNR
SFDR
SNR
SFDR
73.8
73.4
73
72.2
72
87.5
85
71.8
71.6
71.4
82.5
80
72.6
72.2
77.5
30
35
40
45
50
55
60
65
70
30
35
40
45
50
55
60
65
70
Input Clock Duty Cycle (%)
Input Clock Duty Cycle (%)
D129
D130
Figure 122. Performance vs Clock Duty Cycle (30 MHz)
Figure 123. Performance vs Clock Duty Cycle (150 MHz)
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Typical Characteristics: ADC3244 (continued)
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
20
16
12
8
4
0
D131
Output Code (LSB)
RMS Noise = 1.4 LSBs
Figure 124. Idle Channel Histogram
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7.19 Typical Characteristics: Common
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when chopper is enabled, unless otherwise noted.
0
-10
0
-5
-20
-10
-15
-20
-25
-30
-35
-40
-45
-50
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
12ꢀ5
25
37ꢀ5
50
62ꢀ5
0
50
100
150
200
250
300
Crequency (aIz)
Frequency of Signal on Supply (MHz)
D001
D0012
fIN = 30 MHz, AIN = –1 dBFS,
test signal amplitude = 50 mVPP
fIN = 30.1 MHz, fPSRR = 3 MHz, APSRR = 50 mVPP
SNR = 58.51 dBFS, SINAD = 58.51 dBFS, SFDR = 60.53 dBc,
THD = –90.71 dBc, SFDR = 60.53 dBc (non 23)
,
Figure 126. Power-Supply Rejection Ratio Spectrum
Figure 125. Power-Supply Rejection Ratio vs
Test Signal Frequency
0
-10
0
-5
-20
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
12ꢀ5
25
37ꢀ5
50
62ꢀ5
0
50
100
150
200
250
300
Crequency (aIz)
Frequency of Input Common-Mode Signal (MHz)
D003
D004
fIN = 30 MHz, AIN = –1 dBFS,
test signal amplitude = 50 mVPP
fIN = 170.1 MHz, fCMRR = 5 MHz, ACMRR = 50 mVPP
SNR = 69.72 dBFS, SINAD = 69.66 dBFS, SFDR = 75.66 dBc,
THD = –86.98 dBc, SFDR = 75.66 dBc (non 23)
,
Figure 128. Common-Mode Rejection Ratio Spectrum
Figure 127. Common-Mode Rejection Ratio vs
Test Signal Frequency
240
Analog Power
Digital Power
Total Power
200
160
120
80
40
5
15 25 35 45 55 65 75 85 95 105 115 125
Sampling Speed (MSPS)
Figure 129. Power vs Sampling Frequency
(One-Wire Mode)
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7.20 Typical Characteristics: Contour
Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1-
dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc
when chopper is disabled and from fS / 2 when is chopper enabled, unless otherwise noted.
80
85
120
110
100
90
90
80
90
75
90
85
80
75
80
70
70
60
90
50
85
40
70
75
90
80
30
50
100
150
200
250
300
350
400
450
90
Input Frequency, MHz
70
75
80
85
Figure 130. Spurious-Free Dynamic Range (SFDR)
120
110
100
90
72.5
73
72
71.5
71
70.5
69.5
69
70
80
72.5
73
71.5
70
72
71
70.5
69.5
69
70
60
50
40
68.5
72.5
70.5
71.5
70
71
73
72
69.5
69
30
68
67.5
50
100
150
200
250
300
350
400
450
73
Input Frequency, MHz
70
67
68
69
71
72
Figure 131. Signal-to-Noise Ratio (SNR)
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8 Parameter Measurement Information
8.1 Timing Diagrams
DAn_P
DBn_P
Logic 0
ODL = -410 mV(1)
Logic 1
VODH = +410 mV(1)
V
DAn_M
DBn_M
VOCM
GND
(1) With an external 100-Ω termination.
Figure 132. Serial LVDS Output Voltage Levels
CLKIN
FCLK
DCLK
1-Wire (14x Serialization)
Dx0P
Dx0M
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
D
D
D
0
D
13
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
D
D
D
0
10 11 12 13
10 11 12 13
CLKIN
FCLK
DCLK
Dx0P
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
0
2-Wire (7x Serialization)
Dx0M
Dx1P
Dx1M
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
7
SAMPLE N-1
SAMPLE N
SAMPLE N+1
Figure 133. Output Timing Diagram
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Timing Diagrams (continued)
DCLK
t HO
Dx0P
Dx0M
t SU
Figure 134. Setup and Hold Time
N+10
N+1
N+9
Sample N
TA
Input Signal
on INxP, INxM pins
Data Latency(1) = 9 Input Clock Cycles
Sample N
CLKINP,
CLKINM
tPDI
FCLKP,
FCLKM
DCLKP,
DCLKM
DCLK edges are centered within the data valid
window.
DA0P, DA0M,
DB0P, DB0M
5
6
0
7
1
8
2
9
3
4
5
6
0
7
1
8
2
9
3
4
12 13
10 11 12 13
Sample N
10 11
DA1P, DA1M,
DB1P, DB1M
Sample N+1
th
tsu
(1) Overall latency = data latency + tPDI
.
Figure 135. Latency Diagram
46
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9 Detailed Description
9.1 Overview
The ADC324x are a high-linearity, ultra-low power, quad-channel, 14-bit, 25-MSPS to 125-MSPS, analog-to-
digital converter (ADC) family. The devices are designed specifically to support demanding, high input frequency
signals with large dynamic range requirements. An input clock divider allows more flexibility for system clock
architecture design while the SYSREF input enables complete system synchronization. The ADC324x family
supports serial LVDS interface in order to reduce the number of interface lines, thus allowing for high system
integration density. The serial LVDS interface is two-wire, where each ADC data are serialized and output over
two LVDS pairs. An internal phase-locked loop (PLL) multiplies the incoming ADC sampling clock to derive the
bit clock that is used to serialize the 14-bit output data from each channel. In addition to the serial data streams,
the frame and bit clocks are also transmitted as LVDS outputs.
9.2 Functional Block Diagram
DA0P
DA0M
Digital Encoder
and Serializer
INAP
INAM
14-Bit
ADC
DA1P
DA1M
CLKP
CLKM
Divide by
1,2,4
DCLKP
DCLKM
Bit Clock
PLL
Frame Clock
FCLKP
FCLKM
SYSREFP
SYSREFM
DB0P
DB0M
INBP
INBM
14-Bit
ADC
Digital Encoder
and Serializer
DB1P
DB1M
Common
Mode
VCM
Configuration Registers
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9.3 Feature Description
9.3.1 Analog Inputs
The ADC324x analog signal inputs are designed to be driven differentially. Each input pin (INP, INM) must swing
symmetrically between (VCM + 0.5 V) and (VCM – 0.5 V), resulting in a 2-VPP (default) differential input swing.
The input sampling circuit has a 3-dB bandwidth that extends up to 540 MHz (50-Ω source driving 50-Ω
termination between INP and INM).
9.3.2 Clock Input
The device clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with
little or no difference in performance between them. The common-mode voltage of the clock inputs is set to
0.95 V using internal 5-kΩ resistors. The self-bias clock inputs of the ADC324x can be driven by the transformer-
coupled, sine-wave clock source or by the ac-coupled, LVPECL and LVDS clock sources, as shown in
Figure 136, Figure 137, and Figure 138. See Figure 139 for details regarding the internal clock buffer.
0.1 mF
0.1 mF
Zo
CLKP
CLKP
Differential
Sine-Wave
Clock Input
RT
Typical LVDS
Clock Input
100 W
0.1 mF
CLKM
Device
0.1 mF
Zo
CLKM
NOTE: RT = termination resistor, if necessary.
Device
Figure 136. Differential Sine-Wave Clock Driving
Circuit
Figure 137. LVDS Clock Driving Circuit
0.1 mF
Zo
CLKP
150 W
Typical LVPECL
Clock Input
100 W
0.1 mF
Zo
CLKM
Device
150 W
Figure 138. LVPECL Clock Driving Circuit
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Clock Buffer
LPKG
2 nH
20 W
CLKP
CBOND
1 pF
CEQ
CEQ
5 kW
RESR
100 W
1.4 V
LPKG
2 nH
5 kW
20 W
CLKM
CBOND
1 pF
RESR
100 W
NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer.
Figure 139. Internal Clock Buffer
A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1-μF
capacitor, as shown in Figure 140. However, for best performance the clock inputs must be driven differentially,
thereby reducing susceptibility to common-mode noise. For high input frequency sampling, TI recommends using
a clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter.
There is no change in performance with a non-50% duty cycle clock input.
0.1 mF
CMOS
Clock Input
CLKP
0.1 mF
CLKM
Device
Figure 140. Single-Ended Clock Driving Circuit
9.3.2.1 SNR and Clock Jitter
The signal-to-noise ratio of the ADC is limited by three different factors, as shown in Equation 1. Quantization
noise (typically 86 dB for a 14-bit ADC) and thermal noise limit SNR at low input frequencies while the clock jitter
sets SNR for higher input frequencies.
2
2
2
SNRQuantizatoin
SNR
SNR
Jitter
Noise
≈
’
÷
Thermal Noise
≈
’
÷
≈
’
÷
-
-
-
∆
20
20
20
∆
∆
SNRADC[dBc] = -20∂log 10
+ 10
+ 10
∆
«
÷
◊
∆
«
÷
∆
«
÷
◊
◊
(1)
(2)
The SNR limitation resulting from sample clock jitter can be calculated with Equation 2.
SNRJitter[dBc] = -20∂log(2p ∂ fin ∂TJitter )
The total clock jitter (TJitter) has two components: the internal aperture jitter (130 fs for the device) which is set by
the noise of the clock input buffer and the external clock. TJitter can be calculated with Equation 3.
2
TJitter = (TJitter,Ext.Clock _ Input )2 +(TAperture_ ADC
)
(3)
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External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band pass
filters at the clock input while a faster clock slew rate improves the ADC aperture jitter. The ADC324x has a
typical thermal noise of 73.5 dBFS and internal aperture jitter of 130 fs. Figure 141 shows SNR (from 1 MHz
offset leaving the 1/f flicker noise) for different jitter of clock driver.
73.0
Ext Clock Jitter
72.5
35 fs
72.0
71.5
71.0
70.5
70.0
69.5
69.0
68.5
68.0
67.5
67.0
50 fs
100 fs
150 fs
200 fs
10
100
1000
Input Frequency (MHz)
D03061
Figure 141. SNR vs Frequency for Different Clock Jitter
9.3.3 Digital Output Interface
The devices offer two different output format options, thus making interfacing to a field-programmable gate array
(FPGA) or an application-specific integrated circuit (ASIC) easy. Each option can be easily programmed using
the serial interface, as shown in Table 3. The output interface options are:
•
•
One-wire, 1x frame clock, 14x serialization with the DDR bit clock and
Two-wire, 0.5x frame clock, 7x serialization with the DDR bit clock.
Table 3. Interface Rates
RECOMMENDED SAMPLING
FREQUENCY (MSPS)
BIT CLOCK
FREQUENCY
(MHz)
FRAME CLOCK
FREQUENCY
(MHz)
INTERFACE
OPTIONS
SERIAL DATA
RATE (Mbps)
SERIALIZATION
MINIMUM
15(1)
—
MAXIMUM
—
80
105
560
15
80
210
1120
140
1-wire
14x
7x
20(1)
—
70
10
2-wire (default
after reset)
—
125
437.5
62.5
875
(1) Use the LOW SPEED ENABLE register bits for low speed operation; see Table 22.
9.3.3.1 One-Wire Interface: 14x Serialization
In this interface option, the device outputs the data of each ADC serially on a single LVDS pair (one-wire). The
data are available at the rising and falling edges of the bit clock (DDR bit clock). The ADC outputs a new word at
the rising edge of every frame clock, starting with the MSB. The data rate is 14x sample frequency (14x
serialization).
50
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9.3.3.2 Two-Wire Interface: 7x Serialization
The two-wire interface is recommended for sampling frequencies above 65 MSPS. The output data rate is 7x
sample frequency because seven data bits are output every clock cycle on each differential pair. Each ADC
sample is sent over the two wires with the seven MSBs on Dx1P, Dx1M and the seven LSBs on Dx0P, Dx0M, as
shown in Figure 142. Note that in two-wire mode, the frame clock (FCLK) frequency is half of sampling clock
(CLKIN) frequency.
CLKIN
FCLK
DCLK
1-Wire (14x Serialization)
Dx0P
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
D
D
D
0
D
13
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
D
D
D
0
10 11 12 13
10 11 12 13
Dx0M
CLKIN
FCLK
DCLK
Dx0P
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
0
2-Wire (7x Serialization)
Dx0M
Dx1P
Dx1M
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
7
SAMPLE N-1
SAMPLE N
SAMPLE N+1
Figure 142. Output Timing Diagram
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9.4 Device Functional Modes
9.4.1 Input Clock Divider
The devices are equipped with an internal divider on the clock input. The clock divider allows operation with a
faster input clock, thus simplifying the system clock distribution design. The clock divider can be bypassed for
operation with a 125-MHz clock while the divide-by-2 option supports a maximum input clock of 250 MHz and the
divide-by-4 option provides a maximum input clock frequency of 500 MHz.
9.4.2 Chopper Functionality
The devices are equipped with an internal chopper front-end. Enabling the chopper function swaps the ADC
noise spectrum by shifting the 1/f noise from dc to fS / 2. Figure 143 shows the noise spectrum with the chopper
off and Figure 144 shows the noise spectrum with the chopper on. This function is especially useful in
applications requiring good ac performance at low input frequencies or in dc-coupled applications. The chopper
can be enabled via SPI register writes and is recommended for input frequencies below 30 MHz. The chopper
function creates a spur at fS / 2 that must be filtered out digitally.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D052
D051
fIN = 10 MHz, fS = 125 MHz
fIN = 10 MHz, fS = 125 MHz
Figure 143. Chopper Off
Figure 144. Chopper On
9.4.3 Power-Down Control
The power-down functions of the ADC324x can be controlled either through the parallel control pin (PDN) or
through an SPI register setting (see register 15h). The PDN pin can also be configured via SPI to a global power-
down or standby functionality, as shown in Table 4.
Table 4. Power-Down Modes
FUNCTION
Global power-down
Standby
POWER CONSUMPTION (mW)
WAKE-UP TIME (µs)
5
85
35
81
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9.4.3.1 Improving Wake-Up Time From Global Power-Down
The device has an internal low-pass filter in the sampling clock path. This low-pass filter helps improve the
aperture jitter of the device. However, in applications where input frequencies are < 200 MHz, noise from the
aperture jitter does not dominate the overall SNR of the device. In such applications, the wake-up time from a
global power-down can be reduced by bypassing the low-pass filter using the DIS CLK FILT register bit (write
80h to register address 70Ah). As shown in Table 5, setting the DIS CLK FILT bit improves the wake-up time
from a global power-down from 85 µs to 55 µs.
Table 5. Wake-Up Time From Global Power-Down
WAKE-UP TIME
DIS CLK FILT
REGISTER BIT
GLOBAL PDN
REGISTER BIT
TYP
85
MAX
140
81
UNIT
µs
0
1
0→1→0
0→1→0
55
µs
9.4.4 Internal Dither Algorithm
The ADC324x use an internal dither algorithm to achieve high SFDR and a clean spectrum. However, the dither
algorithm marginally degrades SNR, creating a trade-off between SNR and SFDR. If desired, the dither algorithm
can be turned off by using the DIS DITH CHx registers bits. Figure 145 and Figure 146 show the effect of using
dither algorithms.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
0
12.5
25
37.5
50
62.5
0
12.5
25
37.5
50
62.5
Frequency (MHz)
Frequency (MHz)
D103
D104
SFDR = 95.9 dBc, SNR = 72.7 dBFS, SINAD = 72.7 dBFS,
THD = 93.6 dBc, HD2 = –100.6 dBc, HD3 = –95.9 dBc
SFDR = 90.9 dBc, SNR = 73.3 dBFS, SINAD = 73.1 dBFS,
THD = 87 dBc, HD2 = –90.9 dBc, HD3 = –94.9 dBc
Figure 145. FFT with Dither On
Figure 146. FFT with Dither Off
9.5 Programming
The ADC324x can be configured using a serial programming interface, as described in this section.
9.5.1 Serial Interface
The device has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial
interface enable), SCLK (serial interface clock), SDATA (serial interface data), and SDOUT (serial interface data
output) pins. Serially shifting bits into the device is enabled when SEN is low. Serial data SDATA are latched at
every SCLK rising edge when SEN is active (low). The serial data are loaded into the register at every 24th
SCLK rising edge when SEN is low. When the word length exceeds a multiple of 24 bits, the excess bits are
ignored. Data can be loaded in multiples of 24-bit words within a single active SEN pulse. The interface can
function with SCLK frequencies from 20 MHz down to very low speeds (of a few hertz) and also with a non-50%
SCLK duty cycle.
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Programming (continued)
9.5.1.1 Register Initialization
After power-up, the internal registers must be initialized to their default values through a hardware reset by
applying a high pulse on the RESET pin (of durations greater than 10 ns), as shown in Figure 147. If required,
the serial interface registers can be cleared during operation either:
1. Through a hardware reset, or
2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h)
high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low.
In this case, the RESET pin is kept low.
9.5.1.1.1 Serial Register Write
The device internal register can be programmed with these steps:
1. Drive the SEN pin low,
2. Set the R/W bit to 0 (bit A15 of the 16-bit address),
3. Set bit A14 in the address field to 1,
4. Initiate a serial interface cycle by specifying the address of the register (A13 to A0) whose content must be
written, and
5. Write the 8-bit data that are latched in on the SCLK rising edge.
Figure 147 and Table 6 show the timing requirements for the serial register write operation.
Register Address [13:0]
A13 A12 A11 A1
Register Data [7:0]
SDATA
R/W
= 0
1
A0
D7
D6
D5
D4
D3
D2
D1
tDH
D0
tSCLK
tDSU
SCLK
SEN
tSLOADS
tSLOADH
RESET
Figure 147. Serial Register Write Timing Diagram
Table 6. Serial Interface Timing(1)
MIN
> dc
25
TYP
MAX
UNIT
MHz
ns
fSCLK
tSLOADS
tSLOADH
tDSU
SCLK frequency (equal to 1 / tSCLK
SEN to SCLK setup time
SCLK to SEN hold time
SDIO setup time
)
20
25
ns
25
ns
tDH
SDIO hold time
25
ns
(1) Typical values are at 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, and AVDD = DVDD = 1.8 V, unless otherwise
noted.
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9.5.1.1.2 Serial Register Readout
The device includes a mode where the contents of the internal registers can be read back using the SDOUT pin.
This readback mode can be useful as a diagnostic check to verify the serial interface communication between
the external controller and the ADC. Given below is the procedure to read contents of serial registers:
1. Drive the SEN pin low.
2. Set the R/W bit (A15) to 1. This setting disables any further writes to the registers.
3. Set bit A14 in the address field to 1.
4. Initiate a serial interface cycle specifying the address of the register (A13 to A0) whose content must be read.
5. The device outputs the contents (D7 to D0) of the selected register on the SDOUT pin.
6. The external controller can latch the contents at the SCLK rising edge.
7. To enable register writes, reset the R/W register bit to 0.
When READOUT is disabled, the SDOUT pin is in a high-impedance mode. If serial readout is not used, the
SDOUT pin must float. Figure 148 shows a timing diagram of the serial register read operation. Data appear on
the SDOUT pin at the SCLK falling edge with an approximate delay (tSD_DELAY) of 20 ns, as shown in Figure 149.
Register Address [13:0]
A13 A12 A11 A1
Register Data: Don‘t Care
D5 D4 D3 D2
SDATA
R/W
= 1
A0
D7
D7
D6
D6
D1
D1
D0
D0
1
Register Read Data [7:0]
SDOUT
SCLK
D5
D4
D3
D2
SEN
Figure 148. Serial Register Read Timing Diagram
SCLK
tSD_DELAY
SDOUT
Figure 149. SDOUT Timing Diagram
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9.5.2 Register Initialization
After power-up, the internal registers must be initialized to their default values through a hardware reset by
applying a high pulse on the RESET pin, as shown in Figure 150 and Table 7.
Power
Supplies
t1
RESET
t2
t3
SEN
Figure 150. Initialization of Serial Registers after Power-Up
Table 7. Power-Up Timing
MIN
1
TYP
MAX
UNIT
ms
ns
t1
t2
t3
Power-on delay: delay from power up to active high RESET pulse
Reset pulse duration: active high RESET pulse duration
Register write delay: delay from RESET disable to SEN active
10
1000
100
ns
If required, the serial interface registers can be cleared during operation either:
1. Through hardware reset, or
2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h)
high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low.
In this case, the RESET pin is kept low.
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9.6 Register Maps
Table 8. Register Map Summary
REGISTER
ADDRESS
REGISTER DATA
A[13:0] (Hex)
D7
0
D6
0
D5
D4
D3
D2
D1
0
D0
0
01
03
04
05
DIS DITH CHA
DIS DITH CHB
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
ODD EVEN
FLIP WIRE
1W-2W
0
0
0
0
0
0
TEST PATTERN
EN
06
07
09
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RESET
0
OVR ON LSB
DATA FORMAT
ALIGN TEST
PATTERN
0A
0B
0
0
0
CHA TEST PATTERN
CHB TEST PATTERN
0
0
0
0
0E
CUSTOM PATTERN[13:6]
CUSTOM PATTERN[5:0]
0F
0
0
13
0
0
0
0
0
0
0
0
LOW SPEED ENABLE
15
CHA PDN
CHB PDN
STANDBY
GLOBAL PDN
0
CONFIG PDN PIN
25
LVDS SWING
27
CLK DIV
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
41D
422
434
439
51D
522
534
539
608
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
HIGH IF MODE0
0
0
0
DIS CHOP CHA
0
DIS DITH CHA
DIS DITH CHA
0
0
0
SP1 CHA
0
0
0
0
HIGH IF MODE1
0
0
0
DIS CHOP CHB
0
DIS DITH CHB
DIS DITH CHB
0
0
0
0
0
0
0
0
SP1 CHB
0
HIGH IF MODE[3:2]
DIS CLK FILT
0
0
0
70A
0
PDN SYSREF
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9.6.1 Summary of Special Mode Registers
Table 9 lists the location, value, and functions of special mode registers in the device.
Table 9. Special Modes Summary
MODE
REGISTER SETTINGS
DESCRIPTION
Special modes
Registers 439h (bit 3) and 539h (bit 3)
Always set these bits high for best performance
Registers 1h (bits 5-2), 434h (bits 5 and 3), and
534h (bits 5 and 3)
Disable dither
Disable chopper
High IF modes
Disable dither to improve SNR
Registers 422h (bit 1) and 522h (bit 1)
Disable chopper to shift 1/f noise floor at dc
Improves HD3 for IF > 100 MHz
Registers 41Dh (bit 1), 51Dh (bit 1), and
608h (bits 7-6)
9.6.2 Serial Register Description
9.6.2.1 Register 01h
Figure 151. Register 01h
7
0
6
0
5
4
3
2
1
0
0
0
DIS DITH CHA
R/W-0h
DIS DITH CHB
R/W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 10. Register 01h Description
Bit
Field
Type
Reset
Description
7-6
0
W
0h
Must write 0
These bits enable or disable the on-chip dither. Control this bit
with bits 5 and 3 of register 434h.
5-4
DIS DITH CHA
R/W
0h
00 = Default
11 = Dither is disabled for channel A. In this mode, SNR typically
improves by 0.5 dB at 70 MHz.
These bits enable or disable the on-chip dither. Control this bit
with bits 5 and 3 of register 434h.
3-2
1-0
DIS DITH CHB
0
R/W
W
0h
0h
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.5 dB at 70 MHz.
Must write 0
9.6.2.2 Register 03h
Figure 152. Register 03h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
ODD EVEN
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 11. Register 03h Description
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
This bit selects the bit sequence on the output lanes
(in 2-wire mode only).
0 = Bits 0, 1, and 2 appear on lane 0; bits 7, 8, and 9 appear on lane 1
1 = Bits 0, 2, and 4 appear on lane 0; bits 1, 3, and 5 appear on lane 1
0
ODD EVEN
R/W
0h
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9.6.2.3 Register 04h
Figure 153. Register 04h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
FLIP WIRE
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 12. Register 04h Description
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
This bit flips the data on the output wires. Valid only in two wire
configuration.
0
FLIP WIRE
R/W
0h
0 = Default
1 = Data on output wires is flipped. Pin D0x becomes D1x, and
vice versa.
9.6.2.4 Register 05h
Figure 154. Register 05h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1W-2W
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 13. Register 05h Description
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
This bit transmits output data on either one or two wires.
0 = Output data are transmitted on two wires (Dx0P, Dx0M and
Dx1P, Dx1M)
0
1W-2W
R/W
0h
1 = Output data are transmitted on one wire (Dx0P, Dx0M). In this
mode, the recommended fS is less than 62.5 MSPS.
9.6.2.5 Register 06h
Figure 155. Register 06h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
TEST PATTERN EN
R/W-0h
RESET
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 14. Register 06h Description
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
This bit enables test pattern selection for the digital outputs.
0 = Normal output
1 = Test pattern output enabled
1
0
TEST PATTERN EN
RESET
R/W
W
0h
0h
This bit applies a software reset.
This bit resets all internal registers to the default values and self-
clears to 0.
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9.6.2.6 Register 07h
Figure 156. Register 07h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
OVR ON LSB
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 15. Register 07h Description
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
This bit provides the overrange (OVR) information on the LSB bits.
0 = Output data bit 0 functions as the LSB of the 14-bit data
1 = Output data bit 0 carries the OVR information.
0
OVR ON LSB
R/W
0h
9.6.2.7 Register 09h
Figure 157. Register 09h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
ALIGN TEST
PATTERN
DATA FORMAT
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 16. Register 09h Description
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
This bit aligns the test patterns across the outputs of both channels.
0 = Test patterns of both channels are free running
1 = Test patterns of both channels are aligned
1
0
ALIGN TEST PATTERN
DATA FORMAT
R/W
R/W
0h
0h
This bit programs the digital output data format.
0 = Twos complement
1 = Offset binary
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9.6.2.8 Register 0Ah
Figure 158. Register 0Ah
7
0
6
0
5
0
4
0
3
2
1
0
CHA TEST PATTERN
R/W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 17. Register 0Ah Description
Bit
Field
Type
Reset
Description
7-4
0
W
0h
Must write 0
These bits control the test pattern for channel A after the TEST
PATTERN EN bit is set.
0000 = Normal operation
0001 = All 0's
0010 = All 1's
0011 = Toggle pattern: data alternate between 10101010101010 and
01010101010101
0100 = Digital ramp: data increment by 1 LSB every clock cycle from
code 0 to 16383
3-0
CHA TEST PATTERN
R/W
0h
0101 = Custom pattern: output data are the same as programmed by
the CUSTOM PATTERN register bits
0110 = Deskew pattern: data are 2AAAh
1000 = PRBS pattern: data are a sequence of pseudo random
numbers
1001 = 8-point sine-wave: data are a repetitive sequence of the
following eight numbers that form a sine-wave: 0, 2399, 8192, 13984,
16383, 13984, 8192, 2399.
Others = Do not use
9.6.2.9 Register 0Bh
Figure 159. Register 0Bh
7
6
5
4
3
0
2
0
1
0
0
0
CHB TEST PATTERN
R/W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 18. Register 0Bh Description
Bit
7-4
3-0
Field
Type
R/W
W
Reset
Description
These bits control the test pattern for channel B after the TEST
PATTERN EN bit is set.
0000 = Normal operation
0001 = All 0's
0010 = All 1's
0011 = Toggle pattern: data alternate between 10101010101010 and
01010101010101
0100 = Digital ramp: data increment by 1 LSB every clock cycle from
code 0 to 16383
0101 = Custom pattern: output data are the same as programmed by
the CUSTOM PATTERN register bits
0110 = Deskew pattern: data are 2AAAh
1000 = PRBS pattern: data are a sequence of pseudo random
numbers
1001 = 8-point sine-wave: data are a repetitive sequence of the
following eight numbers that form a sine-wave: 0, 2399, 8192, 13984,
16383, 13984, 8192, 2399.
CHB TEST PATTERN
0h
Others = Do not use
0
0h
Must write 0
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9.6.2.10 Register 0Eh
Figure 160. Register 0Eh
7
6
5
4
3
2
1
0
CUSTOM PATTERN[13:6]
R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 19. Register 0Eh Description
Bit
Field
Type
Reset
Description
These bits set the 14-bit custom pattern (bits 13-6) for all channels.
7-0
CUSTOM PATTERN[13:6]
R/W
0h
9.6.2.11 Register 0Fh
Figure 161. Register 0Fh
7
6
5
4
3
2
1
0
0
0
CUSTOM PATTERN[5:0]
R/W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 20. Register 0Fh Description
Bit
7-2
1-0
Field
Type
R/W
W
Reset
0h
Description
CUSTOM PATTERN[5:0]
0
These bits set the 14-bit custom pattern (bits 5-0) for all channels.
Must write 0
0h
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9.6.2.12 Register 13h (address = 13h)
Figure 162. Register 13h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
LOW SPEED ENABLE
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
Table 21. Register 13h Field Descriptions
Bit
7-2
1-0
Field
Type
W
Reset
0h
Description
0
Must write 0.
LOW SPEED ENABLE
R/W
0h
Enables low speed operation in 1-wire and 2-wire mode.
Depending upon sampling frequency, write this bit as per
Table 22.
Table 22. LOW SPEED ENABLE Register Bit Settings Across fS
fS (MSPS)
REGISTER BIT LOW SPEED ENABLE
MIN
25
MAX
125
25
1-WIRE MODE
2-WIRE MODE
00
00
10
00
10
20
15
20
Not supported
9.6.2.13 Register 15h
Figure 163. Register 15h
7
0
6
5
4
0
3
2
1
0
0
CHA PDN
R/W-0h
CHB PDN
R/W-0h
STANDBY
R/W-0h
GLOBAL PDN
R/W-0h
CONFIG PDN PIN
R/W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 23. Register 15h Description
Bit
Field
Type
Reset
Description
7
0
W
0h
Must write 0
0 = Normal operation
1 = Power-down channel A
6
CHA PDN
R/W
0h
0 = Normal operation
1 = Power-down channel B
5
4
CHB PDN
0
R/W
W
0h
0h
Must write 0
The ADCs of both channels enter standby.
0 = Normal operation
3
STANDBY
R/W
0h
1 = Standby
0 = Normal operation
1 = Global power-down
2
1
GLOBAL PDN
0
R/W
W
0h
0h
Must write 0
This bit configures the PDN pin as either a global power-down or
standby pin.
0
CONFIG PDN PIN
R/W
0h
0 = Logic high voltage on the PDN pin sends the device into global
power-down
1 = Logic high voltage on the PDN pin sends the device into standby
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9.6.2.14 Register 25h
Figure 164. Register 25h
7
6
5
4
3
2
1
0
LVDS SWING
R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 24. Register 25h Description
Bit
Field
Type
Reset
Description
These bits control the swing of the LVDS outputs (including the
data output, bit clock, and frame clock). For details see
Table 25.
7-0
LVDS SWING
R/W
0h
Table 25. LVDS Output Swing
BITS 7-4
0h
BITS 3-0
0h
LVDS OUTPUT SWING
Default (±425 mV)
Dh
9h
Swing reduces by 50 mV
Swing reduces by 100 mV
Swing reduces by 300 mV
Swing increases by 100 mV
Do not use
Eh
Ah
Fh
Dh
Ch
Eh
Others
Others
9.6.2.15 Register 27h
Figure 165. Register 27h
7
6
5
0
4
0
3
0
2
0
1
0
0
0
CLK DIV
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 26. Register 27h Description
Bit
7-6
5-0
Field
CLK DIV
0
Type
R/W
W
Reset
Description
These bits set the internal clock divider for the input sampling clock.
00 = Divide-by-1
01 = Divide-by-1
10 = Divide-by-2
11 = Divide-by-4
0h
0h
Must write 0
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9.6.2.16 Register 41Dh
Figure 166. Register 41Dh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF MODE0
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 27. Register 41Dh Description
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
This bit improves HD3 for IF > 100 MHz.
0 = Normal operation
For best HD3 at IF > 100 MHz, set HIGH IF MODE[3:0] to 1111.
1
0
HIGH IF MODE0
0
R/W
W
0h
0h
Must write 0
9.6.2.17 Register 422h
Figure 167. Register 422h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
DIS CHOP CHA
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 28. Register 422h Description
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
Disable chopper.
Set this bit to shift a 1/f noise floor at dc.
1
DIS CHOP CHA
R/W
W
0h
0h
0 = 1/f noise floor is centered at fS / 2 (default)
1 = Chopper mechanism is disabled; 1/f noise floor is centered at
dc
0
0
Must write 0
9.6.2.18 Register 434h
Figure 168. Register 434h
7
0
6
0
5
4
0
3
2
0
1
0
0
0
DIS DITH CHA
R/W-0h
DIS DITH CHA
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 29. Register 434h Description
Bit
Field
Type
Reset
Description
7-6
0
W
0h
Must write 0
Set this bit with bits 5 and 4 of register 01h.
00 = Default
11 = Dither is disabled for channel A. In this mode, SNR typically
improves by 0.5 dB at 70 MHz.
5
4
DIS DITH CHA
R/W
W
0h
0h
0h
0h
0
Must write 0
Set this bit with bits 5 and 4 of register 01h.
00 = Default
11 = Dither is disabled for channel A. In this mode, SNR typically
improves by 0.5 dB at 70 MHz.
3
DIS DITH CHA
0
R/W
W
2-0
Must write 0
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9.6.2.19 Register 439h
Figure 169. Register 439h
7
0
6
0
5
0
4
0
3
2
0
1
0
0
0
SP1 CHA
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 30. Register 439h Description
Bit
Field
Type
Reset
Description
7-4
0
W
0h
Must write 0
Special mode for best performance on channel A.
Always write 1 after reset.
3
SP1 CHA
0
R/W
W
0h
0h
2-0
Must write 0
9.6.2.20 Register 51Dh
Figure 170. Register 51Dh
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
HIGH IF MODE1
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 31. Register 51Dh Description
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
This bit improves HD3 for IF > 100 MHz.
0 = Normal operation
For best HD3 at IF > 100 MHz, set HIGH IF MODE[3:0] to 1111.
1
0
HIGH IF MODE1
0
R/W
W
0h
0h
Must write 0
9.6.2.21 Register 522h
Figure 171. Register 522h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
DIS CHOP CHB
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 32. Register 522h Description
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
Disable chopper.
Set this bit to shift a 1/f noise floor at dc.
1
0
DIS CHOP CHB
0
R/W
W
0h
0h
0 = 1/f noise floor is centered at fS / 2 (default)
1 = Chopper mechanism is disabled; 1/f noise floor is centered
at dc
Must write 0
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9.6.2.22 Register 534h
Figure 172. Register 534h
7
0
6
0
5
4
0
3
2
0
1
0
0
0
DIS DITH CHA
R/W-0h
DIS DITH CHA
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 33. Register 534h Description
Bit
Field
Type
Reset
Description
7-6
0
W
0h
Must write 0
Set this bit with bits 3 and 2 of register 01h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.5 dB at 70 MHz.
5
4
DIS DITH CHA
R/W
W
0h
0h
0h
0h
0
Must write 0
Set this bit with bits 3 and 2 of register 01h.
00 = Default
11 = Dither is disabled for channel B. In this mode, SNR typically
improves by 0.5 dB at 70 MHz.
3
DIS DITH CHA
0
R/W
W
2-0
Must write 0
9.6.2.23 Register 539h
Figure 173. Register 539h
7
0
6
0
5
0
4
0
3
2
0
1
0
0
0
SP1 CHB
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 34. Register 539h Description
Bit
Field
Type
Reset
Description
7-4
0
W
0h
Must write 0
Special mode for best performance on channel B.
Always write 1 after reset.
3
0
SP1 CHB
0
R/W
W
0h
0h
Must write 0
9.6.2.24 Register 608h
Figure 174. Register 608h
7
6
5
0
4
0
3
0
2
0
1
0
0
0
HIGH IF MODE[3:2]
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 35. Register 608h Description
Bit
7-6
5-0
Field
Type
R/W
W
Reset
Description
This bit improves HD3 for IF > 100 MHz.
0 = Normal operation
For best HD3 at IF > 100 MHz, set HIGH IF MODE[3:0] to 1111.
HIGH IF MODE[3:2]
0
0h
0h
Must write 0
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9.6.2.25 Register 70Ah
Figure 175. Register 70Ah
7
6
0
5
0
4
0
3
0
2
0
1
0
0
DIS CLK FILT
R/W-0h
PDN SYSREF
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 36. Register 70Ah Description
Bit
7
Field
Type
R/W
W
Reset
Description
Set this bit to improve wake-up time from global power-down
mode; see the Improving Wake-Up Time From Global Power-
Down section for details.
DIS CLK FILT
0
0h
6-1
0h
Must write 0
If the SYSREF pins are not used in the system, the SYSREF
buffer must be powered down by setting this bit.
0 = Normal operation
0
PDN SYSREF
R/W
0h
1 = Powers down the SYSREF buffer
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10 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
Typical applications involving transformer coupled circuits are discussed in this section. Transformers (such as
ADT1-1WT or WBC1-1) can be used up to 250 MHz to achieve good phase and amplitude balances at ADC
inputs. While designing the dc driving circuits, the ADC input impedance must be considered. Figure 176 and
Figure 177 show the impedance (Zin = Rin || Cin) across the ADC input pins.
10
6
5
4
3
2
1
1
0.1
0.01
0
100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
0
100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
D024
D00215
Figure 176. Differential Input Resistance (RIN
)
Figure 177. Differential Input Capacitance (CIN)
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10.2 Typical Applications
10.2.1 Driving Circuit Design: Low Input Frequencies
39 nH
0.1 mF
INP
0.1 mF
50 Ω
50 Ω
25 Ω
25 Ω
0.1 mF
22 pF
50 Ω
50 Ω
INM
1:1
1:1
0.1 mF
39 nH
VCM
Device
Figure 178. Driving Circuit for Low Input Frequencies
10.2.1.1 Design Requirements
For optimum performance, the analog inputs must be driven differentially. An optional 5-Ω to 15-Ω resistor in
series with each input pin can be kept to damp out ringing caused by package parasitic. The drive circuit may
have to be designed to minimize the impact of kick-back noise generated by sampling switches opening and
closing inside the ADC, as well as ensuring low insertion loss over the desired frequency range and matched
impedance to the source.
10.2.1.2 Detailed Design Procedure
A typical application involving using two back-to-back coupled transformers is shown in Figure 178. The circuit is
optimized for low input frequencies. An external R-C-R filter using 50-Ω resistors and a 22-pF capacitor is used
with the series inductor (39 nH), this combination helps absorb the sampling glitches.
10.2.1.3 Application Curve
Figure 179 shows the performance obtained by using circuit shown in Figure 178.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
12.5
25
37.5
50
62.5
Frequency (MHz)
D101
SFDR = 102.6 dBc, SNR = 72.9 dBFS, SINAD = 72.8 dBFS,
THD = 99.8 dBc, HD2 = –108.6 dBc, HD3 = –104.0 dBc
Figure 179. Performance FFT at 10 MHz (Low Input Frequency)
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Typical Applications (continued)
10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz
0.1 mF
10 Ω
INP
0.1 mF
15 Ω
25 Ω
0.1 mF
56 nH
10 pF
25 Ω
15 Ω
INM
10 Ω
1:1
1:1
0.1 mF
VCM
Device
Figure 180. Driving Circuit for Mid-Range Input Frequencies (100 MHz < fIN < 230 MHz)
10.2.2.1 Design Requirements
See the Design Requirements section for further details.
10.2.2.2 Detailed Design Procedure
When input frequencies are between 100 MHz to 230 MHz, an R-LC-R circuit can be used to optimize
performance, as shown in Figure 180.
10.2.2.3 Application Curve
Figure 181 shows the performance obtained by using circuit shown in Figure 180.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
12.5
25
37.5
50
62.5
Frequency (MHz)
D105
SFDR = 96.4 dBc, SNR = 72.1 dBFS, SINAD = 72.0 dBFS,
THD = 92.6 dBc, HD2 = –96.4 dBc, HD3 = –98.8 dBc
Figure 181. Performance FFT at 170 MHz (Mid Input Frequency)
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Typical Applications (continued)
10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz
0.1 mF
0.1 mF
10 Ω
INP
25 Ω
0.1 mF
25 Ω
INM
1:1
1:1
10 Ω
0.1 mF
VCM
Device
Figure 182. Driving Circuit for High input Frequencies ( fIN > 230 MHz)
10.2.3.1 Design Requirements
See the Design Requirements section for further details.
10.2.3.2 Detailed Design Procedure
For high input frequencies (> 230 MHz), using the R-C-R or R-LC-R circuit does not show significant
improvement in performance. However, a series resistance of 10 Ω can be used as shown in Figure 182.
10.2.3.3 Application Curve
Figure 183 shows the performance obtained by using circuit shown in Figure 182.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
0
12.5
25
37.5
50
62.5
Frequency (MHz)
D109
SFDR = 76.2 dBc, SNR = 68.3 dBFS, SINAD = 67.5 dBFS,
THD = 74.3 dBc, HD2 = –76.2 dBc, HD3 = –79.2 dBc
Figure 183. Performance FFT at 450 MHz (High Input Frequency)
11 Power-Supply Recommendations
The device requires a 1.8-V nominal supply for AVDD and DVDD. There are no specific sequence power-supply
requirements during device power-up. AVDD and DVDD can power up in any order.
72
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12 Layout
12.1 Layout Guidelines
The ADC324x EVM layout can be used as a reference layout to obtain the best performance. A layout diagram
of the EVM top layer is provided in Figure 184. Some important points to remember during laying out the board
are:
1. Analog inputs are located on opposite sides of the device pin out to ensure minimum crosstalk on the
package level. To minimize crosstalk onboard, the analog inputs must exit the pin out in opposite directions,
as shown in the reference layout of Figure 184 as much as possible.
2. In the device pin out, the sampling clock is located on a side perpendicular to the analog inputs in order to
minimize coupling between them. This configuration is also maintained on the reference layout of Figure 184
as much as possible.
3. Keep digital outputs away from the analog inputs. When these digital outputs exit the pin out, do not keep the
digital output traces parallel to the analog input traces because this configuration can result in coupling from
digital outputs to analog inputs and degrade performance. All digital output traces to the receiver [such as a
field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] must be matched
in length to avoid skew among outputs.
4. At each power-supply pin (AVDD and DVDD), keep a 0.1-µF decoupling capacitor close to the device. A
separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF
capacitors can be kept close to the supply source.
12.2 Layout Example
{ampling
/lock
!nalog
Lnput
wouting
wouting
!5/32xx
5igital
hutput
wouting
Figure 184. Typical Layout of the ADC324x Board
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13 器件和文档支持
13.1 相关链接
下面的表格列出了快速访问链接。范围包括技术文档、支持和社区资源、工具和软件,以及样片或购买的快速访
问。
表 37. 相关链接
器件
产品文件夹
请单击此处
请单击此处
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
请单击此处
请单击此处
支持与社区
请单击此处
请单击此处
请单击此处
请单击此处
ADC3241
ADC3242
ADC3243
ADC3244
13.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 商标
E2E is a trademark of Texas Instruments.
PowerPAD is a trademark of Texas Instruments, Inc.
All other trademarks are the property of their respective owners.
13.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
74
版权 © 2014–2016, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ADC3241IRGZR
ADC3241IRGZT
ADC3242IRGZR
ADC3242IRGZT
ADC3243IRGZR
ADC3243IRGZT
ADC3244IRGZR
ADC3244IRGZT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
RGZ
RGZ
RGZ
RGZ
RGZ
RGZ
RGZ
RGZ
48
48
48
48
48
48
48
48
2500 RoHS & Green
250 RoHS & Green
2500 RoHS & Green
250 RoHS & Green
2500 RoHS & Green
250 RoHS & Green
2500 RoHS & Green
250 RoHS & Green
NIPDAUAG
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AZ3241
NIPDAUAG
NIPDAUAG
NIPDAUAG
NIPDAUAG
NIPDAUAG
NIPDAUAG
NIPDAUAG
AZ3241
AZ3242
AZ3242
AZ3243
AZ3243
AZ3244
AZ3244
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2022
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Sep-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ADC3241IRGZR
ADC3242IRGZR
ADC3243IRGZR
ADC3244IRGZR
VQFN
VQFN
VQFN
VQFN
RGZ
RGZ
RGZ
RGZ
48
48
48
48
2500
2500
2500
2500
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
1.5
1.5
1.5
1.5
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
Q2
Q2
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Sep-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
ADC3241IRGZR
ADC3242IRGZR
ADC3243IRGZR
ADC3244IRGZR
VQFN
VQFN
VQFN
VQFN
RGZ
RGZ
RGZ
RGZ
48
48
48
48
2500
2500
2500
2500
350.0
350.0
350.0
350.0
350.0
350.0
350.0
350.0
43.0
43.0
43.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGZ 48
7 x 7, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224671/A
www.ti.com
PACKAGE OUTLINE
RGZ0048D
VQFN - 1 mm max height
S
C
A
L
E
1
.
9
0
0
PLASTIC QUAD FLATPACK - NO LEAD
7.1
6.9
A
B
0.5
0.3
PIN 1 INDEX AREA
7.1
6.9
0.30
0.18
DETAIL
OPTIONAL TERMINAL
TYPICAL
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
5.6 0.1
2X 5.5
(0.2) TYP
13
24
44X 0.5
12
25
EXPOSED
THERMAL PAD
2X
49
SYMM
5.5
SEE TERMINAL
DETAIL
1
36
0.30
48X
0.18
37
48
PIN 1 ID
(OPTIONAL)
SYMM
0.1
C A B
0.5
0.3
48X
0.05
4219046/B 11/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGZ0048D
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
5.6)
SYMM
48
37
48X (0.6)
1
36
48X (0.24)
6X
(1.22)
44X (0.5)
SYMM
10X
(1.33)
49
(6.8)
(R0.05)
TYP
(
0.2) TYP
VIA
25
12
13
24
10X (1.33)
6X (1.22)
(6.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219046/B 11/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGZ0048D
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.665 TYP)
(1.33) TYP
16X ( 1.13)
37
48
48X (0.6)
49
36
1
48X (0.24)
44X (0.5)
(1.33)
TYP
(0.665)
TYP
SYMM
(6.8)
(R0.05) TYP
25
12
METAL
TYP
13
24
SYMM
(6.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
66% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
4219046/B 11/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
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您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
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TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022,德州仪器 (TI) 公司
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