ADS1278-EP [TI]
增强型产品:八路、144kHz、24 位同步采样 Σ-Δ ADC;型号: | ADS1278-EP |
厂家: | TEXAS INSTRUMENTS |
描述: | 增强型产品:八路、144kHz、24 位同步采样 Σ-Δ ADC |
文件: | 总44页 (文件大小:2059K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
八路同步采样 24 位模数转换器
查询样品: ADS1278-EP
1
特性
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234
同时测量八个通道
应用范围
•
高达 128kSPS 数据速率
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振动/模式分析
多通道数据采集
声学/动态应变仪
压力传感器
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AC 性能:
62kHz 带宽
111dB 信噪比 (SNR)(高分辨率模式)
-108dB 总谐波失真 (THD)
xxxx
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DC 精度:
0.8-μV/°C 偏移漂移
1.3-ppm/°C 增益漂移
说明
基于单通道ADS1271,ADS1278(八通道)是一款 24
位、三角积分 (ΔΣ) 模数转换器 (ADC),其数据速率高
达每秒 128k 次采样 (SPS),从而可实现八通道同时采
样。
可选运行模式:
高速:128kSPS,106dB SNR
高分辨率:52kSPS,111dB SNR
低功耗:52kSPS,31mW/ch
低速:10kSPS,7mW/ch
传统上来讲,提供良好漂移性能的工业用三角积分
ADC 使用带有较大通带衰减的数字滤波器。 因此,它
们的信号带宽有限并且主要适合于 dc 测量。 音频应用
中的高分辨 ADC 提供更大的可用带宽,但是与工业用
ADC 相比,它的偏移和漂移技术规格被大大削弱。
ADS1278 将三种类型的转换器组合在一起,从而实现
带有出色 dc 和 ac 技术规格的高精度工业测量。
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线性相位数字滤波器
SPI™ 或者帧同步串行接口
低采样孔径错误
调制器输出选项(数字滤波器旁通)
模拟电源:5V
数字内核:1.8V
I/O 电源:1.8V 至 3.3V
高阶、斩波稳定调制器在低带内噪声情况下实现极低漂
移。 板载抽取滤波器抑制调制器和信号带外噪声。 这
些 ADC 在纹波小于 0.005dB 的情况下提供高达那奎
斯特速率 90% 的可用信号带宽。
当前提供散热增强薄型四方扁平封装 (HTQFP)-64
封装 PowerPAD™ 封装
支持国防、航空航天、和医疗应用
四个运行模式可实现速度、分辨率和功率的优化。 所
有操作直接由引脚控制;无需寄存器编程。 器件可在
军用温度范围(-55°C 至 125°C)内运行并且采用
HTQFP-64 PowerPAD 封装。
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受控基线
一个组装/测试场所
一个制造场所
(1)
军用温度范围 (-55°C/125°C) 内可用
延长的产品生命周期
延长的产品变更通知
产品可追溯性
(1) 可提供额外温度范围-请与厂家联系
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
2
3
4
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
English Data Sheet: SBAS579
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
VREFP VREFN AVDD
DVDD
IOVDD
DS
DS
DS
Input1
Input2
Input3
Input4
Input5
Input6
Input7
Input8
SPI
and
DRDY/FSYNC
SCLK
Frame-
Sync
DOUT[8:1]
DIN
Interface
Eight
Digital
Filters
DS
DS
DS
DS
DS
TEST[1:0]
FORMAT[2:0]
CLK
Control
Logic
SYNC
PWDN[8:1]
CLKDIV
MODE[1:0]
AGND
DGND
ADS1278
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
PACKAGE
TQFP - PAP Reel of 250
ORDERABLE PART NUMBER
TOP-SIDE MARKING
VID NUMBER
–55°C to 125°C
ADS1278MPAPTEP
ADS1278EP
V62/12611-01XE
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
PIN ASSIGNMENTS
PAP PACKAGE
TQFP-64
(TOP VIEW)
1
2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AINN7
AINP2
AINN2
AINP1
AINN1
AVDD
AINP7
3
AINN8
4
AINP8
5
AVDD
6
AGND
DGND
TEST0
TEST1
CLKDIV
SYNC
DIN
AGND
7
PWDN1
PWDN2
PWDN3
PWDN4
PWDN5
PWDN6
PWDN7
PWDN8
MODE0
MODE1
8
ADS1278
9
10
11
12
13
14
15
16
DOUT8
DOUT7
DOUT6
DOUT5
(PowerPAD Outline)
Table 1. PIN DESCRIPTIONS
PIN
NAME
NO.
FUNCTION
DESCRIPTION
6, 43, 54,
58, 59
AGND
Analog ground
Analog ground; connect to DGND using a single plane.
AINP1
AINP2
AINP3
AINP4
AINP5
AINP6
AINP7
AINP8
3
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
1
63
61
51
49
47
45
AINP[8:1] Positive analog input, channels 8 through 1.
Copyright © 2012, Texas Instruments Incorporated
3
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
Table 1. PIN DESCRIPTIONS (continued)
PIN
NAME
AINN1
AINN2
AINN3
AINN4
AINN5
AINN6
AINN7
AINN8
AVDD
VCOM
VREFN
VREFP
CLK
NO.
FUNCTION
DESCRIPTION
4
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
2
64
62
AINN[8:1] Negative analog input, channels 8 through 1.
52
50
48
46
5, 44, 53, 60
Analog power supply Analog power supply (4.75V to 5.25V).
55
57
56
27
Analog output
Analog input
Analog input
Digital input
AVDD/2 Unbuffered voltage output.
Negative reference input.
Positive reference input.
Master clock input (fCLK).
CLK input divider control:
1 = 37MHz (High-Speed mode)/otherwise 27MHz
0 = 13.5MHz (low-power)/5.4MHz (low-speed)
CLKDIV
10
Digital input
DGND
DIN
7, 21, 24, 25
Digital ground
Digital input
Digital ground power supply.
Daisy-chain data input.
12
20
19
18
17
16
15
14
13
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
DOUT1 is TDM data output (TDM mode).
DOUT[8:1] Data output for channels 8 through 1.
DRDY/
FSYNC
29
Digital input/output
Frame-Sync protocol: frame clock input; SPI protocol: data ready output.
DVDD
FORMAT0
FORMAT1
FORMAT2
IOVDD
26
32
31
30
22, 23
34
33
42
41
40
39
38
37
36
35
28
11
8
Digital power supply Digital core power supply.
Digital input
FORMAT[2:0] Selects Frame-Sync/SPI protocol, TDM/discrete data outputs,
fixed/dynamic position TDM data, and modulator mode/normal operating mode.
Digital input
Digital input
Digital power supply I/O power supply (+1.65V to +3.6V).
MODE0
MODE1
PWDN1
PWDN2
PWDN3
PWDN4
PWDN5
PWDN6
PWDN7
PWDN8
SCLK
Digital input
Digital input
Digital input
Digital input
Digital input
Digital input
Digital input
Digital input
Digital input
Digital input
Digital input/output
Digital input
Digital input
Digital input
MODE[1:0] Selects High-Speed, High-Resolution, Low-Power, or Low-Speed
mode operation.
PWDN[8:1] Power-down control for channels 8 through 1.
Serial clock input, Modulator clock output.
Synchronize input (all channels).
SYNC
TEST0
TEST[1:0] Test mode select:
01 = Do not use
10 = Do not use
00 = Normal operation
11 = Test mode
TEST1
9
4
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range, unless otherwise noted(1)
UNIT
V
AVDD to AGND
–0.3 to 6.0
–0.3 to 3.6
–0.3 to 0.3
100
DVDD, IOVDD to DGND
AGND to DGND
V
V
Momentary
mA
mA
V
Input current
Continuous
10
Analog input to AGND
–0.3 to AVDD + 0.3
–0.3 to DVDD + 0.3
150
Digital input or output to DGND
Maximum junction temperature, TJ
Storage temperature range
V
°C
°C
–60 to 150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
THERMAL INFORMATION
ADS1278
THERMAL METRIC(1)
PAP
64 PINS
33.1
6.2
UNITS
θJA
θJC
θJB
ψJT
ψJB
Junction-to-ambient thermal resistance(2)
Junction-to-case thermal resistance
Junction-to-board thermal resistance(3)
Junction-to-top characterization parameter(4)
Junction-to-board characterization parameter(5)
7.9
°C/W
0.2
7.8
(1) 有关传统和新的热 度量的更多信息,请参阅IC 封装热度量应用报告, SPRA953。
(2) 在 JESD51-2a 描述的环境中,按照 JESD51-7 的指定,在一个 JEDEC 标准高 K 电路板上进行仿真,从而获得自然 对流条件下的结至环
境热阻。
(3) 按照 JESD51-8 中的说明,通过 在配有用于控制 PCB 温度的环形冷板夹具的环境中进行仿真,以获得结板热阻。
(4) 结至顶部特征参数, ψJT,估算真实系统中器件的结温,并使用 JESD51-2a(第 6 章和第 7 章)中 描述的程序从仿真数据中 提取出该参
数以便获得 θJA
(5) 结至电路板特征参数, ψJB,估算真实系统中器件的结温,并使用 JESD51-2a(第 6 章和第 7 章)中 描述的程序从仿真数据中 提取出该
参数以便获得 θJA
。
。
Copyright © 2012, Texas Instruments Incorporated
5
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
ELECTRICAL CHARACTERISTICS
All specifications at TA = –55°C to 125°C, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V,
VREFN = 0 V, and all channels active, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Operating temperature range, TA
-55
125
°C
Analog Inputs
Full-scale input voltage (FSR(1)
)
VIN = (AINP – AINN)
AINP or AINN to AGND
VCM = (AINP + AINN)/2
±VREF
V
V
AVDD +
0.1
Absolute input voltage
AGND – 0.1
Common-mode input voltage (VCM
)
2.5
14
V
High-Speed mode
High-Resolution mode
Low-Power mode
Low-Speed mode
kΩ
kΩ
kΩ
kΩ
14
Differential input
impedance
28
140
DC Performance
Resolution
No missing codes
fCLK = 32.768MHz(2)
fCLK = 27MHz
24
Bits
SPS
SPS(3)
128,000
105,469
52,734
52,734
10,547
±0.0003
0.25
High-Speed mode
Data rate (fDATA
)
High-Resolution mode
Low-Power mode
Low-Speed mode
SPS
SPS
SPS
% FSR(1)
Integral nonlinearity (INL)(4)
Differential input, VCM = 2.5V
±0.0014
2
Offset error
mV
Offset drift
0.8
μV/°C
% FSR
ppm/°C
μV, rms
μV, rms
μV, rms
μV, rms
dB
Gain error
0.1
0.5
Gain drift
1.3
High-Speed mode
Shorted input
Shorted input
Shorted input
Shorted input
fCM = 60Hz
8.5
68
13
21
21
High-Resolution mode
Low-Power mode
Low-Speed mode
5.5
Noise
8.5
8.0
Common-mode rejection
90
108
AVDD
80
dB
Power-supply rejection DVDD
IOVDD
fPS = 60Hz
No load
85
dB
105
dB
VCOM output voltage
AC Performance
Crosstalk
AVDD/2
V
f = 1kHz, –0.5dBFS(5)
–107
106
dB
dB
dB
dB
dB
dB
dB
dB
dB
Hz
Hz
High-Speed mode
88.3
101
VREF = 2.5V
VREF = 3V
110
High-Resolution mode
Signal-to-noise ratio
111
(SNR)(6) (unweighted)
Low-Power mode
Low-Speed mode
Total harmonic distortion (THD)(7)
Spurious-free dynamic range
Passband ripple
98
98
106
107
VIN = 1kHz, –0.5dBFS
–108
–96
109
±0.005
0.453 fDATA
0.49 fDATA
Passband
–3dB Bandwidth
(1) FSR = full-scale range = 2VREF
.
(2) fCLK = 32.768MHz max for High-Speed mode, and 27MHz max for all other modes. When fCLK > 27MHz, operation is limited to Frame-
Sync mode and VREF ≤ 2.6V.
(3) SPS = samples per second.
(4) Best fit method.
(5) Worst-case channel crosstalk between one or more channels.
(6) Minimum SNR is ensured by the limit of the DC noise specification.
(7) THD includes the first nine harmonics of the input signal; Low-Speed mode includes the first five harmonics.
6
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
ELECTRICAL CHARACTERISTICS (continued)
All specifications at TA = –55°C to 125°C, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V,
VREFN = 0 V, and all channels active, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
High-Resolution mode
All other modes
95
dB
Stop band attenuation
Stop band
100
127.453
fDATA
High-Resolution mode
All other modes
0.547 fDATA
0.547 fDATA
Hz
Hz
63.453
fDATA
High-Resolution mode
All other modes
39/fDATA
38/fDATA
78/fDATA
76/fDATA
s
s
s
s
Group delay
High-Resolution mode
All other modes
Complete settling
Complete settling
Settling time (latency)
Voltage Reference Inputs
fCLK = 27MHz
fCLK = 32.768MHz(2)
0.5
0.5
2.5
2.5
3.1
2.6
V
V
Reference input voltage (VREF
(VREF = VREFP – VREFN)
)
AGND +
0.1
Negative reference input (VREFN)
Positive reference input (VREFP)
AGND – 0.1
VREFN + 0.5
V
V
AVDD +
0.1
High-Speed mode
0.65
0.65
1.3
kΩ
kΩ
kΩ
kΩ
High-Resolution mode
Low-Power mode
Low-Speed mode
Reference Input
impedance
6.5
Digital Input/Output (IOVDD = 1.8V to 3.6V)
VIH
0.7 IOVDD
DGND
IOVDD
V
V
V
V
0.3
IOVDD
VIL
VOH
IOH = 4mA
IOL = 4mA
0.8 IOVDD
DGND
IOVDD
0.2
IOVDD
VOL
Input leakage
0 < VIN DIGITAL < IOVDD
High-Speed mode(8)
Other modes
±10
32.768
27
μA
0.1
0.1
MHz
MHz
Master clock rate (fCLK
)
Power Supply
AVDD
4.75
1.65
1.65
5
5.25
1.95
3.6
10
V
DVDD
1.8
V
IOVDD
V
AVDD
1
1
μA
μA
μA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Power-down current
AVDD current
DVDD
50
IOVDD
1
11
High-Speed mode
High-Resolution mode
Low-Power mode
Low-Speed mode
High-Speed mode
High-Resolution mode
Low-Power mode
Low-Speed mode
High-Speed mode
High-Resolution mode
Low-Power mode
Low-Speed mode
97
145
145
64
97
44
9
14
23
30
16
20
DVDD current
IOVDD current
12
17
2.5
0.25
0.125
0.125
0.035
4.5
1
0.6
0.6
0.3
(8) fCLK = 32.768MHz max for High-Speed mode, and 27MHz max for all other modes. When fCLK > 27MHz, operation is limited to Frame-
Sync mode and VREF ≤ 2.6V.
Copyright © 2012, Texas Instruments Incorporated
7
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
ELECTRICAL CHARACTERISTICS (continued)
All specifications at TA = –55°C to 125°C, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V,
VREFN = 0 V, and all channels active, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
530
515
245
50
MAX
785
765
355
80
UNIT
mW
mW
mW
mW
High-Speed mode
High-Resolution mode
Low-Power mode
Low-Speed mode
Power dissipation
TIMING CHARACTERISTICS: SPI FORMAT
tCLK
tCPW
CLK
· · ·
tCPW
tCD
tCONV
DRDY
tSD
tDS
tSCLK
tSPW
SCLK
tSPW
tDOPD
tMSBPD
tDOHD
Bit 23 (MSB)
Bit 22
tDIST
Bit 21
DOUT
DIN
tDIHD
TIMING REQUIREMENTS: SPI FORMAT
For TA = –40°C to 125°C, IOVDD = 1.65 V to 3.6 V, and DVDD = 1.65 V to 1.95 V.
SYMBOL
tCLK
PARAMETER
MIN
37
TYP
MAX
UNIT
(1)
CLK period (1/fCLK
)
10,000
ns
ns
tCPW
CLK positive or negative pulse width
15
(2)
tCONV
Conversion period (1/fDATA
)
256
2560
tCLK
ns
(3)
tCD
Falling edge of CLK to falling edge of DRDY
Falling edge of DRDY to rising edge of first SCLK to retrieve data
DRDY falling edge to DOUT MSB valid (propagation delay)
Falling edge of SCLK to rising edge of DRDY
SCLK period
22
18
(3)
tDS
1
tCLK
ns
tMSBPD
16
32
(3)
tSD
ns
(4)
tSCLK
1
0.4
10
tCLK
tCLK
ns
tSPW
SCLK positive or negative pulse width
(5)(3) (6)
tDOHD
tDOPD
tDIST
SCLK falling edge to new DOUT invalid (hold time)
SCLK falling edge to new DOUT valid (propagation delay)
New DIN valid to falling edge of SCLK (setup time)
Old DIN valid to falling edge of SCLK (hold time)
(5)(3)
ns
6
6
ns
(6)
tDIHD
ns
(1) fCLK = 27MHz maximum.
(2) Depends on MODE[1:0] and CLKDIV selection. See Table 7 (fCLK/fDATA).
(3) Load on DRDY and DOUT = 20pF.
(4) For best performance, limit fSCLK/fCLK to ratios of 1, 1/2, 1/4, 1/8, etc.
(5) Timing parameters are characerized or guranteed by design for specified temperature but not production tested.
(6) tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and
ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is >4ns.
8
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
Figure 1. TIMING CHARACTERISTICS: FRAME-SYNC FORMAT
tCPW
tCLK
CLK
tCPW
tCS
tFRAME
tFPW
tFPW
FSYNC
SCLK
DOUT
DIN
tFS
tSCLK
tSPW
tSF
tSPW
tMSBPD
Bit 23 (MSB)
tDOPD
tDOHD
Bit 21
Bit 22
tDIST
tDIHD
TIMING REQUIREMENTS: FRAME-SYNC FORMAT(1)
For TA = –40°C to 125°C, IOVDD = 1.65 V to 3.6 V, and DVDD = 1.65 V to 1.95 V.
SYMBOL
PARAMETER
MIN
37
TYP
MAX
UNIT
ns
All modes
10,000
tCLK
CLK period (1/fCLK)
High-Speed mode only
30.5
12
ns
tCPW
tCS
CLK positive or negative pulse width
ns
Falling edge of CLK to falling edge of SCLK
–0.25
256
1
0.25
tCLK
tCLK
tSCLK
ns
(2)
tFRAME
tFPW
tFS
Frame period (1/fDATA
)
2560
FSYNC positive or negative pulse width
Rising edge of FSYNC to rising edge of SCLK
Rising edge of SCLK to rising edge of FSYNC
SCLK period(3)
5
tSF
5
ns
tSCLK
tSPW
tDOHD
1
tCLK
tCLK
ns
SCLK positive or negative pulse width
0.4
10
(4)(5) (6)
SCLK falling edge to old DOUT invalid (hold time)
SCLK falling edge to new DOUT valid (propagation delay)
FSYNC rising edge to DOUT MSB valid (propagation delay)
New DIN valid to falling edge of SCLK (setup time)
Old DIN valid to falling edge of SCLK (hold time)
(4)(6)
tDOPD
31
31
ns
(4)
tMSBPD
tDIST
ns
6
6
ns
(5)
tDIHD
ns
(1) Timing parameters are characerized or guranteed by design for specified temperature but not production tested.
(2) Depends on MODE[1:0] and CLKDIV selection. See Table 7 (fCLK/fDATA).
(3) SCLK must be continuously running and limited to ratios of 1, 1/2, 1/4, and 1/8 of fCLK
.
(4) Timing parameters are characerized or guranteed by design for specified temperature but not production tested.
(5) tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and
ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is >4 ns.
(6) Load on DOUT = 20 pF.
Copyright © 2012, Texas Instruments Incorporated
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100000000.00
www.ti.com.cn
10000000.00
1000000.00
100000.00
10000.00
Wirebond Voiding Fail Mode
Electromigration Fail Mode
80
90
100
110
120
130
140
150
160
170
Continuous T (°C)
J
Figure 2. ADS1278 Operating Life Derating and Wirebond Voiding Fail Mode Chart
Notes:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Sillicon operating life design goal is 10 years at 110°C junction temperature.
10
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TYPICAL CHARACTERISTICS
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OUTPUT SPECTRUM
OUTPUT SPECTRUM
0
-20
0
-20
High-Speed Mode
High-Speed Mode
fIN = 1kHz, -0.5dBFS
fIN = 1kHz, -20dBFS
32,768 Points
32,768 Points
-40
-40
-60
-60
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
10
100
1k
10k
100k
100k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 3.
Figure 4.
OUTPUT SPECTRUM
NOISE HISTOGRAM
25k
20k
15k
10k
5k
0
High-Speed Mode
High-Speed Mode
Shorted Input
-20 Shorted Input
262,144 Points
262,144 Points
-40
-60
-80
-100
-120
-140
-160
-180
0
1
10
100
1k
10k
Frequency (Hz)
Output (mV)
Figure 5.
Figure 6.
OUTPUT SPECTRUM
OUTPUT SPECTRUM
0
-20
0
-20
High-Resolution Mode
fIN = 1kHz, -0.5dBFS
32,768 Points
High-Resolution Mode
fIN = 1kHz, -20dBFS
32,768 Points
-40
-40
-60
-60
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
10
100
1k
10k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 7.
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OUTPUT SPECTRUM
NOISE HISTOGRAM
25k
20k
15k
10k
5k
0
High-Resolution Mode
High-Resolution Mode
-20 Shorted Input
Shorted Input
262,144 Points
262,144 Points
-40
-60
-80
-100
-120
-140
-160
-180
0
1
10
100
1k
10k
100k
Frequency (Hz)
Output (mV)
Figure 9.
Figure 10.
OUTPUT SPECTRUM
OUTPUT SPECTRUM
0
-20
0
Low-Power Mode
fIN = 1kHz, -0.5dBFS
32,768 Points
Low-Power Mode
fIN = 1kHz, -20dBFS
32,768 Points
-20
-40
-40
-60
-60
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 11.
Figure 12.
OUTPUT SPECTRUM
NOISE HISTOGRAM
0
25k
Low-Power Mode
Low-Power Mode
Shorted Input
-20 Shorted Input
262,144 Points
262,144 Points
20k
15k
10k
5k
-40
-60
-80
-100
-120
-140
-160
-180
0
1
10
100
1k
10k
100k
Frequency (Hz)
Output (mV)
Figure 13.
Figure 14.
12
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OUTPUT SPECTRUM
OUTPUT SPECTRUM
0
-20
0
-20
Low-Speed Mode
Low-Speed Mode
fIN = 100Hz, -0.5dBFS
fIN = 100Hz, -20dBFS
32,768 Points
32,768 Points
-40
-40
-60
-60
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
1
10
100
1k
10k
1
10
100
1k
10k
Frequency (Hz)
Frequency (Hz)
Figure 15.
Figure 16.
OUTPUT SPECTRUM
NOISE HISTOGRAM
25k
20k
15k
10k
5k
0
Low-Speed Mode
Low-Speed Mode
-20 Shorted Input
Shorted Input
262,144 Points
262,144 Points
-40
-60
-80
-100
-120
-140
-160
-180
0
0.1
1
10
100
1k
10k
Frequency (Hz)
Output (mV)
Figure 17.
Figure 18.
TOTAL HARMONIC DISTORTION
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
INPUT AMPLITUDE
0
-20
0
-20
High-Speed Mode
VIN = -0.5dBFS
High-Speed Mode
fIN = 1kHz
-40
-40
-60
-60
-80
-80
THD+N
THD
THD+N
THD
-100
-120
-140
-100
-120
-140
10
100
1k
10k
100k
-120
-100
-80
-60
-40
-20
0
Frequency (Hz)
Input Amplitude (dBFS)
Figure 19.
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
TOTAL HARMONIC DISTORTION
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
INPUT AMPLITUDE
0
-20
0
-20
High-Resolution Mode
VIN = -0.5dBFS
High-Resolution Mode
fIN = 1kHz
-40
-40
-60
-60
-80
-80
THD+N
THD
-100
-120
-140
-100
-120
-140
THD+N
THD
10
100
1k
10k
100k
100k
10k
-120
-100
-80
-60
-40
-20
0
0
0
Frequency (Hz)
Input Amplitude (dBFS)
Figure 21.
Figure 22.
TOTAL HARMONIC DISTORTION
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
INPUT AMPLITUDE
0
-20
0
-20
Low-Power Mode
VIN = -0.5dBFS
Low-Power Mode
fIN = 1kHz
-40
-40
-60
-60
-80
-80
THD+N
THD
THD+N
THD
-100
-120
-140
-100
-120
-140
10
100
1k
10k
-120
-100
-80
-60
-40
-20
Frequency (Hz)
Input Amplitude (dBFS)
Figure 23.
Figure 24.
TOTAL HARMONIC DISTORTION
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
INPUT AMPLITUDE
0
0
-20
Low-Speed Mode
VIN = -0.5dBFS
Low-Speed Mode
-20
-40
-40
-60
-60
-80
-80
THD+N
THD
THD+N
THD
-100
-120
-140
-100
-120
-140
10
100
1k
-120
-100
-80
-60
-40
-20
Frequency (Hz)
Input Amplitude (dBFS)
Figure 25.
Figure 26.
14
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OFFSET DRIFT HISTOGRAM
GAIN DRIFT HISTOGRAM
400
350
300
250
200
150
100
50
900
800
700
600
500
400
300
200
100
0
Multi-lot data based on
25 units based on
20°C intervals over the
range -40°C to +105°C.
20°C intervals over the
range -40°C to +105°C.
Outliers: T < -20°C
0
Offset Drift (mV/°C)
Gain Drift (ppm/°C)
Figure 27.
Figure 28.
OFFSET WARMUP DRIFT RESPONSE BAND
ADS1278 High-Speed and High-Resolution Modes
ADS1278 Low-Power Mode
GAIN WARMUP DRIFT RESPONSE BAND
ADS1274/78 High-Speed and High-Resolution Modes
ADS1278 Low-Power Mode
40
30
20
10
0
40
30
20
10
0
-10
-10
-20
-30
-40
-20
-30
-40
ADS1278 Low-Speed Mode
ADS1278 Low-Speed Mode
ADS1274 High-Speed and High-Resolution Modes
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
Time (s)
Time (s)
Figure 29.
Figure 30.
OFFSET ERROR HISTOGRAM
GAIN ERROR HISTOGRAM
90
40
35
30
25
20
15
10
5
High-Speed Mode
25 Units
High-Speed Mode
25 Units
80
70
60
50
40
30
20
10
0
0
Offset (mV)
Gain Error (ppm)
Figure 31.
Figure 32.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
CHANNEL GAIN MATCH HISTOGRAM
CHANNEL OFFSET MATCH HISTOGRAM
100
90
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
High-Speed Mode
10 Units
High-Speed Mode
10 Units
Channel Gain Match (ppm)
Channel Offset Match (mV)
Figure 33.
Figure 34.
OFFSET AND GAIN
vs
TEMPERATURE
VCOM VOLTAGE OUTPUT HISTOGRAM
400
20
18
16
14
12
10
8
600
500
AVDD = 5V
25 Units, No Load
300
200
100
400
300
200
100
0
Offset
0
6
-100
-100
4
-200
-300
Gain
-200
-300
2
0
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
VCOM Voltage Output (V)
Figure 35.
Figure 36.
REFERENCE INPUT DIFFERENTIAL
IMPEDANCE
vs
SAMPLING MATCH ERROR HISTOGRAM
TEMPERATURE
6.8
6.7
0.68
40
30 units over 3 production lots,
inter-channel combinations.
35
30
25
20
15
10
5
0.67
0.66
0.65
0.64
6.6
6.5
6.4
High Speed and
High Resolution
6.3
6.2
0.63
0.62
Low Speed Mode
0
-55
-40
-20
0
25
45
65
85
105
125
Temperature (°C)
Sampling Match Error (ps)
Figure 37.
Figure 38.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
ANALOG INPUT DIFFERENTIAL IMPEDANCE
ANALOG INPUT DIFFERENTIAL IMPEDANCE
vs
vs
TEMPERATURE
TEMPERATURE
14.3
14.2
14.1
170
160
150
140
28.6
28.4
28.2
Low-Speed Mode
14
28
13.9
13.8
13.7
13.6
13.5
27.8
27.6
27.4
27.2
27
High Speed and
High Resolution
130
13.4
13.3
26.8
26.6
120
110
Low Power Mode
13.2
13.1
26.4
26.2
-55
-35
-15
5
25
45
65
85
105
125
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
Temperature (°C)
Figure 39.
Figure 40.
INTEGRAL NONLINEARITY
LINEARITY ERROR
vs
vs
TEMPERATURE
INPUT LEVEL
10
10
8
6
8
T = +105°C
4
T = +25°C
6
4
2
2
0
-2
-4
-6
-8
-10
T = -40°C
T = +125°C
0
-55
-35
-15
5
25
45
65
85
105
125
-2.5 -2.0 -1.5 -1.0 -0.5
0
0.5 1.0 1.5 2.0 2.5
Temperature (°C)
VIN (V)
Figure 41.
Figure 42.
LINEARITY AND TOTAL HARMONIC DISTORTION
vs
NOISE AND LINEARITY
vs
REFERENCE VOLTAGE
INPUT COMMON-MODE VOLTAGE
14
12
10
8
-100
14
12
10
8
14
12
10
8
THD: fIN = 1kHz, VIN = -0.5dBFS
-104
-108
-112
-116
-120
-124
-128
Noise
THD
6
6
6
Linearity
4
4
4
Linearity
2
2
2
See Electrical Characteristics for VREF Operating Range.
0
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common-Mode Voltage (V)
VREF (V)
Figure 43.
Figure 44.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
NOISE
vs
NOISE
vs
TEMPERATURE
REFERENCE VOLTAGE
12
10
12
10
8
High-Speed
Low Power Mode
Low-Power
High Speed Mode
8
Low Speed Mode
Low-Speed
6
4
2
6
4
High Resolution Mode
High-Resolution
2
0
See Electrical Characteristics for VREF Operating Range.
0
-55
-35
-15
5
25
45
65
85
105
125
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Temperature (°C)
VREF (V)
Figure 45.
Figure 46.
TOTAL HARMONIC DISTORTION AND NOISE
COMMON-MODE REJECTION
vs
vs
CLK
INPUT FREQUENCY
0
-20
14
12
10
8
0
High-Speed Mode
fCLK > 32.768MHz: VREF = 2.048V, DVDD = 2.1V
-20
-40
THD: AIN = fCLK/5120, -0.5dBFS
Noise: Shorted Input
-40
-60
-60
Noise
-80
6
THD
-80
-100
-120
-140
4
-100
-120
2
0
10k
100k
1M
10M
100M
10
100
1k
10k
100k
1M
CLK (Hz)
Input Frequency (Hz)
Figure 47.
Figure 48.
POWER-SUPPLY REJECTION
vs
AVDD CURRENT
vs
POWER-SUPPLY FREQUENCY
TEMPERATURE
160
0
140
High Speed and High Resolution Modes
-20
-40
120
100
80
-60
Low Power Mode
AVDD
60
40
-80
Low Speed Mode
DVDD
-100
-120
20
IOVDD
0
-55
-35
-15
5
25
45
65
85
105
125
10
100
1k
10k
100k
1M
Temperature (°C)
Power-Supply Modulation Frequency (Hz)
Figure 49.
Figure 50.
18
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ZHCSAC0 –AUGUST 2012
TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
DVDD CURRENT
IOVDD CURRENT
vs
vs
TEMPERATURE
TEMPERATURE
0.5
0.4
30
25
20
15
10
High Speed Mode
High Resolution Mode
0.3
0.2
High Speed Mode
Low Power Mode
Low Speed Mode
High Resolution and Low Power Modes
Low Speed Mode
0.1
0
5
0
-55
-55
-35
-15
5
25
45
65
85
105
125
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
Temperature (°C)
Figure 51.
Figure 52.
POWER DISSIPATION
vs
TEMPERATURE
800
700
600
500
High Speed Mode
400
300
High Resolution Mode
Low Power Mode
200
100
Low Speed Mode
0
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
Figure 53.
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OVERVIEW
High-Speed, High-Resolution, Low-Power, and Low-
Speed. Table 2 summarizes the performance of each
mode.
The ADS1278 is an octal 24-bit, delta-sigma ADC
based on the single-channel ADS1271. It offers the
combination of outstanding dc accuracy and superior
ac performance. Figure 54 shows the block diagram.
The converter is comprised of eight advanced, 6th-
order, chopper-stabilized, delta-sigma modulators
followed by low-ripple, linear phase FIR filters. The
In High-Speed mode, the maximum data rate is 128
kSPS (when operating at 128 kSPS, Frame-Sync
format must be used). In High-Resolution mode, the
SNR = 111dB (VREF = 3.0 V); in Low-Power mode,
the power dissipation is 31 mW/channel; and in Low-
modulators measure the differential input signal, VIN
=
(AINP – AINN), against the differential reference,
VREF = (VREFP – VREFN). The digital filters receive
the modulator signal and provide a low-noise digital
output. To allow tradeoffs among speed, resolution,
and power, four operating modes are supported:
Speed mode, the power dissipation is only 7
mW/channel at 10.5 kSPS. The digital filters can be
bypassed, enabling direct access to the modulator
output.
The ADS1278 is configured by simply setting the
appropriate I/O pins—there are no registers to
program. Data are retrieved over a serial interface
that supports both SPI and Frame-Sync formats. The
ADS1278 has a daisy-chainable output and the ability
to synchronize externally, so it can be used
conveniently in systems requiring more than eight
channels.
VREFP
AVDD
VREFN
DVDD
IOVDD
Mod 1
Mod 2
R
S
Modulator
Output
VCOM
VREF
R
Mod 8
VIN1
DS
AINP1
AINN1
Digital
DRDY/FSYNC
SCLK
S
S
Modulator1
SPI
and
Frame-Sync
Interface
Filter1
[8:1]
DOUT
DIN
VIN2
DS
AINP2
AINN2
Digital
Filter2
Modulator2
TEST[1:0]
FORMAT[2:0]
CLK
Control
Logic
SYNC
[8:1]
PWDN
VIN4/8
DS
AINP8
AINN8
Digital
Filter8
CLKDIV
S
Modulator8
MODE[1:0]
AGND
DGND
Figure 54. Block Diagram
Table 2. Operating Mode Performance Summary
MODE
High-Speed
High-Resolution
Low-Power
Low-Speed
MAX DATA RATE (SPS)
PASSBAND (kHz)
57,984
SNR (dB)
106
NOISE (μVRMS
)
POWER/CHANNEL (mW)
128,000
52,734
52,734
10,547
8.5
5.5
8.5
8.0
70
64
31
7
23,889
110
23,889
106
4,798
107
20
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FUNCTIONAL DESCRIPTION
SAMPLING APERTURE MATCHING
The ADS1278 is a delta-sigma ADC consisting of
eight independent converters that digitize eight input
signals in parallel.
The ADS1278 converter operates from the same CLK
input. The CLK input controls the timing of the
modulator sampling instant. The converter is
designed such that the sampling skew, or modulator
sampling aperture match between channels, is
controlled. Furthermore, the digital filters are
synchronized to start the convolution phase at the
same modulator clock cycle. This design results in
excellent phase match among the ADS1278
channels.
The converter is composed of two main functional
blocks to perform the ADC conversions: the
modulator and the digital filter. The modulator
samples the input signal together with sampling the
reference voltage to produce a 1s density output
stream. The density of the output stream is
proportional to the analog input level relative to the
reference voltage. The pulse stream is filtered by the
internal digital filter where the output conversion
result is produced.
Figure 37 shows the inter-device channel sample
matching for the ADS1278.
FREQUENCY RESPONSE
In operation, the input signal is sampled by the
modulator at a high rate (typically 64x higher than the
final output data rate). The quantization noise of the
modulator is moved to a higher frequency range
where the internal digital filter removes it.
Oversampling results in very low levels of noise
within the signal passband.
The digital filter sets the overall frequency response.
The filter uses a multi-stage FIR topology to provide
linear phase with minimal passband ripple and high
stop band attenuation. The filter coefficients are
identical to the coefficients used in the ADS1271. The
oversampling ratio of the digital filter (that is, the ratio
of the modulator sampling to the output data rate, or
fMOD/fDATA) is a function of the selected mode, as
shown in Table 3.
Since the input signal is sampled at a very high rate,
input signal aliasing does not occur until the input
signal frequency is at the modulator sampling rate.
This architecture greatly relaxes the requirement of
external antialiasing filters because of the high
modulator sampling rate.
Table 3. Oversampling Ratio versus Mode
MODE SELECTION
High-Speed
OVERSAMPLING RATIO (fMOD/fDATA)
64
128
64
High-Resolution
Low-Power
Low-Speed
64
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High-Speed, Low-Power, and Low-Speed Modes
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
The digital filter configuration is the same in High-
Speed, Low-Power, and Low-Speed modes with the
oversampling ratio set to 64. Figure 55 shows the
frequency response in High-Speed, Low-Power, and
Low-Speed modes normalized to fDATA. Figure 56
shows the passband ripple. The transition from
passband to stop band is shown in Figure 57. The
overall frequency response repeats at 64x multiples
of the modulator frequency fMOD, as shown in
Figure 58.
0
-20
0.45
0.47
0.49
0.51
0.53
0.55
Normalized Input Frequency (fIN/fDATA
)
-40
Figure 57. Transition Band Response for High-
Speed, Low-Power, and Low-Speed Modes
-60
-80
20
0
-100
-120
-140
-20
-40
-60
0
0.2
0.4
0.6
0.8
1.0
Normalized Input Frequency (fIN/fDATA
)
-80
-100
-120
-140
-160
Figure 55. Frequency Response for High-Speed,
Low-Power, and Low-Speed Modes
0.02
0
0
16
32
48
64
Input Frequency (fIN/fDATA
)
Figure 58. Frequency Response Out to fMOD for
High-Speed, Low-Power, and Low-Speed Modes
-0.02
-0.04
-0.06
-0.08
-0.10
These image frequencies, if present in the signal and
not externally filtered, will fold back (or alias) into the
passband, causing errors. The stop band of the
ADS1278 provides 100 dB attenuation of frequencies
that begin just beyond the passband and continue out
to fMOD. Placing an antialiasing, low-pass filter in front
of the ADS1278 inputs is recommended to limit
possible high-amplitude, out-of-band signals and
noise. Often, a simple RC filter is sufficient. Table 4
lists the image rejection versus external filter order.
0
0.1
0.2
0.3
0.4
0.5
0.6
Normalized Input Frequency (fIN/fDATA
)
Figure 56. Passband Response for High-Speed,
Low-Power, and Low-Speed Modes
Table 4. Antialiasing Filter Order Image Rejection
IMAGE REJECTION (dB)
(f–3dB at fDATA
)
ANTIALIASING
FILTER ORDER
HS, LP, LS
HR
45
1
2
3
39
75
87
111
129
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High-Resolution Mode
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
The oversampling ratio is 128 in High-Resolution
mode. Figure 59 shows the frequency response in
High-Resolution mode normalized to fDATA. Figure 60
shows the passband ripple, and the transition from
passband to stop band is shown in Figure 61. The
overall frequency response repeats at multiples of the
modulator frequency fMOD (128 × fDATA), as shown in
Figure 62. The stop band of the ADS1278 provides
100 dB attenuation of frequencies that begin just
beyond the passband and continue out to fMOD
.
Placing an antialiasing, low-pass filter in front of the
ADS1278 inputs is recommended to limit possible
high-amplitude out-of-band signals and noise. Often,
a simple RC filter is sufficient. Table 4 lists the image
rejection versus external filter order.
0.45
0.47
0.49
0.51
0.53
0.55
Normalized Input Frequency (fIN/fDATA
)
Figure 61. Transition Band Response for High-
Resolution mode
0
-20
20
0
-40
-20
-60
-40
-80
-60
-100
-120
-140
-80
-100
-120
-140
-160
0
0.25
0.50
0.75
1
Normalized Input Frequency (fIN/fDATA
)
0
32
64
96
128
Normalized Input Frequency (fIN/fDATA
)
Figure 59. Frequency Response for High-
Resolution Mode
Figure 62. Frequency Response Out to fMOD for
High-Resolution Mode
0.02
0
-0.02
-0.04
-0.06
-0.08
-0.10
0
0.1
0.2
0.3
0.4
0.5
0.6
Normalized Input Frequency (fIN/fDATA
)
Figure 60. Passband Response for High-
Resolution Mode
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Table 5. Ideal Output Code versus Input Signal
PHASE RESPONSE
INPUT SIGNAL VIN
(AINP – AINN)
The ADS1278 incorporates a multiple stage, linear
phase digital filter. Linear phase filters exhibit
constant delay time versus input frequency (constant
group delay). This characteristic means the time
delay from any instant of the input signal to the same
instant of the output data is constant and is
independent of input signal frequency. This behavior
results in essentially zero phase errors when
analyzing multi-tone signals.
IDEAL OUTPUT CODE(1)
≥ +VREF
7FFFFFh
) VREF
223 * 1
0
000001h
000000h
FFFFFFh
* VREF
223 * 1
223
ǒ
Ǔ
v −VREF
800000h
SETTLING TIME
223 * 1
As with frequency and phase response, the digital
filter also determines settling time. Figure 63 shows
the output settling behavior after a step change on
the analog inputs normalized to conversion periods.
The X-axis is given in units of conversion. Note that
after the step change on the input occurs, the output
data change very little prior to 30 conversion periods.
The output data are fully settled after 76 conversion
periods for High-Speed and Low-Power modes, and
78 conversion periods for High-Resolution mode.
(1) Excludes effects of noise, INL, offset, and gain errors.
ANALOG INPUTS (AINP, AINN)
The ADS1278 measures each differential input signal
VIN = (AINP – AINN) against the common differential
reference VREF = (VREFP – VREFN). The most
positive measurable differential input is +VREF, which
produces the most positive digital output code of
7FFFFFh. Likewise, the most negative measurable
differential input is –VREF, which produces the most
negative digital output code of 800000h.
Final Value
100
For optimum performance, the inputs of the ADS1278
are intended to be driven differentially. For single-
ended applications, one of the inputs (AINP or AINN)
can be driven while the other input is fixed (typically
to AGND or 2.5 V). Fixing the input to 2.5 V permits
bipolar operation, thereby allowing full use of the
entire converter range.
Fully Settled Data
at 76 Conversions
(78 Conversions for
High-Resolution mode)
Initial Value
0
While the ADS1278 measures the differential input
signal, the absolute input voltage is also important.
This value is the voltage on either input (AINP or
AINN) with respect to AGND. The range for this
voltage is:
0
10
20
30
40
50
60
70
80
Conversions (1/fDATA
)
Figure 63. Step Response
–0.1 V < (AINN or AINP) < AVDD + 0.1 V
If either input is taken below –0.4 V or above
(AVDD + 0.4 V), ESD protection diodes on the inputs
may turn on. If these conditions are possible, external
Schottky clamp diodes or series resistors may be
required to limit the input current to safe values (see
the Absolute Maximum Ratings table).
DATA FORMAT
The ADS1278 outputs 24 bits of data in twos
complement format.
A positive full-scale input produces an ideal output
code of 7FFFFFh, and the negative full-scale input
produces an ideal output code of 800000h. The
output clips at these codes for signals exceeding full-
scale. Table 5 summarizes the ideal output codes for
different input signals.
The ADS1278 is a very high-performance ADC. For
optimum performance, it is critical that the appropriate
circuitry be used to drive the ADS1278 inputs. See
the Application Information section for several
recommended circuits.
24
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The ADS1278 uses switched-capacitor circuitry to
measure the input voltage. Internal capacitors are
charged by the inputs and then discharged. Figure 64
shows a conceptual diagram of these circuits. Switch
S2 represents the net effect of the modulator circuitry
in discharging the sampling capacitor; the actual
implementation is different. The timing for switches S1
and S2 is shown in Figure 65. The sampling time
AINP
AINN
Zeff = 14kW ´ (6.75MHz/fMOD
)
(tSAMPLE
) is the inverse of modulator sampling
frequency (fMOD) and is a function of the mode, the
CLKDIV input, and CLK frequency, as shown in
Table 6.
Figure 66. Effective Input Impedances
VOLTAGE REFERENCE INPUTS
(VREFP, VREFN)
AVDD AGND
The voltage reference for the ADS1278 ADC is the
differential voltage between VREFP and VREFN:
VREF = (VREFP – VREFN). The voltage reference is
common to all channels. The reference inputs use a
structure similar to that of the analog inputs with the
equivalent circuitry on the reference inputs shown in
Figure 67. As with the analog inputs, the load
presented by the switched capacitor can be modeled
with an effective impedance, as shown in Figure 68.
However, the reference input impedance depends on
the number of active (enabled) channels in addition to
fMOD. As a result of the change of reference input
impedance caused by enabling and disabling
channels, the regulation and setting time of the
external reference should be noted, so as not to
affect the readings.
S1
AINP
S2
9pF
AINN
S1
AGND AVDD
ESD Protection
Figure 64. Equivalent Analog Input Circuitry
tSAMPLE = 1/fMOD
VREFP
VREFN
ON
S1
OFF
ON
S2
AGND
AVDD
AGND
AVDD
OFF
Figure 65. S1 and S2 Switch Timing for Figure 64
ESD
Protection
Table 6. Modulator Frequency (fMOD) Mode
Selection
MODE SELECTION
High-Speed
CLKDIV
fMOD
fCLK/4
fCLK/4
fCLK/8
fCLK/4
fCLK/40
fCLK/8
1
1
1
0
1
0
High-Resolution
Figure 67. Equivalent Reference Input Circuitry
Low-Power
Low-Speed
VREFP
VREFN
The average load presented by the switched
capacitor input can be modeled with an effective
differential impedance, as shown in Figure 66. Note
5.2kW
Zeff
=
´ (6.75MHz/fMOD)
N
that the effective impedance is a function of fMOD
.
N = number of active channels.
Figure 68. Effective Reference Impedance
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Table 7. Clock Input Options
ESD diodes protect the reference inputs. To keep
these diodes from turning on, make sure the voltages
on the reference pins do not go below AGND by
more than 0.4 V, and likewise do not exceed AVDD
by 0.4 V. If these conditions are possible, external
Schottky clamp diodes or series resistors may be
required to limit the input current to safe values (see
the Absolute Maximum Ratings table).
MODE
MAX fCLK
DATA RATE
(SPS)
SELECTION
(MHz)
32.768
27
CLKDIV fCLK/fDATA
High-Speed
1
1
1
0
1
0
256
512
128,000
52,734
High-Resolution
27
512
Low-Power
Low-Speed
52,734
10,547
13.5
27
256
2,560
512
Note that the valid operating range of the reference
inputs is limited to the following parameters:
5.4
–0.1 V ≤ VREFN ≤ +0.1 V
MODE SELECTION (MODE)
VREFN + 0.5 V ≤ VREFP ≤ AVDD + 0.1 V
The ADS1278 supports four modes of operation:
High-Speed, High-Resolution, Low-Power, and Low-
Speed. The modes offer optimization of speed,
resolution, and power. Mode selection is determined
by the status of the digital input MODE[1:0] pins, as
shown in Table 8. The ADS1278 continually monitors
the status of the MODE pin during operation.
CLOCK INPUT (CLK)
The ADS1278 requires a clock input for operation.
The individual converters of the ADS1278 operate
from the same clock input. At the maximum data rate,
the clock input can be either 27 MHz or 13.5 MHz for
Low-Power mode, or 2 7MHz or 5.4 MHz for Low-
Speed mode, determined by the setting of the
CLKDIV input. For High-Speed mode, the maximum
CLK input frequency is 32.768 MHz. For High-
Resolution mode, the maximum CLK input frequency
is 27 MHz. The selection of the external clock
frequency (fCLK) does not affect the resolution of the
ADS1278. Use of a slower fCLK can reduce the power
consumption of an external clock buffer. The output
data rate scales with clock frequency, down to a
minimum clock frequency of fCLK = 100 kHz. Table 7
summarizes the ratio of the clock input frequency
(fCLK) to data rate (fDATA), maximum data rate and
corresponding maximum clock input for the four
operating modes.
Table 8. Mode Selection
(1)
MODE[1:0]
MODE SELECTION
High-Speed
MAX fDATA
128,000
52,734
00
01
10
11
High-Resolution
Low-Power
52,734
Low-Speed
10,547
(1) fCLK = 27 MHz max (32.768MHz max in High-Speed mode).
When using the SPI protocol, DRDY is held high after
a mode change occurs until settled (or valid) data are
ready; see Figure 69 and Table 9.
In Frame-Sync protocol, the DOUT pins are held low
after a mode change occurs until settled data are
ready; see Figure 69 and Table 9. Data can be read
from the device to detect when DOUT changes to
logic 1, indicating that the data are valid.
As with any high-speed data converter, a high-quality,
low-jitter clock is essential for optimum performance.
Crystal clock oscillators are the recommended clock
source. Make sure to avoid excess ringing on the
clock input; keeping the clock trace as short as
possible, and using a 50-Ω series resistor placed
close to the source end, often helps.
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MODE[1:0]
Pins
ADS1278
Mode
Previous
Mode
New Mode
tNDR-SPI
SPI
DRDY
DOUT
Protocol
New Mode
Valid Data Ready
tNDR-FS
Frame-Sync
Protocol
New Mode
Valid Data on DOUT
Figure 69. Mode Change Timing
Table 9. New Data After Mode Change
SYMBOL
tNDR-SPI
tNDR-FS
DESCRIPTION
MIN
TYP
MAX
129
UNITS
Time for new data to be ready (SPI)
Time for new data to be ready (Frame-Sync)
Conversions (1/fDATA
)
)
127
128
Conversions (1/fDATA
SYNCHRONIZATION (SYNC)
See Figure 71 for the Frame-Sync format timing
requirement.
The ADS1278 can be synchronized by pulsing the
SYNC pin low and then returning the pin high. When
the pin goes low, the conversion process stops, and
the internal counters used by the digital filter are
reset. When the SYNC pin returns high, the
conversion process restarts. Synchronization allows
the conversion to be aligned with an external event,
such as the changing of an external multiplexer on
the analog inputs, or by a reference timing pulse.
After synchronization, indication of valid data
depends on whether SPI or Frame-Sync format was
used.
In the SPI format, DRDY goes high as soon as SYNC
is taken low; see Figure 70. After SYNC is returned
high, DRDY stays high while the digital filter is
settling. Once valid data are ready for retrieval,
DRDY goes low.
Because the ADS1278 converters operate in parallel
from the same master clock and use the same SYNC
input control, they are always in synchronization with
each other. The aperture match among internal
channels is typically less than 500 ps. However, the
synchronization of multiple devices is somewhat
different. At device power-on, variations in internal
reset thresholds from device to device may result in
uncertainty in conversion timing.
In the Frame-Sync format, DOUT goes low as soon
as SYNC is taken low; see Figure 71. After SYNC is
returned high, DOUT stays low while the digital filter
is settling. Once valid data are ready for retrieval,
DOUT begins to output valid data. For proper
synchronization, FSYNC, SCLK, and CLK must be
established before taking SYNC high, and must then
remain running. If the clock inputs (CLK, FSYNC or
SCLK) are subsequently interrupted or reset, re-
assert the SYNC pin.
The SYNC pin can be used to synchronize multiple
devices to within the same CLK cycle. Figure 70
illustrates the timing requirement of SYNC and CLK
in SPI format.
For consistent performance, re-assert SYNC after
device power-on when data first appear.
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tCSHD
CLK
tSCSU
tSYN
SYNC
DRDY
tNDR
Figure 70. Synchronization Timing (SPI Protocol)
Table 10. SPI Protocol
SYMBOL
tCSHD
tSCSU
tSYN
DESCRIPTION
MIN
10
5
TYP
MAX
UNITS
CLK to SYNC hold time
SYNC to CLK setup time
Synchronize pulse width
Time for new data to be ready
ns
ns
1
CLK periods
tNDR
129
Conversions (1/fDATA)
tCSHD
CLK
tSCSU
tSYN
SYNC
FSYNC
DOUT
tNDR
Valid Data
Figure 71. Synchronization Timing (Frame-Sync Protocol)
Table 11. Frame-Sync Protocol
SYMBOL
tCSHD
tSCSU
tSYN
DESCRIPTION
MIN
10
5
TYP
MAX
UNITS
CLK to SYNC hold time
SYNC to CLK setup time
Synchronize pulse width
Time for new data to be ready
ns
ns
1
CLK periods
Conversions (1/fDATA)
tNDR
127
128
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POWER-DOWN (PWDN)
3. Detect for non-zero data in the powered-up
channel.
The channels of the ADS1278 can be independently
powered down by use of the PWDN inputs. To enter
the power-down mode, hold the respective PWDN pin
low for at least two CLK cycles. To exit power-down,
return the corresponding PWDN pin high. Note that
when all channels are powered down, the ADS1278
enters a microwatt (μW) power state where all
internal biasing is disabled. In this state, the
TEST[1:0] input pins must be driven; all other input
pins can float. The ADS1278 outputs remain driven.
After powering up one or more channels, the
channels are synchronized to each other. It is not
necessary to use the SYNC pin to synchronize them.
When a channel is powered down in TDM data
format, the data for that channel are either forced to
zero (fixed-position TDM data mode) or replaced by
shifting the data from the next channel into the
vacated data position (dynamic-position TDM data
mode).
As shown in Figure 72 and Table 12, a maximum of
130 conversion cycles must elapse for SPI interface,
and 129 conversion cycles must elapse for Frame-
Sync, before reading data after exiting power-down.
Data from channels already running are not affected.
The user software can perform the required delay
time in any of the following ways:
In Discrete data format, the data are always forced to
zero. When powering-up a channel in dynamic-
position TDM data format mode, the channel data
remain packed until the data are ready, at which time
the data frame is expanded to include the just-
powered channel data. See the Data Format section
for details.
1. Count the number of data conversions after
taking the PWDN pin high.
2. Delay 129/fDATA or 130/fDATA after taking the
PWDN pins high, then read data.
· · ·
· · ·
CLK
tPWDN
tNDR
PWDN
DRDY/FSYNC(1)
DOUT
(Discrete Data Output Mode)
Post Power-Up Data
Normal Position
DOUT1
(TDM Mode, Dynamic Position)
Normal Position
Data Shifts Position
DOUT1
(TDM Mode, Fixed Position)
Normal Position
Data Remains in Position
Normal Position
Figure 72. Power-Down Timing
Table 12. Power-Down Timing
SYMBOL
tPWDN
tNDR
DESCRIPTION
MIN
TYP
MAX
UNITS
PWDN pulse width to enter Power-Down mode
Time for new data ready (SPI)
2
CLK periods
129
128
130
129
Conversions (1/fDATA
)
)
tNDR
Time for new data ready (Frame-Sync)
Conversions (1/fDATA
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FORMAT[2:0]
Even though the SCLK input has hysteresis, it is
recommended to keep SCLK as clean as possible to
prevent glitches from accidentally shifting the data.
Data can be read from the ADS1278 with two
interface protocols (SPI or Frame-Sync) and several
options of data formats (TDM/Discrete and
Fixed/Dynamic data positions). The FORMAT[2:0]
inputs are used to select among the options. Table 13
lists the available options. See the DOUT Modes
section for details of the DOUT Mode and Data
Position.
SCLK may be run as fast as the CLK frequency.
SCLK may be either in free-running or stop-clock
operation between conversions. Note that one fCLK is
required after the falling edge of DRDY until the first
rising edge of SCLK. For best performance, limit
fSCLK/fCLK to ratios of 1, 1/2, 1/4, 1/8, etc. When the
device is configured for modulator output, SCLK
becomes the modulator clock output (see the
Modulator Output section).
Table 13. Data Output Format
INTERFACE
PROTOCOL
DOUT
MODE
DATA
POSITION
FORMAT[2:0]
DRDY/FSYNC (SPI Format)
000
001
010
011
100
101
110
SPI
SPI
TDM
TDM
Dynamic
Fixed
—
In the SPI format, this pin functions as the DRDY
output. It goes low when data are ready for retrieval
and then returns high on the falling edge of the first
subsequent SCLK. If data are not retrieved (that is,
SCLK is held low), DRDY pulses high just before the
next conversion data are ready, as shown in
Figure 73. The new data are loaded within one CLK
cycle before DRDY goes low. All data must be shifted
out before this time to avoid being overwritten.
SPI
Discrete
TDM
Frame-Sync
Frame-Sync
Frame-Sync
Modulator Mode
Dynamic
Fixed
—
TDM
Discrete
—
—
SERIAL INTERFACE PROTOCOLS
Data are retrieved from the ADS1278 using the serial
interface. Two protocols are available: SPI and
Frame-Sync. The same pins are used for both
interfaces: SCLK, DRDY/FSYNC, DOUT[8:1], and
DIN. The FORMAT[2:0] pins select the desired
interface protocol.
1/fCLK
1/fDATA
DRDY
SCLK
Figure 73. DRDY Timing with No Readback
SPI SERIAL INTERFACE
DOUT
The SPI-compatible format is a read-only interface.
Data ready for retrieval are indicated by the falling
DRDY output and are shifted out on the falling edge
of SCLK, MSB first. The interface can be daisy-
chained using the DIN input when using multiple
devices. See the Daisy-Chaining section for more
information.
The conversion data are output on DOUT[8:1]. The
MSB data are valid on DOUT[8:1] after DRDY goes
low. Subsequent bits are shifted out with each falling
edge of SCLK. If daisy-chaining, the data shifted in
using DIN appear on DOUT after all channel data
have been shifted out. When the device is configured
for modulator output, DOUT[8:1] becomes the
modulator data output for each channel (see the
Modulator Output section).
NOTE: The SPI format is limited to a CLK input
frequency of 27 MHz, maximum. For CLK input
operation above 27 MHz (High-Speed mode only),
use Frame-Sync format.
DIN
SCLK
This input is used when multiple ADS1278s are to be
daisy-chained together. The DOUT1 pin of the first
device connects to the DIN pin of the next, etc. It can
be used with either the SPI or Frame-Sync formats.
Data are shifted in on the falling edge of SCLK. When
using only one ADS1278, tie DIN low. See the Daisy-
Chaining section for more information.
The serial clock (SCLK) features a Schmitt-triggered
input and shifts out data on DOUT on the falling
edge. It also shifts in data on the falling edge on DIN
when this pin is being used for daisy-chaining. The
device shifts data out on the falling edge and the user
normally shifts this data in on the rising edge.
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DOUT
FRAME-SYNC SERIAL INTERFACE
The conversion data are shifted out on DOUT[8:1].
The MSB data become valid on DOUT[8:1] after
FSYNC goes high. The subsequent bits are shifted
out with each falling edge of SCLK. If daisy-chaining,
the data shifted in using DIN appear on DOUT[8:1]
after all channel data have been shifted out. When
the device is configured for modulator output, DOUT
becomes the modulator data output (see the
Modulator Output section).
Frame-Sync format is similar to the interface often
used on audio ADCs. It operates in slave
fashion—the user must supply framing signal FSYNC
(similar to the left/right clock on stereo audio ADCs)
and the serial clock SCLK (similar to the bit clock on
audio ADCs). The data are output MSB first or left-
justified on the rising edge of FSYNC. When using
Frame-Sync format, the FSYNC and SCLK inputs
must be continuously running with the relationships
shown in the Frame-Sync Timing Requirements.
DIN
SCLK
This input is used when multiple ADS1278s are to be
daisy-chained together. It can be used with either SPI
or Frame-Sync formats. Data are shifted in on the
falling edge of SCLK. When using only one
ADS1278, tie DIN low. See the Daisy-Chaining
section for more information.
The serial clock (SCLK) features a Schmitt-triggered
input and shifts out data on DOUT on the falling
edge. It also shifts in data on the falling edge on DIN
when this pin is being used for daisy-chaining. Even
though SCLK has hysteresis, it is recommended to
keep SCLK as clean as possible to prevent glitches
from accidentally shifting the data. When using
Frame-Sync format, SCLK must run continuously. If it
is shut down, the data readback will be corrupted.
The number of SCLKs within a frame period (FSYNC
clock) can be any power-of-2 ratio of CLK cycles (1,
1/2, 1/4, etc), as long as the number of cycles is
sufficient to shift the data output from all channels
within one frame. When the device is configured for
modulator output, SCLK becomes the modulator
clock output (see the Modulator Output section).
DOUT MODES
For both SPI and Frame-Sync interface protocols, the
data are shifted out either through individual channel
DOUT pins, in a parallel data format (Discrete mode),
or the data for all channels are shifted out, in a serial
format, through a common pin, DOUT1 (TDM mode).
TDM Mode
In TDM (time-division multiplexed) data output mode,
the data for all channels are shifted out, in sequence,
on a single pin (DOUT1). As shown in Figure 74, the
data from channel 1 are shifted out first, followed by
channel 2 data, etc. After the data from the last
channel are shifted out, the data from the DIN input
follow. The DIN is used to daisy-chain the data output
from an additional ADS1278 or other compatible
device. Note that when all channels of the ADS1278
are disabled, the interface is disabled, rendering the
DIN input disabled as well. When one or more
channels of the device are powered down, the data
format of the TDM mode can be fixed or dynamic.
DRDY/FSYNC (Frame-Sync Format)
In Frame-Sync format, this pin is used as the FSYNC
input. The frame-sync input (FSYNC) sets the frame
period, which must be the same as the data rate. The
required number of fCLK cycles to each FSYNC period
depends on the mode selection and the CLKDIV
input. Table 7 indicates the number of CLK cycles to
each frame (fCLK/fDATA). If the FSYNC period is not
the proper value, data readback will be corrupted.
SCLK
1
2
23
24
25
47
48
49
71
73
95
96
97
167
168
169
191
192
193
194
195
72
DOUT1
CH1
CH2
CH3
CH4
CH5
CH7
CH8
DIN
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 74. TDM Mode (All Channels Enabled)
Copyright © 2012, Texas Instruments Incorporated
31
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
TDM Mode, Fixed-Position Data
TDM Mode, Dynamic Position Data
In this TDM data output mode, the data position of
the channels remain fixed, regardless of whether the
channels are powered down. If a channel is powered
down, the data are forced to zero but occupy the
same position within the data stream. Figure 75
shows the data stream with channel 1 and channel 3
powered down.
In this TDM data output mode, when a channel is
powered down, the data from higher channels shift
one position in the data stream to fill the vacated data
slot. Figure 76 shows the data stream with channel 1
and channel 3 powered down.
Discrete Data Output Mode
In Discrete data output mode, the channel data are
shifted out in parallel using individual channel data
output pins DOUT[8:1]. After the 24th SCLK, the
channel data are forced to zero. The data are also
forced to zero for powered down channels. Figure 77
shows the discrete data output format.
SCLK
1
2
23
24
25
47
48
49
71
72
73
95
96
97
167
168
169
191
192
193
194
195
DOUT1
CH1
CH2
CH3
CH4
CH5
CH7
CH8
DIN
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 75. TDM Mode, Fixed-Position Data (Channels 1 and 3 Shown Powered Down)
SCLK
1
2
23
24
25
47
48
49
50
119
120
121
143
144
145
145
146
CH2
CH4
CH5
CH7
CH8
DIN
DOUT1
DRDY
(SPI)
FSYNC
(Frame- Sync)
Figure 76. TDM Mode, Dynamic Position Data (Channels 1 and 3 Shown Powered Down)
32
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
SCLK
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
1
2
22
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
23
24
25
26
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 77. Discrete Data Output Mode
Table 14. Maximum Channels in a Daisy-Chain
(fSCLK = fCLK) (continued)
DAISY-CHAINING
(fSCLK = fCLK
)
Multiple ADS1278s can be daisy-chained together to
output data on a single pin. The DOUT1 data output
pin of one device is connected to the DIN of the next
device. As shown in Figure 78, the DOUT1 pin of
device 1 provides the output data to a controller, and
the DIN of device 2 is grounded. Figure 79 shows the
data format when reading back data.
MAXIMUM NUMBER
OF CHANNELS
MODE SELECTION
High-Speed
CLKDIV
1
1
1
0
1
0
10
21
High-Resolution
21
Low-Power
Low-Speed
10
The maximum number of channels that may be
daisy-chained in this way is limited by the frequency
of fSCLK, the mode selection, and the CLKDIV input.
The frequency of fSCLK must be high enough to
completely shift the data out from all channels within
one fDATA period. Table 14 lists the maximum number
106
21
Whether the interface protocol is SPI or Frame-Sync,
it is recommended to synchronize all devices by tying
the SYNC inputs together. When synchronized in SPI
protocol, it is only necessary to monitor the DRDY
output of one ADS1278.
of daisy-chained channels when fSCLK = fCLK
.
To increase the number of data channels possible in
a chain, a segmented DOUT scheme may be used,
producing two data streams. Figure 80 illustrates four
ADS1278s, with pairs of ADS1278s daisy-chained
together. The channel data of each daisy-chained
pair are shifted out in parallel and received by the
processor through independent data channels.
In Frame-Sync interface protocol, the data from all
devices are ready after the rising edge of FSYNC.
Since DOUT1 and DIN are both shifted on the falling
edge of SCLK, the propagation delay on DOUT1
creates a setup time on DIN. Minimize the skew in
SCLK to avoid timing violations.
Table 14. Maximum Channels in a Daisy-Chain
Copyright © 2012, Texas Instruments Incorporated
33
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
U1
U2
SYNC
CLK
SYNC
SYNC
DRDY
DRDY Output from Device 1
DOUT from Devices 1 and 2
CLK
DIN
CLK
DIN
DOUT1
DOUT1
SCLK
SCLK
SCLK
Note: The number of chained devices is limited by the SCLK rate and device mode.
Figure 78. Daisy-Chaining of Two Devices, SPI Protocol (FORMAT[2:0] = 000 or 001)
SCLK
1
2
25
26
49
50
73
74
97
98
193
194
217
218
385
386
DOUT1
CH1, U1
CH2, U1
CH3, U1
CH4, U1
CH5, U1
CH1, U2
CH2, U2
DIN2
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 79. Daisy-Chain Data Format of Figure 78
SYNC
CLK
Serial Data
Devices 3 and 4
U1
U2
U3
U4
SYNC
CLK
SYNC
CLK
SYNC
CLK
SYNC
CLK
Serial Data
DOUT1
DOUT1
DIN
DOUT1
DIN
DIN
DOUT1
DIN
Devices 1 and 2
FSYNC
SCLK
FSYNC
SCLK
FSYNC
SCLK
FSYNC
SCLK
SCLK
FSYNC
Note: The number of chained devices is limited by the SCLK rate and device mode.
Figure 80. Segmented DOUT Daisy-Chain, Frame-Sync Protocol (FORMAT[2:0] = 011 or 100)
34
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
POWER SUPPLIES
space
space
The ADS1278 has three power supplies: AVDD,
DVDD, and IOVDD. AVDD is the analog supply that
powers the modulator, DVDD is the digital supply that
powers the digital core, and IOVDD is the digital I/O
power supply. The IOVDD and DVDD power supplies
can be tied together if desired (1.8 V). To achieve
rated performance, it is critical that the power
supplies are bypassed with 0.1-μF and 10-μF
capacitors placed as close as possible to the supply
pins. A single 10-μF ceramic capacitor may be
substituted in place of the two capacitors.
MODULATOR OUTPUT
The ADS1278 incorporates a 6th-order, single-bit,
chopper-stabilized modulator followed by a multi-
stage digital filter that yields the conversion results.
The data stream output of the modulator is available
directly, bypassing the internal digital filter. The digital
filter is disabled, reducing the DVDD current, as
shown in Table 15. In this mode, an external digital
filter implemented in an ASIC, FPGA, or similar
device is required. To invoke the modulator output, tie
FORMAT[2:0], as shown in Figure 82. DOUT[8:1]
then becomes the modulator data stream outputs for
each channel and SCLK becomes the modulator
clock output. The DRDY/FSYNC pin becomes an
unused output and can be ignored. The normal
operation of the Frame-Sync and SPI interfaces is
disabled, and the functionality of SCLK changes from
an input to an output, as shown in Figure 82.
Figure 81 shows the start-up sequence of the
ADS1278. At power-on, bring up the DVDD supply
first, followed by IOVDD and then AVDD. Check the
power-supply sequence for proper order, including
the ramp rate of each supply. DVDD and IOVDD may
be sequenced at the same time if the supplies are
tied together. Each supply has an internal reset circuit
whose outputs are summed together to generate a
global power-on reset. After the supplies have
exceeded the reset thresholds, 218 fCLK cycles are
counted before the converter initiates the conversion
process. Following the CLK cycles, the data for 129
conversions are suppressed by the ADS1278 to allow
output of fully-settled data. In SPI protocol, DRDY is
held high during this interval. In frame-sync protocol,
DOUT is forced to zero. The power supplies should
be applied before any analog or digital pin is driven.
For consistent performance, assert SYNC after
device power-on when data first appear.
Table 15. Modulator Output Clock Frequencies
MODULATOR
CLOCK OUTPUT
(SCLK)
MODE
[1:0]
CLKDIV
DVDD (mA)
00
01
1
1
1
0
1
0
fCLK/4
fCLK/4
fCLK/8
fCLK/4
fCLK/40
fCLK/8
8
7
4
4
1
1
10
11
DVDD
IOVDD
AVDD
1V nom(1)
1V nom(1)
Modulator Data Channel 1
DOUT1
DOUT2
3V nom(1)
Modulator Data Channel 2
IOVDD
Internal Reset
CLK
DIN
218
129 (max)
tDATA
FORMAT0
FORMAT1
FORMAT2
fCLK
DOUT8
SCLK
Modulator Data Channel 8
Modulator Clock Output
DRDY
(SPI Protocol)
DOUT
Figure 82. Modulator Output
(Frame-Sync Protocol)
Valid Data
Figure 81. Start-Up Sequence
Copyright © 2012, Texas Instruments Incorporated
35
ADS1278-EP
ZHCSAC0 –AUGUST 2012
www.ti.com.cn
Table 16. Test Mode Pin Map (TEST[1:0] = 11)
In modulator output mode, the frequency of the
modulator clock output (SCLK) depends on the mode
selection of the ADS1278. Table 15 lists the
modulator clock output frequency and DVDD current
versus device mode.
TEST MODE PIN MAP
INPUT PINS
PWDN1
OUTPUT PINS
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
DIN
PWDN2
Figure 83 shows the timing relationship of the
modulator clock and data outputs.
PWDN3
PWDN4
The data output is a modulated 1s density data
stream. When VIN = +VREF, the 1s density is
approximately 80% and when VIN = –VREF, the 1s
density is approximately 20%.
PWDN5
PWDN6
PWDN7
PWDN8
Modulator
MODE0
SCLK
Clock Output
MODE1
SYNC
FORMAT0
FORMAT1
FORMAT2
CLKDIV
FSYNC/DRDY
SCLK
Modulator
DOUT
Data Output
(13ns max)
Figure 83. Modulator Output Timing
VCOM OUTPUT
The VCOM pin provides a voltage output equal to
AVDD/2. The intended use of this output is to set the
output common-mode level of the analog input
drivers. The drive capability of the output is limited;
therefore, the output should only be used to drive
high-impedance nodes (> 1 MΩ). In some cases, an
external buffer may be necessary. A 0.1-μF bypass
capacitor is recommended to reduce noise pickup.
PIN TEST USING TEST[1:0] INPUTS
The test mode feature of the ADS1278 allows
continuity testing of the digital I/O pins. In this mode,
the normal functions of the digital pins are disabled
and routed to each other as pairs through internal
logic, as shown in Table 16. The pins in the left
column drive the output pins in the right column.
Note: some of the digital input pins become outputs;
these outputs must be accommodated in the design.
The analog input, power supply, and ground pins all
remain connected as normal. The test mode is
engaged by setting the pins TEST [1:0] = 11. For
normal converter operation, set TEST[1:0] = 00. Do
not use '01' or '10'.
OPA350
VCOM » (AVDD/2)
0.1mF
Figure 84. VCOM Output
36
Copyright © 2012, Texas Instruments Incorporated
ADS1278-EP
www.ti.com.cn
ZHCSAC0 –AUGUST 2012
APPLICATION INFORMATION
VREFP and VREFN. The reference input should
be driven by a low-impedance source. For best
performance, the reference should have less than
3 μVRMS in-band noise. For references with noise
higher than this level, external reference filtering
may be necessary.
To obtain the specified performance from the
ADS1278, the following layout and component
guidelines should be considered.
1. Power Supplies: The device requires three
power supplies for operation: DVDD, IOVDD, and
AVDD. The allowed range for DVDD is 1.65 V to
1.95 V; the range of IOVDD is 1.65 V to 3.6 V;
AVDD is restricted to 4.75 V to 5.25 V. For all
supplies, use
a
10-μF tantalum capacitor,
bypassed with a 0.1-μF ceramic capacitor, placed
close to the device pins. Alternatively, a single
10-μF ceramic capacitor can be used. The
supplies should be relatively free of noise and
should not be shared with devices that produce
voltage spikes (such as relays, LED display
drivers, etc.). If a switching power-supply source
is used, the voltage ripple should be low (less
than 2 mV) and the switching frequency outside
the passband of the converter.
6. Analog Inputs: The analog input pins must be
driven differentially to achieve specified
performance.
A
true differential driver or
2. Ground Plane: A single ground plane connecting
both AGND and DGND pins can be used. If
separate digital and analog grounds are used,
connect the grounds together at the converter.
transformer (ac applications) can be used for this
purpose. Route the analog inputs tracks (AINP,
AINN) as a pair from the buffer to the converter
using short, direct tracks and away from digital
tracks. A 1-nF to 10-nF capacitor should be used
directly across the analog input pins, AINP and
AINN. A low-k dielectric (such as COG or film
type) should be used to maintain low THD.
Capacitors from each analog input to ground can
be used. They should be no larger than 1/10 the
size of the difference capacitor (typically 100 pF)
to preserve the ac common-mode performance.
3. Digital Inputs: It is recommended to source-
terminate the digital inputs to the device with 50-
Ω series resistors. The resistors should be placed
close to the driving end of digital source
(oscillator, logic gates, DSP, etc.) This placement
helps to reduce ringing on the digital lines (ringing
may lead to degraded ADC performance).
4. Analog/Digital Circuits: Place analog circuitry
(input buffer, reference) and associated tracks
together, keeping them away from digital circuitry
(DSP, microcontroller, logic). Avoid crossing
digital tracks across analog tracks to reduce
noise coupling and crosstalk.
7. Component Placement: Place the power supply,
analog input, and reference input bypass
capacitors as close as possible to the device
pins. This layout is particularly important for
small-value ceramic capacitors. Larger (bulk)
decoupling capacitors can be located farther from
the device than the smaller ceramic capacitors.
5. Reference Inputs: It is recommended to use a
minimum 10-μF tantalum with a 0.1-μF ceramic
capacitor directly across the reference inputs,
Copyright © 2012, Texas Instruments Incorporated
37
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ADS1278MPAPTEP
V62/12611-01XE
ACTIVE
ACTIVE
HTQFP
HTQFP
PAP
PAP
64
64
250
250
RoHS & Green
RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-55 to 125
-55 to 125
ADS1278EP
ADS1278EP
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
GENERIC PACKAGE VIEW
PAP 64
10 x 10, 0.5 mm pitch
HTQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
www.ti.com
PACKAGE OUTLINE
TM
PAP0064G
PowerPAD TQFP - 1.2 mm max height
SCALE 1.300
PLASTIC QUAD FLATPACK
10.2
9.8
B
NOTE 3
64
49
PIN 1 ID
1
48
10.2
9.8
12.2
TYP
11.8
NOTE 3
16
33
17
32
A
0.27
64X
60X 0.5
0.17
0.08
C A B
4X 7.5
C
SEATING PLANE
1.2 MAX
(0.127)
TYP
SEE DETAIL A
17
32
0.25
GAGE PLANE
(1)
33
16
0.15
0.05
0.08 C
0 -7
0.75
0.45
65
7.00
5.99
DETAIL A
A
17
TYPICAL
1
48
49
64
4218924/A 01/2022
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features may not be present.
5. Reference JEDEC registration MS-026.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
PAP0064G
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
8)
NOTE 8
(
7)
SYMM
SOLDER MASK
49
64
DEFINED PAD
64X (1.5)
(R0.05)
TYP
1
48
64X (0.3)
65
(11.4)
SYMM
(1.3 TYP)
60X (0.5)
33
16
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
17
32
SEE DETAILS
(1.3 TYP)
(11.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4218924/A 01/2022
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
PAP0064G
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
7)
BASED ON 0.125
THICK STENCIL
SYMM
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
64
49
64X (1.5)
1
48
64X (0.3)
(R0.05) TYP
SYMM
65
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
32
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
7.83 X 7.83
7.0 X 7.0 (SHOWN)
6.39 X 6.39
0.125
0.15
0.175
5.92 X 5.92
4218924/A 01/2022
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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