ADS52J90ZZE [TI]
14 位多通道低功耗高速模数转换器 (ADC) | ZZE | 198 | -40 to 85;型号: | ADS52J90ZZE |
厂家: | TEXAS INSTRUMENTS |
描述: | 14 位多通道低功耗高速模数转换器 (ADC) | ZZE | 198 | -40 to 85 转换器 模数转换器 |
文件: | 总153页 (文件大小:4702K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ADS52J90
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
具有 LVDS、JESD 输出的 ADS52J90 10 位、12 位、14 位多通道低功耗
高速 ADC
1 特性
3 说明
1
•
16 通道 ADC,可配置为转换
8、16 或 32 路输入
ADS52J90 是一款低功耗、高性能、16 通道的模数转
换器 (ADC)。每个 ADC 在 10 位模式下的转换速率最
高可达 100MSPS。ADC 分辨率越高,最高转换速率
越低。
•
•
10 位、12 位和 14 位三种分辨率模式
最大 ADC 转换速率:
–
–
–
10 位模式下为 100MSPS
12 位模式下为 80MSPS
14 位模式下为 65MSPS
该器件可配置为接受 8、16 或 32 个输入。在 32 位模
式下,每个 ADC 以值为 ADC 转换速率一半的有效采
样率对两个不同输入交替进行采样并转换。在 8 位输
入模式下,两个 ADC 以交错方式对同一输入进行转
换,这种情况下的有效采样率为 ADC 转换速率的 2
倍。ADC 设计为根据转换速率调整其功耗。
•
16 个 ADC 经配置可进行下列转换:
–
–
–
8 个输入,采样率为
ADC 转换速率的 2 倍
16 个输入,采样率与
ADC 转换速率相同
器件信息
32 个输入,采样率为
ADC 转换速率的一半
器件型号
ADS52J90
封装
封装尺寸(标称值)
NFBGA (198)
9.00mm × 15.00mm
•
•
支持 10/12/14/16 倍串行化的低压差分信令 (LVDS)
输出
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
5Gbps JESD 接口:
简化原理图
–
–
–
在 16 输入和 32 输入模式下受支持
JESD204B 子类 0、1 和 2
AVDD_1P8
DVDD_1P2
DVDD_1P8
每条 JESD 信道包含 2、4 或 8 条通道
Reference
VCM
(1)
Generator
ADC 1
•
•
•
•
•
可选的数字 I-Q 解调器
电源:1.2V、1.8V
DOUTP1
DOUTM1
INP1
INM1
DOUTP2
DOUTM2
2 VPP 差分输入,0.8V 共模
差分或单端输入时钟
信噪比 (SNR):
INP2
INM2
DOUTP16
DOUTM16
–
–
–
10 位模式下为 61dBFS
12 位模式下为 70dBFS
14 位模式下为 73.5dBFS
INP31
INM31
FCLKP
FCLKM
ADC 16
DCLKP
DCLKM
INP32
INM32
•
•
•
100MSPS 转换速率下的功耗:41mW/通道
封装:NFBGA-198 (9mm x 15mm)
无铅(符合 RoHS 标准)绿色
CML1_OUTP
CML1_OUTM
CML8_OUTP
CML8_OUTM
2 应用
•
•
•
•
超声波成像
Clock
Generator
CLKP
CLKM
Serial
Interface
便携式仪表
SYNC
Generator
SDOUT
声纳和雷达
高速多通道数据采集
(1) 本文档中未详细介绍。如需详细信息,请联系工厂。
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBAS690
ADS52J90
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
www.ti.com.cn
目录
8.4 Device Functional Modes........................................ 73
8.5 Programming........................................................... 76
Application and Implementation ........................ 77
9.1 Application Information............................................ 77
9.2 Typical Application .................................................. 78
9.3 Do's and Don'ts....................................................... 90
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明 (续).............................................................. 4
Pin Configuration and Functions......................... 5
Specifications......................................................... 9
7.1 Absolute Maximum Ratings ...................................... 9
7.2 ESD Ratings.............................................................. 9
7.3 Recommended Operating Conditions..................... 10
7.4 Thermal Information................................................ 10
7.5 Electrical Characteristics......................................... 11
7.6 Digital Characteristics ............................................. 13
7.7 Timing Requirements: Signal Chain ....................... 14
7.8 Timing Requirements: JESD Interface.................... 15
7.9 Timing Requirements: Serial Interface.................... 15
7.10 Typical Characteristics.......................................... 17
7.11 Typical Characteristics: JESD Interface................ 24
7.12 Typical Characteristics: Contour Plots.................. 26
Detailed Description ............................................ 28
8.1 Overview ................................................................. 28
8.2 Functional Block Diagrams ..................................... 28
8.3 Feature Description................................................. 29
9
10 Power Supply Recommendations ..................... 90
10.1 Power Sequencing and Initialization..................... 90
11 Layout................................................................... 92
11.1 Power Supply, Grounding, and Bypassing ........... 92
11.2 Layout Guidelines ................................................. 92
11.3 Layout Example .................................................... 93
12 Register Map........................................................ 94
12.1 ADC Registers ...................................................... 94
12.2 JESD Serial Interface Registers ......................... 134
13 器件和文档支持 ................................................... 149
13.1 文档支持.............................................................. 149
13.2 社区资源.............................................................. 149
13.3 商标..................................................................... 149
13.4 静电放电警告....................................................... 149
13.5 术语表 ................................................................. 149
14 机械、封装和可订购信息..................................... 150
8
4 修订历史记录
Changes from Revision B (August 2015) to Revision C
Page
•
已更改 HPF_ROUND_ENABLE register bit (register 15, bit 5) to HPF_ROUND_EN_CH1-8 and
HPF_ROUND_EN_CH9-16 bits in last paragraph of Digital HPF section ........................................................................... 40
•
•
•
•
•
•
•
•
•
已更改 Masking of the Various Reset Operations Resulting from SYNC~ or SYSREF table ............................................. 59
已添加 Interfacing SYNC~ and SYSREF Between the FPGA and ADCs section ............................................................... 65
已更改 Mapping of Analog Inputs to LVDS Outputs (8-Input Mode, 1X Data Rate) table ................................................... 84
已更改 Mapping of Analog Inputs to LVDS Outputs (8-Input Mode, 2X Data Rate) table ................................................... 85
已更改 description for the value 001 in Pattern Mode Bit Description table......................................................................... 99
已更改 bit 5 from HPF_ROUND_EN to HPF_ROUND_EN_CH1-8 in Register 15 ........................................................... 109
已更改 bit 5 from 0 to HPF_ROUND_EN_CH9-16 in Register 2Dh .................................................................................. 123
已更改 description for JESD_RESET1 in Register 70........................................................................................................ 135
已更改 description of JESD_RESET2 and JESD_RESET3 in Register 74 ....................................................................... 137
Changes from Revision A (June 2015) to Revision B
Page
•
•
•
•
•
•
•
•
已更改文档标题以包含 LVDS 和 JESD 输出 .......................................................................................................................... 1
已添加 JESD 接口 可选解调器和 特性 要点 ........................................................................................................................... 1
更改简化原理图....................................................................................................................................................................... 1
已添加 JESD 接口信息至说明 部分中添加了“概述”部分......................................................................................................... 4
Added footnote 1 to Pin Functions table ................................................................................................................................ 6
Changed description of SPI_DIG_EN pin in Pin Functions table........................................................................................... 8
Changed title of Current Consumption with LVDS Interface Enabled section of Electrical Characteristics table................ 12
Changed Current Consumption with JESD Interface Enabled section of Electrical Characteristics table........................... 12
2
版权 © 2015–2018, Texas Instruments Incorporated
ADS52J90
www.ti.com.cn
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
•
•
•
•
•
Added SPI_DIG_EN to Digital Inputs section title of Digital Characteristics table ............................................................... 13
Changed VOC-CML parameter name in JESD Interface Timing Requirements table.............................................................. 15
Added 图 47.......................................................................................................................................................................... 25
Added LVDS, JESD discussion to second paragraph of Overview section......................................................................... 51
添加了社区资源部分 ........................................................................................................................................................... 149
Changes from Original (May 2015) to Revision A
Page
•
•
已投入量产.............................................................................................................................................................................. 1
已更改 Circuit to Level-Shift the Common-Mode Voltage From 1.2 V at the Driver Output to 0.7 V at the ADC Input
figure..................................................................................................................................................................................... 65
•
已更改 AC-Coupling Scheme for SYSREF figure ................................................................................................................ 66
版权 © 2015–2018, Texas Instruments Incorporated
3
ADS52J90
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
www.ti.com.cn
5 说明 (续)
ADC 输出会进行串行化,并与帧时钟和高速位时钟一起通过低压差分信令 (LVDS) 接口输出。
该器件还具有一个可选的 JESD204B 接口,同时可在 16 输入和 32 输入模式下工作。该接口的运行速率最高可达
5Gbps。
ADS52J90 采用间距为 0.8mm 的 9mm × 15mm NFBGA-198 封装,额定工作温度范围为 –40°C 至 +85°C。
4
Copyright © 2015–2018, Texas Instruments Incorporated
ADS52J90
www.ti.com.cn
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
6 Pin Configuration and Functions
ZZE Package
NFBGA-198 (15 mm × 9 mm)
Top View
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
INM2
INP2
INP1
AVDD_1P8
SDIN
RESET
DVDD_1P2
DVSS
CML1_OUTP
CML1_OUTM
CML2_OUTP
INM3
INM5
INP3
INP5
INM1
INP4
AVSS
AVSS
AVSS
INP8
SEN
SDOUT
NC
SPI_DIG_EN
PDN_FAST
TX_TRIG
AVDD_1P8
AVDD_1P8
AVDD_1P8
AVSS
SCLK
PDN_GBL
DVSS
DVDD_1P2
DVDD_1P2
DVDD_1P2
DVDD_1P8
DVDD_1P8
DVDD_1P8
DVSS
DOUTP1
DOUTP2
DOUTP3
DOUTP4
DOUTP5
DOUTP6
DOUTP7
FCLKP
DOUTM1
DOUTM2
DOUTM3
DOUTM4
DOUTM5
DOUTM6
DOUTM7
DVDD_1P8
DVSS
CML2_OUTM
CML3_OUTP
CML3_OUTM
CML4_OUTP
CML4_OUTM
DOUTM8
INM6
INP6
INM4
INM7
INP7
INM8
NC
DVSS
INM9
INP9
INM10
INM12
INM14
INM16
INM18
INM20
INM22
INM24
INM26
INM28
INP28
INM32
INP32
INP10
INP12
INP14
INP16
INP18
INP20
INP22
INP24
INP26
AVSS
AVSS
AVSS
AVDD_1P8
VCM
DVDD_1P2
DVDD_1P2
DVSS
G
H
J
INM11
INM13
INM15
INM17
INM19
INM21
INM23
INM25
INM27
INM29
INM30
INM31
INP11
INP13
INP15
INP17
INP19
INP21
INP23
INP25
INP27
INP29
INP30
INP31
AVDD_1P8
AVSS
AVSS
AVSS
AVSS
AVDD_1P8
NC
DOUTP8
AVSS
DVSS
DVSS
DCLKP
K
L
AVSS
DVSS
DVSS
FCLKM
DCLKM
AVSS
DVSS
DVSS
DOUTP10
DOUTP11
DOUTP12
DOUTP13
DOUTP14
DOUTP15
DOUTP16
CML5_OUTP
DOUTM10
DOUTM11
DOUTM12
DOUTM13
DOUTM14
DOUTM15
DOUTM16
CML5_OUTM
DOUTP9
M
N
P
R
T
AVDD_1P8
AVDD_1P8
AVDD_1P8
DVSS
DVDD_1P2
DVDD_1P2
DVDD_1P8
DVDD_1P8
DVDD_1P8
DVDD_1P2
DVDD_1P2
DVDD_1P2
DVSS
DOUTM9
CML8_OUTM
CML8_OUTP
CML7_OUTM
CML7_OUTP
CML6_OUTM
CML6_OUTP
SYNCM_
SERDES
NC
SYNCP_
SERDES
AVSS
AVSS
CLKM
CLKP
SYSREFM_
SERDES
DVDD_1P2
AVSS
SYSREFP_
SERDES
U
V
AVSS
DVDD_1P2
Copyright © 2015–2018, Texas Instruments Incorporated
5
ADS52J90
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
www.ti.com.cn
Pin Functions(1)
PIN
I/O
DESCRIPTION
NAME
AVDD_1P8
NO.
A4, E6, F6, G5, G6, M5,
M6, N6, P6, V4
P
1.8-V analog supply voltage
Analog ground
B4, C4, D4, H5, H6, J5,
J6, K5, K6, L5, L6, R4, R5,
T4, T5, U4, U6, V6
AVSS
G
CLKM
U5
V5
Differential clock input pins. A single-ended clock is also supported.
See the Clock Input section for further details.
I
CLKP
CML1_OUTM
CML1_OUTP
CML2_OUTM
CML2_OUTP
CML3_OUTM
CML3_OUTP
CML4_OUTM
CML4_OUTP
CML5_OUTM
CML5_OUTP
CML6_OUTM
CML6_OUTP
CML7_OUTM
CML7_OUTP
CML8_OUTM
CML8_OUTP
DCLKM
A10
A9
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
JESD output lane 1
JESD output lane 2
JESD output lane 3
JESD output lane 4
JESD output lane 5
JESD output lane 6
JESD output lane 7
JESD output lane 8
LVDS bit clock output
LVDS data lane 1
LVDS data lane 2
LVDS data lane 3
LVDS data lane 4
LVDS data lane 5
LVDS data lane 6
LVDS data lane 7
LVDS data lane 8
LVDS data lane 9
LVDS data lane 10
LVDS data lane 11
LVDS data lane 12
B11
A11
D11
C11
F11
E11
V10
V9
U11
V11
R11
T11
N11
P11
K11
J11
B10
B9
DCLKP
DOUTM1
DOUTP1
DOUTM2
C10
C9
DOUTP2
DOUTM3
D10
D9
DOUTP3
DOUTM4
E10
E9
DOUTP4
DOUTM5
F10
F9
DOUTP5
DOUTM6
G10
G9
DOUTP6
DOUTM7
H10
H9
DOUTP7
DOUTM8
G11
H11
M11
L11
L10
L9
DOUTP8
DOUTM9
DOUTP9
DOUTM10
DOUTP10
DOUTM11
DOUTP11
DOUTM12
DOUTP12
M10
M9
N10
N9
(1) If the JESD interface is not used, then do not connect the CMLx, SYNCx, and SYSREFx pins. If the LVDS interface is not used, then do
not connect DOUTx, DCLKx, and FCLKx.
6
Copyright © 2015–2018, Texas Instruments Incorporated
ADS52J90
www.ti.com.cn
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
Pin Functions(1) (continued)
PIN
I/O
DESCRIPTION
NAME
DOUTM13
DOUTP13
DOUTM14
DOUTP14
DOUTM15
DOUTP15
DOUTM16
DOUTP16
NO.
P10
P9
O
LVDS data lane 13
LVDS data lane 14
LVDS data lane 15
LVDS data lane 16
R10
R9
O
T10
T9
O
U10
U9
O
A7, B8, C8, D8, F7, G7,
M7, N7, R8, T6, T8, U8,
V7
DVDD_1P2
DVDD_1P8
DVSS
P
P
G
1.2-V digital supply voltage
1.8-V digital supply voltage
Digital ground
E8, F8, G8, J10, M8, N8,
P8
A8, D7, E7, H7, H8, J7,
J8, K7, K8, K10, L7, L8,
R6, V8
FCLKM
FCLKP
INM1
INP1
K9
J9
O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
LVDS frame clock output
B3
A3
A1
A2
B1
B2
D3
C3
C1
C2
D1
D2
E1
E2
E3
E4
F1
F2
F3
F4
G1
G2
G3
G4
H1
H2
H3
H4
J1
Differential analog input 1 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM2
INP2
Differential analog input 2 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM3
INP3
Differential analog input 3 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM4
INP4
Differential analog input 4 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM5
INP5
Differential analog input 5 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM6
INP6
Differential analog input 6 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM7
INP7
Differential analog input 7 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM8
INP8
Differential analog input 8 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM9
INP9
Differential analog input 9 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
INM10
INP10
INM11
INP11
INM12
INP12
INM13
INP13
INM14
INP14
INM15
INP15
INM16
INP16
INM17
INP17
Differential analog input 10 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
Differential analog input 11 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
Differential analog input 12 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
Differential analog input 13 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
Differential analog input 14 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
Differential analog input 15 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
J2
J3
Differential analog input 16 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
J4
K1
K2
Differential analog input 17 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
Copyright © 2015–2018, Texas Instruments Incorporated
7
ADS52J90
ZHCSDS3C –MAY 2015–REVISED APRIL 2018
www.ti.com.cn
Pin Functions(1) (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
INM18
INP18
INM19
INP19
INM20
INP20
INM21
INP21
INM22
INP22
INM23
INP23
INM24
INP24
INM25
INP25
INM26
INP26
INM27
INP27
INM28
INP28
INM29
INP29
INM30
INP30
INM31
INP31
INM32
INP32
NC
K3
Differential analog input 18 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
K4
L1
Differential analog input 19 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
L2
L3
Differential analog input 20 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
L4
M1
Differential analog input 21 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
M2
M3
Differential analog input 22 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
M4
N1
Differential analog input 23 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
N2
N3
Differential analog input 24 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
N4
P1
Differential analog input 25 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
P2
P3
Differential analog input 26 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
P4
R1
Differential analog input 27 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
R2
R3
Differential analog input 28 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
T3
T1
Differential analog input 29 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
T2
U1
Differential analog input 30 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
U2
V1
Differential analog input 31 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
V2
U3
V3
Differential analog input 32 pins; see 表 1 for mapping to external inputs in 8-, 16-, and
32-input modes
D5, E5, N5, P5
—
I
Do not connect; leave floating.
Fast power-down control pin (active high) with an internal pulldown resistor of 20 kΩ.
For active high, a 1.8-V logic level is recommended.
PDN_FAST
PDN_GBL
SPI_DIG_EN
RESET
C6
C7
B6
A6
B7
A5
C5
B5
Global power-down control input (active high) with an internal pulldown resistor of 20
kΩ. For active high, a 1.8-V logic level is recommended.
I
I
Reserved for digital functionality. This pin can be left floating or be connected to the
1.8-V supply. This pin has an internal pullup resistor of 20 kΩ.
Hardware reset pin (active high) with an internal pulldown resistor of 20 kΩ. For active
high, a 1.8-V logic level is recommended.
I
Serial interface clock input with an internal pulldown resistor of 20 kΩ. For active high,
a 1.8-V logic level is recommended.
SCLK
I
Serial interface data input with an internal pulldown resistor of 20 kΩ. For active high, a
1.8-V logic level is recommended.
SDIN
I
Serial interface data readout. High impedance when readout is disabled. 1.8-V logic
level is recommended.
SDOUT
SEN
O
I
Serial interface enable with an internal pullup resistor of 20 kΩ. 1.8-V logic level is
recommended.
1.8-V logic; a pulse on TX_TRIG must be applied after power-up to ensure that all
internal clock dividers are synchronized(2).Has an internal pull-down resistor of 20 kΩ
to ground.
TX_TRIG
D6
I
I
SYNCM_SERDES
SYNCP_SERDES
P7
R7
Frame synchronization input as per JESD204B standard
(2) See the Device Synchronization Using TX_TRIG section for more details on synchronization using TX_TRIG.
8
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Pin Functions(1) (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
T7
SYSREFM_SERDES
SYSREFP_SERDES
Frame clock and local multiframe clock (LMFC) synchronization input as per
JESD204B, subclass 1 standard
I
U7
Common-mode output pin for biasing analog input signals. Connect a 10-µF capacitor
to ground.
VCM
F5
O
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
UNIT
AVDD_1P8
2.2
Voltage
DVDD_1P2
DVDD_1P8
1.35
V
2.2
Analog input pins (INMi, INPi)
CLKP, CLKM
Minimum [2.2, (AVDD_1P8 + 0.3)]
Minimum [2.2, (AVDD_1P8 + 0.3)]
V
V
PDN_GBL, PDN_FAST, RESET, SCLK, SDIN,
SEN, TX_TRIG, SPI_DIG_EN,
SYNCM_SERDES, SYNCP_SERDES,
SYSREFM_SERDES, SYSREFP_SERDES
Digital control pins
–0.3
Minimum [2.2, (DVDD_1P8 + 0.3)]
V
Maximum operating junction temperature, TJMax
Storage temperature, Tstg
105
150
°C
°C
–55
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
TEMPERATURE
TA
Ambient
–40
85
°C
SUPPLIES
V(AVDD_1P8)
V(DVDD_1P8)
V(DVDD_1P2)
ANALOG INPUT
V(INx)
1.8-V analog supply voltage
1.8-V digital supply voltage
1.2-V digital supply voltage
1.7
1.7
1.8
1.8
1.2
1.9
1.9
V
V
V
1.15
1.25
Voltage range at analog input pins
VCM – 0.5
0.7
VCM + 0.5
0.9
V
V
Input common-mode range at
analog input pins
VIN(CM)
0.8
2
VIN(FS)
Input differential full-scale voltage
Analog input frequency range(1)
VPP
FIN
0
70
MHz
ANALOG OUTPUT
I(VCM)
External loading on VCM pin
±50-mV change in VCM
100
µA
CLOCK INPUT
16-input mode, 10-bit ADC resolution
16-input mode, 12-bit ADC resolution
16-input mode, 14-bit ADC resolution
32-input mode, 10-bit ADC resolution
32-input mode, 12-bit ADC resolution
32-input mode, 14-bit ADC resolution
8-input mode, 10-bit ADC resolution
Sine-wave, ac-coupled
5
5
100
80
5
65
fS
System clock frequency
5
100
80
MSPS
5
5
65
10
0.7
200
VCLKP – VCLKM
Differential clock amplitude
LVPECL, ac-coupled
1.6
0.7
VPP
VPP
LVDS, ac-coupled
0.35
40%
VCLKP
Single-ended clock amplitude
Input clock duty cycle
LVCMOS on CLKP with CLKM grounded
1.8
50%
60%
DIGITAL INPUTS
0.75 ×
DVDD_1P8
VIH
Digital input minimum, high level
Digital input maximum, low level
1.8
0
V
V
0.25 ×
DVDD_1P8
VIL
DIGITAL OUTPUT (LVDS)
RLOAD
Differential load resistance
Between DOUTP and DOUTM
100
50
Ω
Ω
DIGITAL OUTPUT (CML)
RCML
Load resistance from each CML output to a common mode
(1) Performance degradation may be seen at high input frequencies.
7.4 Thermal Information
ADS52J90
ZZE (NFBGA)
198 PINS
33.7
THERMAL METRIC(1)
UNITS
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
4.9
14.1
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.1
ψJB
14.1
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
10
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7.5 Electrical Characteristics
Typical values are across ADC resolution and input modes, unless otherwise specified. Typical values are at 25°C,
AVDD_1P8 = DVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V. External 100-Ω differential load between LVDS outputs, 4-pF load
capacitor from each LVDS output to ground, and 1X data rate mode.
All ADCs are powered up and the input signal is a –1-dBFS tone at 5 MHz applied on one channel at a time.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ADC
32-channel input, 16-channel input
8-channel input
10
14
Nadc
ADC resolution
Bits
10
16
Number of ADCs
ADCs
CLOCK DOMAINS
10-bit ADC resolution
12-bit ADC resolution
14-bit ADC resolution
16-input mode
100
80
Conversion rate of each ADC
(conversion clock frequency)
fC
MSPS
MSPS
MSPS
65
fC
fC
System clock frequency in
terms of fC
fS
32-input mode
8-input mode
2 × fC
fC
16-input mode
Effective sampling rate of each
input channel in terms of fC
fSAMP
32-input mode
0.5 × fC
2 × fC
8-input mode
PERFORMANCE
Same device, across channels
Same channel, across devices
±0.1
±0.1
GMATCH
Gain matching
dB
Gain drift with temperature over
full temperature range
GDRIFT
VOFF
0.1
dB
Offset error
–7 to 7
–0.5 to 0.5
–0.9 to 0.9
–1 to 2
–0.5 to 0.5
–1 to 1
–3 to 3
61.3
mV
10-bit resolution
12-bit resolution
14-bit resolution
10-bit resolution
Differential nonlinearity of the
ADC
DNL
INL
LSB
LSB
Integral nonlinearity of the ADC 12-bit resolution
14-bit resolution
10-bit, 16-channel input mode, fSAMP = 100 MSPS
10-bit, 32-channel input mode, fSAMP = 50 MSPS
10-bit mode, 8-channel input, fSAMP = 200 MSPS
10-bit mode, 8-channel input, fSAMP = 130 MSPS
12-bit mode, 16- channel input, fSAMP = 80 MSPS
12-bit mode, 32-channel input, fSAMP = 40 MSPS
12-bit mode, 32-channel input, fSAMP = 20 MSPS
14-bit mode, 16- channel input, fSAMP = 65 MSPS
14-bit mode, 16- channel input, fSAMP = 50 MSPS
14-bit mode, 32-channel input, fSAMP = 32.5 MSPS
61.3
56
60
58.2
61
Signal-to-noise ratio:
69.5
excludes first 9 harmonics as
well as spurs at (fS / 2 ± fIN),
(fS / 4 ± fIN), fS / 2, and fS / 4
SNR
dBFS
65
67.5
65.9
67.9
69.5
70.2
72.5
73.5
73
Second-order harmonic
distortion
HD2
All input modes and resolutions
–80
dBc
HD3
THD
Third-order harmonic distortion All input modes and resolutions
–80
–76
–73
–62
dBc
dBc
Total harmonic distortion
All input modes and resolutions
16-input mode; 10-,12-,14-bit resolutions
8-input mode, 10-bit resolution
Magnitude of spur at
dBc
(fS / 2 ± fIN
)
Magnitude of spur at
8-input mode, 10-bit resolution
–65
–80
dBc
dBc
(fS / 4 ± fIN
)
Input spur on neighboring channel with one channel
excited at 5 MHz, –1 dBFS
Crosstalk
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Electrical Characteristics (continued)
Typical values are across ADC resolution and input modes, unless otherwise specified. Typical values are at 25°C,
AVDD_1P8 = DVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V. External 100-Ω differential load between LVDS outputs, 4-pF load
capacitor from each LVDS output to ground, and 1X data rate mode.
All ADCs are powered up and the input signal is a –1-dBFS tone at 5 MHz applied on one channel at a time.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PERFORMANCE (continued)
AC power-supply rejection ratio:
PSRR100kHz
tone at output relative to tone
on supply
100-mVPP, 100-kHz tone on supply
–70
dBc
AC power-supply modulation
ratio: intermodulation tone at
output resulting from tones at
supply and input measured
relative to input tone
100-mVPP, 100-kHz tone on supply and –1-dBFS,
5-MHz tone on input
PSMR100kHz
–80
–40
dBc
dBc
AC common-mode rejection
ratio: tone at output relative to
the common-mode tone applied frequency of 5 MHz
at the analog input pins
50-mVPP common-mode tone at input pins with a
CMRR
TRANSIENT BEHAVIOR
NOVERLOAD Input overload recovery
tPDN_GBL
Conversion
clock
5-MHz overload input, 6-dBFS overload
PDN_GBL from high to low
1
1
Recovery time from global
power-down mode
ms
Recovery time from fast power-
down mode (standby mode)
Conversion
clocks
tPDN_FAST
PDN_FAST from high to low
15
CURRENT CONSUMPTION WITH LVDS INTERFACE ENABLED
AVDD_1P8 current
3
3
Current consumption in global
power-down mode
(PDN_GBL = 1)
DVDD_1P8 current
DVDD_1P2 current
AVDD_1P8 current
DVDD_1P8 current
DVDD_1P2 current
AVDD_1P8 current
DVDD_1P8 current
DVDD_1P2 current
16-channel input mode
32-channel input mode
8-channel input mode
mA
mA
25
80
Current consumption in standby
mode (PDN_FAST = 1) at
fC = 100 MSPS
35
70
190
100
110
41
Current consumption in active
mode at fC = 100 MSPS(1)
mA
Power dissipation in active
mode per input channel at
fC = 100 MSPS
PCH
20.5
82
mW/channel
CURRENT CONSUMPTION WITH JESD INTERFACE ENABLED
AVDD_1P8 current(1)
170
260
40
Supply currents: JESD204B
interface enabled, LVDS
interface disabled at 12-bit, 80-
MSPS, 4 ADCs per lane mode
IJESD
DVDD_1P2 current(1)
DVDD_1P8 current(1)
16-channel input mode
mA
Power dissipation in active
mode per input channel: fC = 80
MSPS, 12-bit mode, LVDS
interface disabled, JESD
interface enabled (4 ADCs per
lane mode)
43.1
PJESD_CH
mW/channel
32-channel input mode
21.6
(1) See the Power Supply Recommendations section for guidelines on designing the supplies.
12
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7.6 Digital Characteristics
The dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic
level 0 or 1. Typical values are at 25°C, AVDD_1P8 = DVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V, and external differential load
resistance between the LVDS output pair (RLOAD = 100 Ω), unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS (PDN_FAST, PDN_GBL, RESET, SCLK, SDIN, SEN, TX_TRIG, SPI_DIG_EN)
VIH
VIL
IIH
IIL
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
Input capacitance
1.35
V
V
0.45
150
150
4
µA
µA
pF
Ci
DIGITAL OUTPUTS (SDOUT)
VOH
VOL
zo
High-level output voltage
Low-level output voltage
Output impedance
1.6
1.8
0
V
V
Ω
0.2
50
LVDS DIGITAL OUTPUTS (DOUTPI, DOUTMI)(1)
100-Ω external load connected differentially
across DOUTPI and DOUTMI
|VOD
|
Output differential voltage
320
0.9
400
480
mV
V
Output offset voltage
(common-mode voltage of
DOUTPI and DOUTMI)
100-Ω external load connected differentially
across DOUTPI and DOUTMI
VOS
1.03
1.15
(1) All digital specifications are characterized across operating temperature range but are not tested at production.
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7.7 Timing Requirements: Signal Chain
Typical values are at 25°C. AVDD_1P8 = DVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V, and external differential load resistance
between the LVDS output pair (RLOAD= 100 Ω), unless otherwise noted. A capacitive load of 4 pF is on the LVDS outputs.
MIN
TYP
MAX
UNIT
GENERAL
tAP
Aperture delay
1.6
±0.5
0.5
ns
ns
ps
Aperture delay variation from device to device
(at same temperature and supply)
δtAP
tAPJ
Aperture jitter with LVPECL clock as input clock
ADC TIMING
Default after reset
ADC latency
8.5
4.5
Conversion
clocks
NLAT
Low-latency mode
LVDS TIMING
16-input and 8-input modes
Frame clock frequency
fC
fC / 2
50%
fF
MHz
32-input mode
DFRAME
NSER
Frame clock duty cycle
Number of bits serialization of each ADC word
10
16
Bits
Mbps
MHz
Output rate of serialized data for 1X output data rate
mode, 16-, 8-. and 32-input modes
NSER × fC
1000
fD
Output rate of serialized data for 2X output data rate
mode, 16-input and 8-input modes
2 × NSER × fC
1000
500
fB
Bit clock frequency
Bit clock duty cycle
Data bit duration
fD / 2
50%
DBIT
tD
1
1000 / fD
6 × tD+ 5
ns
ns
tPROP
Clock propagation delay(1)
Clock propagation delay variation from device to device
(at same temperature and supply)
δtPROP
±2
ns
ns
DOUT, DCLK, FCLK rise and fall time, transition time
between –100 mV and +100 mV
tORF
0.2
tOSU
tOH
tDV
Minimum serial data, serial clock setup time(2)
Minimum serial data, serial clock hold time(2)
Minimum data valid window(3)(2)
tD / 2 – 0.4
tD / 2 – 0.4
tD – 0.65
ns
ns
ns
TX_TRIG TIMING
tTX_TRIG_DEL
Delay between TX_TRIG and TX_TRIGD(4)
(5)
0.5
0.4 × tS
ns
ns
Setup time related to latching TX_TRIG relative to the
rising edge of the system clock
tSU_TX_TRIGD
0.6
0.4
Hold time related to latching TX_TRIG relative to the
rising edge of the system clock
tH_TX_TRIGD
ns
(1) See 图 64 to 图 68 for the definition of tPROP in various operating modes.
(2) See 图 1.
(3) The specification for the minimum data valid window is larger than the sum of the minimum setup and hold times because there can be
a skew between the ideal transitions of the serial output data with respect to the transition of the bit clock. This skew can vary across
channels and across devices. A mechanism to correct this skew can therefore improve the setup and hold timing margins. For example,
the LVDS_DCLK_DELAY_PROG control can be used to shift the relative timing of the bit clock with respect to the data.
(4) TX_TRIGD is the internally delayed version of TX_TRIG that gets latched on the rising edge of the system clock.
(5) tS is the system clock period in ns.
14
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7.8 Timing Requirements: JESD Interface
Typical values are at TA = 25°C, AVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V, DVDD_1P8 = 1.8 V, differential ADC clock, RLOAD
=
50 Ω from each CML pin to DVDD_1P2, 12-bit ADC resolution, sample rate, and fC = 80 MSPS, unless otherwise noted.
Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C. The JESD204B
interface operates in default mode after setting the JESD_EN bit to 1 (12-bit ADC resolution, 12-bit serialization, 4 ADCs per
lane, and scrambling disabled).
MIN
TYP
MAX
UNIT
TIMING CHARACTERISTICS
Serial output data rate in terms of F (number of octets per frame)
and fC (ADC clock frequency in MHz)
fJESD
0.01 × F × fC
Gbps
UI
Tj
Unit interval
200 1000 / fJESD
0.27
2000
ps
Total jitter: fJESD = 5 Gbps, PRE_EMP = 7, INC_JESD_VDD = 1
p-p UI
Rise and fall time: 20% to 80%, each pin loaded by CLOAD = 1.2 pF
to DVDD_1P2
tR, tF
85
ps
SAMPLING TIMING
tSU_S Setup time for SYSREF with respect to the device clock rising edge
tH_S
tSU_T
tH_T
JESD LATENCY
Latency from SYNC~ assertion (falling) edge to start of CGS phase
3
2
3
2
ns
ns
ns
ns
Hold time for SYSREF with respect to the device clock rising edge
Setup time for SYNC~ with respect to the device clock rising edge
Hold time for SYNC~ with respect to the device clock rising edge
Device
clock cycles
NA_SYNC~
17
11
(K28.5) in subclass 0, 1, and 2
Latency from the first LMFC boundary after SYNC~ deassertion
(rising) edge to start of ILA phase (K28.0) in subclass 1
Device
clock cycles
ND_SYNC~
Latency from the device clock falling edge sampling the analog input
of ADC1 to the appearance of the corresponding octets on the JESD
outputs
Device
clock cycles
NLAT_JESD
14.5
JESD DIGITAL OUTPUTS
High-level output voltage of the CML output (CMLx_OUTP,
CMLx_OUTM)
VOH-CML
VOL-CML
DVDD_1P2
V
V
Low-level output voltage of the CML output (CMLx_OUTP,
CMLx_OUTM)
DVDD_1P2 – 0.4
|VOD-CML
VOC-CML
zOS
|
Differential output voltage of CMLx_OUT
0.4
DVDD_1P2 – 0.2
50 ± 25%
V
V
Common-mode output voltage of CMLx_OUTP, CMLx_OUTM
Single-ended output impedance
Ω
CCML
Output capacitance inside device from either CML output to ground
1
pF
Transmitter short-circuit current: transmitter terminals shorted to any
voltage between –0.25 V and 1.45 V
±100
mA
7.9 Timing Requirements: Serial Interface(1)(2)
MIN
50
20
20
5
TYP
MAX
UNIT
ns
tSCLK
SCLK period
tSCLK_H
tSCLK_L
tDSU
SCLK high time
ns
SCLK low time
ns
Data setup time
ns
tDHO
Data hold time
5
ns
tSEN_SU
tSEN_HO
tOUT_DV
SEN falling edge to SCLK rising edge
Time between last SCLK rising edge to SEN rising edge
SDOUT delay
8
ns
8
ns
12
20
28
ns
(1) Characterized in lab over operating temperature range, not tested at production testing.
(2) See 图 92 and 图 93.
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SERIAL_IN1 (D[11:0])
Frame Clock (FCLK)
D0
D2
D4
D6
D8
DOUT1
D1
D3
D5
D7
D9
D10 D11
Bit Clock (DCLK)
tD
tD
tOH
tOSU
DOUT1
tB
Bit Clock (DCLK)
tDV
tDV
图 1. LVDS Output Signals Timing Diagram in
16-Input Mode with 12-Bit Serialization, LSB-First, 1X Data Rate Mode
16
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
7.10 Typical Characteristics
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-100
-110
-120
-130
-140
0
5
10
15
20
25
0
5
10
15
20
25
30
35
40
45
50
Frequency (MHz)
Frequency (MHz)
fIN = 5 MHz, fC = 100 MSPS, SNR = 61.5 dBFS,
fIN = 5 MHz, fC = 100 MSPS, SNR = 61.6 dBFS,
SFDR = 81.9 dBc, HD2 = –86.5 dBc, HD3 = –93.9 dBc
SFDR = 78.7 dBc, HD2 = –97.6 dBc, HD3 = –92.2 dBc
图 2. FFT of 10-Bit, 32-Input Mode
图 3. FFT of 10-Bit, 16-Input Mode
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-100
-110
-120
-130
0
10
20
30
40
50
60
70
80
90 100
0
5
10
15
20
Frequency (MHz)
Frequency (MHz)
fIN = 5 MHz, fC = 100 MSPS, SNR = 61.3 dBFS,
SFDR = 70.8 dBc, HD2 = –94.2 dBc, HD3 = –80.1 dBc
fIN = 5 MHz, fC = 80 MSPS, SNR = 69.9 dBFS, SFDR = 82.6 dBc,
HD2 = –82.6 dBc, HD3 = –88.9 dBc
图 5. FFT of 12-Bit, 32-Input Mode
图 4. FFT of 10-Bit, 8-Input Mode
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-100
-110
-120
-130
-140
-150
0
5
10
15
20
25
30
35
40
0
5
10
15
Frequency (MHz)
Frequency (MHz)
fIN = 5 MHz, fC = 80 MSPS, SNR = 70.2 dBFS, SFDR = 75.4 dBc,
HD2 = –109.8 dBc, HD3 = –86.1 dBc
fIN = 5 MHz, fC = 65 MSPS, SNR = 73.7 dBFS, SFDR = 91.8 dBc,
HD2 = –96.6 dBc, HD3 = –97.2 dBc
图 6. FFT of 12-Bit, 16-Input Mode
图 7. FFT of 14-Bit, 32-Input Mode
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17
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Typical Characteristics (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
61.62
61.58
61.54
61.5
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
61.46
61.42
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
0
5
10
15
20
25
30 32.5
Frequency (MHz)
fSAMP = 50 MSPS
fIN = 5 MHz, fC = 65 MSPS, SNR = 73.4 dBFS, SFDR = 80.2 dBc,
HD2 = –88.7 dBc, HD3 = –93.9 dBc
图 9. Signal-to-Noise Ratio vs fIN in
图 8. FFT of 14-Bit, 16-Input Mode
10-Bit, 32-Input Mode
61.58
61.4
61.35
61.3
61.54
61.5
61.25
61.2
61.46
61.42
61.15
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
fSAMP = 100 MSPS
fSAMP = 200 MSPS
图 10. Signal-to-Noise Ratio vs fIN in
图 11. Signal-to-Noise Ratio vs fIN in
10-Bit, 16-Input Mode
10-Bit, 8-Input Mode
70.28
70.08
69.88
69.68
69.48
69.28
69.08
70.2
70
69.8
69.6
69.4
69.2
69
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
fSAMP = 40 MSPS
fSAMP = 80 MSPS
图 12. Signal-to-Noise Ratio vs fIN in
图 13. Signal-to-Noise Ratio vs fIN in
12-Bit, 32-Input Mode
12-Bit, 16-Input Mode
18
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ADS52J90
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
Typical Characteristics (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
74
73.5
73
73.7
73.3
72.9
72.5
72.1
71.7
71.3
72.5
72
71.5
71
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
fSAMP = 32.5 MSPS
fSAMP = 65 MSPS
图 14. Signal-to-Noise Ratio vs fIN in
图 15. Signal-to-Noise Ratio vs fIN in
14-Bit, 32-Input Mode
14-Bit, 16-Input Mode
-77
-80
-83
-86
-89
-92
-95
-82
-83
-84
-85
-86
-87
-88
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
100-MSPS conversion clock
100-MSPS conversion clock
图 16. Third-Order Harmonic Distortion vs fIN
图 17. Second-Order Harmonic Distortion vs fIN
-74
-46
-75
-76
-77
-78
-79
-80
-50
-54
-58
-62
-66
-70
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
100-MSPS conversion clock
fSAMP = 200 MSPS
图 18. Total Harmonic Distortion vs fIN
图 19. Input-Clock Intermodulation Spur at (fS / 2 ± fIN) vs fIN
in 8-Input Mode
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Typical Characteristics (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
-65
-69
-73
-77
-81
-85
-68
-70
-72
-74
-76
-78
-80
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
fSAMP = 100 MSPS
fSAMP = 200 MSPS
图 20. Input-Clock Intermodulation Spur at (fS / 2 ± fIN) vs fIN
图 21. Input-Clock Intermodulation Spur at (fS / 4 ± fIN) vs fIN
in 16-Input Mode
in 8-Input Mode
75.7
110
100
90
104
100
96
SFDR (dBc)
SFDR (dBFS)
75.3
74.9
74.5
74.1
73.7
73.3
80
92
70
88
60
84
50
80
-40
-35
-30
-25
-20
-15
-10
-5
-1
-40
-35
-30
-25
-20
-15
-10
-5
-1
Input Amplitude, AIN (dBFS)
Input Amplitude, AIN (dBFS)
16-input mode, 14-bit resolution, fSAMP = 65 MSPS
32-input mode, 14-bit resolution, fSAMP = 32.5 MSPS
图 22. Signal-to-Noise Ratio vs AIN
图 23. Spurious-Free Dynamic Range vs AIN
74
73.9
73.8
73.7
73.6
73.5
73.4
73.3
73.2
73.1
73
78
Input signal frequency = 5 MHz
Input signal frequency = 50 MHz
75
72
69
66
63
60
0.6
0.65
0.7
0.75
0.8
0.85
0.9
0.95
1
0.1
0.4
0.7
1
1.3
1.6
1.9
2.2
Input Common-Mode Voltage, INPCM (V)
Differential Input Clock Amplitude (VPP
)
16-input mode, 14-bit resolution, fSAMP = 65 MSPS
16-input mode, 14-bit resolution, fSAMP = 65 MSPS
图 24. Signal-to-Noise Ratio vs
图 25. Signal-to-Noise Ratio vs Amplitude of
Input Common-Mode Voltage (INPCM)
Differential Sine-Wave Input Clock
20
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Typical Characteristics (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
-57
-62
-67
-72
-77
-82
-87
74.2
74
73.8
73.6
73.4
73.2
73
5
10 15 20 25 30 35 40 45 50 55 60 65 70
Input Frequency, fIN (MHz)
30
35
40
45
50
55
60
65
70
Differential Input Clock Duty Cycle (%)
32-input mode, 14-bit resolution, fSAMP = 32.5 MSPS, –1-dBFS
tone applied on one channel and spur on neighboring channel
measured as crosstalk
16-input mode, 14-bit resolution, fSAMP = 65 MSPS
space
space
图 27. Crosstalk vs fIN
图 26. Signal-to-Noise Ratio vs Differential Input
Clock Duty Cycle
2.8
2.5
2
1.8
0.8
1.5
1
-0.2
-1.2
-2.2
-3.2
0.5
0
-0.5
-1
-1.5
0
3000
6000
9000
Code
12000
15000
0
3000
6000
9000
Code
12000
15000
32-input mode, 14-bit resolution, fSAMP = 32.5 MSPS
32-input mode, 14-bit resolution, fSAMP = 32.5 MSPS
图 28. Integral Nonlinearity
图 29. Differential Nonlinearity
-58
-36
-60
-62
-64
-66
-68
-70
-40
-44
-48
-52
-56
-60
0.1
0.2 0.3
0.5 0.7
1
2
3
4
5
6 7 8 10
0.1
0.2 0.3
0.5 0.7
1
2
3
4 5 6 7 8 10
Frequency of Signal on Supply (MHz)
Frequency of Signal on Supply (MHz)
32-input mode, 14-bit resolution, fSAMP = 32.5 MSPS, 100-mVPP
tone on supply
32-input mode; 14-bit resolution; fSAMP = 32.5 MSPS; 100-mVPP
tone on supply; 5-MHz, –1-dBFS tone on input; PSMR is
intermodulation tone referred to input tone amplitude
图 31. Power-Supply Modulation Ratio vs
图 30. Power-Supply Rejection Ratio vs
Frequency of Signal on Supply
Frequency of Signal on Supply
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Typical Characteristics (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
180
170
160
150
140
130
120
110
100
-30
-35
-40
-45
-50
-55
-60
10
20
30
40
50
60
70
80
90
100
Conversion Clock Frequency, fC (MHz)
0.1
0.2 0.3 0.50.7
1
2
3
4 5 67 10
20 30 50 70
Frequency of Common-Mode Input Signal (MHz)
32-input mode, 10-bit resolution
32-input mode, 14-bit resolution, fSAMP = 32.5 MSPS, 50-mVPP
common-mode tone applied at the inputs, output tone referred to
the input tone
图 33. AVDD_1P8 Current vs
Conversion Clock Frequency
图 32. Common-Mode Rejection Ratio vs
Frequency of Common-Mode Input Signal
101
99
97
95
93
91
89
87
85
83
120
110
100
90
80
70
60
50
40
30
10
20
30
40
50
60
70
80
90
100
10
20
30
40
50
60
70
80
90
100
Conversion Clock Frequency, fC (MHz)
Conversion Clock Frequency, fC (MHz)
32-input mode, 10-bit resolution
32-input mode, 10-bit resolution
图 34. DVDD_1P8 Current vs
图 35. DVDD_1P2 Current vs
Conversion Clock Frequency
Conversion Clock Frequency
655
10
0
620
585
550
515
480
445
410
375
-10
-20
-30
-40
-50
-60
HPF_CORNER_ADC* = 2
HPF_CORNER_ADC* = 3
HPF_CORNER_ADC* = 4
HPF_CORNER_ADC* = 5
HPF_CORNER_ADC* = 6
HPF_CORNER_ADC* = 7
HPF_CORNER_ADC* = 8
HPF_CORNER_ADC* = 9
HPF_CORNER_ADC* = 10
10
20
30
40
50
60
70
80
90
100
0.01
0.05
0.2 0.5
1
2 3 45 710 20 50 100 200
Conversion Clock Frequency, fC (MHz)
Frequency (MHz)
32-input mode, 10-bit resolution
图 36. Total Power vs Conversion Clock Frequency
图 37. Digital High-Pass Filter Response
22
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
Typical Characteristics (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at
5 MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. A LVPECL clock is used as the clock source.
77
76
75
74
73
72
71
70
69
400
350
300
250
200
150
100
50
Min
Typ
Max
Chopper Disabled
Chopper Enabled
0
1E-5
0.0001
0.001
Frequency (MHz)
0.01
0.10.2 0.5 1 2
1
5
9
13
17
21
25
29
32
Channel Number
16-input mode, 12-bit resolution
Statistical values taken over 100 devices in 14-bit, 32-input mode
at fSAMP = 32.5 MSPS
图 38. Signal-to-Noise Ratio Histogram
图 39. Low-Frequency Noise With and Without
Chopper Enabled
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7.11 Typical Characteristics: JESD Interface
Typical values are at TA = 25°C, AVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V, DVDD_1P8 = 1.8 V, differential ADC clock, RLOAD
50 Ω from each CML pin to DVDD_1P2, 12-bit ADC resolution, sample rate, and fCLKIN = 80 MSPS, unless otherwise noted.
Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C. The JESD204B
interface operates in default mode after setting the JESD_EN bit to 1 (12-bit ADC resolution, 12-bit serialization, 4 ADCs per
lane, and scrambling disabled).
=
0.55
0.5
0.55
0.5
0.45
0.4
0.45
0.4
0.35
0.3
0.35
0.3
5 Gbps
6 Gbps
6.4 Gbps
PRE_EMP = 0
PRE_EMP = 7
PRE_EMP = 15
0.25
0.2
0.25
1
3
5
7
9
11
13
1
3
5
7
9
11
13
Trace Length (inch)
Trace Length (inch)
D001
D002
PRE_EMP = 15 , across JESD speeds
图 40. Total Jitter vs Trace Length
JESD speed = 5 Gbps, across PRE_EMP settings
图 41. Total Jitter vs Trace Length
0.65
0.6
0.65
PRE_EMP = 0
PRE_EMP = 7
PRE_EMP = 15
0.6
0.55
0.5
0.55
0.5
0.45
0.4
0.45
0.4
PRE_EMP = 0
PRE_EMP = 7
PRE_EMP = 15
0.35
0.3
0.35
1
3
5
7
9
11
13
1
3
5
7
9
11
13
Trace Length (inch)
Trace Length (inch)
D003
D004
JESD speed = 6 Gbps, across PRE_EMP settings
JESD speed = 6.4 Gbps, across PRE_EMP settings
图 42. Total Jitter vs Trace Length
图 43. Total Jitter vs Trace Length
175
320
ADC Resolution 12 bit
ADC Resolution 14 bit
2 ADCs per lane
4 ADCs per lane
8 ADCs per lane
170
165
160
155
150
145
140
135
130
125
120
115
110
300
280
260
240
220
200
180
160
140
120
100
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
ADC Sample Rate (MHz)
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
ADC Sample Rate (MHz)
Across ADC resolutions
ADC resolution = 12 bits, across lane modes
图 44. AVDD_1P8 Current vs ADC Sample Rate
图 45. DVDD_1P2 Current vs ADC Sample Rate
24
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
Typical Characteristics: JESD Interface (接下页)
Typical values are at TA = 25°C, AVDD_1P8 = 1.8 V, DVDD_1P2 = 1.2 V, DVDD_1P8 = 1.8 V, differential ADC clock, RLOAD
=
50 Ω from each CML pin to DVDD_1P2, 12-bit ADC resolution, sample rate, and fCLKIN = 80 MSPS, unless otherwise noted.
Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C. The JESD204B
interface operates in default mode after setting the JESD_EN bit to 1 (12-bit ADC resolution, 12-bit serialization, 4 ADCs per
lane, and scrambling disabled).
300
280
260
240
220
200
180
160
140
120
100
45
40
35
30
25
20
15
10
2 ADCs per lane
4 ADCs per lane
8 ADCs per lane
10 15 20 25 30 35 40 45 50 55 60 65
ADC Sample Rate (MHz)
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
ADC Sample Rate (MHz)
ADC resolution = 14 bits, across lane modes
ADC resolution = 12, 14 bits; across lane modes
图 46. DVDD_1P2 Current vs ADC Sample Rate
图 47. DVDD_1P8 Current vs ADC Sample Rate
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7.12 Typical Characteristics: Contour Plots
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at 5
MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. An LVPECL clock is used as the clock source.
图 49. Signal-to-Noise Ratio in 10-Bit, 16-Input Mode
图 48. Signal-to-Noise Ratio in 10-Bit, 32-Input Mode
图 50. Signal-to-Noise Ratio in 10-Bit, 8-Input Mode
图 51. Signal-to-Noise Ratio in 12-Bit, 32-Input Mode
26
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
Typical Characteristics: Contour Plots (接下页)
At 25°C, AVDD_IP8 = DVDD_1P8 = 1.8 V, and DVDD_1P2 = 1.2 V, unless otherwise noted. All LVDS outputs are active with
100-Ω differential terminations and a 4-pF load capacitor from each LVDS output pin to ground. A –1-dBFS input signal at 5
MHz is applied to the input channel under test. SNR is computed by ignoring the power contained in the first nine harmonic
bins, the fS / 2 and fS / 4 frequency bins as well as the bins corresponding to the intermodulation frequencies between the
input and the clock. An LVPECL clock is used as the clock source.
图 53. Signal-to-Noise Ratio in 14-Bit, 32-Input Mode
图 52. Signal-to-Noise Ratio in 12-Bit, 16-Input Mode
图 54. Signal-to-Noise Ratio in 14-Bit, 16-Input Mode
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8 Detailed Description
8.1 Overview
A block diagram of the device is shown in 图 55. 图 56 illustrates the signal flow for the device while operating
with the LVDS output interface. The device consists of 16 ADCs configurable to convert 8-, 16-, or 32-inputs. All
ADCs run off the external clocks (provided on the CLKP, CLKM pins). The references needed for the ADCs are
internally generated. The reference voltage that can be used to set the common mode voltage of the analog
input comes out on the VCM pin. The output data from the 16 ADCs are serialized and output on the LVDS
interface. The device also has an optional JESD204B interface. The device is controlled using an SPI interface.
8.2 Functional Block Diagrams
Reference Voltage
VCM
and
Current Generator
INP1
INM1
LVDS
DOUTP1
DOUTM1
ADC 1
INP2
INM2
DOUTP2
DOUTM2
INP3
INM3
ADC 2
LVDS Outputs
INP4
INM4
Analog Inputs
DOUTP16
DOUTM16
FCLKP
FCLKM
INP31
INM31
DCLKP
DCLKM
ADC 16
INP32
INM32
CML
fSAMP
fC
CML1_OUTP
CML1_OUTM
CML Outputs
CML8_OUTP
CML8_OUTM
Clock
Generator
CLKP
CLKM
System Clock
SYNC
Generator
Serial Interface
SDOUT
fS
图 55. Block Diagram
28
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Functional Block Diagrams (接下页)
16-, 32-, and
8-Input Mode
ADC Resolution:
10, 12, 14, 16
Serialization Factor:
10, 12, 14, 16
Test Pattern
Setting
MSB_FIRST 1X, 2X Mode
1X, 2X Mode
Analog
Inputs
LVDS
Outputs
IN1
IN2
AIN1
ADCIN1
ADCIN2
ADCOUT1
10/12/14
SERIAL_IN1
SERIAL_OUT1
SERIAL_OUT2
DOUT1
DOUT2
DIGOUT1
16
DIGRES1
ADC1
ADC2
AIN2
10, 12, 14, 16
SERIAL_IN2
10, 12, 14,
16
ADCOUT2
DIGOUT2
DIGRES2
Digital
Processing
Input
Multiplexer
and Sampler
Teset Pattern
Insertion
Output
Multiplexer
Serializer
Truncation
(Bypassable)
DOUT16
FCLK
ADCIN16
ADCOUT16
DIGOUT16
DIGRES16
SERIAL_IN16
SERIAL_OUT16
ADC16
IN32
DCLK
AIN32
A/D Conversion and Digital Processing
Data Formatting
Frame Clock, fF
Sampling Clock, fSAMP
(Split as Odd and Even
Conversion Clock, fC
Sampling Phase for Each ADC)
Internal Clock Generation
and Clock Tree
System Clock, fS
图 56. Signal Flow Diagram
8.3 Feature Description
The device has 16 synchronously operating ADCs (ADC1 to ADC16) and can be configured to accept and
convert 8, 16, or 32 active differential external analog inputs (AIN1 to AIN32). The converted digital outputs can
be made to come out on either 16 pairs of low-voltage differential signaling (LVDS) outputs or compressed into
eight pairs. The device operates from a single clock input. This input is referred to as the system clock and its
frequency is denoted by fS. The recommended mode of driving the clock is with a differential low-voltage
positive-referenced emitter coupled logic (LVPECL) clock. The system clock can be also driven by a differential
sine-wave or LVDS, or can be driven with a single-ended low voltage complementary metal oxide semiconductor
(LVCMOS) clock. The various aspects of the signal chain are discussed in the following sections.
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Feature Description (接下页)
8.3.1 Connection of the External Inputs to the Input Pins
The effective conversion rate per input changes depending on the input mode. The methodology of connecting
the external inputs (AINx) to the input pins (INx) is shown in 表 1 for the 16-, 32- and 8-channel input modes. In
表 1, AIN1 refers to the differential input signal (AINP1, AINM1) and IN1 refers to the input pair (INP1, INM1).
The voltage that gets sampled and converted by the device is (AINP1-AINM1).
表 1. Scheme of Driving the Input Pins (16-, 32-, 8-Channel Input Modes)
CONNECTION TO THE EXTERNAL ANALOG INPUT SIGNAL
INPUT PAIR
16-CHANNEL INPUT MODE(1)(2)
32-CHANNEL INPUT MODE
AIN1
8-CHANNEL INPUT MODE(1)
IN1
IN2
AIN1
—
AIN1
—
AIN2
IN3
AIN2
—
AIN3
AIN1
—
IN4
AIN4
IN5
AIN3
—
AIN5
AIN2
—
IN6
AIN6
IN7
AIN4
—
AIN7
AIN2
—
IN8
AIN8
IN9
AIN5
—
AIN9
AIN3
—
IN10
IN11
IN12
IN13
IN14
IN15
IN16
IN17
IN18
IN19
IN20
IN21
IN22
IN23
IN24
IN25
IN26
IN27
IN28
IN29
IN30
IN31
IN32
AIN10
AIN11
AIN12
AIN13
AIN14
AIN15
AIN16
AIN17
AIN18
AIN19
AIN20
AIN21
AIN22
AIN23
AIN24
AIN25
AIN26
AIN27
AIN28
AIN29
AIN30
AIN31
AIN32
AIN6
—
AIN3
—
AIN7
—
AIN4
—
AIN8
—
AIN4
—
AIN9
—
AIN5
—
AIN10
—
AIN5
—
AIN11
—
AIN6
—
AIN12
—
AIN6
—
AIN13
—
AIN7
—
AIN14
—
AIN7
—
AIN15
—
AIN8
—
AIN16
—
AIN8
—
(1) — = do not connect.
(2) To switch ADCx to convert the even numbered inputs, use register control IN_16CH_ADCx.
8.3.2 Input Multiplexer and Sampler
The input multiplexer determines the mapping of the input pins (IN1 to IN32) to the inputs that are sampled and
converted by the ADCs (ADC1 to ADC16). Each ADC has two sets of sampling circuits (termed odd and even)
and alternately converts the inputs presented to them.
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The sampling windows for the odd and even sampling circuits of each ADC are derived from the system clock. A
pair of ADCs are used in 图 57, 图 58, and 图 59 to illustrate how the odd and even sampling phases are derived
for each ADC in each input mode. AIN1 (t1) refers to the AIN1 input sampled at the t1 instant. ADC1o refers to
the odd sample converted by ADC1 and ADC1e refers to the even sample converted by ADC1. The input
sampling and conversion schemes for the 32-, 16-, and 8-input modes are illustrated in 图 57, 图 58, and 图 59,
respectively.
32-Channel Input Mode
t1
t2
t3
t4
Sampling Instants
Analog input, AIN1
Analog input, AIN2
Analog input, AIN3
Analog input, AIN4
System Clock, fS
(External Clock)
Sampling Clock for Input 1, fSAMP
(Internal Signal)
Input to Odd
Sampling Circuit
AIN1
AIN1
ADCIN1
Input to Even
Sampling Circuit
AIN2
AIN2
ADC1o
AIN1(t1)
ADC1e
AIN2(t2)
ADC1o
AIN1(t3)
ADC1e
AIN2(t4)
ADC1 Conversion
Input to Odd
Sampling Circuit
AIN3
AIN3
ADCIN2
Input to Even
Sampling Circuit
AIN4
AIN4
ADC2o
AIN3(t1)
ADC2e
AIN4(t2)
ADC2o
AIN3(t3)
ADC2e
AIN4(t4)
ADC2 Conversion
ADC Conversion Clock, fC
(Internal Signal)
图 57. Input Sampling and Conversion Scheme (32-Input Mode)
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16-Channel Input Mode
Sampling Instants
Analog input, AIN1
t2
t3
t1
t4
Analog input, AIN2
System Clock, fS
(External Clock)
Sampling Clock for Input 1, fSAMP
(Internal Signal)
Input to Odd
Sampling Circuit
AIN1
AIN1
ADCIN1
Input to Even
AIN1
AIN1
Sampling Circuit
ADC1o
ADC1e
ADC1o
ADC1e
AIN1(t3)
AIN1(t4)
AIN1(t1)
AIN1(t2)
ADC1 Conversion
Input to Odd
Sampling Circuit
AIN2
AIN2
ADCIN2
Input to Even
Sampling Circuit
AIN2
AIN2
ADC2o
ADC2e
ADC2o
ADC2e
AIN2(t3)
AIN2(t4)
AIN2(t1)
AIN2(t2)
ADC2 Conversion
ADC Conversion Clock, fC
(Internal Signal)
图 58. Input Sampling and Conversion Scheme (16-Input Mode)
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8-Channel Input Mode
Sampling Instants
t5
t7
t8
t6
t1
t3
t4
t2
Analog input, AIN1
System Clock, fS
(External Clock)
Sampling Clock for Input 1, fSAMP
(Internal Signal)
Input to Odd
Sampling Circuit
AIN1
AIN1
ADCIN1
Input to Even
Sampling Circuit
AIN1
AIN1
ADC1o
ADC1e
ADC1o
ADC1e
AIN1(t5)
AIN1(t7)
AIN1(t1)
AIN1(t3)
ADC1 Conversion
Input to Odd
Sampling Circuit
AIN1
AIN1
ADCIN2
Input to Even
Sampling Circuit
AIN1
AIN1
ADC2o
ADC2e
ADC2o
ADC2e
ADC2 Conversion
AIN1(t2)
AIN1(t4)
AIN1(t6)
AIN1(t8)
ADC Conversion Clock, fC
(Internal Signal)
图 59. Input Sampling and Conversion Scheme (8-Input Mode)
Mapping the inputs of the odd and even sampling circuits of subsequent-numbered ADCs to subsequent-
numbered sets of input pairs repeats in a similar manner.
The sampling rate (fSAMP) can be defined as the rate at which the device converts each analog input presented to
it. The relationship between the sampling rate and the system clock frequency is listed in 表 2 for the three input
modes.
表 2. Sampling Rate and Input Clock Frequency
ANALOG INPUT MODE (Number of Input Channels)
SAMPLING RATE (fSAMP)
16
32
8
fS
0.5 × fS
fS
In 16-input mode, each ADC converts one input at a sampling rate equal to the system clock. In 32-input mode,
one ADC alternately converts two sets of inputs, each at a sampling rate that is half the system clock. In the 8-
input mode, two ADCs convert the same input in interleaved manner.
In 16-input mode, a ping-pong operation exists between two sampling circuits of one ADC that are sampling the
same input. The mismatch between the two sampling circuit bandwidths can result in an interleaving spur at
(fS / 2 ± fIN), where fS is the frequency of the system clock and fIN is the frequency of the input signal.
In 8-input mode, additional interleaving across two adjacent ADCs is present in addition to the ping-pong
operation between the two sampling circuits of the same ADC. This increased mismatch can result in significant
interleaving spurs at (fS / 2 ± fIN) and (fS / 4 ± fIN). The offset mismatch between the four sets of sampling circuits
can result in a spur at fS / 4.
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For the 32-input mode, the sampling instants of the even-numbered input signals are offset from the sampling
instants of the odd-numbered input signals by one system clock period. The magnitude of the interleaving spurs
increases when the input frequency is increased because the sampling bandwidth mismatch across the different
sampling circuits results in larger phase error mismatches when the input frequency is increased.
8.3.3 Analog-to-Digital Converter (ADC)
The device has 16 synchronous ADCs that provide a digital representation of the input in twos complement
format. Each ADC converts at a rate of fC using a conversion clock that is internally generated from the system
clock. Every cycle of a conversion clock corresponds to a new ADC conversion.
The mapping of the ADC conversions to the analog input is described in 表 3. See 图 57, 图 58, and 图 59 for the
naming conventions.
表 3. Mapping of the ADC Conversions to the Analog Inputs and Sampling Instants
INPUT CONVERTED BY THE ADC
ADC SAMPLE
16-INPUT MODE
AIN1 (t1)
32-INPUT MODE
AIN1 (t1)
8-INPUT MODE
AIN1 (t1)
ADC1o
ADC2o
ADC1e
ADC2e
AIN2 (t1)
AIN3 (t1)
AIN1 (t2)
AIN1 (t2)
AIN2 (t2)
AIN1 (t3)
AIN2 (t2)
AIN4 (t2)
AIN1 (t4)
The ADC resolution (the number of bits in the signals marked as ADCOUT1 to ADCOUT16) can be programmed
as 10, 12, or 14 bits using the ADC_RES bits. The maximum conversion clock of the ADC depends on the ADC
resolution setting, as shown in 表 4.
表 4. Maximum Conversion Rate of the ADC for Different ADC Resolutions
ADC RESOLUTION (Bits)
MAXIMUM CONVERSION CLOCK (fC(max), MSPS)
10
12
14
100
80
65
The relationship between the system clock and sampling clock rates to the ADC conversion clock is shown in 表
5. Note that the maximum conversion rate of the ADC is fixed for the three resolution modes. In 表 5, sampling
rate refers to the effective rate of sampling each active analog input.
表 5. System Clock and Sampling Clock Relationship to the ADC Conversion Clock
ANALOG INPUT MODE
(1)
(Number of Input
Channels)
SYSTEM CLOCK RATE (fS)
SAMPLING RATE (fSAMP
)
ADC RESOLUTIONS SUPPORTED
16
32
8
fC
fC
fC
10, 12, 14
10, 12, 14
10
0.5 × fC
2 × fC
2 × fC
(1) Sampling rate is also the effective conversion rate of each input channel.
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8.3.4 Device Synchronization Using TX_TRIG
The device has multiple PLLs and clock dividers that are used to generate the programmable ADC resolutions
and LVDS synchronization factors as well as to synchronize LVDS test patterns.
The TX_TRIG input is used to synchronize clock dividers inside the device. The synchronization achieved using
TX_TRIG also enables multiple parallel devices to operate synchronously.
For the 32-input mode, the same ADC alternates between converting two inputs. The TX_TRIG signal provides
the mechanism to determine the sampling instants of the odd and even input signals with respect to the system
clock, as shown in 图 60.
tTX_TRIG_DEL
TX_TRIG
tSU_TX_TRIGD
tH_TX_TRIGD
tH_TX_TRIGD
TX_TRIGD
(Internal signal latched by
System clock rising edge)
t2
t1
System Clock
ADC1o
ADC1e
AIN2(t2)
ADC1 Conversion
AIN1(t1)
ADC2o
AIN3(t1)
ADC2e
AIN4(t2)
ADC2 Conversion
Conversion Clock
图 60. Odd- and Even-Channel Sampling Instant Definition Mechanism in
32-Input Mode with the TX_TRIG Signal
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For the 8-input mode, the conversion clock is obtained by dividing the system clock by 2. The phase of the
division is again determined by the TX_TRIG signal, as shown in 图 61.
tTX_TRIG_DEL
TX_TRIG
tSU_TX_TRIGD
tH_TX_TRIGD
tH_TX_TRIGD
TX_TRIGD
(Internal signal latched by
System clock rising edge)
t1
t2
t3
t4
System Clock
ADC1o
AIN1(t1)
ADC1e
AIN1(t3)
ADC1 Conversion
ADC2o
AIN1(t2)
ADC2e
AIN1(t4)
ADC2 Conversion
Conversion Clock
图 61. Conversion Clock Deriving Mechanism from Division of the Sampling Clock in 8-Input Mode
Applying a pulse on TX_TRIG is a mandatory part of the power-up and initialization sequence; see the Power
Sequencing and Initialization section.
In case a TX_TRIG is not applied, the device can possibly behave in an unexpected manner. The identified
cases are shown in 表 6.
表 6. Device Behavior Cases: TX_TRIG is Not Applied
INPUT MODE WHERE ISSUE OCCURS
(8-, 16-, 32-Channel Input Modes)
SCENARIO
ISSUE
Frame clock across devices is not
synchronized
8- and 32-channel input modes
Multiple devices operating in parallel
LVDS patterns across devices are not
synchronized
8-, 16-, and 32-channel input modes
8- and 32-channel input modes
Serialization factor different from ADC
resolution
Framing of data words within a frame clock is
not defined
The TX_TRIG pulse resets the phase of the test pattern generator, the odd and even sampling phase selection,
and the phase of the frame clock. As a result of this phase reset operation, the ADC data can be corrupted for
four to six clocks immediately after applying TX_TRIG. The phase reset from TX_TRIG can be disabled using
MASK_TX_TRIG.
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8.3.5 Digital Processing
The ADC outputs go to a digital processing block that can be used to enhance ADC performance. Some of the
operations done in the digital processing block can enhance the effective signal to noise ratio at its output. For
this reason, the number of bits at the DIGOUT1 to DIGOUT16 signals are considered to be 16. However, some
of the LSBs of this 16-bit word may be zero. For example, when the digital processing block is bypassed, the
number of non-zero bits in DIGOUT is the same as the ADC resolution—the extra LSBs of the 16-bit word are
zero.
The digital processing block results in additional latency that can be avoided by using the low latency mode
(programmed using the LOW_LATENCY_EN bit) that bypasses the entire digital processing block without
introducing extra latency. The various features available in the digital processing block are shown in 图 62 and
are explained in the subsequent sections.
ADC 2
Output
Digital Test Patterns
ADCOUT
10b, 12b, 14b
MUX
DIGOUT
16b
ADC1
Output
Digital Average
Default = No
Digital Gain
Default = 0 dB
Digital HPF
Default = No
Digital Offset
Default = No
图 62. ADC Digital Block Diagram
8.3.5.1 Digital Offset
Digital functionality provides for channel offset correction. Setting the DIG_OFFSET_EN bit to 1 enables the
subtraction of the offset value from the ADC output. There are two offset correction modes, as shown in 图 63.
DIG_OFFSET_EN
0
Data Output,
Bits 13-0
Bits 13-0
MUX
(0s appended as LSBs when in 10-/12-bit resolutions)
Analog
Input(s)
ADCx
+
1
-
AUTO_OFFSET_REMOVAL_
ACC_CYCLES
OFFSET_REMOVAL_SELF
(Register 4, Bit 15)
(Register 4, Bits 12:9)
OFFSET_REMOVAL_START_SEL
(Register 4, Bit 14)
Bits
29-0
OFFSET_REMOVAL_
Truncation and
Rounding Data
Bits
Bits 13-0
1
START_MANUAL
(Register 4, Bit 13)
0
Accumulator
Start
MUX
MUX
1
TX_TRIG Pin
Bits 9-0
0
OFFSET_ADC_xo,
OFFSET_ADC_xe
Extending Sign
Bit to 14 Bits
Bits 13-0
图 63. Digital Offset Correction Block Diagram
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8.3.5.1.1 Manual Offset Correction
If the channel offset is known or estimated, it can be written into a 10-bit register and can be subtracted from the
ADC output. There are 32 sets of manual offset controls. To enable per-channel offset correction in the 32-input
mode, the offset values for the odd and even data streams of each of the 16 ADCs can be independently
controlled. The registers OFFSET_ADCxo and OFFSET_ADCxe correspond to the offsets subtracted from the
odd and even data streams of ADCx. Write the offset values in twos complement format.
8.3.5.1.2 Auto Offset Correction Mode (Offset Correction using a Built-In Offset Calculation Function)
The auto offset calculation module can be used to calculate the channel offset that is then subtracted from the
ADC output. To enable the auto offset correction mode, set the OFFSET_REMOVAL_SELF bit and
DIG_OFFSET_EN bit to 1.
In auto offset correction mode the dc component of the ADC output (assumed to be the channel offset) is
estimated using a digital accumulator. The ADC output sample set used by the accumulator is determined by a
start time or first sample and number of samples to be used. A high pulse on the TX_TRIG pin or setting the
OFFSET_REMOVAL_START_MANUAL register can be used to determine the first sample to the accumulator.
To set the number of samples, the AUTO_OFFSET_REMOVAL_ACC_CYCLES register must be programmed
according to 表 7.
If a pulse on the TX_TRIG pin is used to set the first sample, additional flexibility in setting the first sample is
provided. A programmable delay between the TX_TRIG pulse and the first sample can be set by writing to the
OFFSET_CORR_DELAY_FROM_TX_TRIG register.
The determined offset value can be read out for each channel. Set the channel number in the
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL register and read the offset value for the corresponding channel
in the AUTO_OFFSET_REMOVAL_VAL_RD register. Note that the offset estimation is done separately for the
odd and even data streams of each of the 16 ADCs and results in 32 sets of offset estimates that can be read
out.
表 7. Auto Offset Removal Accumulator Cycles
NUMBER OF SAMPLES USED FOR OFFSET VALUE
AUTO_OFFSET_REMOVAL_ACC_CYCLES (Bits 3-0)
EVALUATION
0
2047
127
1
2
255
3
511
4
1023
2045
4095
8191
16383
32767
65535
5
6
7
8
9
10 to 15
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8.3.5.1.3 Digital Averaging
The data from two adjacent ADCs (ADC1 and ADC2, ADC3 and ADC4, and so forth) can be averaged by
enabling the AVG_EN bit. A scenario where this feature can be useful is where the same analog input is fed to
two channels and their outputs are averaged to achieve approximately a 3-dB improvement in SNR. The
mapping of DIGOUT to the ADC data is shown in 表 8.
表 8. Mapping of the DIGOUT Words to the ADC Outputs when Using Digital Averaging
LVDS PAIR THE DATA COME OUT ON
DIGOUT
RELATIONSHIP TO ADC DATA
1X DATA RATE MODE
2X DATA RATE MODE
DIGOUT1
DIGOUT2
DIGOUT3
DIGOUT4
DIGOUT5
DIGOUT6
DIGOUT7
DIGOUT8
DIGOUT9
DIGOUT10
DIGOUT11
DIGOUT12
DIGOUT13
DIGOUT14
DIGOUT15
DIGOUT16
Average of ADC1 and ADC2
DOUT1
DOUT2
DOUT3
DOUT4
—
DOUT1
Average of ADC3 and ADC4
Average of ADC5 and ADC6
DOUT2
Average of ADC7 and ADC8
Ignore
—
—
—
—
Ignore
—
Ignore
—
Ignore
Average of ADC9 and ADC10
Average of ADC11 and ADC12
Average of ADC13 and ADC14
Average of ADC15 and ADC16
Ignore
—
DOUT9
DOUT10
DOUT11
DOUT12
—
DOUT9
DOUT10
—
—
—
—
Ignore
—
Ignore
—
Ignore
—
8.3.5.1.4 Digital Gain
The digital gain block can be enabled using the DIG_GAIN_EN bit. When enabled, a digital gain programmable
from 0 dB to 6 dB in steps of 0.2 dB can be applied. To enable individual digital gain control for each input in 32-
input mode, a separate digital gain control is provided for the odd and even sample of each ADC. Therefore,
there are 32 gain controls. When using 16-input mode, set the odd and even gain controls of the same ADC to
the same value. When using 8-input mode, four sets of gain controls are to be set to the same value (the odd
and even gains of adjacent ADCs; for instance, ADC1 and ADC2).
8.3.5.1.5 Digital HPF
A digital high-pass filter (HPF) can be enabled in the path of each ADC word. The enable control is shared
between sets of four consecutive-numbered ADCs (ADC1-ADC4, ADC5-ADC8, ADC9-ADC12, and ADC13-
ADC16). For example, DIG_HPF_EN_ADC1-4 enables the HPF in the paths of ADCOUT1, ADCOUT2,
ADCOUT3, and ADCOUT4. The digital high-pass transfer function is determined by 公式 1:
2k
Y(n) =
[x(n) - x(n - 1) + y(n - 1)]
k
(1)
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When DIG_HPF_EN_ADC1-4 is set, the value of K in 公式 1 is set by the HPF_CORNER_ADC1-4 bits. The
value of K can be programmed from 2 to 10. 表 9 shows the cutoff frequency as a function of K.
表 9. Digital HPF, –1-dB Corner Frequency versus K and fS
CORNER FREQUENCY (k)
(HPF_CORNER_ADCx
Register)
CORNER FREQUENCY (kHz)
fS = 40 MSPS
fS = 50 MSPS
fS = 65 MSPS
2
3
2780
1490
738
369
185
111
49
3480
1860
230
461
230
138
61
4520
2420
1200
600
300
180
80
4
5
6
7
8
9
25
30
40
10
12.
15
20
By default the HPF output is truncated to 14 bits. To enable the rounding operation to map the HPF output to the
ADC resolution, set the HPF_ROUND_EN_CH1-8 and HPF_ROUND_EN_CH9-16 bits to 1.
8.3.6 Data Formatting
The data formatting block does two functions: truncation and test pattern insertion. The serialization block
following the data formatting block performs a parallel-to-serial conversion of the input word. The serialization
factor is programmable to 10, 12, 14, or 16. The truncation block truncates the DIGOUT signal to the number of
bits specified by the serialization factor. The number of bits in DIGRES1 to DIGRES16 is therefore determined by
the serialization factor. Again, some of the bits in DIGRES may always be zero, depending on the combination of
ADC resolution, what digital features are enabled or disabled, and the serialization factor that is programmed. To
aid the FPGA in capturing and deserializing the serial output, the device includes provisions to replace the ADC
data with test patterns. The SERIAL_IN1 to SERIAL_IN16 signals are the same as the DIGRES1 to DIGRES16
signals during normal operation. When a test pattern is programmed, the DIGRES signals are replaced with the
appropriate test pattern. The manner in which a given test pattern actually comes out of the LVDS lines can be
altered based on the serializer operating mode because the serializer itself has multiple modes (LSB-, MSB-first
modes and 1X, 2X data rate modes).
8.3.7 Serializer and LVDS Interface
By default, each serializer takes in one SERIAL_IN word and performs a parallel-to-serial conversion. This mode
is referred to as the 1X data rate mode. In the 1X data rate mode, all 16 LVDS pairs are active and each pair
corresponds to the data coming out of one ADC. In the 2X data rate mode (set using the LVDS_RATE_2X bit),
the data from a pair of ADCs (two SERIAL_IN words) is packed into the same serial stream. In 2X mode, half the
LVDS pairs are idle and can be powered down. The 2X data rate mode causes the LVDS interface to run at
twice the rate but results in power saving. See the Timing Requirements: Signal Chain table for speed
restrictions when using the 1X and 2X data rate modes.
The LVDS interface is a clock-data-frame (CDF) format, and has a frame clock and a high-speed bit clock in
addition to the serial data lines.
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The frequency of the bit clock with respect to the conversion clock frequency depends on the serialization factor
(set using the SER_DATA_RATE bits), as shown in 表 10. Note that the serialized data are meant to be captured
on both the rising and falling edges of the bit clock. Thus, the serialized data rate is twice the bit clock frequency.
表 10. Bit Clock Rate Relationship to the Conversion Clock and System Clock Rates
BIT CLOCK RATE (fB in Terms of fS)
SERIALIZATION
FACTOR
BIT CLOCK RATE
(fB in Terms of fC)
DATA RATE MODE
16-INPUT MODE
32-INPUT MODE
5 × fS
8-INPUT MODE
1X
2X
1X
2X
1X
2X
1X
2X
5 × fC
10 × fC
6 × fC
5 × fS
10 × fS
6 × fS
2.5 × fS
5 × fS
3 × fS
6 × fS
3.5 × fS
7 × fS
4 × fS
8 × fS
10
12
14
16
10 × fS
6 × fS
12 × fC
7 × fC
12 × fS
7 × fS
12 × fS
7 × fS
14 × fC
8 × fC
14 × fS
8 × fS
14 × fS
8 × fS
16 × fC
16 × fS
16 × fS
The relationship of the frame clock frequency to the conversion clock frequency for the three input modes is as
shown in 表 11. The relationship of the frame clock frequency to the system clock (and conversion clock)
frequencies is the same between the 1X and 2X data rate modes.
表 11. Relation of Frame Clock Rate to the Conversion Clock and System Clock Rates
ANALOG INPUT MODE
(Number of Channels)
FRAME CLOCK RATE
(fF in Terms of fC)
FRAME CLOCK RATE
(fF in Terms of fS)
DATA RATE MODES
SUPPORTED
16
32
8
fC
0.5 × fC
fC
fS
1X, 2X
1X
0.5 × fS
0.5 × fS
1X, 2X
The serialization schemes for the various modes are illustrated in 图 64 to 图 68. Note that although the signals
marked ADCx Conversion in 图 64 to 图 68 represent a multi-bit digital word, the SERIAL_OUTx signals are
actually serialized representations of the correspondingly colored signals. For example, the blue-colored section
in the SERIAL_OUT1 signal in 图 64 contains the serial stream of data that originated from the word
corresponding to ADC1o.
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AIN1
t2
AIN2
t1
tAP
System Clock, fS
Conversion Clock, fC
NLAT
Frame Clock Output, fF
tPROP
ADC1e
ADC1o
ADC1 Conversion
SERIAL_OUT1
Serialized output of ...
Corresponding to ...
SERIAL_IN1
SERIAL_IN1
AIN1(t1)
AIN1(t2)
ADC2o
ADC2e
ADC2 Conversion
SERIAL_OUT2
Serialized output of ...
Corresponding to ...
SERIAL_IN2
SERIAL_IN2
AIN2(t1)
AIN2(t2)
图 64. ADC to Output Mapping in 16-Input, 1X Mode in LVDS Interface Mode
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t4
t3
t1
t2
AIN1
tAP
System Clock, fS
Conversion Clock, fC
NLAT
Frame Clock Output, fF
tPROP
ADC1o
ADC1e
ADC1 Conversion
SERIAL_OUT1
Serialized output of ...
Corresponding to ...
SERIAL_IN1
AIN1(t1)
SERIAL_IN1
AIN1(t3)
ADC2 Conversion
SERIAL_OUT2
ADC2o
ADC2e
Serialized output of ...
Corresponding to ...
SERIAL_IN2
AIN1(t2)
SERIAL_IN2
AIN1(t4)
图 65. ADC to Output Mapping in 8-Input, 1X Mode in LVDS Interface Mode
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AIN1
t2
AIN2
t1
tAP
System Clock, fS
Conversion Clock, fC
NLAT
Frame Clock Output, fF
ADC1o
ADC1e
tPROP
ADC1 Conversion
ADC2 Conversion
ADC2o
ADC2e
SERIAL_OUT1
(SERIAL_OUT2 is Idle)
SERIAL_IN2
ADC2o
SERIAL_IN1
ADC1e
SERIAL_IN2
ADC2e
Serialized output of ...
Corresponding to ...
SERIAL_IN1
ADC1o
AIN1(t1)
AIN2(t1)
AIN1(t2)
AIN2(t2)
图 66. ADC to Output Mapping in 16-Input, 2X Mode in LVDS Interface Mode
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t4
t3
t1
t2
AIN1
tAP
System Clock, fS
Conversion Clock, fC
NLAT
Frame Clock Output, fF
ADC1 Conversion
tPROP
ADC1o
ADC1e
ADC2o
ADC2e
ADC2 Conversion
SERIAL_OUT1
(SERIAL_OUT2 is Idle)
SERIAL_IN2
ADC2o
SERIAL_IN1
ADC1e
SERIAL_IN2
ADC2e
Serialized output of ...
Corresponding to ...
SERIAL_IN1
ADC1o
AIN1(t1)
AIN1(t2)
AIN1(t3)
AIN1(t4)
图 67. ADC to Output Mapping in 8-Input, 2X Mode in LVDS Interface Mode
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AIN1
t1
t2
tAP
AIN2
tAP
System Clock, fS
Conversion Clock, fC
NLAT
Frame Clock Output, fF
tPROP
tPROP
ADC1o
ADC1e
ADC1 Conversion
SERIAL_OUT1
Serialized output of ...
Corresponding to ...
SERIAL_IN1
AIN1(t1)
SERIAL_IN1
AIN2(t2)
ADC2o
ADC2e
ADC2 Conversion
SERIAL_OUT2
Serialized output of ...
Corresponding to ...
SERIAL_IN2
AIN3(t1)
SERIAL_IN2
AIN4(t2)
图 68. ADC to Output Mapping in 32-Input, 1X Mode in LVDS Interface Mode
The mapping of the subsequent-numbered ADC signals to subsequent-numbered SERIAL_OUT signals follows
the same pattern as indicated previously.
The serialized stream in SERIAL_OUT is a serialized representation of SERIAL_IN, which is the input word
coming into the serializer. By default, serialization is done LSB-first. By setting the MSB_FIRST bit, serialization
can be set to MSB-first.
The alignment of the frame clock, bit clock, and the serialized output data is illustrated in 图 1 for 16-input mode
where the serialization factor is set to 12 bit, serialization is LSB-first, and the data rate is set to 1X mode.
Another case is shown in 图 69 for 16-input mode. Here, the serialization factor is set to 14 bit, serialization is
MSB-first, and the data rate is set to 2X mode.
SERIAL_IN1 (D[13:0])
SERIAL_IN2 (D[13:0])
D13 D12
D11 D10 D9
D7
D5
D3
D1
D13 D12
D8
D6
D4
D2
D0
D11 D10 D9
D7
D5
D3
D1
D8
D6
D4
D2
Data (DOUT)
D0
Bit Clock (DCLK)
Frame Clock (FCLK)
图 69. LVDS Output Signals Timing Diagram in 16-Input Mode with
14-Bit Serialization, MSB-First, 2X Data Rate Mode
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The serialized signals come out on the DOUT pins as indicated in 表 12. The buffers marked Idle can be
powered down using the appropriate register bits to save power.
表 12. Mapping of the Serialized Outputs to the DOUT Pins
OUTPUT SIGNAL
LVDS OUTPUT PIN (DOUT)
1X DATA RATE MODE
SERIAL_OUT1
SERIAL_OUT2
SERIAL_OUT3
SERIAL_OUT4
SERIAL_OUT5
SERIAL_OUT6
SERIAL_OUT7
SERIAL_OUT8
SERIAL_OUT9
SERIAL_OUT10
SERIAL_OUT11
SERIAL_OUT12
SERIAL_OUT13
SERIAL_OUT14
SERIAL_OUT15
SERIAL_OUT16
2X DATA RATE MODE
SERIAL_OUT1
SERIAL_OUT3
SERIAL_OUT5
SERIAL_OUT7
Idle
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
DOUT9
DOUT10
DOUT11
DOUT12
DOUT13
DOUT14
DOUT15
DOUT16
Idle
Idle
Idle
SERIAL_OUT9
SERIAL_OUT11
SERIAL_OUT13
SERIAL_OUT15
Idle
Idle
Idle
Idle
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8.3.8 LVDS Buffers
A graphical representation of the 18 LVDS output buffers is shown in 图 70.
LVDS Buffer
DOUTP1
DOUTM1
DOUTP2
DOUTM2
Digital Output
DOUTP16
DOUTM16
DCLKP
DCLKM
Serial Clock
Frame Clock
FCLKP
FCLKM
图 70. LVDS Output
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The equivalent circuit of each LVDS output buffer is shown in 图 71. The buffer is designed for a differential
output impedance of 100 Ω (ROUT). The differential outputs can be terminated at the receiver end by a 100-Ω
termination. The buffer output impedance functions like a source-side series termination. By absorbing reflections
from the receiver end, the buffer output impedance helps improve signal integrity.
Device
OUTP
+0.4 V
External
100-ꢀ Load
OUTM
ROUT
1.03 V
-0.4 V
Switch impedance is
nominally 50 ꢀ (ê10%).
NOTE: When either the high or low switches are closed, differential ROUT = 100 Ω.
图 71. LVDS Output Circuit
8.3.9 JESD204B Interface
8.3.9.1 Overview
When operating in 16-input and 32-input modes, the device supports a multi-lane output interface based on the
JEDEC standard: JESD204B (serial interface for data converters). This interface runs up to 5 Gbps and provides
a compact way of routing the data from multiple ADCs in the device to the FPGA. Subclasses 0, 1, and 2 of the
JESD204B interface are supported. The block diagram in 图 72 illustrates the connections of the JESD interface
to the rest of the device. After the test pattern insertion block, the parallel data streams SERIAL_IN1 to
SERIAL_IN16 can be routed to either the LVDS interface or to the JESD interface (or both). The ADC data can
be sent out using the EN_JESD and DIS_LVDS controls. The LVDS_INx and CML_INx words are the same as
the SERIAL_INx words.
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SER_DATA_RATE
ADC_RES
12-, 14-Bits
SER_DATA_RATE
12-, 14-, 16-Bits
Test Pattern
Setting
1X, 2X
Mode
EN_JESD
DIS_LVDS
MSB_
FIRST
1X, 2X
Mode
SERIAL_
OUT1
DOUT1
SERIAL_
LVDS_IN1
DIGOUT1
16
ADCOUT1
IN1
IN1
DIGRES1
12, 14, 16
ADC1
12, 14
12, 14, 16
LVDS Outputs
12, 14, 16
SERIAL_
IN2
LVDS
Serializer
Output
Multiplexer
DIGOUT2
IN2
ADCOUT2
DIGRES2
ADC2
DOUT16
FCLK
SERIAL_
OUT16
LVDS_IN16
12, 14, 16
DCLK
Digital
Processing
(Bypassable)
LVDS,
JESD
Selection
Test Pattern
Insertion
Truncation
Analog
Inputs
CML1_OUT
CML_IN1
12, 14, 16
CML Outputs
JESD Tx Block
(Transport, Link, and Physical Layers)
SERIAL_
IN16
ADCOUT16
DIGRES16
DIGOUT16
IN16
CML_IN16
12, 14, 16
ADC16
CML8_OUT
A/D Conversion and Digital Processing
Data Formatting
Frame Clock, fF
Conversion Clock, fC
SYNC~,
SYSREF
SER_
DATA_
RATE
DATA_
PACKING
Sampling Clock,
fSAMP
ADC_RES Version,
Subclass
8, 4,
2_LANE
Internal Clock Generation and
Clock Tree
System Clock, fS
图 72. JESD Interface Connection to the Digital Processing Output
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The JESD interface can be enabled by setting the EN_JESD bit to 1. When in JESD mode, the LVDS interface
can be disabled by setting the DIS_LVDS bit to 1. Both the LVDS and JESD interfaces can be simultaneously
kept active by setting the DIS_LVDS bit to 0 and the EN_JESD bit to 1.
表 13 shows the clock rates corresponding to the various clocks mentioned in the JESD204B document. This
mapping is independent of whether the device operates in 8-, 16-, or 32-input mode.
表 13. Mapping of JESD204B Clock Notation to the Clock Rates
CLOCK NOTATION IN JESD204B DOCUMENT
CORRESPONDING CLOCK RATE
Device clock
Frame clock
fS
fC
fC
fC
Conversion clock
Sample clock
All mandatory features of the JESD204B interface are supported by the device, and are:
•
•
•
•
•
•
Breaking up of data from the ADCs into octets.
Optional scrambling of octets to avoid spectral tones.
Conversion of (scrambled) octets to 10-bit words using 8b, 10b encoding.
Parallel-to-serial conversion of octets.
A code group synchronization (CGS) phase to enable the receiver to synchronize to the frame boundaries.
An initial lane alignment (ILA) sequence phase to help the receiver align the data from all lanes and also for
the receiver to read and verify the link configuration parameters.
•
•
Character replacement at frame and multi-frame boundaries during normal data transmission to enable the
receiver to monitor frame alignment.
Mechanism to achieve deterministic latency across the link using the SYSREF signal in subclass 1 and the
SYNC~ signal in subclass 2.
The Link Configuration section details only the device-specific implementation aspects of the JESD204B
interface. For additional details related to the standard, see the JEDEC standard 204B (July 2011).
8.3.9.2 Link Configuration
The JESD204B link in the device can be configured to operate in different modes using the register controls in 表
14.
表 14. Register Controls Determining Link Configuration Parameters
REGISTER CONTROL
DESCRIPTION
ALLOWED SETTINGS
NUM_ADC_PER_LANE
Number of ADC words packed into one lane
2, 4, 8
Number of bits resolution in the ADC word input to the JESD
transmitter block
ADC_RES
10, 12, 14, 16
10, 12, 14, 16
SER_DATA_RATE
Serialization factor control
In addition to the register controls mentioned in 表 14, the SING_CONV_PER_OCT register bit controls the
packaging efficiency of the ADC data into octets.
The link configuration parameters are determined by 表 15.
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表 15. Link Configuration Parameters
LINK CONFIGURATION PARAMETER
LINK CONFIGURATION FIELD
CORRESPONDING RELATION OF FIELD TO
DEFAULT VALUE
(In Decimal, Unless
Otherwise Specified)(1)
LINK CONFIGURATION
DESCRIPTION
ALLOWED VALUES
(Decimal)
METHOD OF SETTING
PARAMETER
FIELD IN ILAS
PARAMETER
ADJCNT
ADJDIR
BID
Not relevant
0
0
0
0
0
0
0
6
0
Forced to 0; not used
Forced to 0; not used
BANK_ID register control
Forced to 0
ADJCNT[3:0]
ADJDIR[0]
BID[3:0]
CF[4:0]
Binary value
Binary value
Not relevant
0
Bank ID
0…15
Binary value
CF
Number of control words per frame
Number of control bits per sample
Device ID
0
Binary value
CS
0
0…255
See 表 18
0
Forced to 0
CS[1:0]
Binary value
DID
DEVICE_ID register control
Determined by 表 18
Forced to 0; not used
DID[7:0]
F[7:0]
Binary value
F
Number of octets per frame
High density format
Binary value minus 1
Binary value
HD
HD[0]
ENABLE_JESD_VER_CONTROL,
JESD_VERSION register control; see
表 16
0 = JESD204A
1 = JESD204B
JESDV
JESD204 version
1
JESDV[2:0]
Binary value
Determined by 表 29; can be changed
using FORCE_K and
K_VALUE_TO_FORCE register
controls
K
L
Number of frames per multiframe
Number of lanes
See 表 16
2, 4, 8
3
K[4:0]
L[4:0]
Binary value minus 1
Binary value minus 1
Binary value
4
Determined by 表 18
Default (value given in 表 17) can be
changed using EN_LANE_ID# and
LANE_ID# register controls for each
lane number
LID
Lane ID
1 to 8
As given in 表 5
LID[4:0]
M
N
Number of ADCs
ADC resolution
16
16
12
Forced to 16
M[7:0]
N[4:0]
Binary value minus 1
Binary value minus 1
Determined by ADC_RES register
control
10, 12, 14, 16
N’
PHADJ
S
Total number of bits per sample
Not relevant
See 表 18
12
0
Determined by 表 18
Forced to 0; not used
Forced to 1
N’[4:0]
PHADJ[0]
S[4:0]
Binary value minus 1
Binary value
0
1
Number of samples per ADC per frame
Scrambler enable or disable
1
Binary value minus 1
Binary value
SCR
0,1
0
SCR_EN register control
SCR[0]
0 = Subclass 0
1 = Subclass 1
2 = Subclass 2
ENABLE_JESD_VER_CONTROL,
JESD_SUBCLASS register control;
see 表 16
SUBCLASSV
Device subclass version
1
SUBCLASSV[2:0]
Binary value
RES1
RES2
Reserved field 1
Reserved field 2
0
0
0
0
Forced to 0
Forced to 0
RES1[7:0]
RES2[7:0]
Binary value
Binary value
Lane 1 – 32h
Lane 3 – 34h
Lane 5 – 36h
Lane 7 – 38h
Default value as calculated by device
can be changed using
EN_CHECKSUM_LANE# and
CHECK_SUM# for each lane number
CHKSUM
Checksum
—
FCHK[7:0]
Binary value
(1) Corresponding to ADC_RES set to 12 bits, SER_DATA_RATE set to 12 bits, NUM_ADC_PER_LANE set to four ADCs per lane, SING_CONV_PER_OCT mode disabled, and
ENABLE_JESD_VER_CONTROL set to 0 (to operate in JESD204B-subclass1).
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8.3.9.3 JESD Version and Subclass
The interface can be configured to operate either as a JESD204A version or as a JESD204B version.
Furthermore, when operating as a JESD204B version, the subclass can be configured as subclass 0, 1, or 2.
The register controls for programming the version and subclass are shown in 表 16.
表 16. JESD Version and Subclass Control
FIELD VALUE
ENABLE_JESD_
VER_CONTROL JESD_VERSION
JESD_
SUBCLASS
SUBCLASS
VERSION
JESD VERSION
JESD204B-subclass1
JESD204A
JESD VERSION
0
1
1
1
1
X(1)
000
001
001
001
X
001
000
001
001
001
001
000
000
001
010
000
000
001
010
JESD204B-subclass 0
JESD204B-subclass 1
JESD204B-subclass 2
(1) X = don't care.
8.3.9.4 Transport Layer
In the JESD204B transport layer, the incoming stream of ADC samples are mapped to one or more parallel lanes
and grouped into a frame of F octets for transmission on each lane. Additional tail bits can be appended to the
ADC samples.
8.3.9.4.1 User Data Format
The interface can be configured to operate in 2, 4, or 8 lane modes (L = 2, 4, or 8). Depending on the number of
lanes used, the data from the 16 ADCs comes out in the different lanes as shown in 表 17.
表 17. Lane Mapping to CML Pins(1)
DEFAULT
LANE ID
2 ADCS PER LANE
(8-Lane Mode)(2)
4 ADCS PER LANE
(4-Lane Mode)(2)
8 ADCS PER LANE
(2-Lane Mode)(2)
MAPPING TO THE PINS
1
2
3
4
5
6
7
8
CML1_OUTP-CML1_OUTM
CML2_OUTP-CML2_OUTM
CML3_OUTP-CML3_OUTM
CML4_OUTP-CML4_OUTM
CML5_OUTP-CML5_OUTM
CML6_OUTP-CML6_OUTM
CML7_OUTP-CML7_OUTM
CML8_OUTP-CML8_OUTM
ADC1, ADC2
ADC3, ADC4
ADC5, ADC6
ADC7, ADC8
ADC9, ADC10
ADC11, ADC12
ADC13, ADC14
ADC15, ADC16
ADC1…ADC4
ADC1…ADC8
—
—
ADC5…ADC8
—
—
—
ADC9…ADC12
ADC9…ADC16
—
ADC13…ADC16
—
—
—
—
(1) More accurately, ADC1…ADC16 corresponds to CML_IN1…CML_IN16 as illustrated in 图 72.
(2) Determined by the NUM_ADC_PER_LANE register control.
The unused lanes are automatically powered down.
The device supports several combinations of ADC resolutions and number of lanes. There are no control bits or
control words (CF = 0). The device has two modes of data packing: normal packing mode and single converter
per octet mode. The packing mode can be chosen using the SING_CONV_PER_OCT register control. The
number of ADCs per lane can be programmed to 8, 4, or 2 using the NUM_ADC_PER_LANE register control.
The number of ADCs per lane automatically determines the value of L (the number of lanes). The values of N’
and F for the different modes are described in 表 18.
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表 18. Different JESD204B Interface Modes of Operation
N(3)
SINGLE CONVERTER PER
OCTET MODE(1)
NORMAL PACKING MODE(1)
(Resolution of
ADC Word
Input to the
JESD204B
Transmitter)
NUMBER OF
ADCS PER
LANE, NAL
SER_DATA_
RATE,
ADC_RES,
NRES
(Bits)
L(3)
(Lanes)
(1)
N'(3)
F(3)
N'(3)
F(3)
(1)
NSER(1)(2) (Bits)
(Total Number
of Bits)
(Octets per
Frame)
(Total Number
of Bits)
(Octets per
Frame)
SER_DATA_
RATE
SER_DATA_
RATE
8
4
10, 12, 14, 16
10, 12, 14, 16
10, 12, 14, 16
10, 12, 14, 16
2
4
ADC_RES
ADC_RES
16
16
16(5)
8(5)
(4)
SER_DATA_
RATE(4)
SER_DATA_
RATE/2
10
12
14
16
10
ADC_RES
ADC_RES
ADC_RES
ADC_RES
12
12
16
16
3(6)
16
16
16
16
4(5)
4(5)
4(5)
4(5)
10, 12
3
2
8
10, 12, 14
10, 12, 14, 16
4(6)
4
(1) Value or mode is set by programming the appropriate registers.
(2) SER_DATA_RATE must be greater than or equal to ADC_RES.
(3) Automatically calculated and set by the device.
(4) When SER_DATA_RATE > ADC_RES, then each ADC word is additionally padded with the (SER_DATA_RATE – ADC_RES) number
of zeros on the LSB side to create the‘JESD ADC word. Each JESD ADC word is broken up into nibbles. Incomplete nibbles (if any) are
stuffed with the starting bits of the subsequent JESD ADC word for maximum data packing.
(5) Each ADC sample is broken into two octets; the incomplete octet is completed using zeros as tail bits.
(6) Each ADC sample is broken into nibbles; incomplete nibbles are completed using zeros as tail bits.
The data packing modes are described in 表 19 to 表 24 for different modes of operation. Lane 1 is used for
illustration purposes in these tables.
(1)
表 19. Data Packing in Normal Packing Mode for NAL = 8 and NRES = NSER
NRES = 10, NSER = 10
NRES = 12, NSER = 12
NRES = 14, NSER = 14
NRES = 16, NSER = 16
OCTET
NIBBLE 1
NIBBLE 2
NIBBLE 1
NIBBLE 2
NIBBLE 1
NIBBLE 2
NIBBLE 1
NIBBLE 2
1
2
3
4
5
6
ADC1[9:6]
ADC1[5:2]
ADC1[11:8]
ADC1[7:4]
ADC1[13:10]
ADC1[9:6]
ADC1[15:12]
ADC1[11:8]
ADC1[1:0],
ADC2[9:8]
ADC1[1:0],
ADC2[13:12]
ADC2[7:4]
ADC3[9:6]
ADC1[3:0]
ADC2[7:4]
ADC3[11:8]
ADC3[3:0]
ADC4[7:4]
ADC2[11:8]
ADC2[3:0]
ADC3[7:4]
ADC4[11:8]
ADC4[3:0]
ADC1[5:2]
ADC2[11:8]
ADC2[3:0]
ADC3[9:6]
ADC1[7:4]
ADC2[15:12]
ADC2[7:4]
ADC1[3:0]
ADC2[11:8]
ADC2[3:0]
ADC3[11:8]
ADC3[3:0]
ADC2[3:0]
ADC3[5:2]
ADC4[7:4]
ADC5[9:6]
ADC2[7:4]
ADC3[13:10]
ADC3[5:2]
ADC3[1:0],
ADC4[9:8]
ADC4[3:0]
ADC3[15:12]
ADC3[7:4]
ADC3[1:0],
ADC4[13:12]
ADC5[5:2]
ADC4[11:8]
ADC5[1:0],
ADC6[9:8]
7
8
9
ADC6[7:4]
ADC7[9:6]
ADC5[11:8]
ADC5[3:0]
ADC6[7:4]
ADC5[7:4]
ADC6[11:8]
ADC6[3:0]
ADC4[7:4]
ADC5[13:10]
ADC5[5:2]
ADC4[3:0]
ADC5[9:6]
ADC4[15:12]
ADC4[7:4]
ADC4[11:8]
ADC4[3:0]
ADC5[11:8]
ADC6[3:0]
ADC7[1:0],
ADC8[9:8]
ADC5[1:0],
ADC6[13:12]
ADC7[5:2]
ADC5[15:12]
ADC5[7:4]
10
11
12
ADC7[7:4]
ADC8[3:0]
ADC7[11:8]
ADC7[3:0]
ADC8[7:4]
ADC7[7:4]
ADC8[11:8]
ADC8[3:0]
ADC6[11:8]
ADC6[3:0]
ADC7[9:6]
ADC6[7:4]
ADC5[3:0]
ADC6[11:8]
ADC6[3:0]
—
—
—
—
ADC7[13:10] ADC6[15:12]
ADC7[5:2]
ADC6[7:4]
ADC7[1:0],
ADC8[13:12]
13
—
—
—
—
ADC8[11:8]
ADC7[15:12]
ADC7[11:8]
14
15
16
—
—
—
—
—
—
—
—
—
—
—
—
ADC8[7:4]
ADC8[3:0]
ADC7[7:4]
ADC8[15:12]
ADC8[7:4]
ADC7[3:0]
ADC8[11:8]
ADC8[3:0]
—
—
—
—
(1) A similar data packing scheme is used for other lanes with the mapping of ADCs per lane as indicated in 表 17.
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(1)
表 20. Data Packing in Normal Packing Mode for NAL = 8 and NSER > NRES
NRES = 10, NSER = 12
NIBBLE 1
NRES = 12, NSER = 14
NIBBLE 1
NRES = 14, NSER = 16
NIBBLE 2
ADC1[5:2]
ADC2[9:6]
ADC2[1:0], 00
ADC3[5:2]
ADC4[9:6]
ADC4[1:0], 00
ADC5[5:2]
ADC6[9:6]
ADC6[1:0], 00
ADC7[5:2]
ADC8[9:6]
ADC8[1:0], 00
—
NIBBLE 2
ADC1[7:4]
00,ADC2[11:10]
ADC2[5:2]
ADC3[11:8]
ADC3[3:0]
ADC4[9:6]
ADC4[1:0],00
ADC5[7:4]
00,ADC6[11:10]
ADC6[5:2]
ADC7[11:8]
ADC7[3:0]
ADC8[9:6]
ADC8[1:0],00
—
NIBBLE 1
NIBBLE 2
ADC1[9:6]
1
2
ADC1[9:6]
ADC1[1:0], 00
ADC2[5:2]
ADC3[9:6]
ADC3[1:0], 00
ADC4[5:2]
ADC5[9:6]
ADC5[1:0], 00
ADC6[5:2]
ADC7[9:6]
ADC7[1:0], 00
ADC8[5:2]
—
ADC1[11:8]
ADC1[3:0]
ADC2[9:6]
ADC2[1:0],00
ADC3[7:4]
00,ADC4[11:10]
ADC4[5:2]
ADC5[11:8]
ADC5[3:0]
ADC6[9:6]
ADC6[1:0],00
ADC7[7:4]
00,ADC8[11:10]
ADC8[5:2]
—
ADC1[13:10]
ADC1[5:2]
ADC1[1:0], 00
ADC2[9:6]
3
ADC2[13:10]
ADC2[5:2]
4
ADC2[1:0], 00
ADC3[9:6]
5
ADC3[13:10]
ADC3[5:2]
6
ADC3[1:0], 00
ADC4[9:6]
7
ADC4[13:10]
ADC4[5:2]
8
ADC4[1:0], 00
ADC5[9:6]
9
ADC5[13:10]
ADC5[5:2]
10
11
12
13
14
15
16
ADC5[1:0], 00
ADC6[9:6]
ADC6[13:10]
ADC6[5:2]
ADC6[1:0], 00
ADC7[9:6]
ADC7[13:10]
ADC7[5:2]
—
—
ADC7[1:0], 00
ADC8[9:6]
—
—
ADC8[13:10]
ADC8[5:2]
—
—
—
—
ADC8[1:0], 00
(1) A similar data packing scheme is used for other lanes with the mapping of ADCs per lane as indicated in 表 17.
(1)
表 21. Data Packing in Normal Packing Mode for NAL = 4 and NRES = NSER
NRES = 10, NSER = 10
NRES = 12, NSER = 12
NRES = 14, NSER = 14
NRES = 16, NSER = 16
OCTET
NIBBLE 1
NIBBLE 2
NIBBLE 1
NIBBLE 2
NIBBLE 1
NIBBLE 2
NIBBLE 1
NIBBLE 2
1
2
3
4
5
6
ADC1[9:6]
ADC1[5:2]
ADC1[11:8]
ADC1[7:4]
ADC1[13:10]
ADC1[9:6]
ADC1[15:12]
ADC1[11:8]
ADC1[1:0],
ADC2[9:8]
ADC1[1:0],
ADC2[13:12]
ADC2[7:4]
ADC3[9:6]
ADC1[3:0]
ADC2[7:4]
ADC3[11:8]
ADC3[3:0]
ADC4[7:4]
ADC2[11:8]
ADC2[3:0]
ADC3[7:4]
ADC4[11:8]
ADC4[3:0]
ADC1[5:2]
ADC2[11:8]
ADC2[3:0]
ADC3[9:6]
ADC1[7:4]
ADC2[15:12]
ADC2[7:4]
ADC1[3:0]
ADC2[11:8]
ADC2[3:0]
ADC3[11:8]
ADC3[3:0]
ADC2[3:0]
ADC3[5:2]
ADC4[7:4]
—
ADC2[7:4]
ADC3[13:10]
ADC3[5:2]
ADC3[1:0],
AD4[9:8]
ADC4[3:0]
ADC3[15:12]
ADC3[7:4]
ADC3[1:0],
ADC4[13:12]
—
ADC4[11:8]
7
8
—
—
—
—
—
—
—
—
ADC4[7:4]
—
ADC4[3:0]
—
ADC4[15:12]
ADC4[7:4]
ADC4[11:8]
ADC4[3:0]
(1) A similar data packing scheme is used for other lanes with the mapping of ADCs per lane as indicated in 表 17.
(1)
表 22. Data Packing in Normal Packing Mode for NAL = 4 and NSER > NRES
NRES = 10, NSER = 12
NIBBLE 1
NRES = 12, NSER = 14
NIBBLE 1
NRES = 14, NSER = 16
OCTET
NIBBLE 2
ADC1[5:2]
ADC2[9:6]
ADC2[1:0], 00
ADC3[5:2]
ADC4[9:6]
ADC4[1:0], 00
—
NIBBLE 2
ADC1[7:4]
00,ADC2[11:10]
ADC2[5:2]
ADC3[11:8]
ADC3[3:0]
ADC4[9:6]
ADC4[1:0],00
—
NIBBLE 1
NIBBLE 2
ADC1[9:6]
1
2
3
4
5
6
7
8
ADC1[9:6]
ADC1[1:0], 00
ADC2[5:2]
ADC3[9:6]
ADC3[1:0], 00
ADC4[5:2]
—
ADC1[11:8]
ADC1[3:0]
ADC2[9:6]
ADC2[1:0],00
ADC3[7:4]
00,ADC4[11:10]
ADC4[5:2]
—
ADC1[13:10]
ADC1[5:2]
ADC1[1:0], 00
ADC2[9:6]
ADC2[13:10]
ADC2[5:2]
ADC2[1:0], 00
ADC3[9:6]
ADC3[13:10]
ADC3[5:2]
ADC3[1:0], 00
ADC4[9:6]
ADC4[13:10]
ADC4[5:2]
—
—
ADC4[1:0], 00
(1) A similar data packing scheme is used for other lanes with the mapping of ADCs per lane as indicated in 表 17.
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表 23. Data Packing in Normal Packing Mode for NAL = 2(1)
NRES = 10, NSER = 10 or 12
NRES = 12, NSER = 12
NRES = 14, NSER = 14 or 16
NRES = 16, NSER = 16
OCTET
NIBBLE 1
ADC1[9:6]
ADC1[1:0], 00
ADC2[5:2]
—
NIBBLE 2
ADC1[5:2]
ADC2[9:6]
ADC3[1:0], 00
—
NIBBLE 1
ADC1[11:8]
ADC1[3:0]
ADC2[7:4]
—
NIBBLE 2
ADC1[7:4]
ADC2[11:8]
ADC2[3:0]
—
NIBBLE 1
ADC1[13:10]
ADC1[5:2]
NIBBLE 2
ADC1[9:6]
NIBBLE 1
ADC1[15:12]
ADC1[7:4]
NIBBLE 2
ADC1[11:8]
ADC1[3:0]
ADC2[11:8]
ADC2[3:0]
1
2
3
4
ADC1[1:0], 00
ADC2[9:6]
ADC2[13:10]
ADC2[5:2]
ADC2[15:12]
ADC2[7:4]
ADC2[1:0], 00
(1) A similar data packing scheme is used for other lanes with the mapping of ADCs per lane as indicated in 表 17.
(1)(2)
表 24. Data Packing in Single Converter per Octet Packing Mode for NAL = 8 (Independent of NSER
)
NRES = 10
NRES = 12
NRES = 14
NRES = 16, NSER = 16
OCTET
NIBBLE 1
NIBBLE 2
ADC1[5:2]
0000
NIBBLE 1
NIBBLE 2
ADC1[7:4]
0000
NIBBLE 1
NIBBLE 2
ADC1[9:6]
NIBBLE 1
ADC1[15:12]
ADC1[7:4]
NIBBLE 2
ADC1[11:8]
ADC1[3:0]
ADC2[11:8]
ADC2[3:0]
ADC3[11:8]
ADC3[3:0]
ADC4[11:8]
ADC4[3:0]
ADC5[11:8]
ADC5[3:0]
ADC6[11:8]
ADC6[3:0]
ADC7[11:8]
ADC7[3:0]
ADC8[11:8]
ADC8[3:0]
1
2
ADC1[9:6]
ADC1[1:0], 00
ADC2[9:6]
ADC1[11:8]
ADC1[3:0]
ADC2[11:8]
ADC2[3:0]
ADC3[11:8]
ADC3[3:0]
ADC4[11:8]
ADC4[3:0]
ADC5[11:8]
ADC5[3:0]
ADC6[11:8]
ADC6[3:0]
ADC7[11:8]
ADC7[3:0]
ADC8[11:8]
ADC8[3:0]
ADC1[13:10]
ADC1[5:2]
ADC1[1:0], 00
ADC2[9:6]
3
ADC2[5:2]
0000
ADC2[7:4]
0000
ADC2[13:10]
ADC2[5:2]
ADC2[15:12]
ADC2[7:4]
4
ADC2[1:0], 00
ADC3[9:6]
ADC2[1:0], 00
ADC3[9:6]
5
ADC3[5:2]
0000
ADC3[7:4]
0000
ADC3[13:10]
ADC3[5:2]
ADC3[15:12]
ADC3[7:4]
6
ADC3[1:0], 00
ADC4[9:6]
ADC3[1:0], 00
ADC4[9:6]
7
ADC4[5:2]
0000
ADC4[7:4]
0000
ADC4[13:10]
ADC4[5:2]
ADC4[15:12]
ADC4[7:4]
8
ADC4[1:0], 00
ADC5[9:6]
ADC4[1:0], 00
ADC5[9:6]
9
ADC5[5:2]
0000
ADC5[7:4]
0000
ADC5[13:10]
ADC5[5:2]
ADC5[15:12]
ADC5[7:4]
10
11
12
13
14
15
16
ADC5[1:0], 00
ADC6[9:6]
ADC5[1:0], 00
ADC6[9:6]
ADC6[5:2]
0000
ADC6[7:4]
0000
ADC6[13:10]
ADC6[5:2]
ADC6[15:12]
ADC6[7:4]
ADC6[1:0], 00
ADC7[9:6]
ADC6[1:0], 00
ADC7[9:6]
ADC7[5:2]
0000
ADC7[7:4]
0000
ADC7[13:10]
ADC7[5:2]
ADC7[15:12]
ADC7[7:4]
ADC7[1:0], 00
ADC8[9:6]
ADC7[1:0], 00
ADC8[9:6]
ADC8[5:2]
0000
ADC8[7:4]
0000
ADC8[13:10]
ADC8[5:2]
ADC8[15:12]
ADC8[7:4]
ADC8[1:0], 00
ADC8[1:0], 00
(1) For NAL = 4, use the first eight octets. For NAL = 2, use the first four octets.
(2) A similar data packing scheme is used for other lanes with the mapping of ADCs per lane as indicated in 表 17.
Tail bits (in modes where applicable) are set to 0. There is no option for a pseudo-random generator for
generating the tail bits. When a converter is powered down, the corresponding sample is replaced by a dummy
sample that corresponds to all zeros. There is no option for a pseudo-random generator for generating the
dummy samples. The value S (number of samples per ADC per frame minus 1) is always 0 and HD mode is not
supported.
8.3.9.4.2 Transport Layer Test Patterns
All test patterns described in the LVDS Test Pattern Mode section can be set, even with the JESD204B interface.
These test patterns serve as transport layer test modes for the JESD interface. These test patterns can replace
the normal ADC data going into the JESD204B link layer.
8.3.9.5 Scrambler
An optional scrambler is implemented in the device using the polynomial as defined in the JESD204B standard.
The scrambler can be enabled using the SCR_EN register control. The scrambler is bypassed during the code
group synchronization and transmission of the initial lane alignment sequence. There is no alternate scrambler to
keep processing the user data during these states.
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8.3.9.6 Data Link Layer
The data link layer of the JESD204B block handles various functions (such as the 8b, 10b encoding of the input
octets, code group synchronization (CGS), transmission of an initial lane alignment (ILA) sequence, frame
alignment character replacement, and transmission of link layer test patterns). As specified by the standard, the
device uses 8b, 10b coding to encode the data before being transmitted. The frame contents are processed from
MSB to LSB.
8.3.9.6.1 Code Group Synchronization (CGS)
In the CGS state, the device transmits a set of /K28.5/ characters that are used by the receiver to recover the
clock and data from the serial stream using a clock and data recovery (CDR) circuit, and also to align to the
symbol boundaries. The device enters the CGS state when it receives an active (low going) SYNC pulse that is
at least four device clocks wide. In addition, when the device is in the CGS state as defined by the JESD204B
standard, the device can also be made to transmit a stream of /K28.5/ symbols by programming the
TX_SYNC_REQ register control.
8.3.9.6.2 Initial Lane Alignment (ILA)
By default, the CGS phase is followed by the transmission of an ILA sequence. The ILA transmission can be
disabled using the LINK_CONFIG_DIS register control. Transitioning from a CGS state to an ILA sequence state
occurs on the local multiframe clock (LMFC) boundary. By default, the transition occurs at the first LMFC
boundary after SYNC~ is deasserted. However, the transition point can be delayed to the second, third, or fourth
LMFC edge by programming the RELEASE_ILA register control to 1, 2, or 3, respectively. This mode can be
used to provide sufficient time to the receiver to achieve synchronization.
8.3.9.6.3 Lane and Frame Alignment Monitoring
The lane and frame alignment monitoring and character replacement are as per the JESD204B standard. The
insertion of frame and lane alignment characters can be enabled by setting the LANE_ALIGN and
FRAME_ALIGN register controls. These controls, in conjunction with the SCR_EN control, determine the
mechanism of the lane and frame alignment character replacement, as shown in 表 25.
表 25. Character Replacement for Lane and Frame Alignment
SCR_EN
FRAME_ALIGN LANE_ALIGN
EFFECT ON LINK DATA
0
0
0
ADC data are sent without any character replacement.
If the last octet of the multiframe is the same as the last octet of the previous
multiframe, then the last octet is replaced with /K28.3/.
0
0
1
If the last octet of the frame is the same as the last octet of the previous frame, then
the last octet is replaced with /K28.7/. If an alignment character has already been
sent in the previous frame, then no characters are replaced.
0
1
0
0
1
1
0
1
0
Frame and lane alignment character replacements are enabled.
ADC data are scrambled and sent without any character replacement.
If the last scrambled octet of the multiframe is D28.3, then that octet is replaced with
/K28.3/.
1
0
1
If the last scrambled octet of the frame is D28.7, then that octet is replaced with
/K28.7/.
1
1
1
1
0
1
Frame and lane alignment character replacements are enabled with scrambling.
8.3.9.6.4 Link Layer Test Modes
The JESD link can be tested by transmitting predetermined 8b, 10b characters in all frames and on all lanes.
Test modes can be enabled with the LINK_LAYER_TESTMODES register control. These test patterns are never
scrambled. A pseudo-random pattern of 120 bits corresponds to the random pattern (RPAT). An additional PRBS
pattern can be output by setting the transport layer test mode to a constant pattern and enabling the scrambler. A
scrambled jitter pattern (JSPAT) is not supported.
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8.3.9.7 Deterministic Latency
Deterministic latency is achieved in the subclass 1 and subclass 2 of the JESD204B standard through a local
multiframe clock (LMFC) that is synchronized between the transmitter and receiver. The phase of the LMFC is
dictated by the sampled SYSREF input in subclass 1 and by the SYNC~ rising edge in subclass 2.
8.3.9.7.1 Synchronization Using SYNC~ and SYSREF
In order to achieve deterministic latency across the entire link, the device supports system-level link
synchronization using the SYNC~ (in subclass 2) and SYSREF (in subclass 1) signals, as mentioned in the
JESD204B standards document. The mapping of these signals to the pin voltages is shown in 表 26.
表 26. Mapping of the JESD204B Signals to Device Pins
SIGNAL NOTATION IN JESD204B DOCUMENT
RELATION TO DEVICE PINS
ADC_CLKP – ADC_CLKM
Device clock
SYNC~
SYSREF(1)
SYNCP_SERDES – SYNCM_SERDES
SYSREFP_SERDES – SYSREFM_SERDES
(1) Must be inactive (low) except when operating in JESD204B subclass 1.
JESD subclasses 1 and 2 use an internal clock called the local multiframe clock (LMFC) to achieve deterministic
latency in the link. The phase of the LMFC clock is set based on the device clock rising edge that the SYSREF
(in subclass 1) or SYNC~(in subclass 2) signals are sampled on. The device clock is the highest speed input
clock for the device and there is no provision for a higher speed adjustment clock to achieve phase adjustments
finer than what is achievable using the device clock. By default, the LMFC count is reset to 0 during a SYNC~ or
SYSREF event. This reset count can be forced to a different value by using the FORCE_LMFC_COUNT and
LMFC_COUNTER_INIT_VALUE register controls. The LMFC does not exist in JESD subclass 0.
SYSREF can be a periodic, one-shot, or gapped periodic active-high signal that is sampled on the rising edge of
the device clock. There is no option to sample the SYSREF signal on the falling edge of the device clock. If
SYSREF is a periodic or gapped periodic signal, then its periodicity must be a multiple of the LMFC period in
order to avoid unwanted sudden shifts in the phase of the LMFC. Note that a continuous periodic SYSREF can
cause spurious degradation in the ADC performance because of energy coupling into the device at a rate that is
a sub-harmonic of the device clock rate.
In addition to resetting the phase of the LMFC, SYSREF (or SYNC~) also resets some of the other internal clock
dividers not related to the JESD block and affects the reset of the phase of the test pattern generator (see the
LVDS Test Pattern Mode section). SYSREF (or SYNC~) also affects the reset of the frame clock phases and the
odd or even sampling selection in 32-channel mode.
The default mode is to reset all internal dividers as well as the phase of the LMFC during every SYSREF (or
SYNC~) event based on the JESD subclass.
The reset operations based on SYNC~ and SYSREF for the different subclasses occurs as shown in 表 27.
表 27. Reset Operations from SYNC~ or SYSREF in the Various JESD204B Subclasses
What gets reset
EVENT CONTROLLING THE
SUBCLASS
JESD BLOCK (Phase of the LMFC
Clock)
RESET
REST OF DEVICE
JESD204B-subclass 0
JESD204B-subclass 1
JESD204B-subclass 2
JESD204A
SYNC~ rising edge
SYSREF(1)
Not applicable
Yes
Yes
Yes
Yes
Yes
SYNC~ rising edge
SYNC~ rising edge
Yes
Not applicable
(1) To avoid unexpected reset behavior, SYSREF must be active only when operating in JESD204B subclass 1.
58
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表 28 lists the register controls to selectively mask the reset operations of the various blocks.
表 28. Masking of the Various Reset Operations Resulting from SYNC~ or SYSREF
MASKS RESET OPERATION IN
REGISTER BIT
JESD BLOCK (Phase of the
LMFC Clock)
CLOCK DIVIDERS
OTHER SYNCHRONIZATION(1)
JESD_RESET1
JESD_RESET2
No
Yes
Yes
Yes
No
Yes
(1) Demodulators and test pattern generation.
The JESD_RESET1 and JESD_RESET2 bits mask the reset operations as indicated in 表 28 for all subsequent
SYNC~ and SYSREF events after the bits are set. The JESD_RESET3 register bit is functionally similar to
JESD_RESET2 (in terms of masking the reset function to the blocks). However, when JESD_RESET3 is set, this
bit allows the first SYNC~ or SYSREF event to reset all clock dividers, takes affect, and masks the reset of the
LMFC clock divider only after the first SYNC~ or SYSREF event occurs. The JESD_RESET1, JESD_RESET2,
and JESD_RESET3 bits can be used appropriately to avoid unwanted reset operations resulting from SYNC~
and SYSREF events.
When SYSREF resets the rest of the device, the ADC data can be corrupted for four to six clocks. If SYSREF is
periodic, then periodic corruption of ADC data can result. Thus, when using a periodic or a gapped periodic
SYSREF, one JESD_RESET (JESD_RESET1, JESD_RESET2, or JESD_RESET3) must be set to 1.
8.3.9.7.2 Latency
图 73 to 图 76 illustrate the relevant latencies for the JESD interface with the default mode of operation (four
ADCs per lane mode, NADC = 12, NSER = 12, and K = 3) used for illustration purposes.
N+3
N+4
N+2
N+1
Sample
N
Analog Input
to ADC1
tAP
ADC_CLKP
ADC_CLKM
(3)
tD_JESD
NLAT_JESD
CML_OUT(1)
Output(2)
N
Output
N+1
Output
N+2
(1) CML_OUT is shown broken in terms of octets.
(2) The ADC word corresponding to ADC1 is contained in the first two octets of output N.
(3) tD_JESD is a small additional variable delay which is a fraction of the device clock period.
图 73. ADC Latency in JESD Mode
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SYNC~ is latched by the device.
ADC_CLKP
ADC_CLKM
tSU_T
tH_T
SYNC~
NA_SYNC~
CGS Phase
CML_OUT(1)
= K28.5
= Data
(1) CML_OUT is broken in terms of octets.
图 74. Latency from SYNC~ Assertion to Start of CGS Phase
SYSREF is latched
by the device.
SYNC~ is latched
by the device.
ADC_CLKP
ADC_CLKM
Input Clock
SYSREF
LMFC
(Internal Signal)
1st LMFC boundary after SYNC~.
SYNC~
ND_SYNC~
ILA Sequence
CML_OUT
CGS Phase
= K28.5
= K28.0
图 75. Latency from SYNC~ Deassertion to Start of ILA Phase in Subclass 1
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SYNC~ is latched
by the device.
ADC_CLKP
Input Clock
ADC_CLKM
LMFC
(Internal Signal)
1st LMFC boundary after SYNC~.
SYNC~
ND_SYNC~
ILA Sequence
CML_OUT
CGS Phase
= K28.5
= K28.0
图 76. Latency from SYNC~ Deassertion to Start of ILA Phase in Subclass 2
8.3.9.7.3 Multiframe Size
The size of the multiframe (as well as the periodicity of the LMFC clock) is denoted as K. Multiframe size is
calculated as shown in 公式 2:
Ceil (17 / Number of Octets per Frame) ≤ Multiframe Size (In Terms of Number of Frames)
(2)
表 29 lists the multiframe size for different modes of operation.
表 29. Multiframe Size in Different Modes(1)
2 ADCS PER LANE(2)
MULTIFRAME SIZE
FRAMES OCTETS
18
4 ADCS PER LANE(2)
8 ADCS PER LANE(2)
MULTIFRAME SIZE
ADC
RESOLUTION FRAME SIZE
MULTIFRAME SIZE
FRAME SIZE
FRAME SIZE
(Octets)
(Bits)
(Octets)
(Octets)
FRAMES
OCTETS
FRAMES
OCTETS
12
3
4
4
6
6
7
8
3
3
3
18
21
24
12
2
2
2
24
28
32
14
5
5
20
20
14
16
16
(1) The decimal equivalent of K[4:0] in the link configuration parameter is equal to the multiframe size (in frames) minus 1.
(2) Determined by the register control NUM_ADC_PER_LANE.
8.3.9.8 JESD Physical Layer
The JESD transmitter uses a PLL that runs off an internal low-dropout (LDO) regulator that provides noise
rejection on the external 1.2-V supply. At higher speeds (beyond 4 Gbps), the LDO voltage drops because of
increased switching currents. To improve the jitter at higher speeds, restore the LDO voltage with the
INC_JESD_VDD register control.
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8.3.9.8.1 CML Buffer
The device JESD204B transmitter uses differential CML output drivers with a typical current drive of 16 mA. The
output driver includes an internal 50-Ω termination to the DVDD_1P2 supply. Additionally, external 50-Ω
termination resistors connected to DVDD_1P2 must be placed close to the receiver pins. DC compliance to the
standard is not ensured and ac coupling can be used to avoid the common-mode mismatch between the
transmitter and receiver, as shown in 图 77.
DVDD_1P2
CM
CML Buffer (TX)
50 Ω
50 W (Typ)
CML1_
OUTP
ZO = 50 W
0.1 mF
0.1 mF
LO
HI
CML
Receiver
16 mA
(Typ)
CML1_
OUTM
ZO = 50 W
50 Ω
50 W (Typ)
CM
DVDD_1P2
图 77. CML Output Connections
The CML buffer also has a pre-emphasis control for improving the timing margins. Pre-emphasis is achieved by
increasing the CML buffer current if the current transmitter bit is different from the previous one. The current of
the CML buffer for a transitioning bit can be increased from the CML buffer current setting to one of 16 settings in
steps of 0.25 mA using the PRE_EMP register control. Pre-emphasis is recommended to be used at higher
speeds in order to improve the timing margins.
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8.3.9.8.2 Jitter Considerations
图 78 shows the data eye measurement of the device JESD204B transmitter against the JESD204B transmitter
eye mask at 3.125 Gbps.
图 78. Eye Diagram at the CML Output at a Data Rate of 3.125 Gbps
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图 79 shows the data eye measurement of the device JESD204B transmitter against the JESD204B transmitter
eye mask at 5 Gbps. This measurement is taken with PRE_EMP set to 7.
图 79. Eye Diagram at the CML Output at a Data Rate of 5 Gbps
The total jitter as a fraction of the UI changes with interface speed, pre-emphasis setting, and the length of the
trace from the transmitter pins to the external termination resistor. The total jitter at the transmitter pins can
exceed the transmitter eye mask specification for speeds beyond 5 Gbps. However, the interface can be made to
work (and meet the eye mask specification at the receiver inputs) at speeds higher than 5 Gbps for short trace
lengths. 图 40 illustrates the total jitter as a function of the trace length (between the transmitter pins and the
termination resistor) for 5-Gbps, 6-Gbps, and 6.4-Gbps speeds. 图 41 to 图 43 illustrate the total jitter as a
function of the trace length for different pre-emphasis settings at 5 Gbps, 6 Gbps, and 6.4 Gbps, respectively.
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8.3.10 Interfacing SYNC~ and SYSREF Between the FPGA and ADCs
The SYNC~ and SYSREF signals must be connected to the FPGA and the multiple ADCs in the system. When
driving SYNC~ and SYSREF using differential signals, additional interface circuits may be required to decouple
the common-mode levels between the FPGA and the ADC. 图 80 shows an overview of such a scheme for
driving the SYNC~ signal from the FPGA to multiple ADCs.
SYNC~ (eg. LVDS level)
FPGA
Interface circuit(s)
ADC1
ADC2
ADCn
图 80. Connection of SYNC~ From the FPGA to the ADCs
The ADC has internal 5-kΩ resistors from the SYNCP and SYNCM pins to an internal reference voltage of 0.7 V.
When driven by a differential driver, an interface circuit may be required to match the common-mode voltages
between the driver and the ADC. An example circuit is shown in 图 81 to level-shift from a 1.2-V common-mode
voltage at the driver output to the 0.7 V at the ADC input. The 100 Ω at the driver output depicts the differential
termination and could be realized inside the FPGA.
3.57 KΩ
FPGA
ADC
33 nF
SYNCP_FPGA
SYNCP_ADC
5 KΩ
5 KΩ
5 KΩ
VOCM = 1.2 V
100 Ω
0.7 V
33 nF
SYNCM_ADC
SYNCM_FPGA
5 KΩ
3.57 KΩ
图 81. Circuit to Level-Shift the Common-Mode Voltage From 1.2 V at the Driver Output to 0.7 V at the
ADC Input
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For a different driver output common-mode than the one shown in 图 81, the interface circuit must be modified.
A similar circuit as shown in 图 81 can also be used to interface the SYSREF signals to the ADC. As shown in 图
82, the SYSREF signal can also be driven using an ac-coupling scheme. The external components are chosen
for a case where the SYSREF source drives only one ADC. The values of these components must be changed if
the signal is interfaced to multiple ADCs (contact the factory for details).
1.8 V
50 KΩ
ADC
1 uF
SYSREFM_SRC
SYSREFM_ADC
5 KΩ
100 Ω
0.7 V
SYSREF Source
5 KΩ
SYSREFP_ADC
SYSREFP_SRC
1 uF
30 KΩ
图 82. AC-Coupling Scheme for SYSREF (do not use for SYNC~)
SYSREFM_SRC
SYSREFP_SRC
SYSREFM_ADC
SYSREFP_ADC
c
c
c
c
SYSREF high pulse should be less wide than this point
图 83. Transient of SYSREF With AC-Coupling
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The 50-kΩ and 30-kΩ external resistors along with the two 5-kΩ resistors internal to the ADC form a voltage
divider circuit to generate a negative differential offset at the ADC SYSREF input when SYSREF is low. A high-
going pulse on the SYSREF_SRC signal passes through the ac-coupling capacitor. The ac-coupling capacitor
and the resistors form a high-pass filter and cause the SYSREF_ADC signal to droop towards their quiescent
values over time (denoted by the dotted lines in 图 83). However, if the high width of SYSREF is much lower
than the time constant of the filter, the circuit is able to pass the pulse properly.
The SYNC~ and SYSREF signals also can be driven using single-ended LVCMOS levels, which can be done by
driving the P side with the LVCMOS level and connecting the M side to ground as shown in 图 84. When driven
in this manner, the internal 5-kΩ resistor (connecting the P and M pins to the 0.7-V node) is disconnected from
the pins.
LVCMOS
Clock Input
LVCMOS
Clock Input
SYNCP_SERDES
SYSREFP_SERDES
SYNCM_SERDES
SYSREFM_SERDES
图 84. Single-Ended Driving Circuit for SYNC~ and SYSREF
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8.3.11 Clock Input
The input clock to the device (referred to as the system clock) goes to an input buffer that automatically
configures itself either to accept a single-ended clock or a differential clock. The equivalent load on the clock pins
in the case of a differential clock input is shown in 图 85. For the case of a single-ended clock input, the 5-kΩ
resistor is disconnected from the input.
AVDD_1P8
0.7 V
VCM
100 pF
5 kQ
5 kQ
CLKP
6 pF
6 pF
CLKM
图 85. Internal Clock Buffer for Differential Clock Mode
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If the preferred clocking scheme for the device is single-ended, connect the CLKM pin to ground (in other words,
short CLKM directly to AVSS, as shown in 图 86). In this case, the auto-detect feature shuts down the internal
differential clock buffer and the device automatically goes into a single-ended clock input. Connect the single-
ended clock source directly (without decoupling) to the CLKP pin. When using a single-ended clock input, TI
recommends using low-jitter, square signals (LVCMOS levels, 1.8-V amplitude) to drive the ADC (refer to
technical brief, Clocking High-Speed Data Converters, SLYT075 for further details).
CMOS Clock Input
CLKP
CLKM
图 86. Single-Ended Clock Driving Circuit
For differential clocks (such as differential sine-wave, LVPECL, LVDS, and so forth), enable the clock amplifier
with the connection scheme shown in 图 87. This same scheme applies when the clock is single-ended but the
clock amplitude is either small or its edges are not sharp. In this case, connect the input clock signal with a
capacitor to CLKP (as in 图 87) and connect CLKM to ground through a capacitor (that is, ac-coupled to AVSS).
If a transformer is used with the secondary coil floating (for instance, to convert from single-ended to differential),
the outputs of the transformer can be connected directly to the clock inputs without requiring the 10-nF series
capacitors.
10 nF
CLKP
Differential Sine Wave
or PECL or LVDS Clock Signal
CLKM
10 nF
图 87. Differential Clock Driving Circuit
To ensure that the aperture delay and jitter are the same for all channels, the device uses a clock tree network to
generate individual sampling clocks for each channel. For all channels, the clock is closley matched from the
source point to the sampling circuit of each of the eight internal devices.
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The jitter cleaners CDCM7005, CDCE72010, or LMK048X series are suitable to generate the system clock and
enable high performance. 图 88 shows a clock distribution network.
FPGA Clock,
Noisy Clock
n × (5 MHz to 100 MHz)
TI Jitter Cleaner
LMK048X
CDCE72010
CDCM7005
5-MHz to 100-MHz
ADC CLK
CDCLVP1208
The CDCE72010 has 10
LMK0030X
outputs
LMK01000
8 Synchronized
DUT System CLKs
图 88. System Clock Distribution Network
8.3.12 Analog Input and Driving Circuit
8.3.12.1 Signal Input
The analog input to the device can be either ac- or dc-coupled. In ac-coupling, the input common-mode required
for device functionality can be forced with the common-mode voltage, generated internally by the device (that
comes at the VCM pin) through a resistor, as shown in 图 89. The resistor and capacitor values used for coupling
determines the high-pass filter corner of the input circuit; thus, these values are chosen with the frequency of
interest in mind.
Device
INPx
10 nF
25 Q
50 Q
6.8 pF
Input 2-VPP
Differential
VCM
1 mF
25 Q
50 Q
Internal
Reference
INMx
CM Buffer
VCM
10 nF
图 89. AC Coupling
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When dc-coupling the analog input, the output common-mode voltage of the driver can be set using the VCM
output pin as a reference, as shown in 图 90.
Device
50 Q
50 Q
INPx
INMx
OUTP
OUTM
6.8 pF
2-VPP Differential VCM = 0.8 V
CM
Internal
Reference
CM Buffer
VCM
图 90. DC Coupling
Each input interfaces to two sets of identical sampling circuits. The electrical model of the load that each of the
sampling networks present is illustrated in 图 91. For the sake of simplification, the MOS switches can be
considered as ideal switches.
As illustrated in 图 57, 图 58, and 图 59, the scheme of connecting each input sampling circuit to the input pins
differs across the three input modes. The time-dependent loading of the input pins therefore is different across
the three input modes, and can be determined by referring to 图 57, 图 58, 图 59, and 图 91.
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SZ
S
RON
170 Ω
RON
100 Ω
CPAR3
2 pF
Sampling
Switch
S
LPKG
3.5 nH
Sampling
Capacitor
21 Ω
INP
RON
14 Ω
CBOND
0.5 pF
CPAR3
CPAR3
1 pF
CSAMP
4.6 pF
RESR
200 Ω
14 Ω
S
RON
40 Ω
CPAR1
1.5 pF
14 Ω
LPKG
3.5 nH
CSAMP
4.6 pF
RON
14 Ω
21 Ω
INM
CBOND
0.5 pF
CPAR3
1 pF
Sampling
Capacitor
S
Sampling
Switch
RESR
200 Ω
RON
170 Ω
RON
100 Ω
CPAR3
2 pF
S
SZ
图 91. Analog Input Sampling Network
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8.4 Device Functional Modes
8.4.1 Input Modes
The device supports three input modes: a 16-input, a 32-input, and an 8-input mode using the SEL_CH[2:0]
register controls. See 表 49 for a listing of register bits that select the 8-, 16-, and 32-input modes. Using the
same set of 16 ADCs, the three modes can be used to convert 16, 32, or 8 input channels, respectively. The
performance of the ADC itself depends on the conversion clock frequency, which has a different relationship to
the system clock and sampling rates in each of the three modes. Although the ADCs are common to all three
modes, the manner in which the ADCs are used determines unique performance characteristics in each mode.
For example, the 8-input mode can have significant interleaving spurs. Additionally, in the 8-input mode, the
conversion phases of two adjacent ADCs are offset by one system clock period. The switching operation in one
ADC can affect the performance of the adjacent ADC especially at higher input frequencies. For this reason, only
10-bit ADC resolution is supported in the 8-input mode. The restrictions when operating in the different input
modes are listed in 表 30.
表 30. Modes Supported in 8-, 16-, and 32-Input Modes
ANALOG INPUT MODE
ADC RESOLUTIONS SUPPORTED (Bits)
LVDS DATA RATE MODES SUPPORTED
16
32
8
10, 12, 14
10, 12, 14
10
1X, 2X
1X
1X, 2X
8.4.2 ADC Resolution Modes
The ADC resolution can be programmed between 10, 12,and 14 with the ADC_RES register control. The
maximum conversion rate of each ADC is determined by the programmed ADC resolution. The restrictions when
operating with the different ADC resolutions are listed in 表 31.
表 31. Modes Supported in the 10-, 12-, and 14-Bit ADC Resolution Modes
ADC RESOLUTION (Bits)
ANALOG INPUT MODES SUPPORTED
MAXIMUM CONVERSION CLOCK (fC, MHz)
10
12
14
16, 8, 32
16, 32
100
80
16, 32
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8.4.3 LVDS and JESD Interface Modes
By default, the LVDS interface is enabled. To disable the LVDS interface, set DIS_LVDS to 1.
To enable the JESD204B interface, set EN_JESD to 1. The JESD204B interface is supported only in 16-input
and 32-input modes.
8.4.4 LVDS Serialization and Output Data Rate Modes
The serialization factor of the LVDS interface can be set to 10, 12, 14, or 16 using the SER_DATA_RATE
register. Additionally, the density of output data payload can be set to 1X or 2X mode by using the
LVDS_RATE_2X register bits. The maximum data rate (in bits per sec) of the LVDS interface is limited.
Depending on the input mode, serialization factor, and output data rate mode, the LVDS interface speed
restriction may impose additional constraints on the maximum sampling rate achievable.
8.4.5 Power Modes
The ADS52J90 can be configured via SPI or pin settings to a global power-down mode and via pin settings to a
fast power-down (standby mode). During these two modes (global and standby power-down), different internal
functions stay powered up, resulting in different power consumption and wake-up times.
In standby mode, all LVDS data lanes are powered down. The bit clock and frame clock lanes remain enabled to
save time to sync again on the receiver side. However, in global power-down mode all lanes are powered down
and thus this mode requires more time to wake-up because the bit clock and frame clock lanes must sync again
with the receiver device.
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The device consists of the following key blocks:
•
•
•
•
•
Band-gap circuit,
Serial interface,
Reference voltage and current generator,
ADC analog block that performs a sampling and conversion,
ADC digital block that includes all the digital post processing blocks (such as the offset, gain, digital HPF, and
so forth),
•
•
•
LVDS data serializer and buffer that converts the ADC parallel data to a serial stream,
LVDS frame and clock serializer and buffer, and
PLL (phase-locked loop) that generates a high-frequency clock for both the ADC and serializer.
Of all these blocks, only the band-gap and serial interface block are not powered down using the power-down
pins or bits. 表 32 lists which blocks in the ADC are powered down using different pins and bits.
表 32. Power-Down Modes Description for the ADC
LVDS FRAME
LVDS DATA
SERIALIZER,
BUFFER
REFERENCE
+ ADC CLOCK
BUFFER
TYPE (Pin or
Register)
ADC
ANALOG
ADC
DIGITAL
AND CLOCK
SERIALIZER,
BUFFER
NAME
PLL
CHANNEL
PDN_GBL
GLOBAL_PDN
PDN_FAST
Pin
Yes(1)
Yes
Yes
No
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
No
Yes
Yes
No
Yes
Yes
No
No
No
No
No
Yes
Yes
No
No
No
No
No
All(2)
All
Register
Pin
All
DIS_LVDS
Register
Register
Register
Register
Yes
No
All
PDN_ANA_ADCx
PDN_DIG_ADCx
PDN_LVDSx
Yes
No
No
Individual
Individual
Individual
Yes
No
No
No
No
Yes
No
(1) Yes = powered down. No = active.
(2) All = all channels are powered down. Individual = only a single channel is powered down, depending upon the corresponding bit.
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8.4.6 LVDS Test Pattern Mode
The ADC data coming out of the LVDS outputs can be replaced by different kinds of test patterns. Note that the
test patterns replace the data streaming out of the ADCs (more specifically, the DIGRES1 signal). Therefore, in
16-, 8-, and 32-channel input modes, the pattern that occurs on a per-channel basis can be different for some
test patterns. The different test patterns are described in 表 33.
表 33. Description of LVDS Test Patterns
PROGRAMMING THE MODE
TEST
THE PATTERN IS SELECTIVELY
PATTERN
MODE
THE SAME PATTERN MUST BE COMMON
TO ALL DATA LINES
REQUIRED ON ONE OR MORE DATA
LINE
TEST PATTERNS
REPLACE(1)
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Zeros in all bits
(00000000000000) of
DIGRESx
All 0s
Set the mode using PAT_MODES[2:0]
Set the mode using PAT_MODES[2:0]
Set the mode using PAT_MODES[2:0]
Set the mode using PAT_MODES[2:0]
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Ones in all bits
(11111111111111) of
DIGRESx
All 1s
Deskew
Sync
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
DIGRESx word is replaced
by alternate 0s and 1s
(01010101010101)
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
DIGRESx word is replaced
by half 1s and half 0s
(11111110000000)
The word written in the
CUSTOM_PATTERN control
(taken from the MSB side)
replaces DIGRESx.
Set the mode using PAT_MODES[2:0]. Set
the desired custom pattern using the
CUSTOM_PATTERN register control.
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
(For instance,
Custom
CUSTOM_PATTERN =
1100101101011100 and
DIGRESx =
11001011010111 when the
serialization factor is 14.)
The ADCOUTx word (not the
DIGRESx word) is replaced
by a word that increments by
1 LSB every conversion clock
starting at negative full-scale,
increments until positive full-
scale, and wraps back to
negative full-scale.
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Ramp
Set the mode using PAT_MODES[2:0]
The DIGRESx word
alternates between two
words that are all 1s and all
0s. At each setting of the
toggle pattern, the start word
can either be all 0s or all 1s.
(Alternate between
Set PAT_SELECT_IND = 1. To output the
pattern on the DOUTx line, select
PAT_LVDSx[2:0]
Toggle
Set the mode using PAT_MODES[2:0]
11111111111111 and
00000000000000.)
Set PAT_SELECT_IND = 1. Select either
custom or ramp pattern with
PAT_LVDSx[2:0]. Enable PRBS mode on
Set SEL_PRBS_PAT_GBL = 1. Select either
custom or ramp pattern with
PAT_MODES[2:0]. Enable PRBS mode
using PRBS_EN. Select the desired PRBS
mode using PRBS_MODE. Reset the PRBS
generator with PRBS_SYNC.
A 16-bit pattern is generated
by a 23-bit (or 9-bit) PRBS
PRBS
DOUTx with the PAT_PRBS_LVDSx control. pattern generator (taken from
Select the desired PRBS mode using
PRBS_MODE. Reset the PRBS generator
with PRBS_SYNC.
the MSB side) and replaces
the DIGRESx word.
(1) Shown for a serialization factor of 14.
All patterns listed in 表 33 (except the PRBS pattern) can also be forced on the frame clock output line by using
PAT_MODES_FCLK[2:0]. To force a PRBS pattern on the frame clock, use the SEL_PRBS_PAT_FCLK,
PRBS_EN, and PAT_MODES_FCLK register controls.
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The ramp, toggle, and pseudo-random sequence (PRBS) test patterns can be reset or synchronized by providing
a synchronization pulse on the TX_TRIG pin or by setting and resetting a specific register bit.
These test patterns also function as transport layer test patterns for the JESD204B interface.
8.5 Programming
8.5.1 Serial Peripheral Interface (SPI) Operation
This section discusses the read and write operations of the SPI interface.
8.5.1.1 Serial Register Write Description
Several different modes can be programmed with the serial peripheral interface (SPI). This interface is formed by
the SEN (serial interface enable), SCLK (serial interface clock), SDIN (serial interface data), and RESET pins.
The SCLK, SDIN, and RESET pins have a 20-kΩ pulldown resistor to ground. SEN has a 20-kΩ pullup resistor to
supply. Serially shifting bits into the device is enabled when SEN is low. SDIN serial data are latched at every
SCLK rising edge when SEN is active (low). SDIN serial data are loaded into the register at every 24th SCLK
rising edge when SEN is low. If the word length exceeds a multiple of 24 bits, the excess bits are ignored. Data
can be loaded in multiples of 24-bit words within a single active SEN pulse (an internal counter counts the
number of 24 clock groups after the SEN falling edge). Data is divided into two main portions: the register
address (8 bits) and data (16 bits). 图 92 shows the timing diagram for serial interface write operation.
SEN
tSEN_SU
Data Latched On
SCLK Rising Edge
tSCLK_H
tSEN_HO
tSCLK
SCLK
tSCLK_L
tDH
tDSU
A7
A6
A5
A4
A3
A2
A1
A0 D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDIN
RESET
图 92. Serial Interface Timing
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Programming (接下页)
8.5.1.2 Register Readout
The device includes an option where the contents of the internal registers can be read back. This readback can
be useful as a diagnostic test to verify the serial interface communication between the external controller and
AFE. First, the REG_READ_EN bit must be set to 1. Then, initiate a serial interface cycle specifying the address
of the register (A[7:0]) whose content must be read. The data bits are don’t care. The device outputs the contents
(D[15:0]) of the selected register on the SDOUT pin. For lower-speed SCLKs, SDOUT can be latched on the
SCLK rising edge. For higher-speed SCLKs, latching SDOUT at the next SCLK falling edge is preferable. The
read operation timing diagram is shown in 图 93. In readout mode, the REG_READ_EN bit can be accessed with
SDIN, SCLK, and SEN. To enable serial register writes, set the REG_READ_EN bit back to 0.
SEN
SCLK
tOUT_DV
D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDOUT
SDIN
A7
A6
A5
A4
A3
A2
A1
A0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
图 93. Serial Interface Register, Read Operation
The device SDOUT buffer is 3-stated and is only enabled when the REG_READ_EN bit is enabled. SDOUT pins
from multiple devices can therefore be tied together without any pullup resistors. The SN74AUP1T04 level shifter
can be used to convert 1.8-V logic to 2.5-V or 3.3-V logic, if necessary.
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The ADS52J90 supports multiple levels of channel integration (8, 16, and 32) with high sampling rates
achievable for each channel. The ADS52J90 also has options to synchronize the clocking and LVDS interface of
multiple devices. These features, combined with the excellent ADC performance and low power, make the
ADS52J90 an excellent choice for applications involving high channel counts. Such applications include
ultrasound imaging systems, sonar imaging equipment, and radar.
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9.2 Typical Application
An illustration of a system with a channel count of 64 is shown in 图 94. In 图 94, the output interface is selected
as the LVDS interface. Four ADS52J90 devices, each operating in 16-input mode, are connected to a single
FPGA that aggregates the data from all ADCs for further data processing and storage.
SPI
Control
INP1
Channel 1
INM1
TX_TRIG
INP3
Channel 2
INM3
LVDS
Lines
LVDS
Receiver
ADS52J90,
Device1
INP31
INM31
Channel 16
FPGA
Data
Processing
and
Storage
INP1
INM1
INP3
INM3
LVDS
Lines
ADS52J90,
Device4
LVDS
Receiver
INP31
INM31
Channel 64
Clock
Generator
CLKP,
CLKM
图 94. Application Schematic: 64-Channel Medical Ultrasound Receiver Using the ADS52J90
78
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Typical Application (接下页)
9.2.1 Design Requirements
Typical requirements of a medical ultrasound receiver system are listed in 表 34.
表 34. Requirements of a Typical Medical Ultrasound Receiver
DESIGN PARAMETER
EXAMPLE VALUES
5 MHz-15 MHz
2 MHz
Signal center frequency
Signal bandwidth
Maximum input signal amplitude
Transducer noise level
Total harmonic distortion
100 mVPP
1 nV/√Hz
40 dBc
The ultrasound system typically has an LNA and a time-dependent gain block at the front-end before the ADC. In
an ultrasound receiver, the signal level keeps reducing as a function of time and the role of the front-end blocks
is to gain up the signal level without adding too much additional noise. The gain of the front-end can be adjusted
so that the input signal to the ADC always remains within its full-scale range.
A sampling rate of approximately 40 MHz to 50 MHz is usually sufficient for such an application. Thus the
ADS52J90 can be operated in 16-input mode. Furthermore, the resolution can be set to 14 bits to maximize the
SNR of the device. A higher sampling rate ADC results in a lower noise density in the signal band of interest. For
example, an ADC with a 2-VPP input operating at 50 MSPS with an SNR of 73 dBFS has a noise level of
approximately 35 nV/√Hz referred to the input of the ADC. If the front-end has a gain of 40 dB, the ADC noise
referred to the input of the front-end is then 0.35 nV/√Hz, which in this case is lower than the transducer noise
level.
9.2.2 Detailed Design Procedure
The design considerations when designing with the 16-, 32-, and 8-input modes are described in the following
sections.
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9.2.2.1 Designing with the 16-Input Mode
Mapping of the analog inputs to the LVDS outputs is shown in 表 35 for a case corresponding to a 16-input mode
and a 1X data rate.
表 35. Mapping of Analog Inputs to LVDS Outputs (16-Input Mode, 1X Data Rate)
CONNECTION TO
ANALOG INPUT
PINS
ANALOG INPUT
SIGNAL
SAMPLING
INSTANT
SERIAL_OUT
(Over Two Frames)
LVDS OUTPUTS ON
DOUT PINS
ADC WORD
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
ADCOUT1o
ADCOUT1e
ADCOUT2o
ADCOUT2e
ADCOUT3o
ADCOUT3e
ADCOUT4o
ADCOUT4e
ADCOUT5o
ADCOUT5e
ADCOUT6o
ADCOUT6e
ADCOUT7o
ADCOUT7e
ADCOUT8o
ADCOUT8e
ADCOUT9o
ADCOUT9e
ADCOUT10o
ADCOUT10e
ADCOUT11o
ADCOUT11e
ADCOUT12o
ADCOUT12e
ADCOUT13o
ADCOUT13e
ADCOUT14o
ADCOUT14e
ADCOUT15o
ADCOUT15e
ADCOUT16o
ADCOUT16e
Frame 1: ADCOUT1o
Frame 2: ADCOUT1e
AIN1
AIN2
IN1
IN3
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
DOUT9
DOUT10
DOUT11
DOUT12
DOUT13
DOUT14
DOUT15
DOUT16
Frame 1: ADCOUT2o
Frame 2: ADCOUT2e
Frame 1: ADCOUT3o
Frame 2: ADCOUT3e
AIN3
IN5
Frame 1: ADCOUT4o
Frame 2: ADCOUT4e
AIN4
IN7
Frame 1: ADCOUT5o
Frame 2: ADCOUT5e
AIN5
IN9
Frame 1: ADCOUT6o
Frame 2: ADCOUT6e
AIN6
IN11
IN13
IN15
IN17
IN19
IN21
IN23
IN25
IN27
IN29
IN31
Frame 1: ADCOUT7o
Frame 2: ADCOUT7e
AIN7
Frame 1: ADCOUT8o
Frame 2: ADCOUT8e
AIN8
Frame 1: ADCOUT9o
Frame 2: ADCOUT9e
AIN9
Frame 1: ADCOUT10o
Frame 2: ADCOUT10e
AIN10
AIN11
AIN12
AIN13
AIN14
AIN15
AIN16
Frame 1: ADCOUT11o
Frame 2: ADCOUT11e
Frame 1: ADCOUT12o
Frame 2: ADCOUT12e
Frame 1: ADCOUT13o
Frame 2: ADCOUT13e
Frame 1: ADCOUT14o
Frame 2: ADCOUT14e
Frame 1: ADCOUT15o
Frame 2: ADCOUT15e
Frame 1: ADCOUT16o
Frame 2: ADCOUT16e
80
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Mapping of the analog inputs to the LVDS outputs is shown in 表 36 for a case corresponding to a 16-input mode
and a 2X data rate.
表 36. Mapping of Analog Inputs to LVDS Outputs (16-Input Mode, 2X Data Rate)
CONNECTION TO
ANALOG INPUT
PINS
ANALOG INPUT
SIGNAL
SAMPLING
INSTANT
SERIAL_OUT
(Over Two Frames)
LVDS OUTPUTS ON
DOUT PINS
ADC WORD
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
ADCOUT1o
ADCOUT1e
ADCOUT2o
ADCOUT2e
ADCOUT3o
ADCOUT3e
ADCOUT4o
ADCOUT4e
ADCOUT5o
ADCOUT5e
ADCOUT6o
ADCOUT6e
ADCOUT7o
ADCOUT7e
ADCOUT8o
ADCOUT8e
ADCOUT9o
ADCOUT9e
ADCOUT10o
ADCOUT10e
ADCOUT11o
ADCOUT11e
ADCOUT12o
ADCOUT12e
ADCOUT13o
ADCOUT13e
ADCOUT14o
ADCOUT14e
ADCOUT15o
ADCOUT15e
ADCOUT16o
ADCOUT16e
Frame 1: ADCOUT1o,
ADCOUT2o
Frame 2: ADCOUT1e,
ADCOUT2e
AIN1
AIN2
IN1
IN3
DOUT1
DOUT2
DOUT3
DOUT4
DOUT9
DOUT10
DOUT11
DOUT12
Frame 1: ADCOUT3o,
ADCOUT4o
Frame 2: ADCOUT3e,
ADCOUT4e
AIN3
IN5
AIN4
IN7
Frame 1: ADCOUT5o,
ADCOUT6o
Frame 2: ADCOUT5e,
ADCOUT6e
AIN5
IN9
AIN6
IN11
IN13
IN15
IN17
IN19
IN21
IN23
IN25
IN27
IN29
IN31
Frame 1: ADCOUT7o,
ADCOUT8o
Frame 2: ADCOUT7e,
ADCOUT8e
AIN7
AIN8
Frame 1: ADCOUT9o,
ADCOUT10o
Frame 2: ADCOUT9e,
ADCOUT10e
AIN9
AIN10
AIN11
AIN12
AIN13
AIN14
AIN15
AIN16
Frame 1: ADCOUT11o,
ADCOUT12o
Frame 2: ADCOUT11e,
ADCOUT12e
Frame 1: ADCOUT13o,
ADCOUT14
Frame 2: ADCOUT13e,
ADCOUT14e
Frame 1: ADCOUT15o,
ADCOUT16o
Frame 2: ADCOUT15e,
ADCOUT16e
表 35 and 表 36 illustrate that the ADCs convert the odd numbered input when operating in the 16-input mode.
Each ADC can be set to convert the following even numbered input using the register control IN_CH_ADCx. The
performance of the ADC may slightly degrade when IN_CH_ADCx is set to 1.
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In 16-input mode, there is a one-to-one mapping between the inputs and the ADCs. The register map relative to
the ADCs can therefore be mapped to the 16 channels, as shown in 表 37.
表 37. Reinterpretation of the Register Map in 16-Input Mode
MAPPING TO
CHANNELS IN 16-INPUT
MODE
REGISTER MAP
NOTATION
EXAMPLE
GAIN_ADCxo,
GAIN_ADCxe
GAIN_CHANNEL1 = GAIN_ADC1o (same for GAIN_ADC1e)
(Set odd and even gains of the same ADC to the same setting)
GAIN_CHANNELx
OFFSET_ADCxo,
OFFSET_ADCxe
OFFSET_CHANNEL1 = OFFSET_ADC1o (same for OFFSET_ADC1e
(Set odd and even offsets of the same ADC to the same setting)
OFFSET_CHANNELx
PDN_DIG_CHANNELx
PDN_DIG_ADCx
PDN_ANA_ADCx
PDN_DIG_CHANNEL1 = PDN_DIG_ADC1
PDN_ANA_CHANNELx PDN_ANA_CHANNEL1 = PDN_ANA_ADC1
DIG_HPF_EN_CHANNEL1-4 = DIG_HPF_EN_ADC1-4
Mapped to 4 channels
DIG_HPF_EN_ADCx
HPF_CORNER_ADCx
Common setting for 4 ADCs maps to common setting for 4 channels
HPF_CORNER_CHANNEL1-4 = HPF_CORNER_ADC1-4
Mapped to 4 channels
Common setting for 4 ADCs maps to common setting for 4 channels
9.2.2.2 Designing with the 32-Input Mode
Mapping of the analog inputs to the LVDS outputs is shown in 表 38 for a case corresponding to a 32-input mode
and a 1X data rate.
表 38. Mapping of Analog Inputs to LVDS Outputs (32-Input Mode, 1X Data Rate)
CONNECTION TO
ANALOG INPUT
PINS
ANALOG INPUT
SIGNAL
SAMPLING
INSTANT
SERIAL_OUT
(Over One Frame)
LVDS OUTPUTS ON
DOUT PINS
ADC WORD
AIN1
AIN2
IN1
IN2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
t1
t2
ADCOUT1o
ADCOUT1e
ADCOUT2o
ADCOUT2e
ADCOUT3o
ADCOUT3e
ADCOUT4o
ADCOUT4e
ADCOUT5o
ADCOUT5e
ADCOUT6o
ADCOUT6e
ADCOUT7o
ADCOUT7e
ADCOUT8o
ADCOUT8e
ADCOUT9o
ADCOUT9e
ADCOUT10o
ADCOUT10e
ADCOUT11o
ADCOUT11e
ADCOUT12o
ADCOUT12e
ADCOUT13o
ADCOUT13e
ADCOUT1o,
ADCOUT1e
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
DOUT9
DOUT10
DOUT11
DOUT12
DOUT13
AIN3
IN3
ADCOUT2o,
ADCOUT2e
AIN4
IN4
AIN5
IN5
ADCOUT3o,
ADCOUT3e
AIN6
IN6
AIN7
IN7
ADCOUT4o,
ADCOUT4e
AIN8
IN8
AIN9
IN9
ADCOUT5o,
ADCOUT5e
AIN10
AIN11
AIN12
AIN13
AIN14
AIN15
AIN16
AIN17
AIN18
AIN19
AIN20
AIN21
AIN22
AIN23
AIN24
AIN25
AIN26
IN10
IN11
IN12
IN13
IN14
IN15
IN16
IN17
IN18
IN19
IN20
IN21
IN22
IN23
IN24
IN25
IN26
ADCOUT6o,
ADCOUT6e
ADCOUT7o,
ADCOUT7e
ADCOUT8o,
ADCOUT8e
ADCOUT9o,
ADCOUT9e
ADCOUT10o,
ADCOUT10e
ADCOUT11o,
ADCOUT11e
ADCOUT12o,
ADCOUT12e
ADCOUT13o,
ADCOUT13e
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表 38. Mapping of Analog Inputs to LVDS Outputs (32-Input Mode, 1X Data Rate) (接下页)
CONNECTION TO
ANALOG INPUT
PINS
ANALOG INPUT
SIGNAL
SAMPLING
INSTANT
SERIAL_OUT
(Over One Frame)
LVDS OUTPUTS ON
DOUT PINS
ADC WORD
AIN27
AIN28
AIN29
AIN30
AIN31
AIN32
IN27
IN28
IN29
IN30
IN31
IN32
t1
t2
t1
t2
t1
t2
ADCOUT14o
ADCOUT14e
ADCOUT15o
ADCOUT15e
ADCOUT16o
ADCOUT16e
ADCOUT14o,
ADCOUT14e
DOUT14
DOUT15
DOUT16
ADCOUT15o,
ADCOUT15e
ADCOUT16o,
ADCOUT16e
Note that 2X data rate mode is not supported in 32-input mode. In 32-input mode, only one ADC is used to
convert two inputs.
The odd numbered inputs correspond to the odd sample from the ADC, and the even numbered inputs
correspond to the even sample from the ADC. The register map relative to the ADCs can therefore be mapped to
the 32 channels, as shown in 表 39.
表 39. Reinterpretation of Register Map in 32-Input Mode
MAPPING TO CHANNELS IN 16-INPUT
REGISTER MAP NOTATION
EXAMPLE
MODE
GAIN_ADCxo
GAIN_ADCxe
GAIN_CHANNEL (odd)
GAIN_CHANNEL (even)
OFFSET_CHANNEL (odd)
OFFSET_CHANNEL (even)
GAIN_CHANNEL1 = GAIN_ADC1o
GAIN_CHANNEL2 = GAIN_ADC1e
OFFSET_CHANNEL1 = OFFSET_ADC1o
OFFSET_CHANNEL2 = OFFSET_ADC1e
OFFSET_ADCXo
OFFSET_ADCxe
PDN_DIG_CHANNEL1 =
PDN_DIG_CHANNEL2 = PDN_DIG_ADC1
PDN_DIG_ADCx
PDN_ANA_ADCx
PDN_DIG_CHANNEL (odd and even)
PDN_ANA_CHANNEL (odd and even)
PDN_ANA_CHANNEL1 =
PDN_ANA_CHANNEL2 = PDN_ANA_ADC1
DIG_HPF_EN_CHANNEL1-8 =
DIG_HPF_EN_ADC1-4
Common setting for 4 ADCs mapped to
common setting for 8 channels
DIG_HPF_EN_ADCx
HPF_CORNER_ADCx
Mapped to 8 channels
Mapped to 8 channels
HPF_CORNER_CHANNEL1-8 =
HPF_CORNER_ADC1-4
Common setting for 4 ADCs mapped to
common setting for 8 channels
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9.2.2.3 Designing with the 8-Input Mode
Mapping of the analog inputs to the LVDS outputs is shown in 表 40 for a case corresponding to an 8-input mode
and a 1X data rate.
表 40. Mapping of Analog Inputs to LVDS Outputs (8-Input Mode, 1X Data Rate)
CONNECTION TO
ANALOG INPUT
PINS
ANALOG INPUT
SIGNAL
SAMPLING
INSTANT
SERIAL_OUT
(Over Two Frames)
LVDS OUTPUTS ON
DOUT PINS
ADC WORD
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
ADCOUT1o
ADCOUT2o
ADCOUT1e
ADCOUT2e
ADCOUT3o
ADCOUT4o
ADCOUT3e
ADCOUT4e
ADCOUT5o
ADCOUT6o
ADCOUT5e
ADCOUT6e
ADCOUT7o
ADCOUT8o
ADCOUT7e
ADCOUT8e
ADCOUT9o
ADCOUT10o
ADCOUT9e
ADCOUT10e
ADCOUT11o
ADCOUT12o
ADCOUT11e
ADCOUT12e
ADCOUT13o
ADCOUT14o
ADCOUT13e
ADCOUT14e
ADCOUT15o
ADCOUT16o
ADCOUT15e
ADCOUT16e
Frame 1: ADCOUT1o
Frame 2: ADCOUT1e
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DOUT8
DOUT9
DOUT10
DOUT11
DOUT12
DOUT13
DOUT14
DOUT15
DOUT16
IN1, IN3
(shorted externally)
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
Frame 1: ADCOUT2o
Frame 2: ADCOUT2e
Frame 1: ADCOUT3o
Frame 2: ADCOUT3e
IN5, IN7
(shorted externally)
Frame 1: ADCOUT4o
Frame 2: ADCOUT4e
Frame 1: ADCOUT5o
Frame 2: ADCOUT5e
IN9, IN11
(shorted externally)
Frame 1: ADCOUT6o
Frame 2: ADCOUT6e
Frame 1: ADCOUT7o
Frame 2: ADCOUT7e
IN13, IN15
(shorted externally)
Frame 1: ADCOUT8o
Frame 2: ADCOUT8e
Frame 1: ADCOUT9o
Frame 2: ADCOUT9e
IN17, IN19
(shorted externally)
Frame 1: ADCOUT10o
Frame 2: ADCOUT10e
Frame 1: ADCOUT11o
Frame 2: ADCOUT11e
IN21, IN23
(shorted externally)
Frame 1: ADCOUT12o
Frame 2: ADCOUT12e
Frame 1: ADCOUT13o
Frame 2: ADCOUT13e
IN25, IN27
(shorted externally)
Frame 1: ADCOUT14o
Frame 2: ADCOUT14e
Frame 1: ADCOUT15o
Frame 2: ADCOUT15e
IN29, IN31
(shorted externally)
Frame 1: ADCOUT16o
Frame 2: ADCOUT16e
84
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Mapping of the analog inputs to the LVDS outputs is shown in 表 41 for a case corresponding to an 8-input mode
and a 2X data rate.
表 41. Mapping of Analog Inputs to LVDS Outputs (8-Input Mode, 2X Data Rate)
CONNECTION TO
ANALOG INPUT
PINS
ANALOG INPUT
SIGNAL
SAMPLING
INSTANT
SERIAL_OUT
(Over Two Frames)
LVDS OUTPUTS ON
DOUT PINS
ADC WORD
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
t1
t2
t3
t4
ADCOUT1o
ADCOUT2o
ADCOUT1e
ADCOUT2e
ADCOUT3o
ADCOUT4o
ADCOUT3e
ADCOUT4e
ADCOUT5o
ADCOUT6o
ADCOUT5e
ADCOUT6e
ADCOUT7o
ADCOUT8o
ADCOUT7e
ADCOUT8e
ADCOUT9o
ADCOUT10o
ADCOUT9e
ADCOUT10e
ADCOUT11o
ADCOUT12o
ADCOUT11e
ADCOUT12e
ADCOUT13o
ADCOUT14o
ADCOUT13e
ADCOUT14e
ADCOUT15o
ADCOUT16o
ADCOUT15e
ADCOUT16e
Frame 1: ADCOUT1o,
ADCOUT2o
IN1, IN3
(shorted externally)
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
DOUT1
DOUT2
DOUT3
DOUT4
DOUT9
DOUT10
DOUT11
DOUT12
Frame 2: ADCOUT1e,
ADCOUT2e
Frame 1: ADCOUT3o,
ADCOUT4o
IN5, IN7
(shorted externally)
Frame 2: ADCOUT3e,
ADCOUT4e
Frame 1: ADCOUT5o,
ADCOUT6o
IN9, IN11
(shorted externally)
Frame 2: ADCOUT5e,
ADCOUT6e
Frame 1: ADCOUT7o,
ADCOUT8o
IN13, IN15
(shorted externally)
Frame 2: ADCOUT7e,
ADCOUT8e
Frame 1: ADCOUT9o,
ADCOUT10o
IN17, IN19
(shorted externally)
Frame 2: ADCOUT9e,
ADCOUT10e
Frame 1: ADCOUT11o,
ADCOUT12o
IN21, IN23
(shorted externally)
Frame 2: ADCOUT11e,
ADCOUT12e
Frame 1: ADCOUT13o,
ADCOUT14
IN25, IN27
(shorted externally)
Frame 2: ADCOUT13e,
ADCOUT14e
Frame 1: ADCOUT15o,
ADCOUT16o
IN29, IN31
(shorted externally)
Frame 2: ADCOUT15e,
ADCOUT16e
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In 8-input mode, two neighboring ADCs are used to convert a single input. The register map relative to the ADCs
can be mapped to the eight channels, as shown in 表 42.
表 42. Reinterpretation of Register Map in 8-input Mode
MAPPING TO
CHANNELS IN 16-INPUT
MODE
REGISTER MAP
NOTATION
EXAMPLE
GAIN_ADCxo,
GAIN_ADCxe of two
adjacent channels
GAIN_CHANNEL1 = GAIN_ADC1o (same for GAIN_ADC1e, GAIN_ADC2o, and
GAIN_ADC2e)
Set odd and even gains of two adjacent ADCs to the same setting.
GAIN_CHANNELx
OFFSET_CHANNEL1 = OFFSET_ADC1o (same for OFFSET_ADC1e,
OFFSET_ADC2o, and OFFSET_ADC2e)
Set odd and even offsets of two adjacent ADCs to the same setting.
OFFSET_ADCxo,
OFFSET_ADCxe
OFFSET_CHANNELx
PDN_DIG_ADCx of two
adjacent channels
PDN_DIG_CHANNEL1 = PDN_DIG_ADC1 (same for PDN_DIG_ADC2)
Set the power-down for two adjacent ADCs to the same setting.
PDN_DIG_CHANNELx
PDN_ANA_CHANNELx
Mapped to 2 channels
Mapped to 2 channels
PDN_ANA_ADCx of two
adjacent channels
PDN_ANA_CHANNEL1 = PDN_ANA_ADC1 (same for PDN_ANA_ADC2)
Set the power-down for two adjacent ADCs to the same setting.
DIG_HPF_EN_CHANNEL1-2 = DIG_HPF_EN_ADC1-4
Common setting for 4 ADCs mapped to the common setting for 2 channels.
DIG_HPF_EN_ADCx
HPF_CORNER_ADCx
HPF_CORNER_CHANNEL1-2 = HPF_CORNER_ADC1-4
Common setting for 4 ADCs mapped to the common setting for 2 channels.
9.2.3 Application Curves
This section outlines the trends described in the Typical Characteristics section from an application perspective.
图 2 illustrates the FFT with a 5-MHz input signal for 32-input mode with the ADC resolution set to 10 bits. The
system clock provided is 100 MSPS and the input is sampled at an effective rate of 50 MSPS, which is the
maximum sampling rate for this mode of operation.
图 3 illustrates the FFT with a 5-MHz input signal for 16-input mode with the ADC resolution set to 10 bits. The
system clock provided is 100 MSPS and the input is sampled at an effective rate of 100 MSPS, which is the
maximum sampling rate for this mode of operation.
图 4 illustrates the FFT with a 5-MHz input signal for 8-input mode with the ADC resolution set to 10 bits. The
system clock provided is 200 MSPS and the input is sampled at an effective rate of 200 MSPS, which is the
maximum sampling rate for this mode of operation. The increase in sampling rate is achieved through two ADCs
converting the same input in an interleaved manner. The interleaving spurs are visible in the FFT. The
predominant spur is at the frequencies of (fS / 2 ± fIN), which appear at 95 MHz. Additional spurs are at the
frequencies of (fS / 4 ± fIN), which appear at 45 MHz and 55 MHz. The magnitude of the spurs is expected to rise
when the input frequency is increased. Also, the spur level is sensitive to the matching of the manner in which
the two sets of input pins are driven. A spur at fS/4 is also seen. This arises from the offset mismatch between
the four sets of sampling circuits used to sample the same input.
图 5 illustrates the FFT with a 5-MHz input signal for 32-input mode with the ADC resolution set to 12 bits. The
system clock provided is 80 MSPS and the input is sampled at an effective rate of 40 MSPS, which is the
maximum sampling rate for this mode of operation.
图 6 illustrates the FFT with a 5-MHz input signal for 16-input mode with the ADC resolution set to 12 bits. The
system clock provided is 80 MSPS and the input is sampled at an effective rate of 80 MSPS, which is the
maximum sampling rate for this mode of operation.
图 7 illustrates the FFT with a 5-MHz input signal for 32-input mode with the ADC resolution set to 14 bits. The
system clock provided is 65 MSPS and the input is sampled at an effective rate of 32.5 MSPS, which is the
maximum sampling rate for this mode of operation.
图 8 illustrates the FFT with a 5-MHz input signal for 16-input mode with the ADC resolution set to 14 bits. The
system clock provided is 65 MSPS and the input is sampled at an effective rate of 65 MSPS, which is the
maximum sampling rate for this mode of operation. In addition to the harmonics, the spur at the frequency (fS / 2
± fIN) also occurs at 27.5 MHz. This spur is caused by the interleaved sampling of the input signal by two
physically different sampling circuits of the same ADC.
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图 9 illustrates the signal-to-noise ratio (SNR) versus the frequency of the input signal for 32-input mode with the
ADC resolution set to 10 bits. SNR is expressed in the dBFS scale where the RMS noise at the ADC output is
referred to the full-scale differential voltage of 2 V. The system clock provided is 100 MSPS and the input is
sampled at an effective rate of 50 MSPS. SNR is computed by integrating the noise in all FFT bins after
excluding the first nine harmonics. SNR is dominated by the quantization noise of the 10-bit conversion.
图 10 illustrates SNR versus the frequency of the input signal for 16-input mode with the ADC resolution set to 10
bits. The system clock provided is 100 MSPS and the input is sampled at an effective rate of 100 MSPS. SNR is
computed by integrating the noise in all FFT bins after excluding the first nine harmonics and any interleaving
spurs. SNR is dominated by the quantization noise of the 10-bit conversion.
图 11 illustrates SNR versus the frequency of the input signal for 8-input mode with the ADC resolution set to 10
bits. The system clock provided is 200 MSPS and the input is sampled at an effective rate of 200 MSPS. SNR is
computed by integrating the noise in all FFT bins after excluding the first nine harmonics and any interleaving
spurs at (fS / 2 ± fIN) and (fS / 4 ± fIN) as well as additional spurs at fS / 2 and fS / 4. SNR is dominated by the
quantization noise of the 10-bit conversion.
图 12 illustrates SNR versus the frequency of the input signal for 32-input mode with the ADC resolution set to 12
bits. The system clock provided is 80 MSPS and the input is sampled at an effective rate of 40 MSPS.
图 13 illustrates SNR versus the frequency of the input signal for 16-input mode with the ADC resolution set to 12
bits. The system clock provided is 80 MSPS and the input is sampled at an effective rate of 80 MSPS.
图 14 illustrates SNR versus the frequency of the input signal for 32-input mode with the ADC resolution set to 14
bits. The system clock provided is 65 MSPS and the input is sampled at an effective rate of 32.5 MSPS. SNR at
high input frequencies degrades because of clock jitter.
图 15 illustrates SNR versus the frequency of the input signal for 16-input mode with the ADC resolution set to 14
bits. The system clock provided is 65 MSPS and the input is sampled at an effective rate of 65 MSPS.
图 16 illustrates the amplitude of the third-order harmonic distortion (HD3) of the input signal versus the
frequency of the input signal. The unit of dBc indicates that the HD3 amplitude is referred to the amplitude of the
input signal, which is set to –1 dBFS. 图 16 is taken for 32-input mode with the ADC resolution set to 10 bits. The
system clock provided is 100 MSPS and the input is sampled at an effective rate of 50 MSPS. The device follows
a similar trend across the other input modes and resolutions.
图 17 illustrates the amplitude of the second-order harmonic distortion (HD2) of the input signal versus the
frequency of the input signal. The unit of dBc indicates that the HD2 amplitude is referred to the amplitude of the
input signal, which is set to –1 dBFS. 图 17 is taken for 32-input mode with the ADC resolution set to 10 bits. The
system clock provided is 100 MSPS and the input is sampled at an effective rate of 50 MSPS. The device follows
a similar trend across the other input modes and resolutions.
图 18 illustrates the total harmonic distortion (THD) versus the frequency of the input signal. The THD parameter
includes the RMS amplitude of the first nine harmonics of the fundamental signal. The unit of dBc indicates that
THD is referred to the amplitude of the input signal, which is set to –1 dBFS. 图 18 is taken for 32-input mode
with the ADC resolution set to 10 bits. The system clock provided is 100 MSPS and the input is sampled at an
effective rate of 50 MSPS. The device follows a similar trend across the other input modes and resolutions.
图 19 illustrates the interleaving spur at (fS / 2 ± fIN) versus the frequency of the input signal. 图 19 is taken for 8-
input mode with the ADC resolution set to 10 bits. The system clock is set to 200 MSPS and the input is sampled
at an effective rate of 200 MSPS. The interleaving spur at (fS / 2 ± fIN) is referred to the fundamental amplitude,
which is at a level of –1 dBFS. The (fS / 2 ± fIN) spur comes about because of the interleaved conversion of the
same input by two ADCs. As illustrated in 图 19, the interleaving spur gets much worse at higher input
frequencies. This degradation results from the fact that when the input frequency is increased, any mismatch in
the sampling bandwidths and sampling instants of the two interleaved ADCs leads to a larger phase error
between the interleaved conversions.
图 20 illustrates the interleaving spur at (fS / 2 ± fIN) versus the frequency of the input signal. 图 20 is taken for
16-input mode with the ADC resolution set to 10 bits. The system clock is set to 100 MSPS and the input is
sampled at an effective rate of 100 MSPS. The (fS / 2 ± fIN) spur comes about because of the interleaved
sampling of the input by the two sampling circuits of one ADC. Although not as bad as the (fS / 2 ± fIN) spur for 8-
input mode, the interleaving spur could still be the dominant factor governing the SFDR at high input frequencies.
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图 21 illustrates the interleaving spur at (fS / 4 ± fIN) versus the frequency of the input signal. 图 21 is taken for 8-
input mode with the ADC resolution set to 10 bits. The system clock is set to 200 MSPS and the input is sampled
at an effective rate of 200 MSPS. In 8-input mode, there are a total of four sampling circuits (two in each ADC)
that sample the same input in sequence. The (fS / 4 ± fIN) spur comes about from mismatches between these
four sampling circuits.
图 22 illustrates SNR in dBFS as a function of the input amplitude, also expressed in dBFS. SNR excludes the
first nine harmonics and the interleaving spurs. 图 22 is taken for the 16-input mode with the ADC resolution set
to 14 bits. The system clock is set to 65 MSPS and the input is sampled at an effective rate of 65 MSPS. The
points in the left extreme of the curve provide an estimate of the idle channel SNR (SNR in the absence of an
input signal).
图 23 illustrates the spurious-free dynamic range (SFDR) as a function of the input amplitude. 图 23 is taken for
32-input mode with the ADC resolution set to 14 bits. In 32-input mode, there is no interleaved operation of any
sort and SFDR is a true measure of ADC conversion performance. As mentioned previously, SFDR may be
dominated by interleaving spurs (and significantly lower than 32-input mode) when operated in 16-input or 8-
input modes. SFDR is plotted in both dBc and dBFS: the former referring the amplitude of the worst-spur to the
fundamental amplitude and the latter to the full-scale voltage.
图 24 illustrates SNR as a function of the input common-mode voltage (average of INP and INM). 图 24 is taken
for 16-input mode with the ADC resolution set to 14 bits. The device is meant to be operated at an input
common-mode that is tightly controlled around the ideal value of 0.8 V. The driving circuit can generate its output
common-mode using the 0.8-V reference voltage provided at the VCM pin.
图 25 illustrates SNR as a function of the input clock amplitude (expressed in differential VPP) when driven with a
differential sine-wave clock input. At small input amplitudes, the sine-wave clock has a low dV/dt slope at the
zero crossings. This low slope can cause increased jitter in the clocking and can lead to a reduction in the SNR
within the device. The effect is more pronounced when the input frequency is set to a higher value (as is
evidenced by the difference in behavior between the 5-MHz and 50-MHz inputs). The recommended manner to
drive the device is with an LVPECL clock.
图 26 illustrates SNR as a function of the duty cycle of a differential clock input. Ideally, the device is driven with
a 50% clock; see the Electrical Characteristics table for the acceptable variation around 50% duty cycle.
图 27 illustrates the channel-to-channel crosstalk as a function of the analog input frequency. An analog input of
a –1-dBFS amplitude is applied on one channel and the crosstalk spur (at the input frequency) is measured on
all channels. The worst of the crosstalk numbers (usually on the physically closest channel) is plotted.
图 28 illustrates the integral nonlinearity (INL) versus ADC code. The device is operated in 32-input mode at 14-
bit resolution with an effective sampling rate of 32.5 MSPS. 图 28 provides an accurate INL estimate of the ADC
inside the device because there is no interleaving of any kind in the 32-input mode operation.
图 29 illustrates the differential nonlinearity (DNL) versus ADC code. The device is operated in 32-input mode at
14-bit resolution with an effective sampling rate of 32.5 MSPS. The saturation of the DNL on the lower side to –1
indicates missing codes at the 14-bit level.
图 30 illustrates the power-supply rejection ratio (PSRR) as a function of the tone frequency applied on the
supply. A tone is applied on the supplies and the tone at the same frequency is measured at the device output.
The unit of dBc refers to the relation of the amplitude of the output tone to the amplitude of the supply tone that is
set to 100 mVPP for this measurement.
图 31 illustrates the power-supply modulation ratio (PSMR) as a function of the tone frequency applied on the
supply. A –1-dBFS input at 5 MHz is applied on the analog input. Simultaneously, a 100-mVPP tone is applied on
the supply. The tone caused by the intermodulation between the supply tone and the input tone is measured at
the device output. PSMR refers to the intermodulation tone referred to in terms of dBc to the amplitude of the
input tone.
图 32 illustrates the common-mode rejection ratio (CMRR) as a function of the tone frequency applied as a
common-mode signal on the input pins. A 50-mVPP common-mode signal is applied to INP and INM around the
ideal common-mode voltage of 0.8 V. The amplitude of the tone at the same frequency is measured at the
device output. CMRR refers to the amplitude of this output tone referred to in terms of dBc to the amplitude of
the common-mode input tone.
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图 33 illustrates the current of the AVDD_1P8 supply as a function of fC, the conversion clock frequency. The
relation of the sampling rate to the conversion clock frequency is different between the 16-, 32-, and 8- input
modes and therefore the curve can be appropriately interpreted for each mode. The curve extends to a
conversion clock frequency of up to 100 MSPS, which is the maximum value for the 10-bit ADC resolution. For
the 12- and 14-bit ADC resolutions, sections of the same curve up to 80 MSPS and 65 MSPS (respectively) are
applicable.
图 34 illustrates the current of the DVDD_1P8 supply as a function of the conversion clock frequency. All 16
LVDS buffers are on during this measurement.
图 35 illustrates the current of the DVDD_1P2 supply as a function of the conversion clock frequency.
图 36 illustrates the total power consumption as a function of the conversion clock frequency. The power per
input channel can be calculated by dividing this total power by 8, 16, or 32 for the 8-, 16-, or 32-input modes.
图 37 illustrates the digital high-pass filter response for different settings of the HPF corner frequency.
图 38 illustrates the typical minimum and maximum SNR values taken across 100 devices operating in the 14-bit,
32-input mode at fC = 65 MSPS (corresponding to fSAMP = 32.5 MSPS). A trend can be observed across
channels and originates from the physical placement and routing of common signals (such as reference voltage
and power) to the channels. Depending on the way the channel data are combined, an averaging effect can
result when the system-level SNR is computed.
图 39 illustrates a plot of the low-frequency noise from the device with and without the chopper enabled. When
the chopper is enabled (using the CHOPPER_EN register control), the low-frequency noise generated inside the
device is shifted to approximately fS / 2. Chopper mode is useful when the signal frequency of interest is close to
dc.
图 48 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 32-
input mode operating with a 10-bit ADC resolution.
图 49 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 16-
input mode operating with a 10-bit ADC resolution.
图 50 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 8-
input mode operating with a 10-bit ADC resolution.
图 51 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 32-
input mode operating with a 12-bit ADC resolution.
图 52 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 16-
input mode operating with a 12-bit ADC resolution.
图 53 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 32-
input mode operating with a 14-bit ADC resolution.
图 54 illustrates a contour plot of SNR as a function of both the input frequency and sampling frequency for 16-
input mode operating with a 14-bit ADC resolution.
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9.3 Do's and Don'ts
Driving the inputs (analog or digital) beyond the power-supply rails. For device reliability, an input must not
go more than 300 mV below the ground pins or 300 mV above the supply pins. Exceeding these limits, even on
a transient basis, can cause faulty or erratic operation and can impair device reliability.
Driving the device signal input with an excessively high level signal. The device offers consistent and fast
overload recovery for an overload of upto 6 dBFS. For very large overload signals (> 6 dB of the linear input
signal range), TI recommends back-to-back Schottky clamping diodes at the input to limit the amplitude of the
input signal.
Using a clock source with excessive jitter, an excessively long input clock signal trace, or having other
signals coupled to the ADC clock signal trace. These situations cause the sampling instant vary, causing an
excessive output noise and a reduction in SNR performance. For a system with multiple devices, the clock tree
scheme must be used to apply an ADC clock. Excessive clock delay mismatch between devices can also lead to
latency mismatch and functional failure at the system level.
LVDS routing length mismatch. The routing length of all LVDS lines routing to the FPGA must be matched to
avoid any timing-related issues. For systems with multiple devices, the LVDS serialized data clock (DCLKP,
DCLKM) and the frame clock (FCLKP, FCLKM) of each individual device must be used to deserialize the
corresponding LDVS serialized data (DOUTP, DOUTM).
Failure to provide adequate heat removal. Use the appropriate thermal parameter listed in the Thermal
Information table and an ambient, board, or case temperature in order to calculate device junction temperature. A
suitable heat removal technique must be used to keep the device junction temperature below the maximum limit
of 105°C.
10 Power Supply Recommendations
The device requires three supplies in order to operate properly. These supplies are AVDD_1P8, DVDD_1P8, and
DVDD_1P2. All supplies must be driven with low-noise sources to be able to achieve the best performance from
the device. When determining the drive current needed to drive each of the supplies of the device, a margin of
50-100% over the typical current might be needed to account for the current consumption across different modes
of operation.
10.1 Power Sequencing and Initialization
图 95 shows the suggested power-up sequencing and reset timing for the device. Note that the DVDD_1P2
supply must rise before the AVDD_1P8 supply. If the AVDD_1P8 supply rises before the DVDD_1P2 supply, the
AVDD_1P8 supply current is several times higher than the normal operating current until the time the DVDD_1P2
supply reaches the 1.2-V level.
The device requires register described in 表 43 to be written as part of the initialization.
表 43. Initialization Register Details
INITIALIZATION REGISTER ADDRESS
16-BIT DATA WORD TO BE WRITTEN
0Ah
3000h
The initialization sequence is described below:
1. Power-up the supplies as indicated,
2. Apply a hardware reset pulse,
3. Write the initialization register listed in 表 43 through the SPI interface,
4. Write other device settings through the SPI interface, and
5. After a wait time, the device is ready for high accuracy operation.
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The power sequence and initialization is shown in 图 95.
t1
DVDD_1P2
t2
t3
DVDD_1P8
AVDD_1P8
t5
t4
RESET
t6
t7
Device
Initialization
and Settings
SPI
Interface
CLK
t8
TX_TRIG
Device
State
High-Accuracy Operation
图 95. Power Sequencing and Initialization
The timing parameters corresponding to 图 95 are shown in 表 44.
表 44. Timing for Power Sequencing and Initialization
MIN
10 µ
10 µ
t1
MAX
50 m
50 m
UNIT
t1
t2
t3
Ramp-up time of DVDD_1P2
s
s
Ramp up time of AVDD_1P8 and DVDD_1P8
Time between DVDD_1P2 and AVDD_1P8 start of ramp up
Time between supplies stabilizing and application of a
hardware reset
t4
t5
t6
10
100
100
ms
ns
ns
Width of hardware reset
Time between hardware reset and SPI write for device
initialization and programming of device settings
Time between programming of device settings and
synchronization using TX_TRIG
t7
t8
100
10
ns
Time between TX_TRIG pulse and device ready for high-
accuracy operation
ADC clocks
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11 Layout
11.1 Power Supply, Grounding, and Bypassing
In a mixed-signal system design, the power-supply and grounding design plays a significant role. The device
distinguishes between two different grounds: AVSS (analog ground) and DVSS (digital ground). In most cases,
laying out the PCB to use a single ground plane is adequate. However, in high-frequency or high-performance
systems, care must be taken so that this ground plane is properly partitioned between various sections within the
system to minimize interactions between analog and digital circuitry. Alternatively, the digital supply set
consisting of the DVDD_1P8, DVDD_1P2, and DVSS pins can be placed on separate power and ground planes.
For this configuration, tie the AVSS and DVSS grounds together at the power connector in a star layout. In
addition, optical or digital isolators (such as the ISO7240) can completely separate the analog portion from the
digital portion. Consequently, such isolators prevent digital noise from contaminating the analog portion. 表 45
lists the related circuit blocks for each power supply.
表 45. Supply versus Circuit Blocks
POWER SUPPLY
GROUND
CIRCUIT BLOCKS
ADC analog, reference voltage and current generator, band-gap circuit,
and ADC clock buffer
AVDD_1P8
AVSS
DVDD_1P8
DVDD_1P2
DVSS
DVSS
LVDS serializer and buffer, and PLL
ADC digital and serial interface
Reference all bypassing and power supplies for the device to their corresponding ground planes. Bypass all
supply pins with 0.1-μF ceramic chip capacitors (size 0603 or smaller). In order to minimize the lead and trace
inductance, the capacitors must be located as close to the supply pins as possible. Where double-sided
component mounting is allowed, these capacitors are best placed directly under the package. In addition, larger
bipolar decoupling capacitors (2.2 µF to 10 μF, effective at lower frequencies) can also be used on the main
supply pins. These components can be placed on the PCB in close proximity (< 0.5 inch or 12.7 mm) to the
device itself.
Bypass the VCM pin with at least a 1-μF capacitor; higher value capacitors can be used for better low-frequency
noise suppression. For best results, choose low-inductance ceramic chip capacitors (size 0402, > 1 μF) placed
as close as possible to the device pin.
11.2 Layout Guidelines
High-speed, mixed-signal devices are sensitive to various types of noise coupling. One primary source of noise is
the switching noise from the serializer and the output buffer and drivers. For the device, care must be taken to
ensure that the interaction between the analog and digital supplies within the device is kept to a minimal amount.
The extent of noise coupled and transmitted from the digital and analog sections depends on the effective
inductances of each of the supply and ground connections. Smaller effective inductances of the supply and
ground pins result in better noise suppression. For this reason, multiple pins are used to connect each supply
and ground sets. Low inductance properties must be maintained throughout the design of the PCB layout by use
of proper planes and layer thickness.
To avoid noise coupling through supply pins, TI recommends keeping sensitive input pins (such as the INM and
INP pins) away from the supply planes. For example, do not route the traces or vias connected to these pins
across the supply planes. That is, avoid the power planes under the INM and INP pins.
Some layout guidelines associated with the layout of the high speed interfaces are listed below:
•
The length of the positive and negative traces of a differential pair must be matched to within 2 mils of each
other.
•
•
Each differential pair length must be matched within 10 mils of other differential pairs.
When the ADC is used on the same printed circuit board (PCB) with a digital intensive component (such as
an FPGA or ASIC), separate digital and analog ground planes must be used. Do not overlap these separate
ground planes to minimize undesired coupling.
•
•
Connect decoupling capacitors directly to ground and place these capacitors close to the ADC power pins
and the power-supply pins to filter high-frequency current transients directly to the ground plane.
Ground and power planes must be wide enough to keep the impedance very low. In a multilayer PCB, one
layer must be dedicated to each ground and power plane.
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Layout Guidelines (接下页)
•
All high-speed traces must be routed straight with minimum bends. Where a bend is necessary, avoid making
very sharp right-angle bends in the trace.
•
In order to maintain proper LVDS timing, all LVDS traces must follow a controlled impedance design. In
addition, all LVDS trace lengths must be equal and symmetrical; TI recommends keeping trace length
variations less than 150 mil (0.150 inch or 3.81 mm).
•
When routing CML lines, the traces must be designed for a controlled impedance of 50 Ω. The routing of
different lines must be matched as much as possible to minimize the inter-lane skew. However, trace length
matching is less critical for the JESD interface as compared to the LVDS interface.
Additional details on the NFBGA PCB layout techniques can be found in the Texas Instruments application
report, MicroStar BGA Packaging Reference Guide (SSYZ015), available from www.ti.com.
11.3 Layout Example
图 96. Example Layout
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12 Register Map
12.1 ADC Registers
The register map of the device is shown in 表 46.
表 46. ADC Register Map
REGISTER
ADDRESS
REGISTER DATA(1)
(Hex)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
REG_
READ_EN
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RESET
LVDS_
RATE_2X
GLOBAL_
PDN
1
2
0
0
0
0
0
0
0
SEL_CH[2]
EN_JESD
DIS_LVDS
SEL_CH[1]
0
SEL_CH[0]
0
LOW_
LATENCY_
EN
SEL_
PRBS_
PAT_FCLK
SEL_
PRBS_
PAT_GBL
PAT_MODES_FCLK
AVG_EN
PAT_MODES
OFFSET_CORR_DELAY_FROM_TX_TRIG[5:0]
DIG_
OFFSET_
EN
DIG_
GAIN_EN
OFFSET_CORR_DELAY_
FROM_TX_TRIG[7:6]
JESD_
WR_SEL
3
4
SER_DATA_RATE
OFFSET_
REMOVAL_ REMOVAL_
START_
SEL
0
0
0
0
0
0
0
0
0
0
OFFSET_
OFFSET_
REMOVAL_
SELF
PAT_SEL
_IND
PRBS_
SYNC
PRBS_
MODE
PRBS_
EN
MSB_
FIRST
AUTO_OFFSET_REMOVAL_ACC_CYCLES
ADC_RES
START_
MANUAL
5
7
CUSTOM_PATTERN
CHOPPER
_EN
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL
0
0
0
0
0
0
0
0
0
0
0
8
0
0
AUTO_OFFSET_REMOVAL_VAL_RD
A
0
0
INIT2
0
INIT1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
EN_
DITHER
B
0
D
E
GAIN_ADC1o
GAIN_ADC1e
GAIN_ADC2o
GAIN_ADC2e
GAIN_ADC3o
GAIN_ADC3e
GAIN_ADC4o
GAIN_ADC4e
0
0
0
0
0
0
0
0
OFFSET_ADC1o
OFFSET_ADC1e
OFFSET_ADC2o
OFFSET_ADC2e
OFFSET_ADC3o
OFFSET_ADC3e
OFFSET_ADC4o
OFFSET_ADC4e
F
10
11
12
13
14
PAT_
PRBS_
LVDS1
PAT_
PRBS_
LVDS2
PAT_
PRBS_
LVDS3
PAT_
PRBS_
LVDS4
HPF_
ROUND_
EN_CH1-8
DIG_HPF_
EN_ADC1-4
15
PAT_LVDS1
PAT_LVDS2
PDN_
HPF_CORNER_ADC1-4
PAT_LVDS4
IN_16CH_
ADC1
IN_16CH_
ADC2
IN_16CH_
ADC3
IN_16CH_
ADC4
17
18
0
0
0
0
PAT_LVDS3
PDN_
0
0
PDN_
DIG_ADC4
PDN_
DIG_ADC3
PDN_
DIG_ADC2
PDN_
DIG_ADC1
PDN_
LVDS4
PDN_
LVDS3
PDN_
LVDS2
PDN_
LVDS1
PDN_
PDN_
INVERT_
LVDS4
INVERT_
LVDS3
INVERT_
LVDS2
INVERT_
LVDS1
ANA_ADC4 ANA_ADC3 ANA_ADC2 ANA_ADC1
(1) Default value of all registers is 0.
94
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ADC Registers (接下页)
表 46. ADC Register Map (接下页)
REGISTER
ADDRESS
REGISTER DATA(1)
(Hex)
19
15
14
13
12
11
10
0
9
8
7
6
5
4
3
2
1
0
GAIN_ADC5o
GAIN_ADC5e
GAIN_ADC6o
GAIN_ADC6e
GAIN_ADC7o
GAIN_ADC7e
GAIN_ADC8o
GAIN_ADC8e
OFFSET_ADC5o
OFFSET_ADC5e
OFFSET_ADC6o
OFFSET_ADC6e
OFFSET_ADC7o
OFFSET_ADC7e
OFFSET_ADC8o
OFFSET_ADC8e
1A
0
1B
0
1C
1D
1E
0
0
0
1F
0
20
0
PAT_
PRBS_
LVDS5
PAT_
PRBS_
LVDS6
PAT_
PRBS_
LVDS7
PAT_
PRBS_
LVDS8
DIG_
HPF_EN_
ADC5-8
21
PAT_LVDS5
PAT_LVDS6
PDN_
0
HPF_CORNER_ADC5-8
PAT_LVDS8
IN_16CH_
ADC5
IN_16CH_
ADC6
IN_16CH_
ADC7
IN_16CH_
ADC8
23
24
0
0
0
0
PAT_LVDS7
PDN_
0
0
PDN_
DIG_ADC8
PDN_
DIG_ADC7
PDN_
DIG_ADC6
PDN_
DIG_ADC5
PDN_
LVDS8
PDN_
LVDS7
PDN_
LVDS6
PDN_
LVDS5
PDN_
PDN_
INVERT_
LVDS8
INVERT_
LVDS7
INVERT_
LVDS6
INVERT_
LVDS5
ANA_ADC8 ANA_ADC7 ANA_ADC6 ANA_ADC5
25
26
27
28
29
2A
2B
2C
GAIN_ADC9o
GAIN_ADC9e
GAIN_ADC10o
GAIN_ADC10e
GAIN_ADC11o
GAIN_ADC11e
GAIN_ADC12o
GAIN_ADC12e
0
0
0
0
0
0
0
0
OFFSET_ADC9o
OFFSET_ADC9e
OFFSET_ADC10o
OFFSET_ADC10e
OFFSET_ADC11o
OFFSET_ADC11e
OFFSET_ADC12o
OFFSET_ADC12e
PAT_
PRBS_
LVDS9
PAT_
PRBS_
LVDS10
PAT_
PRBS_
LVDS11
PAT_
PRBS_
LVDS12
HPF_ROUN
D_EN_CH9-
16
DIG_
HPF_EN_
ADC9-12
2D
PAT_LVDS9
PAT_LVDS10
HPF_CORNER_ADC9-12
PAT_LVDS12
IN_16CH_
ADC9
IN_16CH_
ADC10
IN_16CH_
ADC11
IN_16CH_
ADC12
2F
30
0
0
0
0
PAT_LVDS11
0
0
PDN_
PDN_
PDN_
PDN_
PDN_
LVDS12
PDN_
LVDS11
PDN_
LVDS10
PDN_
LVDS9
PDN_ANA_ PDN_ANA_ PDN_ANA_ PDN_ANA_
ADC12 ADC11 ADC10 ADC9
INVERT_
LVDS12
INVERT_
LVDS11
INVERT_
LVDS10
INVERT_
LVDS9
DIG_ADC12 DIG_ADC11 DIG_ADC10 DIG_ADC9
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ADC Registers (接下页)
表 46. ADC Register Map (接下页)
REGISTER
ADDRESS
REGISTER DATA(1)
(Hex)
31
15
14
13
12
11
10
0
9
8
7
6
5
4
3
2
1
0
GAIN_ADC13o
GAIN_ADC13e
GAIN_ADC14o
GAIN_ADC14e
GAIN_ADC15o
GAIN_ADC15e
GAIN_ADC16o
GAIN_ADC16e
OFFSET_ADC13o
OFFSET_ADC13e
OFFSET_ADC14o
OFFSET_ADC14e
OFFSET_ADC15o
OFFSET_ADC15e
OFFSET_ADC16o
OFFSET_ADC16e
32
0
33
0
34
0
35
0
36
0
37
0
38
0
PAT_
PRBS_
LVDS13
PAT_
PRBS_
LVDS14
PAT_
PRBS_
LVDS15
PAT_
PRBS_
LVDS16
DIG_
HPF_EN_
ADC13-16
39
3B
PAT_LVDS13
PAT_LVDS14
0
HPF_CORNER_ADC13-16
PAT_LVDS16
IN_16CH_
ADC13
IN_16CH_
ADC14
IN_16CH_
ADC15
IN_16CH_
ADC16
0
0
0
0
PAT_LVDS15
0
0
PDN_
PDN_
PDN_
PDN_
PDN_
LVDS16
PDN_
LVDS15
PDN_
LVDS14
PDN_
LVDS13
PDN_ANA_ PDN_ANA_ PDN_ANA_ PDN_ANA_
INVERT_
LVDS16
INVERT_
LVDS15
INVERT_
LVDS14
INVERT_
LVDS13
3C
43
DIG_ADC16 DIG_ADC15 DIG_ADC14 DIG_ADC13
ADC16
ADC15
ADC14
ADC13
0
0
0
0
0
0
0
0
0
0
0
LVDS_DCLK_DELAY_PROG
96
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12.1.1 Description of Registers
12.1.1.1 Register 0h (address = 0h)
图 97. Register 0h
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
REG_READ_
EN
RESET
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset
表 47. Register 0h Field Descriptions
Bit
15-2
1
Field
Type
W
Reset
0h
Description
0
Must write 0
REG_READ_EN
W
0h
Register readout enabled.
0 = Disabled
1 = Enabled; see the Serial Peripheral Interface (SPI) Operation
section for further details.
0
RESET
W
0h
0 = Disabled
1 = Enabled (this setting returns the device to a reset state; this
bit is self-clearing bit)
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12.1.1.2 Register 1h (address = 1h)
图 98. Register 1h
15
0
14
13
0
12
0
11
0
10
0
9
0
8
0
LVDS_RATE_
2X
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
0
2
1
0
0
SEL_CH[2]
R/W-0h
EN_JESD
R/W-0h
DIS_LVDS
R/W-0h
SEL_CH[1]
R/W-0h
SEL_CH[0]
R/W-0h
GLOBAL_PDN
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 48. Register 1h Field Descriptions
Bit
15
14
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
LVDS_RATE_2X
0h
0 = 1X rate; normal operation (default)
1 = 2X rate. This setting combines the data of two LVDS pairs
into a single LVDS pair. This feature can be used when the ADC
clock rate is low.
13-8
7
0
R/W
R/W
0h
0h
Must write 0
SEL_CH[2]
Input mode selection bit 3. 表 49 lists bit settings for the three
input modes.
6
5
4
EN_JESD
DIS_LVDS
SEL_CH[1]
R/W
R/W
R/W
0h
0h
0h
0 = JESD interface disabled
1 = JESD interface enabled; see 表 49
0 = LVDS interface is enabled (default)
1 = LVDS interface is disabled
Input mode selection bit 2. 表 49 lists bit settings for the three
input modes.
3
2
0
R/W
R/W
0h
0h
Must write 0
SEL_CH[0]
Input mode selection bit 1. 表 49 lists bit settings for the three
input modes.
1
0
0
R/W
R/W
0h
0h
Must write 0
GLOBAL_PDN
0 = The device operates in normal mode (default)
1 = ADC enters complete power-down mode
表 49. 8-, 16-, and 32-Input Mode Selection
INPUT MODE
8-channel input
16-channel input
32-channel input
SEL_CH[2]
SEL_CH[1]
SEL_CH[0]
1
0
0
1
1
0
1
1
0
表 50. Output Interface Supported in 8-, 16-, and 32-Input Mode
OUTPUT INTERFACE SUPPORTED?
INPUT MODE
LVDS
Yes
JESD204B
No
8-channel input
16-channel input
32-channel input
Yes
Yes
Yes
Yes
98
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12.1.1.3 Register 2h (address = 2h)
图 99. Register 2h
15
14
13
5
12
11
10
9
8
LOW_
LATENCY_EN
SEL_PRBS_
PAT_FCLK
PAT_MODES_FCLK[2:0]
R/W-0h
AVG_EN
PAT_MODES[2:0]
R/W-0h
R/W-0h
4
R/W-0h
3
R/W-0h
2
7
6
1
0
PAT_
MODES[2:0]
SEL_PRBS_
PAT_GBL
OFFSET_CORR_DELAY_FROM_TX_TRIG[5:0]
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 51. Register 2h Field Descriptions
Bit
Field
Type
Reset
Description
15-13
PAT_MODES_FCLK[2:0]
R/W
0h
These bits enable different test patterns on the frame clock line;
see 表 52 for bit descriptions and the LVDS Test Pattern Mode
section for further details.
12
11
LOW_LATENCY_EN
AVG_EN
R/W
R/W
0h
0h
0 = Default latency with digital features supported
1 = Low-latency with digital features bypassed
0 = No digital averaging
1 = Enables digital averaging of two channels to improve signal-
to-noise ratio (SNR)
10
9-7
6
SEL_PRBS_PAT_FCLK
PAT_MODES[2:0]
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation
1 = Enables the PRBS pattern to be generated on FCLK; see
the LVDS Test Pattern Mode section for further details.
These bits enable different test patterns on the LVDS data lines;
see 表 52 for bit descriptions and the LVDS Test Pattern Mode
section for further details.
SEL_PRBS_PAT_GBL
0 = Normal operation
1 = Enables the PRBS pattern to be generated on all the LVDS
data lines; see the LVDS Test Pattern Mode section for further
details.
5-0
OFFSET_CORR_DELAY_FROM_
TX_TRIG[5:0]
R/W
0h
This is a part of an 8-bit control that initiates offset correction
after the TX_TRIG input pulse (each step is equivalent to one
sample delay); the remaining two MSB bits are the
OFFSET_CORR_DELAY_FROM_TX_TRIG[7:6] bits (bits 10-9)
in register 3.
表 52. Pattern Mode Bit Description(1)
PAT_MODES[2:0] or PAT_MODES_FCLK[2:0] or PAT_LVDSx[2:0]
DESCRIPTION
Normal operation
Sync (half frame 1, half frame 0)
Deskew
000
001
010
011
100
101
110
111
Custom(2)
All 1s
Toggle mode
All 0s
Ramp(2)
(1) For detailed description, see 表 33.
(2) Either the custom or ramp pattern setting is required for PRBS pattern selection.
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12.1.1.4 Register 3h (address = 3h)
图 100. Register 3h
15
14
13
5
12
11
0
10
9
8
OFFSET_CORR_DELAY_FROM
_TX_TRIG[7:6]
DIG_
OFFSET_EN
SER_DATA_RATE
DIG_GAIN_EN
R/W-0h
6
R/W-0h
4
R/W-0h
3
R/W-0h
R/W-0h
0
7
0
2
0
1
0
JESD_WR_
SEL
0
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 53. Register 3h Field Descriptions
Bit
Field
Type
Reset
Description
15-13
SER_DATA_RATE
R/W
0h
These bits control the LVDS serialization rate.
000 = 12X
001 = 14X
100 = 16X
011 = 10X
101, 110, 111, 010 = Unused
12
DIG_GAIN_EN
0
R/W
0h
0 = Digital gain disabled
1 = Digital gain enabled
11
R/W
R/W
0h
0h
Must write 0
10-9
OFFSET_CORR_DELAY_FROM_
TX_TRIG[7:6]
This is a part of an 8-bit control that initiates offset correction
after the TX_TRIG input pulse (each step is equivalent to one
sample delay); the remaining six LSB bits are the
OFFSET_CORR_DELAY_FROM_TX_TRIG[5:0] bits (bits 5-0) in
register 2.
8
DIG_OFFSET_EN
R/W
0h
0 = Digital offset subtraction disabled
1 = Digital offset subtraction enabled
7-6
5
0
R/W
R/W
0h
0h
Must write 0
JESD_WR_SEL
0 = Setting when writing to all registers except for registers with
addresses in the decimal range of 115-119 and 134-138
1 = Setting when writing to registers with addresses in the
decimal range of 115-119 and 134-138
4-0
0
R/W
0h
Must write 0
100
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12.1.1.5 Register 4h (address = 4h)
图 101. Register 4h
15
14
13
12
11
10
9
1
8
OFFEST_
REMOVAL_
START_
OFFSET_
REMOVAL_
SELF
OFFSET_
REMOVAL_
START_ SEL
PAT_
SELECT_ IND
AUTO_OFFSET_REMOVAL_ACC_CYCLES[3:0]
R/W-0h
MANUAL
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
0
4
3
0
2
0
PRBS_
SYNC
PRBS_
MODE
PRBS_EN
R/W-0h
MSB_FIRST
R/W-0h
ADC_RES
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 54. Register 4h Field Descriptions
Bit
15
14
Field
Type
Reset
0h
Description
OFFSET_REMOVAL_SELF
R/W
Auto offset removal mode is enabled when this bit is set to 1
OFFSET_REMOVAL_START_SEL R/W
0h
0 = Auto offset correction initiated when the
OFFSET_REMOVAL_START_ MANUAL bit is set to 1.
1 = Auto offset correction initiated with a pulse on TX_TRIG pin.
13
12-9
8
OFFSET_REMOVAL_START_
MANUAL
R/W
0h
0h
0h
This bit initiates offset correction when
OFFSET_REMOVAL_START_SEL is set to 0.
AUTO_OFFSET_REMOVAL_ACC_ R/W
CYCLES
These bits define the number of samples required to generate
an offset in auto offset correction mode
PAT_SELECT_IND
R/W
0 = All LVDS output data lines have the same pattern, as
determined by the PAT_MODES[2:0] bits
1 = Different test patterns can be sent on different LVDS data
lines; see the LVDS Test Pattern Mode section for further details
7
6
5
PRBS_SYNC
PRBS_MODE
PRBS_EN
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation
1 = PRBS generator is in a reset state
0 = 23-bit PRBS generator
1 = 9-bit PRBS generator
0 = PRBS sequence generation block disabled
1 = PRBS sequence generation block enabled; see the LVDS
Test Pattern Mode section for further details
4
MSB_FIRST
R/W
0h
0 = The LSB is transmitted first on serialized output data
1 = The MSB is transmitted first on serialized output data
3-2
1-0
0
R/W
R/W
0h
0h
Must write 0
ADC_RES
These bits control the ADC resolution.
00 = 12-bit resolution
01 = 14-bit resolution
11 = 10-bit resolution
10 = Unused
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12.1.1.6 Register 5h (address = 5h)
图 102. Register 5h
15
7
14
6
13
5
12
11
10
2
9
1
8
0
CUSTOM_PATTERN
R/W-0h
4
3
CUSTOM_PATTERN
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 55. Register 5h Field Descriptions
Bit
Field
Type
Reset
Description
15-0
CUSTOM_PATTERN
R/W
0h
If the pattern mode is programmed to a custom pattern mode,
then the custom pattern value can be provided by programming
these bits; see the LVDS Test Pattern Mode section for further
details.
12.1.1.7 Register 7h (address = 7h)
图 103. Register 7h
15
14
13
12
11
10
0
9
0
8
0
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
CHOPPER_EN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 56. Register 7h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
AUTO_OFFSET_REMOVAL_VAL_ R/W
RD_CH_SEL
0h
Write the channel number to read the offset value in auto offset
correction mode for a corresponding channel number (read the
offset value in AUTO_OFFSET_REMOVAL_VAL_RD.(1)
10-1
0
0
R/W
R/W
0h
0h
Must write 0
CHOPPER_EN
The chopper can be used to move low-frequency, 1 / f noise to
fS / 2 frequency.
0 = Chopper disabled
1 = Chopper enabled
(1) In 32-channel input mode, the value written in this register corresponds to the channel number (minus 1). When operating in 8- and 16-
input modes, the value can be mapped to the odd or even data streams of the 16 ADCs. For example, a value of 0 corresponds to the
odd data stream of ADC1. Likewise, a value of 1 corresponds to the even data stream of ADC1, and so on respectively.
102
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12.1.1.8 Register 8h (address = 8h)
图 104. Register 8h
15
0
14
0
13
5
12
11
10
9
1
8
0
AUTO_OFFSET_REMOVAL_VAL_RD[13:0]
R/W-0h
R/W-0h
R/W-0h
7
6
4
3
2
AUTO_OFFSET_REMOVAL_VAL_RD[13:0]
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 57. Register 8h Field Descriptions
Bit
Field
Type
Reset
0h
Description
15-14
13-0
0
R/W
Must write 0
AUTO_OFFSET_REMOVAL_VAL_ R/W
RD
0h
Read the offset value applied in auto offset correction mode for
a specific channel number as defined in
AUTO_OFFSET_REMOVAL_VAL_RD_CH_SEL
12.1.1.9 Register Ah (address = Ah)
图 105. Register Ah
15
0
14
0
13
12
11
0
10
0
9
0
8
0
INIT2
INIT1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 58. Register Ah Field Descriptions
Bit
15-14
13
Field
0
Type
R/W
R/W
R/W
R/W
Reset
0h
Description
Must write 0
INIT2
INIT1
0
0h
Write 1 as part of the initialization after power-up(1)
Write 1 as part of the initialization after power-up(1)
Must write 0
12
0h
11-0
0h
(1) See 表 43.
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12.1.1.10 Register Bh (address = Bh)
图 106. Register Bh
15
0
14
0
13
0
12
0
11
10
0
9
0
8
0
EN_DITHER
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 59. Register Bh Field Descriptions
Bit
15-12
11
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
EN_DITHER
0h
Dither can be used to reduce the power in higher-order
harmonics.
0 = Dither disabled
1 = Dither enabled
Note: Enabling the dither converts higher-order harmonics power
into noise. Thus, enabling this mode reduce the power in higher-
order harmonics but degrades SNR.
10-0
0
R/W
0h
Must write 0
104
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12.1.1.11 Register Dh (address = Dh)
图 107. Register Dh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC1o
R/W-0h
OFFSET_ADC1o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC1o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 60. Register Dh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC1o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC1 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC1o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC1 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.12 Register Eh (address = Eh)
图 108. Register Eh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC1e
R/W-0h
OFFSET_ADC1e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC1e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 61. Register Eh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC1e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC1 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC1e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC1 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
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12.1.1.13 Register Fh (address = Fh)
图 109. Register Fh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC2o
R/W-0h
OFFSET_ADC2o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC2o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 62. Register Fh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC2o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC2 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC2o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC2 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.14 Register 10h (address = 10h)
图 110. Register 10h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC2e
R/W-0h
OFFSET_ADC2e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC2e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 63. Register 10h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC2e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC2 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC2e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC2 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
106
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12.1.1.15 Register 11h (address = 11h)
图 111. Register 11h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC3o
R/W-0h
OFFSET_ADC3o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC3o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 64. Register 11h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC3o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC3 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC3o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC3 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.16 Register 12h (address = 12h)
图 112. Register 12h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC3e
R/W-0h
OFFSET_ADC3e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC3e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 65. Register 12h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC3e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC3 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC3e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC3 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
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12.1.1.17 Register 13h (address = 13h)
图 113. Register 13h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC4o
R/W-0h
OFFSET_ADC4o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC4o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 66. Register 13h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC4o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC4 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC4o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC4 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.18 Register 14h (address = 14h)
图 114. Register 14h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC4e
R/W-0h
OFFSET_ADC4e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC4e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 67. Register 14h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC4e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC4 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC4e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC4 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
108
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12.1.1.19 Register 15h (address = 15h)
图 115. Register 15h
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS1
PAT_PRBS_
LVDS2
PAT_PRBS_
LVDS3
PAT_PRBS_
LVDS4
PAT_
LVDS2
PAT_LVDS1
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
HPF_ROUND_
EN_CH1-8
DIG_HPF_EN_
ADC1-4
PAT_LVDS2
R/W-0h
HPF_CORNER_ADC1-4
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 68. Register 15h Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS1
R/W
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 1 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
14
13
PAT_PRBS_LVDS2
PAT_PRBS_LVDS3
PAT_PRBS_LVDS4
PAT_LVDS1
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 2 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 3 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
12
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 4 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
11-9
8-6
5
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 1 can be programmed with these
bits; see 表 33 for bit descriptions.
PAT_LVDS2
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 2 can be programmed with these
bits; see 表 33 for bit descriptions.
HPF_ROUND_EN_CH1-8
0 = Rounding in the ADC HPF is disabled for channel 1 to 8.
HPF output is truncated to be mapped to the ADC resolution
bits.
1 = HPF output of channel 1 to 8 is mapped to the ADC
resolution bits by the round-off operation.
4-1
0
HPF_CORNER_ADC1-4
DIG_HPF_EN_ADC1-4
R/W
R/W
0h
0h
When the DIG_HPF_EN_ADC1-4 bit is set to 1, the digital HPF
characteristic for the corresponding ADCs can be programmed
by setting the value of k with these bits.
The value of k can be from 2 to 10 (0010b to 1010b); see the
Digital HPF section for further details.
0 = Digital HPF disabled for ADCs 1 to 4 (default)
1 = Enables digital HPF for ADCs 1 to 4
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12.1.1.20 Register 17h (address = 17h)
图 116. Register 17h
15
0
14
0
13
0
12
0
11
10
9
8
IN_16CH_
ADC1
IN_16CH_
ADC2
IN_16CH_
ADC3
IN_16CH_
ADC4
R/W-0h
7
R/W-0h
R/W-0h
5
R/W-0h
4
R/W-0h
R/W-0h
2
R/W-0h
R/W-0h
6
3
1
0
0
0
PAT_LVDS3
R/W-0h
PAT_LVDS4
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 69. Register 17h Field Descriptions
Bit
15-12
11
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
IN_16CH_ADC1
0h
Selects the input pair sampled by ADC1 in 16-input mode.
0 = ADC1 samples the signal on INP1, INM1
1 = ADC1 samples the signal on INP2, INM2
10
9
IN_16CH_ADC2
IN_16CH_ADC3
IN_16CH_ADC4
PAT_LVDS3
PAT_LVDS4
0
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
Selects the input pair sampled by ADC2 in 16-input mode.
0 = ADC2 samples the signal on INP3, INM3
1 = ADC2 samples the signal on INP4, INM4
Selects the input pair sampled by ADC3 in 16-input mode.
0 = ADC3 samples the signal on INP5, INM5
1 = ADC3 samples the signal on INP6, INM6
8
Selects the input pair sampled by ADC4 in 16-input mode.
0 = ADC4 samples the signal on INP7, INM7
1 = ADC4 samples the signal on INP8, INM8
7-5
4-2
1-0
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 3 can be programmed with these
bits; see 表 33 for bit descriptions.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 4 can be programmed with these
bits; see 表 33 for bit descriptions.
Must write 0
110
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12.1.1.21 Register 18h (address = 18h)
图 117. Register 18h
15
14
13
12
11
10
9
8
PDN_DIG_
ADC4
PDN_DIG_
ADC3
PDN_DIG_
ADC2
PDN_DIG_
ADC1
PDN_LVDS4
PDN_LVDS3
PDN_LVDS2
PDN_LVDS1
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
ADC4
PDN_ANA_
ADC3
PDN_ANA_
ADC2
PDN_ANA_
ADC1
INVERT_
LVDS4
INVERT_
LVDS3
INVERT_
LVDS2
INVERT_
LVDS1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 70. Register 18h Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_ADC4
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC4
14
13
12
11
10
9
PDN_DIG_ADC3
PDN_DIG_ADC2
PDN_DIG_ADC1
PDN_LVDS4
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC3
0 = Normal operation (default)
1 = Powers down the digital block for ADC2
0 = Normal operation (default)
1 = Powers down the digital block for ADC1
0 = Normal operation (default)
1 = Powers down LVDS output line 4
PDN_LVDS3
0 = Normal operation (default)
1 = Powers down LVDS output line 3
PDN_LVDS2
0 = Normal operation (default)
1 = Powers down LVDS output line 2
8
PDN_LVDS1
0 = Normal operation (default)
1 = Powers down LVDS output line 1
7
PDN_ANA_ADC4
PDN_ANA_ADC3
PDN_ANA_ADC2
PDN_ANA_ADC1
INVERT_LVDS4
0 = Normal operation (default)
1 = Powers down the analog block for ADC4
6
0 = Normal operation (default)
1 = Powers down the analog block for ADC3
5
0 = Normal operation (default)
1 = Powers down the analog block for ADC2
4
0 = Normal operation (default)
1 = Powers down the analog block for ADC1
3
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 4. Has no effect
on Test patterns.
2
1
0
INVERT_LVDS3
INVERT_LVDS2
INVERT_LVDS1
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 3. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 2. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 1. Has no effect
on Test patterns.
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12.1.1.22 Register 19h (address = 19h)
图 118. Register 19h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC5o
R/W-0h
OFFSET_ADC5o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC5o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 71. Register 19h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC5o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC5 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC5o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC5 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.23 Register 1Ah (address = 1Ah)
图 119. Register 1Ah
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC5e
R/W-0h
OFFSET_ADC5e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC5e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 72. Register 1Ah Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC5e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC5 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC5e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC5 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
112
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12.1.1.24 Register 1Bh (address = 1Bh)
图 120. Register 1Bh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC6o
R/W-0h
OFFSET_ADC6o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC6o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 73. Register 1Bh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC6o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC6 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC6o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC6 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.25 Register 1Ch (address = 1Ch)
图 121. Register 1Ch
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC6e
R/W-0h
OFFSET_ADC6e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC6e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 74. Register 1Ch Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC6e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC6 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC6e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC6 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
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12.1.1.26 Register 1Dh (address = 1Dh)
图 122. Register 1Dh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC7o
R/W-0h
OFFSET_ADC7o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC7o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 75. Register 1Dh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC7o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC7 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC7o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC7 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.27 Register 1Eh (address = 1Eh)
图 123. Register 1Eh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC7e
R/W-0h
OFFSET_ADC7e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC7e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 76. Register 1Eh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC7e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC7 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC7e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC7 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
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12.1.1.28 Register 1Fh (address = 1Fh)
图 124. Register 1Fh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC8o
R/W-0h
OFFSET_ADC8o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC8o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 77. Register 1Fh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC8o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC8 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC8o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC8 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.29 Register 20h (address = 20h)
图 125. Register 20h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC8e
R/W-0h
OFFSET_ADC8e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC8e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 78. Register 20h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC8e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC8 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC8e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC8 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
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12.1.1.30 Register 21h (offset = 21h)
图 126. Register 21h
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS5
PAT_PRBS_
LVDS6
PAT_PRBS_
LVDS7
PAT_PRBS_
LVDS8
PAT_
LVDS6
PAT_LVDS5
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
DIG_HPF_EN_
ADC5-8
PAT_LVDS6
R/W-0h
0
HPF_CORNER_ADC5-8
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 79. Register 21h Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS5
R/W
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 5 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
14
13
PAT_PRBS_LVDS6
PAT_PRBS_LVDS7
PAT_PRBS_LVDS8
PAT_LVDS5
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 6 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 7 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
12
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 8 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
11-9
8-6
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 5 can be programmed with these
bits; see 表 33 for bit descriptions.
PAT_LVDS6
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 6 can be programmed with these
bits; see 表 33 for bit descriptions.
5
0
R/W
R/W
0h
0h
Must write 0
4-1
HPF_CORNER_ADC5-8
When the DIG_HPF_EN_ADC5-8 bit is set to 1, the digital HPF
characteristic for the corresponding ADCs can be programmed
by setting the value of k with these bits.
The value of k can be from 2 to 10 (0010b to 1010b); see the
Digital HPF section for further details.
0
DIG_HPF_EN_ADC5-8
R/W
0h
0 = Digital HPF disabled for ADCs 5 to 8 (default)
1 = Enables digital HPF for ADCs 5 to 8
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12.1.1.31 Register 23h (register = 23h)
图 127. Register 23h
15
0
14
0
13
0
12
0
11
10
9
8
IN_16CH_
ADC5
IN_16CH_
ADC6
IN_16CH_
ADC7
IN_16CH_
ADC8
R/W-0h
7
R/W-0h
R/W-0h
5
R/W-0h
4
R/W-0h
R/W-0h
2
R/W-0h
R/W-0h
6
3
1
0
0
0
PAT_LVDS7
R/W-0h
PAT_LVDS8
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 80. Register 23h Field Descriptions
Bit
15-12
11
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
IN_16CH_ADC5
0h
Selects the input pair sampled by ADC5 in 16-input mode.
0 = ADC5 samples the signal on INP9, INM9
1 = ADC5 samples the signal on INP10, INM10
10
9
IN_16CH_ADC6
IN_16CH_ADC7
IN_16CH_ADC8
PAT_LVDS7
PAT_LVDS8
0
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
Selects the input pair sampled by ADC6 in 16-input mode.
0 = ADC6 samples the signal on INP11, INM11
1 = ADC6 samples the signal on INP12, INM12
Selects the input pair sampled by ADC7 in 16-input mode.
0 = ADC7 samples the signal on INP13, INM13
1 = ADC7 samples the signal on INP14, INM14
8
Selects the input pair sampled by ADC8 in 16-input mode.
0 = ADC8 samples the signal on INP15, INM15
1 = ADC8 samples the signal on INP16, INM16
7-5
4-2
1-0
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 7 can be programmed with these
bits; see 表 33 for bit descriptions.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 8 can be programmed with these
bits; see 表 33 for bit descriptions.
Must write 0
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12.1.1.32 Register 24h (address = 24h)
图 128. Register 24h
15
14
13
12
11
10
9
8
PDN_DIG_
ADC8
PDN_DIG_
ADC7
PDN_DIG_
ADC6
PDN_DIG_
ADC5
PDN_LVDS8
PDN_LVDS7
PDN_LVDS6
PDN_LVDS5
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
ADC8
PDN_ANA_
ADC7
PDN_ANA_
ADC6
PDN_ANA_
ADC5
INVERT_
LVDS8
INVERT_
LVDS7
INVERT_
LVDS6
INVERT_
LVDS5
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 81. Register 24h Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_ADC8
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC8
14
13
12
11
10
9
PDN_DIG_ADC7
PDN_DIG_ADC6
PDN_DIG_ADC5
PDN_LVDS8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC7
0 = Normal operation (default)
1 = Powers down the digital block for ADC6
0 = Normal operation (default)
1 = Powers down the digital block for ADC5
0 = Normal operation (default)
1 = Powers down LVDS output line 8
PDN_LVDS7
0 = Normal operation (default)
1 = Powers down LVDS output line 7
PDN_LVDS6
0 = Normal operation (default)
1 = Powers down LVDS output line 6
8
PDN_LVDS5
0 = Normal operation (default)
1 = Powers down LVDS output line 5
7
PDN_ANA_ADC8
PDN_ANA_ADC7
PDN_ANA_ADC6
PDN_ANA_ADC5
INVERT_LVDS8
0 = Normal operation (default)
1 = Powers down the analog block for ADC8
6
0 = Normal operation (default)
1 = Powers down the analog block for ADC7
5
0 = Normal operation (default)
1 = Powers down the analog block for ADC6
4
0 = Normal operation (default)
1 = Powers down the analog block for ADC5
3
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 8. Has no effect
on Test patterns.
2
1
0
INVERT_LVDS7
INVERT_LVDS6
INVERT_LVDS5
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 7. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 6. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 5. Has no effect
on Test patterns.
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12.1.1.33 Register 25h (address = 25h)
图 129. Register 25h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC9o
R/W-0h
OFFSET_ADC9o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC9o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 82. Register 25h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC9o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC9 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC9o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC9 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.34 Register 26h (address = 26h)
图 130. Register 26h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC9e
R/W-0h
OFFSET_ADC9e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC9e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 83. Register 26h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC9e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC9 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC9e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC9 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
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12.1.1.35 Register 27h (address = 27h)
图 131. Register 27h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC10o
R/W-0h
OFFSET_ADC10o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC10o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 84. Register 27h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC10o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC10 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC10o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC10 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.36 Register 28h (address = 28h)
图 132. Register 28h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC10e
R/W-0h
OFFSET_ADC10e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC10e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 85. Register 28h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC10e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC10 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC10e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC10
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
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12.1.1.37 Register 29h (address = 29h)
图 133. Register 29h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC11o
R/W-0h
OFFSET_ADC11o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC11o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 86. Register 29h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC11o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC11 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC11o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC11 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.38 Register 2Ah (address = 2Ah)
图 134. Register 2Ah
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC11e
R/W-0h
OFFSET_ADC11e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC11e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 87. Register 2Ah Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC11e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC11 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC11e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC11
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
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12.1.1.39 Register 2Bh (address = 2Bh)
图 135. Register 2Bh
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC12o
R/W-0h
OFFSET_ADC12o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC12o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 88. Register 2Bh Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC12o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC12 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC12o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC12 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.40 Register 2Ch (address = 2Ch)
图 136. Register 2Ch
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC12e
R/W-0h
OFFSET_ADC12e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC12e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 89. Register 2Ch Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC12e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC12 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC12e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC12
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
122
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12.1.1.41 Register 2Dh (address = 2Dh)
图 137. Register 2Dh
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS9
PAT_PRBS_
LVDS10
PAT_PRBS_
LVDS11
PAT_PRBS_
LVDS12
PAT_
LVDS10
PAT_LVDS9
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
HPF_ROUND_
EN_CH9-16
DIG_HPF_EN_
ADC9-12
PAT_LVDS10
R/W-0h
HPF_CORNER_ADC9-12
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 90. Register 2Dh Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS9
R/W
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 9 can be enabled with this bit;
see the LVDS Test Pattern Mode section for further details.
14
13
PAT_PRBS_LVDS10
PAT_PRBS_LVDS11
PAT_PRBS_LVDS12
PAT_LVDS9
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 10 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 11 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
12
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 12 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
11-9
8-6
5
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 9 can be programmed with these
bits; see表 33 for bit descriptions.
PAT_LVDS10
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 10 can be programmed with these
bits; see表 33 for bit descriptions.
HPF_ROUND_EN_CH9-16
0 = Rounding in the ADC HPF is disabled for channels 9-16.
The HPF output is truncated to be mapped to the ADC
resolution bits.
1 = HPF output of channels 9-16 is mapped to the ADC
resolution bits by the round-off operation.
4-1
0
HPF_CORNER_ADC9-12
DIG_HPF_EN_ADC9-12
R/W
R/W
0h
0h
When the DIG_HPF_EN_CH9-12 bit is set to 1, the digital HPF
characteristic for the corresponding ADCs can be programmed
by setting the value of k with these bits.
The value of k can be from 2 to 10 (0010b to 1010b); see the
Digital HPF section for further details.
0 = Digital HPF disabled for ADCs 9 to 12 (default)
1 = Enables digital HPF for ADCs 9 to 12
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12.1.1.42 Register 2Fh (address = 2Fh)
图 138. Register 2Fh
15
0
14
0
13
0
12
0
11
10
9
8
IN_16CH_
ADC9
IN_16CH_
ADC10
IN_16CH_
ADC11
IN_16CH_
ADC12
R/W-0h
7
R/W-0h
R/W-0h
5
R/W-0h
4
R/W-0h
R/W-0h
2
R/W-0h
R/W-0h
6
3
1
0
0
0
PAT_LVDS11
R/W-0h
PAT_LVDS12
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write;-n = value after reset
表 91. Register 2Fh Field Descriptions
Bit
15-12
11
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
IN_16CH_ADC9
0h
Selects the input pair sampled by ADC9 in 16-input mode.
0 = ADC9 samples the signal on INP17, INM17
1 = ADC9 samples the signal on INP18, INM18
10
9
IN_16CH_ADC10
IN_16CH_ADC11
IN_16CH_ADC12
PAT_LVDS11[2:0]
PAT_LVDS12[2:0]
0
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
Selects the input pair sampled by ADC10 in 16-input mode.
0 = ADC10 samples the signal on INP19, INM19
1 = ADC10 samples the signal on INP20, INM20
Selects the input pair sampled by ADC11 in 16-input mode.
0 = ADC11 samples the signal on INP21, INM21
1 = ADC11 samples the signal on INP22, INM22
8
Selects the input pair sampled by ADC12 in 16-input mode.
0 = ADC12 samples the signal on INP23, INM23
1 = ADC12 samples the signal on INP24, INM24
7-5
4-2
1-0
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 11 can be programmed with these
bits; see表 33 for bit descriptions.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 12 can be programmed with these
bits; see表 33 for bit descriptions.
Must write 0
124
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12.1.1.43 Register 30h (address = 30h)
图 139. Register 30h
15
14
13
12
11
10
9
8
PDN_DIG_
ADC12
PDN_DIG_
ADC11
PDN_DIG_
ADC10
PDN_DIG_
ADC9
PDN_
LVDS12
PDN_
LVDS11
PDN_
LVDS10
PDN_
LVDS9
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
ADC12
PDN_ANA_
ADC11
PDN_ANA_
ADC10
PDN_ANA_
ADC9
INVERT_
LVDS12
INVERT_
LVDS11
INVERT_
LVDS10
INVERT_
LVDS9
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; W = Write only; = value after reset
表 92. Register 30h Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_ADC12
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC12
14
13
12
11
10
9
PDN_DIG_ADC11
PDN_DIG_ADC10
PDN_DIG_ADC9
PDN_LVDS12
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC11
0 = Normal operation (default)
1 = Powers down the digital block for ADC10
0 = Normal operation (default)
1 = Powers down the digital block for ADC9
0 = Normal operation (default)
1 = Powers down LVDS output line 12
PDN_LVDS11
0 = Normal operation (default)
1 = Powers down LVDS output line 11
PDN_LVDS10
0 = Normal operation (default)
1 = Powers down LVDS output line 10
8
PDN_LVDS9
0 = Normal operation (default)
1 = Powers down LVDS output line 9
7
PDN_ANA_ADC12
PDN_ANA_ADC11
PDN_ANA_ADC10
PDN_ANA_ADC9
INVERT_LVDS12
0 = Normal operation (default)
1 = Powers down the analog block for ADC12
6
0 = Normal operation (default)
1 = Powers down the analog block for ADC11
5
0 = Normal operation (default)
1 = Powers down the analog block for ADC10
4
0 = Normal operation (default)
1 = Powers down the analog block for ADC9
3
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 12. Has no effect
on Test patterns.
2
1
0
INVERT_LVDS11
INVERT_LVDS10
INVERT_LVDS9
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 11. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 10. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 9. Has no effect
on Test patterns.
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12.1.1.44 Register 31h (address = 31h)
图 140. Register 31h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC13o
R/W-0h
OFFSET_ADC13o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC13o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 93. Register 31h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC13o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC13 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC13o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC13 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.45 Register 32h (address = 32h)
图 141. Register 32h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC13e
R/W-0h
OFFSET_ADC13e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC13e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 94. Register 32h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC13e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC13 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC13e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC13
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
126
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12.1.1.46 Register 33h (address = 33h)
图 142. Register 33h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC14o
R/W-0h
OFFSET_ADC14o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC14o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 95. Register 33h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC14o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC14 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC14o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC14 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.47 Register 34h (address = 34h)
图 143. Register 34h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC14e
R/W-0h
OFFSET_ADC14e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC14e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 96. Register 34h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC14e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC14 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC14e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC14
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
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12.1.1.48 Register 35h (address = 35h)
图 144. Register 35h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC15o
R/W-0h
OFFSET_ADC15o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC15o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 97. Register 35h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC15o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC15 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC15o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC15 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.49 Register 36h (address = 36h)
图 145. Register 36h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC15e
R/W-0h
OFFSET_ADC15e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC15e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 98. Register 36h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC15e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC15 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC15e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC15
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
128
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12.1.1.50 Register 37h (address = 37h)
图 146. Register 37h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC16o
R/W-0h
OFFSET_ADC16o
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC16o
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 99. Register 37h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC16o
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the odd sample of ADC16 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC16o
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the odd sample of ADC16 can
be obtained with this 10-bit register. The offset value is in twos
complement format and its LSB corresponds to a 14-bit LSB.
12.1.1.51 Register 38h (address = 38h)
图 147. Register 38h
15
7
14
6
13
12
11
10
0
9
8
GAIN_ADC16e
R/W-0h
OFFSET_ADC16e
R/W-0h
R/W-0h
5
4
3
2
1
0
OFFSET_ADC16e
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 100. Register 38h Field Descriptions
Bit
Field
Type
Reset
Description
15-11
GAIN_ADC16e
R/W
0h
When the DIG_GAIN_EN bit (register 3, bit 12) is set to 1, the
digital gain value for the even sample of ADC16 can be obtained
with this register. For a value of N (decimal equivalent of binary)
written to these bits, the digital gain gets set to N × 0.2 dB.
10
0
R/W
R/W
0h
0h
Must write 0
9-0
OFFSET_ADC16e
When the DIG_OFFSET_EN bit (register 3, bit 8) is set to 1, the
offset value to be subtracted from the even sample of ADC16
can be obtained with this 10-bit register. The offset value is in
twos complement format and its LSB corresponds to a 14-bit
LSB.
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12.1.1.52 Register 39h (address = 39h)
图 148. Register 39h
15
14
13
12
11
10
9
1
8
PAT_PRBS_
LVDS13
PAT_PRBS_
LVDS14
PAT_PRBS_
LVDS15
PAT_PRBS_
LVDS16
PAT_LVDS13
PAT_LVDS14
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
2
R/W-0h
0
3
DIG_HPF_EN_
ADC13-16
PAT_LVDS14
R/W-0h
0
HPF_CORNER_ADC13-16
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 101. Register 39h Field Descriptions
Bit
Field
Type
Reset
Description
15
PAT_PRBS_LVDS13
R/W
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 13 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
14
13
PAT_PRBS_LVDS14
PAT_PRBS_LVDS15
PAT_PRBS_LVDS16
PAT_LVDS13[2:0]
PAT_LVDS14[2:0]
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 14 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 15 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
12
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the PRBS pattern on LVDS output 16 can be enabled with this
bit; see the LVDS Test Pattern Mode section for further details.
11-9
8-6
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 13 can be programmed with these
bits; see 表 33 for bit descriptions.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 14 can be programmed with these
bits; see 表 33 for bit descriptions.
5
0
R/W
R/W
0h
0h
Must write 0
4-1
HPF_CORNER_ADC13-16
When the DIG_HPF_EN_CH13-16 bit is set to 1, the digital HPF
characteristic for the corresponding ADCs can be programmed
by setting the value of k with these bits.
The value of k can be from 2 to 10 (0010b to 1010b); see the
Digital HPF section for further details.
0
DIG_HPF_EN_ADC13-16
R/W
0h
0 = Digital HPF disabled for ADCs 13 to 16 (default)
1 = Enables digital HPF for ADCs 13 to 16
130
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12.1.1.53 Register 3Bh (address = 3Bh)
图 149. Register 3Bh
15
0
14
0
13
0
12
0
11
10
9
8
IN_16CH_
ADC13
IN_16CH_
ADC14
IN_16CH_
ADC15
IN_16CH_
ADC16
R/W-0h
7
R/W-0h
R/W-0h
5
R/W-0h
4
R/W-0h
R/W-0h
2
R/W-0h
R/W-0h
6
3
1
0
0
0
PAT_LVDS15
R/W-0h
PAT_LVDS16
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 102. Register 3Bh Field Descriptions
Bit
15-12
11
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
IN_16CH_ADC13
0h
Selects the input pair sampled by ADC13 in 16-input mode.
0 = ADC13 samples the signal on INP25, INM25
1 = ADC13 samples the signal on INP26, INM26
10
9
IN_16CH_ADC14
IN_16CH_ADC15
IN_16CH_ADC16
PAT_LVDS15[2:0]
PAT_LVDS16[2:0]
0
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
Selects the input pair sampled by ADC14 in 16-input mode.
0 = ADC14 samples the signal on INP27, INM27
1 = ADC14 samples the signal on INP28, INM28
Selects the input pair sampled by ADC15 in 16-input mode.
0 = ADC15 samples the signal on INP29, INM29
1 = ADC15 samples the signal on INP30, INM30
8
Selects the input pair sampled by ADC16 in 16-input mode.
0 = ADC16 samples the signal on INP31, INM31
1 = ADC16 samples the signal on INP32, INM32
7-5
4-2
1-0
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 15 can be programmed with these
bits; see 表 33 for bit descriptions.
When the PAT_SELECT_IND bit (register 4, bit 8) is set to 1,
the pattern on LVDS output 16 can be programmed with these
bits; see 表 33 for bit descriptions.
Must write 0
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12.1.1.54 Register 3Ch (address = 3Ch)
图 150. Register 3Ch
15
14
13
12
11
10
9
8
PDN_DIG_
ADC16
PDN_DIG_
ADC15
PDN_DIG_
ADC14
PDN_DIG_
PDN_LVDS16 PDN_LVDS15 PDN_LVDS14 PDN_LVDS13
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
PDN_ANA_
ADC16
PDN_ANA_
ADC15
PDN_ANA_
ADC14
PDN_ANA_
ADC13
INVERT_
LVDS16
INVERT_
LVDS15
INVERT_
LVDS14
INVERT_
LVDS13
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 103. Register 3Ch Field Descriptions
Bit
Field
Type
Reset
Description
15
PDN_DIG_ADC16
R/W
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC16
14
13
12
11
10
9
PDN_DIG_ADC15
PDN_DIG_ADC14
PDN_DIG_ADC13
PDN_LVDS16
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
0 = Normal operation (default)
1 = Powers down the digital block for ADC15
0 = Normal operation (default)
1 = Powers down the digital block for ADC14
0 = Normal operation (default)
1 = Powers down the digital block for ADC13
0 = Normal operation (default)
1 = Powers down LVDS output line 16
PDN_LVDS15
0 = Normal operation (default)
1 = Powers down LVDS output line 15
PDN_LVDS14
0 = Normal operation (default)
1 = Powers down LVDS output line 14
8
PDN_LVDS13
0 = Normal operation (default)
1 = Powers down LVDS output line 13
7
PDN_ANA_ADC16
PDN_ANA_ADC15
PDN_ANA_ADC14
PDN_ANA_ADC13
INVERT_LVDS16
0 = Normal operation (default)
1 = Powers down the analog block for ADC16
6
0 = Normal operation (default)
1 = Powers down the analog block for ADC15
5
0 = Normal operation (default)
1 = Powers down the analog block for ADC14
4
0 = Normal operation (default)
1 = Powers down the analog block for ADC13
3
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 16. Has no effect
on Test patterns.
2
1
0
INVERT_LVDS15
INVERT_LVDS14
INVERT_LVDS13
R/W
R/W
R/W
0h
0h
0h
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 15. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 14. Has no effect
on Test patterns.
0 = Normal operation (default)
1 = Inverts ADC data sent on LVDS output line 13. Has no effect
on Test patterns.
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12.1.1.55 Register 43h (address = 43h)
图 151. Register 43h
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
1
0
0
LVDS_DCLK_DELAY_PROG
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 104. Register 43h Field Descriptions
Bit
15-5
4-1
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
LVDS_DCLK_DELAY_PROG
0h
The LVDS DCLK output delay is programmable with 110-ps
steps. Delay values are in twos complement format. Increasing
the positive delay increases setup time and reduces hold time,
and vice-versa for the negative delay.
0000 = No delay
0001 = 110 ps
0010 = 220 ps
…
1110 = –220 ps
1111 = –110ps
…
0
0
R/W
0h
Must write 0
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12.2 JESD Serial Interface Registers
This section discusses the JESD registers. A register map is available in 表 105.
表 105. JESD Register Map
REGISTER
ADDRESS
REGISTER DATA(1)
DECIMAL
HEX
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MASK_TX_
TRIG
JESD_
RESET1
70
73
74
46
49
4A
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
LINK_
CONFIG_
DIS
IDLE_
MODE
LANE_
ALIGN
FRAME_
ALIGN
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FORCE_K
0
0
0
TX_SYNC_
REQ
JESD_RES JESD_RES
ET2
LINK_LAYER_TESTMODES
RELEASE_ILA
ET3
SING_
CONV_
PER_OCT
75
77
80
4B
4D
50
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
NUM_ADC_PER_LANE
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PRE_EMP
INC_
JESD_
VDD
0
0
0
0
0
0
0
81
82
83
85
51
52
53
55
DEVICE_ID
0
0
0
BANK_ID
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
SCR_EN
0
0
0
0
0
0
0
0
0
0
0
0
0
K_VALUE_TO_FORCE
0
JESD_SUBCLASS
JESD_VER
0
0
EN_
EN_
EN_
EN_
ENABLE_
JESD_VER
_CONTROL
EN_LANE_ EN_LANE_ EN_LANE_ EN_LANE_
CHECK
SUM_
LANE1
CHECK
SUM_
LANE2
CHECK
SUM_
LANE3
CHECK
SUM_
LANE4
115(2)
73
0
0
0
0
ID1
ID2
ID3
ID4
116(2)
117(2)
118(2)
119(2)
74
75
76
77
CHECK_SUM1
CHECK_SUM3
CHECK_SUM2
CHECK_SUM4
0
0
0
0
0
0
LANE_ID1
LANE_ID3
0
0
0
0
0
0
LANE_ID2
LANE_ID4
FORCE_
LMFC_
COUNT
120
78
86
LMFC_COUNTER_INIT_VALUE
EN_
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
EN_
EN_
EN_
EN_LANE_ EN_LANE_ EN_LANE_ EN_LANE_
CHECK
SUM_
CHECK
SUM_
LANE6
CHECK
SUM_
LANE7
CHECK
SUM_
LANE8
134(2)
ID5
ID6
ID7
ID8
LANE5
135(2)
136(2)
137(2)
138(2)
87
88
89
8A
CHECK_SUM5
CHECK_SUM7
CHECK_SUM6
CHECK_SUM8
0
0
0
0
0
0
LANE_ID5
LANE_ID7
0
0
0
0
0
0
LANE_ID6
LANE_ID8
(1) Default value of all registers is 0.
(2) These registers must only be written to after setting the JESD_WR_SEL register bit (register 3, bit 5) to 1. To write any other registers, set the JESD_WR_SEL bit to 0.
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12.2.1 Description of JESD Serial Interface Registers
12.2.1.1 Register 70 (address = 46h)
图 152. Register 70
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
1
0
0
MASK_TX_
TRIG
JESD_RESET1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 106. Register 70 Field Descriptions
Bit
15-3
2
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
MASK_TX_TRIG
0h
0 = TX_TRIG affects internal clock-phase resets
1 = TX_TRIG does not affect internal clock-phase resets
1
JESD_RESET1
R/W
0h
0 = SYNC~ and SYSREF events reset non-JESD blocks (such
as the clock dividers, demodulator, and test pattern generator)
1 = SYNC~ and SYSREF events do not reset non-JESD blocks
(such as the clock dividers, demodulator, and test pattern
generator)
0
0
R/W
0h
Must write 0
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12.2.1.2 Register 73 (address = 49h)
图 153. Register 73
15
14
0
13
0
12
11
10
9
0
8
0
LINK_CONFIG
_DIS
IDLE_MODE
R/W-0h
LANE_ALIGN FRAME_ALIGN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
1
0
0
0
FORCE_K
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 107. Register 73 Field Descriptions
Bit
Field
Type
Reset
Description
15
IDLE_MODE
R/W
0h
0 = Idle mode disabled (normal operation)
1 = Device sends a continuous pattern (BC50h) on all lanes
Must write 0
14-13
12
0
R/W
R/W
0h
0h
LANE_ALIGN
0 = Character replacement disabled. Data are sent without
inserting a lane alignment control character.
1 = If the last octet of the multiframe is the same as the last
octet of the previous multiframe, then the last octet is replaced
with a /K28.3/ character that can be used by the receiver for
lane alignment monitoring and correction; see the JESD204B
document., section 5.3.3.4 for details.
11
10
FRAME_ALIGN
R/W
R/W
0h
0h
0 = Character replacement is disabled. Data are sent without
inserting a frame alignment control character.
1 = If the last octet of the frame is the same as the last octet of
the previous frame, then the octet is replaced with /K28.7/.
Character replacement is not performed if a control character
was already sent in the previous frame; see the JESD204B
document., section 5.3.3.4 for details.
LINK_CONFIG_DIS
0 = ILA transmission enabled. The initial lane alignment data are
sent, as per section 5.3.3.5 and 8.3 of the JESD204B document.
1 = ILA transmission disabled. The device starts sending
payload data immediately after the code group synchronization.
9-3
2
0
R/W
R/W
0h
0h
Must write 0
FORCE_K
0 = Value of K (number of frames per multiframe) minus 1 is
automatically calculated and set
1 = Value of K (number of frames per multiframe) minus 1 is set
by the K_VALUE_TO_FORCE register setting
1-0
0
R/W
0h
Must write 0
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12.2.1.3 Register 74 (address = 4Ah)
图 154. Register 74
15
14
13
12
11
10
9
0
8
TX_SYNC_
REQ
LINK_LAYER_TESTMODES
RELEASE_ILA
R/W-0h
JESD_RESET2
R/W-0h
R/W-0h
6
R/W-0h
R/W-0h
7
5
0
4
0
3
0
2
0
1
0
0
0
JESD_RESET3
R/W-0h
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 108. Register 74 Field Descriptions
Bit
Field
Type
Reset
Description
15-13
LINK_LAYER_TESTMODES
R/W
0h
000 = Normal operation
001 = D21.5 (1010101010) is transmitted on all lanes
010 = /K28.5/ is transmitted on all lanes
011 = ILA sequence is continuously transmitted on all lanes
100 = Pseudo-random pattern of 120 bits is transmitted on all
lanes
All other combinations are invalid.
12
TX_SYNC_REQ
RELEASE_ILA
R/W
R/W
0h
0h
0 = Sync reinitialization request disabled (normal operation)
1 = A stream of /K28.5/ symbols are transmitted, requesting link
reinitialization. After transmission, the /K28.5/ characters enter
into a link initialization state; see section 5.3.3.7 of the
JESD204B document for further details.
11-10
000 = Default value
The value of this register determines the LMFC edge that the
transmitter enters in the ILA phase from the code group
synchronization. This setting is useful for adjusting the
deterministic latency value; see the Data Link Layer section.
9
8
0
R/W
R/W
0h
0h
Must write 0
JESD_RESET2
0 = SYNC~ and SYSREF events reset the phase of JESD and
non-JESD blocks (demodulator, test pattern generator, and
clock dividers)
1 = SYNC~ and SYSREF events do not reset the phase of
JESD block and clock dividers but do reset the phase of the
demodulator and test pattern generator
7
JESD_RESET3
R/W
R/W
0h
0h
0 = SYNC~ and SYSREF events reset the phase of JESD and
non-JESD blocks (demodulator, test pattern generator, and
clock dividers)
1 = Immediately after setting this bit to 1, the first SYNC~ and
SYSREF event resets the phase of the JESD and non-JESD
blocks. Subsequent SYNC~ and SYSREF events do not reset
the phase of the JESD block and clock dividers but do reset the
phase of the demodulator and test pattern generator.
6-0
0
Must write 0
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12.2.1.4 Register 75 (address = 4Bh)
图 155. Register 75
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
SING_CONV_
PER_OCT
R/W-0h
7
R/W-0h
R/W-0h
5
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
6
4
0
3
0
2
0
1
0
0
0
NUM_ADC_PER_LANE
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 109. Register 75 Field Descriptions
Bit
15-9
8
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
SING_CONV_PER_OCT
0h
0 = Data are packed efficiently and transmitted over the link
1 = Each ADC data are packed in two octets [that is, each ADC
data are transmitted as 16 bits (12-, 14-, and 16-bit mode) by
the appropriate zero padding]; see the User Data Format section
for further details.
7-5
NUM_ADC_PER_LANE
R/W
0h
000 = Four ADCs per lane mode: data from four ADCs are
packed into a lane. Four lanes are active and four lanes are
powered down.
001 = Eight ADCs per lane mode: data from eight ADCs are
packed into a lane. Two lanes are active and six lanes are
powered down.
100 = Two ADCs per lane mode: data from two ADCs are
packed into a lane. All eight lanes are active.
All other settings are invalid.
4-0
0
R/W
0h
Must write 0
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12.2.1.5 Register 77 (address = 4Dh)
图 156. Register 77
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
5
4
3
0
2
0
1
0
0
0
PRE_EMP
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 110. Register 77 Field Descriptions
Bit
15-8
7-4
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
PRE_EMP
0h
The extra current during pre-emphasis is equal to the decimal
equivalent of the programmed value multiplied by 0.25 mA. A
value corresponding to 0 refers to no pre-emphasis.
3-0
0
R/W
0h
Must write 0
12.2.1.6 Register 80 (address = 50h)
图 157. Register 80
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
INC_JESD_
VDD
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 111. Register 80 Field Descriptions
Bit
15-2
1
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
INC_JESD_VDD
0h
0 = Default value for the internal LDO driving the JESD PLL
1 = Increased value for the internal LDO driving the JESD PLL
0
0
R/W
0h
Must write 0
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12.2.1.7 Register 81 (address = 51h)
图 158. Register 81
15
14
13
12
11
10
9
1
8
0
DEVICE_ID
R/W-0h
7
0
6
0
5
0
4
3
2
BANK_ID
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 112. Register 81 Field Descriptions
Bit
15-8
7-5
Field
Type
R/W
R/W
R/W
Reset
0h
Description
DEVICE_ID
0
These bits force the device ID value.
Must write 0
0h
4-0
BANK_ID
0h
These bits force the bank ID value.
12.2.1.8 Register 82 (address = 52h)
图 159. Register 82
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
6
0
5
0
4
0
3
0
2
0
1
0
0
0
SCR_EN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 113. Register 82 Field Descriptions
Bit
15-8
7
Field
0
Type
R/W
R/W
Reset
0h
Description
Must write 0
SCR_EN
0h
0 = Scrambler disabled
1 = Scrambler enabled; see the Scrambler section for further
details
6-0
0
R/W
0h
Must write 0
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12.2.1.9 Register 83 (address = 53h)
图 160. Register 83
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
1
0
K_VALUE_TO_FORCE
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 114. Register 83 Field Descriptions
Bit
15-5
4-0
Field
Type
R/W
R/W
Reset
0h
Description
0
Must write 0
K_VALUE_TO_FORCE
0h
Specifies the value of K (number of frames per multiframe)
minus 1 to be forced when the FORCE_K bit is set to 1.
12.2.1.10 Register 85 (address = 55h)
图 161. Register 85
15
7
14
13
5
12
0
11
0
10
0
9
0
8
0
JESD_SUBCLASS
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
6
4
0
3
0
2
0
1
0
0
0
JESD_VER
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 115. Register 85 Field Descriptions
Bit
Field
Type
Reset
Description
15-13
JESD_SUBCLASS
R/W
0h
000 = Subclass 0
001 = Subclass 1
010 = subclass 2
See the JESD Version and Subclass section for further details.
12-8
7-5
0
R/W
R/W
0h
0h
Must write 0
JESD_VER
000 = JESD204A
001 = JESD204B
See the JESD Version and Subclass section for further details.
4-0
0
R/W
0h
Must write 0
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12.2.1.11 Register 115 (address = 73h)
图 162. Register 115
15
14
13
12
11
10
9
8
EN_
EN_
CHECKSUM_
LANE2
EN_
CHECKSUM_
LANE3
EN_
CHECKSUM_
LANE4
EN_LANE_ID1 EN_LANE_ID2 EN_LANE_ID3 EN_LANE_ID4 CHECKSUM_
LANE1
R/W-0h
7
R/W-0h
6
R/W-0h
5
R/W-0h
4
R/W-0h
3
R/W-0h
2
R/W-0h
1
R/W-0h
0
ENABLE_JESD
_VER_
0
0
0
0
0
0
0
CONTROL
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 116. Register 115 Field Descriptions
Bit
Field
Type
Reset
Description
15
EN_LANE_ID1
R/W
0h
0 = Lane 1 default ID (00001) is set
1 = Lane 1 default ID (00001) can be forced with register 118,
bits 12-8
14
13
12
11
10
9
EN_LANE_ID2
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0 = Lane 2 default ID (00010) is set
1 = Lane 2 default ID (00010) can be forced with register 118,
bits 4-0
EN_LANE_ID3
0 = Lane 3 default ID (00011) is set
1 = Lane 3 default ID (00011) can be forced with register 119,
bits 12-8
EN_LANE_ID4
0 = Lane 4 default ID (00100) is set
1 = Lane 4 default ID (00100) can be forced with register 119,
bits 4-0
EN_CHECKSUM_LANE1
EN_CHECKSUM_LANE2
EN_CHECKSUM_LANE3
EN_CHECKSUM_LANE4
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) is forced from register
116, bits 15-8
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) is forced from register
116, bits 7-0
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) is forced from register
117, bits 15-8
8
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) is forced from register
117, bits 7-0
7-5
4
0
R/W
R/W
0h
0h
Must write 0
ENABLE_JESD_VER_CONTROL
0 = The device is in JESD204B, subclass 1 mode
1 = JESD version and subclass can be changed; see the 表 15
section for further details.
3-0
0
R/W
0h
Must write 0
142
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12.2.1.12 Register 116 (address = 74h)
图 163. Register 116
15
7
14
6
13
5
12
11
10
2
9
1
8
0
CHECK_SUM1
R/W-0h
4
3
CHECK_SUM2
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 117. Register 116 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
CHECK_SUM1
R/W
0h
These bits determine the lane 1 checksum value; see register
135.
7-0
CHECK_SUM2
R/W
0h
These bits determine the lane 2 checksum value; see register
135.
12.2.1.13 Register 117 (address = 75h)
图 164. Register 117
15
7
14
6
13
5
12
11
10
2
9
1
8
0
CHECK_SUM3
R/W-0h
4
3
CHECK_SUM4
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 118. Register 117 Field Descriptions
Bit
Field
Type
Reset
Description
15-8
CHECK_SUM3
R/W
0h
These bits determine the lane 3 checksum value; see register
136.
7-0
CHECK_SUM4
R/W
0h
These bits determine the lane 4 checksum value; see register
136.
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143
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12.2.1.14 Register 118 (address = 76h)
图 165. Register 118
15
0
14
0
13
0
12
11
10
9
1
8
0
LANE_ID1
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
LANE_ID2
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 119. Register 118 Field Descriptions
Bit
15-13
12-8
7-5
Field
Type
R/W
R/W
R/W
R/W
Reset
0h
Description
0
Must write 0
LANE_ID1
0
0h
These bits determine the lane 1 ID value; see register 137.
Must write 0
0h
4-0
LANE_ID2
0h
These bits determine the lane 2 ID value; see register 137.
12.2.1.15 Register 119 (address = 77h)
图 166. Register 119
15
0
14
0
13
0
12
11
10
9
1
8
0
LANE_ID3
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
LANE_ID4
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 120. Register 119 Field Descriptions
Bit
15-13
12-8
7-5
Field
Type
R/W
R/W
R/W
R/W
Reset
0h
Description
0
Must write 0
LANE_ID3
0
0h
These bits determine the lane 3 ID value; see register 138.
Must write 0
0h
4-0
LANE_ID4
0h
These bits determine the lane 4 ID value; see register 138.
144
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
12.2.1.16 Register 120 (address = 78h)
图 167. Register 120
15
14
13
12
LMFC_COUNTER_INIT_VALUE
R/W-0h
11
10
9
0
8
0
FORCE_LMFC
_COUNT
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 121. Register 120 Field Descriptions
Bit
Field
Type
Reset
Description
15
FORCE_LMFC_COUNT
R/W
0h
0 = Default value
1 = The LMFC counter value is forced, as per register 120, bits
14-10.
14-10
9-0
LMFC_COUNTER_INIT_VALUE
R/W
R/W
0h
0h
These bits specify the initial value of the LMFC counter. This
option is useful when the multiframe size must be different than
the default value; see the Synchronization Using SYNC~ and
SYSREF section.
0
Must write 0
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12.2.1.17 Register 134 (address = 86h)
图 168. Register 134
15
14
13
12
11
10
9
8
EN_
EN_
CHECKSUM_
LANE6
EN_
CHECKSUM_
LANE7
EN_
CHECKSUM_
LANE8
EN_LANE_ID5 EN_LANE_ID6 EN_LANE_ID7 EN_LANE_ID8 CHECKSUM_
LANE5
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
(1) This register is valid when JESD_WR_SEL (register 3, bit 5) is 1.
表 122. Register 134 Field Descriptions
Bit
Field
Type
R/W
Reset
0h
Description
15
EN_LANE_ID5
0 = Lane 5 default ID (00101) is set
1 = Lane 5 default ID (00101) can be forced with register 137, bits 12-8
14
13
12
11
10
9
EN_LANE_ID6
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
0h
0h
0 = Lane 6 default ID (00110) is set
1 = Lane 6 default ID (00110) can be forced with register 137, bits 4-0
EN_LANE_ID7
0 = Lane 7 default ID (00111) is set
1 = Lane 7 default ID (00111) can be forced with register 138, bits 12-8
EN_LANE_ID8
0 = Lane 8 default ID (01000) is set
1 = Lane 8 default ID (01000) can be forced with register 138, bits 4-0
EN_CHECKSUM_LANE5
EN_CHECKSUM_LANE6
EN_CHECKSUM_LANE7
EN_CHECKSUM_LANE8
0
0 = Default checksum value calculated by device
1 = Checksum value (FCHK field in 表 15) from register 135, bits 15-8
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) from register 135, bits 7-0
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) from register 135, bits 15-8
8
0 = The default checksum value is calculated by the device
1 = Checksum value (FCHK field in 表 15) from register 135, bits 7-0
7-0
Must write 0
12.2.1.18 Register 135 (address = 87h)
图 169. Register 135
15
7
14
6
13
5
12
11
10
2
9
1
8
0
CHECK_SUM5
R/W-0h
4
3
CHECK_SUM6
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 123. Register 135 Field Descriptions
Bit
15-8
7-0
Field
Type
R/W
R/W
Reset
0h
Description
CHECK_SUM5
CHECK_SUM6
These bits determine the lane 5 checksum value.
These bits determine the lane 6 checksum value.
0h
146
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12.2.1.19 Register 136 (address = 88h)
图 170. Register 136
15
7
14
6
13
5
12
11
10
2
9
1
8
0
CHECK_SUM7
R/W-0h
4
3
CHECK_SUM8
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 124. Register 136 Field Descriptions
Bit
15-8
7-0
Field
Type
R/W
R/W
Reset
0h
Description
CHECK_SUM7
CHECK_SUM8
These bits determine the lane 7 checksum value.
These bits determine the lane 8 checksum value.
0h
12.2.1.20 Register 137 (address = 89h)
图 171. Register 137
15
0
14
0
13
0
12
11
10
9
1
8
0
LANE_ID5
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
LANE_ID6
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 125. Register 137 Field Descriptions
Bit
15-13
12-8
7-5
Field
Type
R/W
R/W
R/W
R/W
Reset
0h
Description
0
Must write 0
LANE_ID5
0
0h
These bits determine the lane 5 ID value.
Must write 0
0h
4-0
LANE_ID6
0h
These bits determine the lane 6 ID value.
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147
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12.2.1.21 Register 138 (address = 8Ah)
图 172. Register 138
15
0
14
0
13
0
12
11
10
9
1
8
0
LANE_ID7
R/W-0h
R/W-0h
R/W-0h
R/W-0h
7
0
6
0
5
0
4
3
2
LANE_ID8
R/W-0h
R/W-0h
R/W-0h
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
表 126. Register 138 Field Descriptions
Bit
15-13
12-8
7-5
Field
Type
R/W
R/W
R/W
R/W
Reset
0h
Description
0
Must write 0
LANE_ID7
0
0h
These bits determine the lane 7 ID value.
Must write 0
0h
4-0
LANE_ID8
0h
These bits determine the lane 8 ID value.
148
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ZHCSDS3C –MAY 2015–REVISED APRIL 2018
13 器件和文档支持
13.1 文档支持
13.1.1 相关文档
《CDCE72010 数据表》,SCAS858
《CDCM7005 数据表》,SCAS793
《LMK048X 数据表》,SNAS605
《SN74AUP1T04 数据表》,SCES800
《高速时钟数据转换器》,SLYT075
13.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
13.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
13.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
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14 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请参阅左侧的导航栏。
150
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ADS52J90ZZE
ACTIVE
NFBGA
ZZE
198
160
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
ADS52J90
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
ADS52J90ZZE
ZZE
NFBGA
198
160
10 x 16
150
315 135.9 7620 19.2
13.5 10.35
Pack Materials-Page 1
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
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邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022,德州仪器 (TI) 公司
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