ADS52J91 [TI]

具有 LVDS 和 JESD 输出的 10 位、12 位和 14 位多通道低功耗 ADC;
ADS52J91
型号: ADS52J91
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有 LVDS 和 JESD 输出的 10 位、12 位和 14 位多通道低功耗 ADC

文件: 总5页 (文件大小:667K)
中文:  中文翻译
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ADS52J91  
ZHCSOY2 SEPTEMBER 2021  
ADS52J91 LVDSJESD 输出10 位、12 位、14 位多通道低功耗  
ADC  
1 特性  
3 说明  
16 ADC可配置为816 32 路  
输入进行转换  
• 最ADC 转换速率:  
10 位模式下125MSPS  
12 位模式下100MSPS  
14 位模式下65MSPS  
• 电源1.2 V/1.8 V  
ADS52J91 是一款低功耗、高性能、16 通道的模数转  
换器 (ADC)。每个 ADC 10 位模式下的转换速率可  
高达 125MSPSADC 分辨率越高最高转换速率越  
低。  
该器件可配置为接受 816 32 个输入。在 32 位模  
式下每个 ADC 以值为 ADC 转换速率一半的有效采  
样率对两个不同输入交替进行采样并转换。在 8 位输  
入模式下两个 ADC 以交错方式对同一输入进行转  
这种情况下的有效采样率为 ADC 转换速率的 2  
倍。ADC 设计为根据转换速率调整其功耗。  
• 差分或单端输入时钟  
• 信噪(SNR):  
10 位模式下61dBFS  
12 位模式下69dBFS  
14 位模式下73.5dBFS  
器件信息  
封装尺寸标称值)  
器件型号  
ADS52J91  
封装  
125MSPS 时的功耗48.6mW/通道  
16 ADC 经配置可进行下列转换:  
NFBGA (198)  
9.00mm × 15.00mm  
8 路输入采样率ADC 转换速率2 倍  
16 路输入采样率ADC 转换速率相同  
32 路输入采样率ADC 转换速率的一半  
• 支10/12/14/16 倍串行化1Gbps LVDS 接口  
5Gbps JESD 接口:  
JESD204B 01 2  
– 每JESD 信道包24 8 个通道  
• 封装NFBGA-198 (9mm × 15mm)  
2 应用  
超声波成像  
• 便携式仪表  
• 声纳和雷达  
高速多通道数据采集  
简化版原理图  
本文档旨在为方便起见提供有TI 产品中文版本的信息以确认产品的概要。有关适用的官方英文版本的最新信息请访问  
www.ti.com其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前请务必参考最新版本的英文版本。  
English Data Sheet: SBASAF8  
ADS52J91  
ZHCSOY2 SEPTEMBER 2021  
www.ti.com.cn  
4 Revision History  
以前版本的页码可能与当前版本的页码不同  
DATE  
REVISION  
NOTES  
September 2021  
*
Initial Release  
5 说明)  
ADC 输出会进行串行化并与帧时钟和高速位时钟一起通过低压差分信(LVDS) 接口输出。  
该器件还具有一个可选JESD204B 接口同时可16 输入32 输入模式下工作。该接口的运行速率最高可达  
5Gbps  
该器件采用间距0.8mm 9mm × 15mm NFBGA-198 封装  
Copyright © 2021 Texas Instruments Incorporated  
2
Submit Document Feedback  
Product Folder Links: ADS52J91  
ADS52J91  
ZHCSOY2 SEPTEMBER 2021  
www.ti.com.cn  
6 Device and Documentation Support  
6.1 Documentation Support  
6.2 Receiving Notification of Documentation Updates  
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper  
right corner, click on Alert me to register and receive a weekly digest of any product information that has  
changed. For change details, review the revision history included in any revised document.  
6.3 Support Resources  
TI E2Esupport forums are an engineer's go-to source for fast, verified answers and design help straight  
from the experts. Search existing answers or ask your own question to get the quick design help you need.  
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do  
not necessarily reflect TI's views; see TI's Terms of Use.  
6.4 Trademarks  
TI E2Eis a trademark of Texas Instruments.  
所有商标均为其各自所有者的财产。  
6.5 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
6.6 术语表  
TI 术语表  
本术语表列出并解释了术语、首字母缩略词和定义。  
7 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical packaging and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
Copyright © 2021 Texas Instruments Incorporated  
Submit Document Feedback  
3
Product Folder Links: ADS52J91  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Sep-2021  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
ADS52J91ZZE  
ACTIVE  
NFBGA  
ZZE  
198  
160  
RoHS & Green  
SNAGCU  
Level-3-260C-168 HR  
0 to 70  
ADS52J91  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
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Copyright © 2021,德州仪器 (TI) 公司  

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