ADS7862YB/2KG4 [TI]

Dual 500kHz, 12-Bit, 2 2 Channel Simultaneous Sampling; 双500kHz的12位,2个2通道同时采样
ADS7862YB/2KG4
型号: ADS7862YB/2KG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Dual 500kHz, 12-Bit, 2 2 Channel Simultaneous Sampling
双500kHz的12位,2个2通道同时采样

转换器 模数转换器
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ADS7862  
ADS7862  
®
SBAS101B JANUARY 1998 REVISED AUGUST 2005  
Dual 500kHz, 12-Bit, 2 + 2 Channel  
Simultaneous Sampling  
ANALOG-TO-DIGITAL CONVERTER  
DESCRIPTION  
FEATURES  
The ADS7862 is a dual 12-bit, 500kHz analog-to-digital  
converter (A/D) with 4 fully differential input channels grouped  
into two pairs for high speed simultaneous signal acquisition.  
Inputs to the sample-and-hold amplifiers are fully differential  
and are maintained differential to the input of the A/D con-  
verter. This provides excellent common-mode rejection of  
80dB at 50kHz, which is important in high noise environ-  
ments.  
4 INPUT CHANNELS  
FULLY DIFFERENTIAL INPUTS  
2µs TOTAL THROUGHPUT PER CHANNEL  
GUARANTEED NO MISSING CODES  
PARALLEL INTERFACE  
1MHz EFFECTIVE SAMPLING RATE  
LOW POWER: 40mW  
The ADS7862 offers parallel interface and control inputs to  
minimize software overhead. The output data for each channel  
is available as a 12-bit word. The ADS7862 is offered in an  
TQFP-32 package and is fully specified over the –40°C to  
+85°C operating range.  
APPLICATIONS  
MOTOR CONTROL  
MULTI-AXIS POSITIONING SYSTEMS  
3-PHASE POWER CONTROL  
CH A0+  
CH A0–  
SAR  
S/H  
Amp  
COMP  
Interface  
CDAC  
A0  
CLOCK  
CS  
CH A1+  
Conversion  
and  
CH A1–  
MUX  
RD  
Control  
BUSY  
CONVST  
REFIN  
Internal  
2.5V  
REFOUT  
Reference  
Output  
Registers  
Data Output  
CH B0+  
CH B0–  
12  
S/H  
Amp  
COMP  
CDAC  
CH B1+  
CH B1–  
MUX  
SAR  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 1998-2005, Texas Instruments Incorporated  
www.ti.com  
ORDERING INFORMATION(1)  
MAXIMUM  
RELATIVE  
ACCURACY  
(LSB)  
MAXIMUM  
GAIN  
ERROR  
(%)  
SPECIFICATION  
TEMPERATURE  
RANGE  
PACKAGE  
DESIGNATOR  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
PACKAGE  
ADS7862Y  
ADS7862Y  
ADS7862YB  
ADS7862YB  
±2  
"
±1  
"
±0.75  
TQFP-32  
PBS  
"
PBS  
"
40°C to +85°C  
ADS7862Y/250  
ADS7862Y/2K5  
ADS7862YB/250  
ADS7862YB/2K5  
Tape and Reel, 250  
Tape and Reel, 2500  
Tape and Reel, 250  
Tape and Reel, 2500  
"
±0.5  
"
"
"
TQFP-32  
40°C to +85°C  
"
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS  
PIN DESCRIPTIONS  
PIN  
NAME  
DESCRIPTION  
Analog Inputs to AGND: Any Channel Input ........ 0.3V to (+VD + 0.3V)  
REFIN ............................. 0.3V to (+VD + 0.3V)  
Digital Inputs to DGND .......................................... 0.3V to (+VD + 0.3V)  
Ground Voltage Differences: AGND, DGND ................................... ±0.3V  
+VD to AGND ......................... 0.3V to +6V  
1
2
REFIN  
Reference Input  
REFOUT  
+2.5V Reference Output. Connect directly to REFIN  
(pin 1) when using internal reference.  
Power Dissipation .......................................................................... 325mW  
Maximum Junction Temperature ................................................... +150°C  
Operating Temperature Range ........................................40°C to +85°C  
Storage Temperature Range .........................................65°C to +150°C  
Lead Temperature (soldering, 10s) ............................................... +300°C  
3
4
AGND  
+VA  
Analog Ground  
Analog Power Supply, +5VDC. Connect directly to  
digital power supply (pin 24). Decouple to analog  
ground with a 0.1µF ceramic capacitor and a 10µF  
tantalum capacitor.  
5
DB11  
DB10  
DB9  
DB8  
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
BUSY  
Data Bit 11, MSB  
Data Bit 10  
6
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Texas Instru-  
ments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and  
installation procedures can cause damage.  
7
Data Bit 9  
8
Data Bit 8  
9
Data Bit 7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
Data Bit 6  
Data Bit 5  
Data Bit 4  
Data Bit 3  
ESD damage can range from subtle performance degradation to  
completedevicefailure.Precisionintegratedcircuitsmaybemore  
susceptible to damage because very small parametric changes  
could cause the device not to meet its published specifications.  
Data Bit 2  
Data Bit 1  
Data Bit 0, LSB  
HIGH when a conversion is in progress.  
CONVST Convert Start  
CLOCK  
An external CMOS-compatible clock can be applied to  
PIN CONFIGURATION  
the CLOCK input to synchronize the conversion pro-  
cess to an external source. The CLOCK pin controls  
Top View  
the sampling rate by the equation: CLOCK 16 fSAMPLE  
.
20  
21  
CS  
RD  
Chip Select  
Synchronization pulse for the parallel output. During a  
Read operation, the first falling edge selects the A  
register and the second edge selects the B register,  
A0, then controls whether input 0 or input 1 is read.  
32 31 30 29 28 27 26 25  
1
2
3
4
5
6
7
8
24 +VD  
REFIN  
REFOUT  
AGND  
+VA  
22  
A0  
On the falling edge of Convert Start, when A0 is LOW  
Channel A0 and Channel B0 are converted and when  
it is HIGH, Channel A1 and Channel B1 are converted.  
During a Read operation, the first falling edge selects  
the A register and the second edge selects the B of RD  
register, A0, then controls whether input 0 or input 1 is  
read.  
23 DGND  
22 A0  
21 RD  
ADS7862  
20 CS  
DB11  
DB10  
DB9  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
DGND  
+VD  
Digital Ground. Connect directly to analog ground (pin 3).  
Digital Power Supply, +5VDC  
19 CLOCK  
18 CONVST  
17 BUSY  
CH B1+ Non-Inverting Input Channel B1  
CH B1Inverting Input Channel B1  
CH B0+ Non-Inverting Input Channel B0  
DB8  
CH B0–  
CH A1–  
Inverting Input Channel B0  
Inverting Input Channel A1  
9
10 11 12 13 14 15 16  
CH A1+ Non-Inverting Input Channel A1  
CH A0Inverting Input Channel A0  
CH A0+ Non-Inverting Input Channel A0  
ADS7862  
2
SBAS101B  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
All specifications TMIN to TMAX, +VA = +VD = +5V, VREF = internal +2.5V and fCLK = 8MHz, fSAMPLE = 500kHz, unless otherwise noted.  
ADS7862Y  
TYP  
ADS7862YB  
TYP  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
MAX  
MIN  
MAX  
UNITS  
12  
Bits  
ANALOG INPUT  
Input Voltage Range-Bipolar  
Absolute Input Range  
VCENTER = Internal VREF at 2.5V  
VREF  
0.3  
0.3  
+VREF  
VCC + 0.3  
VCC + 0.3  
V
V
V
+IN  
IN  
Input Capacitance  
Input Leakage Current  
15  
±1  
pF  
µA  
CLK = GND  
SYSTEM PERFORMANCE  
No Missing Codes  
Integral Linearity  
Integral Linearity Match  
Differential Linearity  
Bipolar Offset Error  
Bipolar Offset Error Match  
Positive Gain Error  
Positive Gain Error Match  
Negative Gain Error  
Negative Gain Error Match  
Common-Mode Rejection Ratio  
12  
Bits  
LSB  
LSB  
LSB  
LSB  
LSB  
% of FSR  
LSB  
% of FSR  
LSB  
±0.75  
0.5  
±0.75  
±0.75  
±2  
1
±0.5  
±0.5  
±0.5  
±1  
±1  
±2  
2
±0.5  
1
±0.5  
1
Referenced to REFIN  
Referenced to REFIN  
Referenced to REFIN  
At DC  
±3  
3
±0.75  
2
±0.75  
2
±0.15  
±0.15  
±0.1  
±0.1  
80  
80  
120  
±0.5  
dB  
dB  
µVRMS  
LSB  
V
IN = ±1.25VPP at 50kHz  
Noise  
Power Supply Rejection Ratio  
±2  
SAMPLING DYNAMICS  
Conversion Time per A/D  
Acquisition Time  
1.75  
0.25  
µs  
µs  
Throughput Rate  
Aperture Delay  
Aperture Delay Matching  
Aperture Jitter  
Small-Signal Bandwidth  
500  
kHz  
ns  
ps  
ps  
MHz  
3.5  
100  
50  
40  
DYNAMIC CHARACTERISTICS  
Total Harmonic Distortion  
SINAD  
Spurious Free Dynamic Range  
Channel-to-Channel Isolation  
V
V
V
V
IN = ±2.5VPP at 100kHz  
IN = ±2.5VPP at 100kHz  
IN = ±2.5VPP at 100kHz  
IN = ±2.5VPP at 100kHz  
75  
71  
78  
dB  
dB  
dB  
dB  
80  
VOLTAGE REFERENCE  
Internal  
Internal Drift  
2.475  
2.5  
±25  
50  
2.525  
V
ppm/°C  
µVPP  
mA  
mV/µA  
dB  
V
µA  
pF  
Internal Noise  
Internal Source Current  
Internal Load Rejection  
Internal PSRR  
External Voltage Range  
Input Current  
2
0.005  
65  
2.5  
0.05  
5
1.2  
2.6  
1
Input Capacitance  
DIGITAL INPUT/OUTPUT  
Logic Family  
Logic Levels: VIH  
VIL  
VOH  
VOL  
External Clock  
Data Format  
CMOS  
IIH = +5µA  
IIL = +5µA  
IOH = 500µA  
IOL = 500µA  
3.0  
0.3  
3.5  
+VDD + 0.3  
0.8  
V
V
V
V
MHz  
0.4  
8
0.2  
Binary Twos Complement  
POWER SUPPLY REQUIREMENTS  
Power Supply Voltage, +V  
Quiescent Current, +VA  
4.75  
5
5
25  
5.25  
8
40  
V
mA  
mW  
Power Dissipation  
Specifications same as ADS7862Y.  
ADS7862  
SBAS101B  
3
www.ti.com  
BASIC OPERATION  
1
2
3
4
5
6
7
8
REFIN  
REFOUT  
AGND  
+VA  
+VD 24  
DGND 23  
A0 22  
+5V  
Analog Supply  
Address Select  
Read Input  
RD 21  
+
+
ADS7862Y  
10µF  
0.1µF  
DB11  
DB10  
DB9  
CS 20  
Chip Select  
CLOCK 19  
CONVST 18  
BUSY 17  
Clock Input  
Conversion Start  
Busy Output  
DB8  
ADS7862  
4
SBAS101B  
www.ti.com  
TYPICAL PERFORMANCE CHARACTERISTICS  
At TA = +25°C, +VA = +VD = +5V, VREF = internal +2.5V and fCLK = 8MHz, fSAMPLE = 500kHz, unless otherwise noted.  
FREQUENCY SPECTRUM  
(4096 Point FFT; fIN = 99.9kHz, 0.5dB)  
FREQUENCY SPECTRUM  
(4096 Point FFT; fIN = 199.9kHz, 0.5dB)  
0
20  
0
20  
40  
40  
60  
60  
80  
80  
100  
120  
100  
120  
0
62.5  
125  
187.5  
250  
0
62.5  
125  
187.5  
250  
Frequency (kHz)  
Frequency (kHz)  
SIGNAL-TO-NOISE RATIO AND  
SIGNAL-TO-(NOISE+DISTORTION)  
vs INPUT FREQUENCY  
CHANGE IN SIGNAL-TO-NOISE RATIO  
AND SIGNAL-TO-(NOISE+DISTORTION)  
vs TEMPERATURE  
76  
74  
72  
70  
68  
66  
64  
0.25  
0.2  
SNR  
0.15  
0.1  
SINAD  
0.05  
0
SINAD  
0.05  
0.1  
0.15  
0.2  
0.25  
SNR  
1k  
10k  
100k  
1M  
40  
25  
85  
Input Frequency (Hz)  
Temperature (°C)  
CHANGE IN POSITIVE GAIN MATCH  
vs TEMPERATURE  
(Maximum Deviation for All Four Channels)  
CHANGE IN SPURIOUS FREE DYNAMIC RANGE  
AND TOTAL HARMONIC DISTORTION  
vs TEMPERATURE  
0.65  
0.45  
0.65  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.45  
SFDR  
0.25  
0.25  
0.05  
0.05  
0.15  
0.35  
0.55  
0.75  
0.15  
0.35  
0.55  
0.75  
THD  
40  
25  
85  
40  
25  
85  
Temperature (°C)  
150  
Temperature (°C)  
ADS7862  
SBAS101B  
5
www.ti.com  
TYPICAL PERFORMANCE CHARACTERISTICS (Cont.)  
At TA = +25°C, +VA = +VD = +5V, VREF = internal +2.5V and fCLK = 8MHz, fSAMPLE = 500kHz, unless otherwise noted.  
CHANGE IN NEGATIVE GAIN MATCH  
CHANGE IN REFERENCE VOLTAGE  
vs TEMPERATURE  
vs TEMPERATURE  
(Maximum Deviation for All Four Channels)  
2.51  
2.505  
2.5  
0.2  
0.18  
0.16  
0.14  
0.12  
0.1  
2.495  
2.49  
0.08  
0.06  
0.04  
0.02  
0
2.485  
40  
25  
85  
150  
150  
7FF  
40  
25  
Temperature (°C)  
85  
150  
150  
85  
Temperature (°C)  
CHANGE IN BIPOLAR ZERO  
vs TEMPERATURE  
CHANGE IN BPZ MATCH vs TEMPERATURE  
1
0.75  
0.5  
0.75  
0.5  
B Channel  
0.25  
0
0.25  
0.5  
0.75  
A Channel  
0.25  
0
40  
25  
85  
Temperature (°C)  
40  
25  
Temperature (°C)  
85  
INTEGRAL LINEARITY ERROR vs CODE  
Typical of All Four Channels  
CHANGE IN CMRR vs TEMPERATURE  
1
86  
85  
84  
83  
82  
81  
80  
79  
78  
0.8  
0.6  
0.4  
0.2  
0
0.2  
0.4  
0.6  
0.8  
1  
800  
000  
40  
5  
25  
55  
Hex BTC Code  
Temperature (°C)  
ADS7862  
6
SBAS101B  
www.ti.com  
TYPICAL PERFORMANCE CHARACTERISTICS (Cont.)  
At TA = +25°C, +VA = +VD = +5V, VREF = internal +2.5V and fCLK = 8MHz, fSAMPLE = 500kHz, unless otherwise noted.  
DIFFERENTIAL LINEARITY ERROR vs CODE  
Typical of All Four Channels  
INTEGRAL LINEARITY ERROR vs TEMPERATURE  
Positive ILE  
1
0.75  
0.5  
0.6  
0.4  
0.2  
0.25  
0
0
0.2  
0.4  
0.6  
0.8  
0.25  
0.5  
0.75  
1  
Negative ILE  
800  
000  
7FF  
40  
25  
85  
150  
7FF  
150  
Hex BTC Code  
Temperature (°C)  
INTEGRAL LINEARITY ERROR MATCH  
vs CODE CHANNEL A0/CHANNEL A1  
(Same Converter, Different Channels)  
DIFFERENTIAL LINEARITY ERROR  
vs TEMPERATURE  
0.8  
0.6  
0.25  
0.2  
Positive DLE  
0.15  
0.1  
0.4  
0.2  
0.05  
0
0
0.05  
0.1  
0.15  
0.2  
0.25  
0.2  
0.4  
0.6  
0.8  
Negative DLE  
40  
25  
85  
150  
800  
000  
Temperature (°C)  
Hex BTC Code  
INTEGRAL LINEARITY ERROR MATCH  
vs TEMPERATURE  
CHANNEL A0/CHANNEL B0  
(Different Converter, Different Channels)  
INTEGRAL LINEARITY ERROR MATCH  
vs CODE CHANNEL A0/CHANNEL B1  
(Different Converter, Different Channels)  
0.25  
0.2  
0.19  
0.18  
0.17  
0.16  
0.15  
0.14  
0.13  
0.12  
0.15  
0.1  
0.05  
0
0.05  
0.1  
0.15  
0.2  
0.25  
40  
25  
85  
800  
000  
7FF  
Temperature (°C)  
Hex BTC Code  
ADS7862  
SBAS101B  
7
www.ti.com  
REFERENCE  
INTRODUCTION  
Under normal operation, the REFOUT pin (pin 2) should be  
directly connected to the REFIN pin (pin 1) to provide an  
internal +2.5V reference to the ADS7862. The ADS7862  
can operate, however, with an external reference in the range  
of 1.2V to 2.6V for a corresponding full-scale range of 2.4V  
to 5.2V.  
The ADS7862 is a high speed, low power, dual 12-bit A/D  
converter that operates from a single +5V supply. The input  
channels are fully differential with a typical common-mode  
rejection of 80dB. The part contains dual 2µs successive  
approximation A/Ds, two differential sample-and-hold am-  
plifiers, an internal +2.5V reference with REFIN and REFOUT  
pins and a high speed parallel interface. There are four  
analog inputs that are grouped into two channels (A and B)  
selected by the A0 input (A0 LOW selects Channels A0 and  
B0, while A0 HIGH selects Channels A1 and B1). Each  
A/D converter has two inputs (A0 and A1 and B0 and B1)  
that can be sampled and converted simultaneously, thus  
preserving the relative phase information of the signals on  
both analog inputs. The part accepts an analog input voltage  
in the range of –VREF to +VREF, centered around the internal  
+2.5V reference. The part will also accept bipolar input  
ranges when a level shift circuit is used at the front end (see  
Figure 7).  
The internal reference of the ADS7862 is double-buffered.  
If the internal reference is used to drive an external load, a  
buffer is provided between the reference and the load ap-  
plied to pin 2 (the internal reference can typically source  
2mA of current—load capacitance should not exceed 100pF).  
If an external reference is used, the second buffer provides  
isolation between the external reference and the CDAC.  
This buffer is also used to recharge all of the capacitors of  
both CDACs during conversion.  
ANALOG INPUT  
The analog input is bipolar and fully differential. There are  
two general methods of driving the analog input of the  
ADS7862: single-ended or differential (see Figures 1 and 2).  
When the input is single-ended, the –IN input is held at the  
common-mode voltage. The +IN input swings around the  
same common voltage and the peak-to-peak amplitude is the  
(common-mode +VREF) and the (common-mode –VREF).  
The value of VREF determines the range over which the  
common-mode voltage may vary (see Figure 3).  
A conversion is initiated on the ADS7862 by bringing the  
CONVST pin LOW for a minimum of 15ns. CONVST  
LOW places both sample-and-hold amplifiers in the hold  
state simultaneously and the conversion process is started on  
both channels. The BUSY output will then go HIGH and  
remain HIGH for the duration of the conversion cycle.  
Depending on the status of the A0 pin, the data will either  
reflect a conversion of Channel 0 (A0 LOW) or Channel 1  
(A0 HIGH). The data can be read from the parallel output  
bus following the conversion by bringing both RD and CS  
LOW.  
When the input is differential, the amplitude of the input is the  
difference between the +IN and –IN input, or: (+IN) – (–IN).  
The peak-to-peak amplitude of each input is ±1/2VREF around  
this common voltage. However, since the inputs are 180° out  
of phase, the peak-to-peak amplitude of the differential voltage  
is +VREF to –VREF. The value of VREF also determines the  
range of the voltage that may be common to both inputs (see  
Figure 4).  
Conversion time for the ADS7862 is 1.75µs when an 8MHz  
external clock is used. The corresponding acquisition time is  
0.25µs. To achieve maximum output rate (500kHz), the read  
function can be performed immediately at the start of the  
next conversion.  
NOTE: This mode of operation is described in more detail  
in the Timing and Control section of this data sheet.  
SAMPLE-AND-HOLD SECTION  
VREF to +VREF  
ADS7862  
The sample-and-hold amplifiers on the ADS7862 allow the  
A/Ds to accurately convert an input sine wave of full-scale  
amplitude to 12-bit accuracy. The input bandwidth of the  
sample-and-hold is greater than the Nyquist rate (Nyquist  
equals one-half of the sampling rate) of the A/D even when  
the A/D is operated at its maximum throughput rate of  
500kHz. The typical small-signal bandwidth of the sample-  
and-hold amplifiers is 40MHz.  
peak-to-peak  
Common  
Voltage  
Single-Ended Input  
VREF  
peak-to-peak  
ADS7862  
Common  
VREF  
Typical aperture delay time or the time it takes for the  
ADS7862 to switch from the sample to the hold mode  
following the CONVST pulse is 3.5ns. The average delta of  
repeated aperture delay values is typically 50ps (also known  
as aperture jitter). These specifications reflect the ability of  
the ADS7862 to capture AC input signals accurately at the  
exact same moment in time.  
Voltage  
peak-to-peak  
Differential Input  
FIGURE 1. Methods of Driving the ADS7862 Single-Ended  
or Differential.  
ADS7862  
8
SBAS101B  
www.ti.com  
+IN  
CM +VREF  
+VREF  
CM Voltage  
IN = CM Voltage  
VREF  
t
CM VREF  
Single-Ended Inputs  
+IN  
+VREF  
CM +1/2VREF  
CM Voltage  
VREF  
IN  
t
CM 1/2VREF  
Differential Inputs  
(IN+) + (IN)  
NOTES: Common-Mode Voltage (Differential Mode) =  
Common-Mode Voltage (Single-Ended Mode) = IN.  
2
The maximum differential voltage between +IN and IN of the ADS7862 is VREF. See Figures 3 and 4 for a further  
explanation of the common voltage range for single-ended and differential inputs.  
FIGURE 2. Using the ADS7862 in the Single-Ended and Differential Input Modes.  
5
4
5
4
VCC = 5V  
4.7  
VCC = 5V  
4.1  
4.05  
3
3
2.7  
2.3  
Single-Ended Input  
Differential Input  
2
2
0.90  
1
1
0.9  
0.3  
0
0
1  
1  
1.2  
2.52.6  
3.0  
1.2  
2.6  
1.0  
1.5  
2.0  
1.0  
1.5  
2.0  
2.5  
3.0  
VREF (V)  
VREF (V)  
FIGURE 3. Single-Ended Input: Common-Mode Voltage  
Range vs VREF  
FIGURE 4. Differential Input: Common-Mode Voltage  
Range vs VREF  
.
.
In each case, care should be taken to ensure that the output  
impedance of the sources driving the +IN and –IN inputs are  
matched. Otherwise, this may result in offset error, which  
will change with both temperature and input voltage.  
capacitance has been fully charged, there is no further input  
current. The source of the analog input voltage must be able  
to charge the input capacitance (15pF) to a 12-bit settling  
level within 2 clock cycles. When the converter goes into the  
hold mode, the input impedance is greater than 1G.  
The input current on the analog inputs depend on a number  
of factors: sample rate, input voltage, and source impedance.  
Essentially, the current into the ADS7862 charges the inter-  
nal capacitor array during the sampling period. After this  
Care must be taken regarding the absolute analog input  
voltage. The +IN input should always remain within the  
range of GND – 300mV to VDD + 0.3V.  
ADS7862  
SBAS101B  
9
www.ti.com  
TRANSITION NOISE  
1.4V  
Figure 5 shows a histogram plot for the ADS7862 following  
8,000 conversions of a DC input. The DC input was set at  
output code 2046. All but one of the conversions had an  
output code result of 2046 (one of the conversions resulted  
in an output of 2047). The histogram reveals the excellent  
noise performance of the ADS7862.  
3kΩ  
DATA  
Test Point  
100pF  
CLOAD  
8000  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
VOH  
VOL  
DATA  
tR  
tF  
Voltage Waveforms for DATA Rise and Fall Times tR, and tF.  
FIGURE 6. Test Circuits for Timing Specifications.  
2044  
2045  
2046  
2047  
2048  
Code (decimal)  
R1  
FIGURE 5. Histogram of 8,000 Conversions of a DC Input.  
4kΩ  
+IN  
OPA132  
20kΩ  
BIPOLAR INPUTS  
Bipolar Input  
IN  
The differential inputs of the ADS7862 were designed to  
accept bipolar inputs (–VREF and +VREF) around the internal  
reference voltage (2.5V), which corresponds to a 0V to 5V  
input range with a 2.5V reference. By using a simple op amp  
circuit featuring a single amplifier and four external resis-  
tors, the ADS7862 can be configured to except bipolar  
inputs. The conventional ±2.5V, ±5V, and ±10V input  
ranges can be interfaced to the ADS7862 using the resistor  
values shown in Figure 7.  
ADS7862  
R2  
REFOUT (pin 2)  
2.5V  
BIPOLAR INPUT  
R1  
R2  
±10V  
±5V  
±2.5V  
1kΩ  
2kΩ  
4kΩ  
5kΩ  
10kΩ  
20kΩ  
FIGURE 7. Level Shift Circuit for Bipolar Input Ranges.  
TIMING AND CONTROL  
The ADS7862 uses an external clock (CLOCK, pin 19)  
which controls the conversion rate of the CDAC. With an  
8MHz external clock, the A/D sampling rate is 500kHz  
which corresponds to a 2µs maximum throughput time.  
Three timing diagrams are used to explain the operation of  
the ADS7862. Figure 8 shows the timing relationship be-  
tween the CLOCK, CONVST (pin 18) and the conversion  
tCKP  
tCKH  
tCKL  
CLOCK  
t3  
CONVST  
CONVERSION  
MODE  
SAMPLE  
HOLD  
CONVERT  
NOTE: The ADS7862 will switch from the sample to the hold mode the instant CONVST goes LOW regardless of  
the state of the external clock. The conversion process is initiated with the first rising edge of the external clock  
following CONVST going LOW.  
FIGURE 8. Conversion Mode.  
ADS7862  
10  
SBAS101B  
www.ti.com  
mode. Figure 9, in conjunction with Table I, shows the basic  
read/write functions of the ADS7862 and highlights all of  
the timing specifications. Figure 10 shows a more detailed  
description of initiating a conversion using CONVST. Fig-  
ure 11 illustrates three consecutive conversions and, with the  
accompanying text, describes all of the read and write  
capabilities of the ADS7862.  
first followed by Channel 1. Channel 1 can be converted  
prior to Channel 0 if the user wishes by simply starting the  
conversion process with the A0 pin at logic HIGH (Channel  
1) followed by logic LOW (Channel 0).  
TIMING SPECIFICATIONS  
SYMBOL  
DESCRIPTION  
MIN  
TYP  
MAX  
UNITS  
DESCRIPTION  
ANALOG INPUT  
tCONV  
tACQ  
tCKP  
tCKL  
tCKH  
t1  
Conversion Time  
Acquisition Time  
1.75  
0.25  
5000  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
(1)  
DIGITAL OUTPUT  
BINARY TWOS COMPLEMENT  
Full-Scale Input Span  
VREF to +VREF  
Clock Period  
125  
40  
40  
0
Least Significant  
Bit (LSB)  
(VREF to +VREF)/4096(2)  
Clock LOW  
BINARY CODE  
HEX CODE  
Clock HIGH  
+Full Scale  
Midscale  
4.99878V  
2.5V  
0111 1111 1111  
0000 0000 0000  
1111 1111 1111  
1000 0000 0000  
7FF  
000  
FFF  
800  
CS to RD Setup Time  
CS to RD Hold Time  
t2  
0
t3  
CONVST LOW  
15  
30  
Midscale 1 LSB  
Full Scale  
2.49878V  
0V  
t4  
RD Pulse Width  
t5  
RD to Valid Data (Bus Access)  
RD to HI-Z Delay (Bus Relinquish)  
Time Between Conversion Reads  
Address Setup Time  
16  
10  
25  
20  
NOTES: (1) VREF to +VREF around VREF. With a 2.5V reference, this corre-  
sponds to a 0V to 5V input span. (2) 1.22mV with a 2.5V reference.  
t6  
t7  
40  
250  
20  
t8  
TABLE I. Ideal Input Voltages and Output Codes.  
t9  
CONVST HIGH  
t10  
t11  
t12  
t13  
tF  
Address Hold Time  
20  
CONVST to BUSY Propagation Delay  
CONVST LOW Prior to CLOCK Rising Edge  
CONVST LOW After CLOCK Rising Edge  
Data Fall Time  
30  
The Figure 11 timing diagram can be divided into three  
sections: (a) initiating a conversion (n – 2), (b) starting a  
second conversion (n – 1) while reading the data output from  
the previous conversion (n – 2), and (c) starting a third  
conversion (n) while reading both previous conversions  
(n – 2 and n – 1). In this sequence, Channel 0 is converted  
10  
5
13  
20  
25  
30  
tR  
Data Rise Time  
CLOCK  
1
2
3
4
5
14  
15  
16  
1
2
3
4
5
14  
15  
16  
tCONV  
tACQ  
t12 t13  
CONVST  
BUSY  
A0  
t3  
t9  
t11  
Conversion n  
Conversion n + 1  
t10  
t8  
CS  
t1  
t2  
t7  
RD  
t4  
t5  
t6  
DATA  
CHA1  
CHB1  
CHA0  
CHB0  
Conversion n 1 Results  
Conversion n Results  
FIGURE 9. Reading and Writing to the ADS7862 During the Same Cycle.  
ADS7862  
SBAS101B  
11  
www.ti.com  
tCKP  
125ns  
CLOCK  
Cycle 1  
Cycle 2  
10ns  
10ns  
5ns  
5ns  
B
A
C
CONVST  
NOTE: All CONVST commands which occur more than 10ns before the rising edge of cycle 1of the external clock  
(Region A) will initiate a conversion on the rising edge of cycle 1. All CONVST commands which occur 5ns after  
the rising edge of cycle 1or 10ns before the rising edge of cycle 2 (Region B) will initiate a conversion on the  
rising edge of cycle 2. All CONVST commands which occur 5ns after the rising edge of cycle 2(Region C) will  
initiate a conversion on the rising edge of the next clock period. The CONVST pin should never be switched from  
HIGH to LOW in the region 10ns prior to the rising edge of the CLOCK and 5ns after the rising edge (gray areas). If  
CONVST is toggled in this gray area, the conversion could begin on either the same rising edge of the CLOCK or  
the following edge.  
FIGURE 10. Timing Between CLOCK and CONVST to Start a Conversion.  
SECTION A  
SECTION B  
SECTION C  
1
16  
1
16  
1
CLOCK  
CONVST  
A0  
min 250ns  
min 250ns  
A0 = 0 Conversion of Ch0  
A0 = 1 Conversion of Ch1  
A0 = 0 Conversion of Ch0  
A0 Selects Between  
Ch0 and Ch1 at Output  
1st RD After CONVST ChA at Output  
2nd RD After CONVST ChB at Output  
RD  
CS  
4 Output-Register  
CS Needed Only During Reading  
High Data Level Output Active  
Data of Ch0 Still Stored  
Low Data Level Tri-state of Output  
DATA  
ChA0 ChB0  
ChA1 ChB1 ChA0 ChB0  
Conversion of Ch0  
Conversion of Ch1  
Conversion of Ch0  
BUSY  
TIME  
0
1µ  
2µ  
3µ  
4µ  
5µ  
Time (seconds)  
FIGURE 11. ADS7862 Timing Diagram Showing Complete Functionality.  
ADS7862  
12  
SBAS101B  
www.ti.com  
SECTION A  
output data should not be read 125ns prior to the falling edge  
of CONVST and 10ns after the falling edge. Any other  
combination of CS and RD will tri-state the parallel output.  
Valid conversion data can be read on pins 5 through 16  
(MSB–LSB). Refer to Table I for ideal output codes.  
Conversions are initiated by bringing the CONVST pin (pin  
18) LOW for a minimum of 5ns (after the 5ns minimum  
requirement has been met, the CONVST pin can be brought  
HIGH). The ADS7862 will switch from the sample to the  
hold mode on the falling edge of the CONVST command.  
Following the first rising edge of the external clock after a  
CONVST LOW, the ADS7862 will begin conversion (this  
first rising edge of the external clock represents the start of  
clock cycle one; the ADS7862 requires sixteen cycles to  
complete a conversion). The input channel is also latched in  
at this point in time. The A0 input (pin 22) must be selected  
250ns prior to the CONVST pin going LOW so that the  
correct address will be selected prior to conversion. The  
BUSY output will go HIGH immediately following CONVST  
going LOW. BUSY will stay HIGH through the conversion  
process and return LOW when the conversion has ended.  
After CONVST has remained LOW for the minimum time,  
the ADS7862 will switch from the hold mode to the conver-  
sion mode synchronous to the next rising edge of the  
external clock and conversion ‘n – 2’ will begin. Both RD  
(pin 21) and CS (pin 20) can be HIGH during and before a  
conversion. However, they must both be LOW to enable the  
output bus and read data out.  
In applications where multiple devices are present on the  
data bus, care should be taken to ensure that the signal  
applied to RD (pin 21) is toggled only when the target device  
is properly chip-selected. Toggling the RD pin will advance  
the internal read pointer regardless of the state of the chip  
select, causing the output data to appear channel-swapped.  
If multiple devices share a single read enable from the host  
processor, the signal may be ORed with an address-decoded  
chip select to ensure channel data integrity. For more infor-  
mation, refer to Application Report SBAA138, Reading  
Data from the ADS7862, available for download from the TI  
website at www.ti.com.  
LAYOUT  
For optimum performance, care should be taken with the  
physical layout of the ADS7862 circuitry. This is particu-  
larly true if the CLOCK input is approaching the maximum  
throughput rate.  
The basic SAR architecture is sensitive to glitches or sudden  
changes on the power supply, reference, ground connections  
and digital inputs that occur just prior to latching the output  
of the analog comparator. Thus, driving any single conver-  
sion for an n-bit SAR converter, there are n “windows” in  
which large external transient voltages can affect the conver-  
sion result. Such glitches might originate from switching  
power supplies, nearby digital logic or high power devices.  
The degree of error in the digital output depends on the  
reference voltage, layout, and the exact timing of the exter-  
nal event. This error can change if the external event changes  
in time with respect to the CLOCK input.  
SECTION B  
The CONVST pin is switched from HIGH to LOW a second  
time to initiate conversion ‘n – 1’. Again, the address must be  
selected 250ns prior to CONVST going LOW to ensure that  
the new address is selected for conversion. Both the RD and  
CS pins are brought LOW in order to enable the parallel output  
bus with the ‘n – 2’ conversion results of Channel A0. While  
continuing to hold CS LOW, RD is held LOW for a minimum  
of 30ns which enables the output bus with the Channel A0  
results of conversion ‘n – 2’. The RD pin is toggled from  
HIGH to LOW a second time in order to enable the output bus  
with the Channel B0 results of conversion ‘n – 2’.  
With this in mind, power to the ADS7862 should be clean  
and well bypassed. A 0.1µF ceramic bypass capacitor should  
be placed as close to the device as possible. In addition, a  
1µF to 10µF capacitor is recommended. If needed, an even  
larger capacitor and a 5or 10series resistor may be used  
to low-pass filter a noisy supply. On average, the ADS7862  
draws very little current from an external reference as the  
reference voltage is internally buffered. If the reference  
voltage is external and originates from an op amp, make sure  
that it can drive the bypass capacitor or capacitors without  
oscillation. A bypass capacitor is not necessary when using  
the internal reference (tie pin 1 directly to pin 2).  
SECTION C  
CONVST is brought LOW for a third time to initiate  
conversion ‘n’ (Channel 0). While the conversion is in  
process, the results for both conversions ‘n – 2’ and ‘n – 1’  
can be read. The address pin is brought HIGH while CS and  
RD are brought LOW which enables the output bus with the  
Channel A1 results of conversion ‘n – 1’. The RD pin is  
toggled from HIGH to LOW for a second time in Section C  
and the ‘n – 1’ conversion results for Channel B1 appear at  
the output bus. The address pin (A0) is then brought LOW  
and the read process repeats itself with the most recent  
conversion results for Channel 0 (n – 2) appearing at the  
output bus.  
The AGND and DGND pins should be connected to a clean  
ground point. In all cases, this should be the ‘analog’  
ground. Avoid connections which are too close to the ground-  
ing point of a microcontroller or digital signal processor. If  
required, run a ground trace directly from the converter to  
the power supply entry point. The ideal layout will include  
an analog ground plane dedicated to the converter and  
associated analog circuitry.  
READING DATA  
The ADS7862 outputs full parallel data in Binary Two’s  
Complement data output format. The parallel output will be  
active when CS (pin 20) and RD (pin 21) are both LOW. The  
ADS7862  
SBAS101B  
13  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2010  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
ADS7862Y/250  
ADS7862Y/250G4  
ADS7862Y/2K  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
TQFP  
PBS  
PBS  
PBS  
PBS  
PBS  
PBS  
PBS  
PBS  
32  
32  
32  
32  
32  
32  
32  
32  
250  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
2000  
2000  
250  
Green (RoHS  
& no Sb/Br)  
ADS7862Y/2KG4  
ADS7862YB/250  
ADS7862YB/250G4  
ADS7862YB/2K  
ADS7862YB/2KG4  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
250  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2010  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
ADS7862Y/250  
ADS7862Y/2K  
ADS7862YB/250  
ADS7862YB/2K  
TQFP  
TQFP  
TQFP  
TQFP  
PBS  
PBS  
PBS  
PBS  
32  
32  
32  
32  
250  
2000  
250  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
7.2  
7.2  
7.2  
7.2  
7.2  
7.2  
7.2  
7.2  
1.5  
1.5  
1.5  
1.5  
12.0  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
16.0  
Q2  
Q2  
Q2  
Q2  
2000  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
ADS7862Y/250  
ADS7862Y/2K  
ADS7862YB/250  
ADS7862YB/2K  
TQFP  
TQFP  
TQFP  
TQFP  
PBS  
PBS  
PBS  
PBS  
32  
32  
32  
32  
250  
2000  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
38.0  
38.0  
2000  
Pack Materials-Page 2  
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