ADS8365IPAGG4 [TI]
16 位 250kSPS 6 通道同步采样 SAR ADC | PAG | 64 | -40 to 85;型号: | ADS8365IPAGG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 16 位 250kSPS 6 通道同步采样 SAR ADC | PAG | 64 | -40 to 85 转换器 |
文件: | 总41页 (文件大小:901K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ADS8365
www.ti.com .................................................................................................................................................... SBAS362C–AUGUST 2006–REVISED MARCH 2008
16-Bit, 250kSPS, 6-Channel, Simultaneous Sampling
SAR ANALOG-TO-DIGITAL CONVERTERS
1
FEATURES
DESCRIPTION
2
•
•
•
•
•
Six Input Channels
Fully Differential Inputs
The ADS8365 includes six, 16-bit, 250kSPS
analog-to-digital converters (ADCs) with six fully
differential input channels grouped into three pairs for
high-speed simultaneous signal acquisition. Inputs to
the sample-and-hold amplifiers are fully differential
and are maintained differential to the input of the
Six Independent 16-Bit ADCs
4µs Total Throughput per Channel
Low Power:
200mW in Normal Mode
5mW in Nap Mode
ADC.
This
architecture
provides
excellent
common-mode rejection of 80dB at 50kHz, which is
important in high-noise environments.
50µW in Power-Down Mode
•
TQFP-64 Package Package
The ADS8365 offers a flexible, high-speed parallel
interface with a direct address mode, a cycle, and a
FIFO mode. The output data for each channel is
available as a 16-bit word.
APPLICATIONS
•
•
•
Motor Control
Multi-Axis Positioning Systems
3-Phase Power Control
CH A0+
CDAC
CH A0-
S/H
Amp
Comp
SAR
SAR
SAR
HOLDA
CH A1+
Interface
A0
A1
A2
CDAC
CDAC
CH A1-
S/H
Amp
Comp
Comp
Conversion
and
ADD
NAP
Control
CH B0+
RD
WR
CS
CH B0-
S/H
Amp
FD
EOC
CLK
FIFO
Register
HOLDB
CH B1+
RESET
BYTE
6x
16
CDAC
CDAC
CH B1-
Comp
Comp
S/H
Amp
Data
Input/Output
CH C0+
CH C0-
S/H
Amp
HOLDC
CH C1+
CDAC
CH C1-
Comp
S/H
Amp
REFIN
Internal
2.5V
Reference
REFOUT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2008, Texas Instruments Incorporated
ADS8365
SBAS362C–AUGUST 2006–REVISED MARCH 2008.................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
MAXIMUM
NO
INTEGRAL MISSING
LINEARITY CODES
SPECIFIED
TEMPERATURE PACKAGE
TRANSPORT
MEDIA,
QUANTITY
ERROR
(LSB)
ERROR PACKAGE-
(LSB)
PACKAGE
DESIGNATOR
ORDERING
NUMBER
PRODUCT
LEAD
RANGE
MARKING
ADS8365IPAG
Tray, 160
ADS8365
±4
14
TQFP-64
PAG
–40°C to +85°C ADS8365AI
Tape and
Reel, 1500
ADS8365IPAGR
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
ADS8365
–0.3 to 6
UNIT
V
Supply voltage, AGND to AVDD
Supply voltage, BGND to BVDD
Analog input voltage range
–0.3 to 6
V
AGND – 0.3 to AVDD + 0.3
AGND – 0.3 to AVDD + 0.3
BGND – 0.3 to BVDD + 0.3
±0.3
V
Reference input voltage range
V
Digital input voltage range
V
Ground voltage differences, AGND to BGND
Voltage differences, BVDD to AGND
Input current to any pin except supply
Power dissipation
V
–0.3 to 6
V
–20 to 20
mA
See Dissipation Ratings Table
Operating virtual junction temperature range, TJ
Operating free-air temperature range, TA
Storage temperature range, TSTG
–40 to +150
–40 to +85
–65 to +150
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
DERATING
FACTOR ABOVE
TA ≤ +25°C
TA = +70°C
TA = +85°C
BOARD
Low-K(1)
High-K(2)
PACKAGE
PAG
RθJC
RθJA
TA = +25°C
POWER RATING
POWER RATING
POWER RATING
8.6°C/W
8.6°C/W
68.5°C/W
42.8°C/W
14.598mW/°C
23.364mW/°C
1824mW
1168mW
1869mW
949mW
PAG
2920mW
1519mW
(1) The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top
of the board.
(2) The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes, and 2-ounce copper traces on the top and bottom of the board.
2
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Product Folder Link(s): ADS8365
ADS8365
www.ti.com .................................................................................................................................................... SBAS362C–AUGUST 2006–REVISED MARCH 2008
RECOMMENDED OPERATING CONDITIONS
MIN
4.75
2.7
4.5
1.5
2.2
0
NOM
MAX
5.25
3.6
UNIT
V
Supply voltage, AVDD to AGND
Supply voltage, BVDD to BGND
5
Low-voltage levels
5V logic levels
V
5
5.5
V
Reference input voltage
2.5
2.5
2.6
V
Operating common-mode signal, –IN
Analog inputs, +IN – (–IN)
2.8
V
±VREF
+125
V
Operating junction temperature range, TJ
–40
°C
ELECTRICAL CHARACTERISTICS: 100kSPS
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 2MHz, and
fSAMPLE = 100kSPS, unless otherwise noted.
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
ANALOG INPUT
Full-scale range
FSR +IN – (–IN)
±VREF
2.8
V
V
Operating common-mode signal
Input resistance
2.2
–IN = VREF
750
25
Ω
Input capacitance
–IN = VREF
pF
nA
Ω
Input leakage current
–IN = VREF
±1
Differential input resistance
Differential input capacitance
–IN = VREF
1500
15
–IN = VREF
pF
dB
dB
MHz
At dc
84
Common-mode rejection ratio
CMRR
VIN = ±1.25VPP at 50kHz
80
Bandwidth
BW FS sinewave, –3dB
10
DC ACCURACY
Resolution
16
Bits
Bits
No missing codes
Integral linearity error
Differential nonlinearity
Bipolar offset error
Bipolar offset error match
Bipolar offset error drift
Gain error
NMC
14
INL
DNL
VOS
±1.5
±1.5
±1
±4
LSB
LSB
±2.3
1
mV
Only pair-wise matching
0.2
mV
TCVOS
0.8
ppm/°C
%FSR
%FSR
ppm/°C
µVrms
dB
GERR Referenced to VREF
Only pair-wise matching
±0.05
0.005
2
±0.25
0.05
Gain error match
Gain error drift
TCGERR
Noise
60
Power-supply rejection ratio
SAMPLING DYNAMICS
Conversion time per ADC
Acquisition time
PSRR 4.75V < AVDD < 5.25V
–87
tCONV 50kHz ≤ fCLK ≤ 5MHz
3.2
320
5
µs
ns
tAQ fCLK = 5MHz
800
Aperture delay
ns
Aperture delay matching
Aperture jitter
100
50
ps
ps
Clock frequency
0.05
5
MHz
(1) All typical values are at +25°C.
Copyright © 2006–2008, Texas Instruments Incorporated
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ADS8365
SBAS362C–AUGUST 2006–REVISED MARCH 2008.................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS: 100kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 2MHz, and
fSAMPLE = 100kSPS, unless otherwise noted.
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
AC ACCURACY
Total harmonic distortion
Spurious-free dynamic range
Signal-to-noise ratio
THD VIN = ±2.5VPP at 50kHz
–94
95
dB
dB
dB
dB
dB
Bits
SFDR VIN = ±2.5VPP at 50kHz
SNR VIN = ±2.5VPP at 10kHz
SINAD VIN = ±2.5VPP at 10kHz
88
Signal-to-noise + distortion
Channel-to-channel isolation
Effective number of bits
VOLTAGE REFERENCE OUTPUT
Reference voltage output
Initial accuracy
87
95
ENOB
VOUT
14.3
2.475
2.5
2.525
±1
V
%
Output voltage temperature drift
dVOUT/dT
±20
40
ppm/°C
µVPP
µVrms
dB
f = 0.1Hz to 10Hz, CL = 10µF
f = 10Hz to 10kHz, CL = 10µF
Output voltage noise
8
Power-supply rejection ratio
Output impedance
PSRR
ROUT
ISC
60
2
kΩ
Short-circuit current
Turn-on settling time
VOLTAGE REFERENCE INPUT
Reference voltage input
Reference input resistance
Reference input capacitance
Reference input current
DIGITAL INPUTS(2)
Logic family
1.25
100
mA
to 0.1% at CL = 0pF
µs
VIN
1.5
2.5
5
2.6
1
V
100
MΩ
pF
µA
CMOS
High-level input voltage
Low-level input voltage
Input current
VIH
VIL
0.7 × BVDD
BVDD + 0.3
0.3 × BVDD
±50
V
V
–0.3
IIN VI = BVDD or GND
CI
nA
pF
Input capacitance
5
DIGITAL OUTPUTS(2)
Logic family
CMOS
High-level output voltage
Low-level output voltage
High-impedance state output current
Output capacitance
Load capacitance
VOH BVDD = 4.5V, IOH = –100µA
4.44
V
VOL BVDD = 4.5V, IOL = 100µA
0.5
V
IOZ CS = BVDD, VI = BVDD or GND
±50
nA
pF
pF
CO
CL
5
30
DIGITAL INPUTS(3)
Logic family
LVCMOS
High-level input voltage
Low-level input voltage
Input current
VIH BVDD = 3.6V
VIL BVDD = 2.7V
IIN VI = BVDD or GND
CI
2
BVDD + 0.3
0.8
V
V
–0.3
±50
nA
pF
Input capacitance
5
(2) Applies for 5.0V nominal supply: BVDD (min) = 4.5V and BVDD (max) = 5.5V.
(3) Applies for 3.0V nominal supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V.
4
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Product Folder Link(s): ADS8365
ADS8365
www.ti.com .................................................................................................................................................... SBAS362C–AUGUST 2006–REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS: 100kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 2MHz, and
fSAMPLE = 100kSPS, unless otherwise noted.
ADS8365
PARAMETER
DIGITAL OUTPUTS(4)
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
Logic family
LVCMOS
High-level output voltage
Low-level output voltage
High-impedance state output current
Output capacitance
VOH BVDD = 2.7V, IOH = –100µA
BVDD – 0.2
V
VOL BVDD = 2.7V, IOL = 100µA
0.2
V
IOZ CS = BVDD, VI = BVDD or GND
±50
nA
pF
pF
CO
CL
5
Load capacitance
30
DATA FORMAT
Bit DB4 = 1
Bit DB4 = 0
Binary two's complement
Straight binary coding
Data format
POWER SUPPLY
Analog supply voltage
AVDD
4.75
2.7
4.5
38
5.25
3.6
5.5
45
V
V
Low-voltage levels
5V logic levels
Buffer I/O supply voltage
BVDD
AIDD
BIDD
V
Analog operating supply current
Buffer I/O operating supply current
mA
µA
µA
mW
mW
mW
µW
BVDD = 3V
60
90
BVDD = 5V
100
190
190
150
225
225
5
BVDD = 3V
BVDD = 5V
Power dissipation
Nap mode enabled
Powerdown enabled
50
(4) Applies for 3.0V nominal supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V.
Copyright © 2006–2008, Texas Instruments Incorporated
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ADS8365
SBAS362C–AUGUST 2006–REVISED MARCH 2008.................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS: 250kSPS
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, and
fSAMPLE = 250kSPS, unless otherwise noted
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
ANALOG INPUT
Full-scale range
FSR +IN – (–IN)
±VREF
2.8
V
V
Operating common-mode signal
Input resistance
2.2
–IN = VREF
750
25
Ω
Input capacitance
–IN = VREF
pF
nA
Ω
Input leakage current
–IN = VREF
±1
Differential input resistance
Differential input capacitance
–IN = VREF
1500
15
–IN = VREF
pF
dB
dB
MHz
At dc
84
Common-mode rejection ratio
CMRR
VIN = ±1.25VPP at 50kHz
80
Bandwidth
BW FS sinewave, –3dB
10
DC ACCURACY
Resolution
16
Bits
Bits
No missing codes
Integral linearity error
Differential nonlinearity
Bipolar offset error
Bipolar offset error match
Bipolar offset error drift
Gain error
NMC
14
INL
±3
±1.5
±1
±8
LSB
DNL Specified for 14 bit
VOS
LSB
±2.3
1
mV
Only pair-wise matching
0.2
mV
TCVOS
0.8
ppm/°C
%FSR
%FSR
ppm/°C
µVrms
dB
GERR Referenced to VREF
Only pair-wise matching
±0.05
0.005
2
±0.25
0.05
Gain error match
Gain error drift
TCGERR
Noise
60
Power-supply rejection ratio
SAMPLING DYNAMICS
Conversion time per ADC
Acquisition time
PSRR 4.75V < AVDD < 5.25V
–87
tCONV 50kHz ≤ fCLK ≤ 5MHz
3.2
320
µs
ns
tAQ fCLK = 5MHz
800
Throughput rate
250
5
kSPS
ns
Aperture delay
Aperture delay matching
Aperture jitter
100
50
ps
ps
Clock frequency
0.05
5
MHz
AC ACCURACY
Total harmonic distortion
Spurious-free dynamic range
Signal-to-noise ratio
Signal-to-noise + distortion
Channel-to-channel isolation
Effective number of bits
THD VIN = ±2.5VPP at 50kHz
SFDR VIN = ±2.5VPP at 50kHz
SNR VIN = ±2.5VPP at 10kHz
SINAD VIN = ±2.5VPP at 10kHz
–94
95
dB
dB
dB
dB
dB
Bits
88
87
95
ENOB
14.3
(1) All typical values are at +25°C.
6
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Product Folder Link(s): ADS8365
ADS8365
www.ti.com .................................................................................................................................................... SBAS362C–AUGUST 2006–REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS: 250kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, and
fSAMPLE = 250kSPS, unless otherwise noted
ADS8365
PARAMETER
VOLTAGE REFERENCE OUTPUT
Reference voltage output
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
VOUT
2.475
2.5
2.525
±1
V
%
Initial accuracy
Output voltage temperature drift
dVOUT/dT
±20
40
ppm/°C
µVPP
µVrms
dB
f = 0.1Hz to 10Hz, CL = 10µF
f = 10Hz to 10kHz, CL = 10µF
Output voltage noise
8
Power-supply rejection ratio
Output impedance
PSRR
ROUT
ISC
60
2
kΩ
Short-circuit current
Turn-on settling time
VOLTAGE REFERENCE INPUT
Reference voltage input
Reference input resistance
Reference input capacitance
Reference input current
DIGITAL INPUTS(2)
Logic family
1.25
100
mA
to 0.1% at CL = 0pF
µs
VIN
1.5
2.5
5
2.6
1
V
100
MΩ
pF
µA
CMOS
High-level input voltage
Low-level input voltage
Input current
VIH
VIL
0.7 × BVDD
BVDD + 0.3
0.3 × BVDD
±50
V
V
–0.3
IIN VI = BVDD or GND
CI
nA
pF
Input capacitance
5
DIGITAL OUTPUTS(2)
Logic family
CMOS
High-level output voltage
Low-level output voltage
High-impedance state output current
Output capacitance
VOH BVDD = 4.5V, IOH = –100µA
4.44
V
VOL BVDD = 4.5V, IOL = 100µA
0.5
V
IOZ CS = BVDD, VI = BVDD or GND
±50
nA
pF
pF
CO
CL
5
Load capacitance
30
DIGITAL INPUTS(3)
Logic family
LVCMOS
High-level input voltage
Low-level input voltage
Input current
VIH BVDD = 3.6V
VIL BVDD = 2.7V
IIN VI = BVDD or GND
CI
2
BVDD + 0.3
0.8
V
V
–0.3
±50
nA
pF
Input capacitance
5
DIGITAL OUTPUTS(3)
Logic family
LVCMOS
High-level output voltage
Low-level output voltage
High-impedance state output current
Output capacitance
VOH BVDD = 2.7V, IOH = –100µA
BVDD – 0.2
V
VOL BVDD = 2.7V, IOL = 100µA
0.2
V
IOZ CS = BVDD, VI = BVDD or GND
±50
nA
pF
pF
CO
CL
5
Load capacitance
30
(2) Applies for 5.0V nominal supply: BVDD (min) = 4.5V and BVDD (max) = 5.5V.
(3) Applies for 3.0V nominal supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V.
Copyright © 2006–2008, Texas Instruments Incorporated
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ADS8365
SBAS362C–AUGUST 2006–REVISED MARCH 2008.................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS: 250kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, and
fSAMPLE = 250kSPS, unless otherwise noted
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
DATA FORMAT
Data format
Bit DB4 = 1
Binary two's complement
Straight binary coding
Bit DB4 = 0
POWER SUPPLY
Analog supply voltage
AVDD
BVDD
AIDD
BIDD
4.75
2.7
5.25
3.6
5.5
48
V
V
Low-voltage levels
5V logic levels
Buffer I/O supply voltage
4.5
V
Analog operating supply current
Buffer I/O operating supply current
40
mA
µA
µA
mW
mW
mW
µW
BVDD = 3V
150
250
200
201
225
375
240
241
5
BVDD = 5V
BVDD = 3V
BVDD = 5V
Power dissipation
Nap mode enabled
Powerdown enabled
50
EQUIVALENT INPUT CIRCUIT
Diode Turn-on Voltage: 0.35V
AVDD
BVDD
RON
C(SAMPLE)
20pF
750W
AIN
DIN
AGND
BGND
Equivalent Digital Input Circuit
Equivalent Analog Input Circuit
8
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Product Folder Link(s): ADS8365
ADS8365
www.ti.com .................................................................................................................................................... SBAS362C–AUGUST 2006–REVISED MARCH 2008
PIN CONFIGURATION
PAG PACKAGE
TQFP-64
(TOP VIEW)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
CH A1-
CH A1+
AVDD
1
2
3
4
5
6
7
8
9
48 D0
47 D1
46 D2
45 D3
44 D4
43 D5
42 D6
41 D7
40 D8
39 D9
38 D10
37 D11
36 D12
35 D13
34 D14
33 D15
AGND
SGND
CH B0+
CH B0-
AVDD
ADS8365
AGND
SGND 10
CH B1- 11
CH B1+ 12
AVDD 13
AGND 14
SGND 15
CH C0+ 16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TERMINAL FUNCTIONS
TERMINAL
NAME
CH A1–
NO.
1
I/O(1)
AI
AI
P
DESCRIPTION
Inverting input channel A1
Noninverting input channel A1
Analog power supply
Analog ground
CH A1+
AVDD
2
3
AGND
SGND
CH B0+
CH B0–
AVDD
4
P
5
P
Signal Ground
6
AI
AI
P
Noninverting input channel B0
Inverting input channel B0
Analog power supply
Analog ground
7
8
AGND
SGND
CH B1–
CH B1+
AVDD
9
P
10
11
12
13
14
15
16
17
18
P
Signal ground
AI
AI
P
Inverting input channel B1
Noninverting input channel B1
Analog power supply
Analog ground
AGND
SGND
CH C0+
CH C0–
CH C1–
P
P
Signal ground
AI
AI
AI
Noninverting input channel C0
Inverting input channel C0
Inverting input channel C1
(1) AI = Analog Input, AO = Analog Output, DI = Digital Input, DO = Digital Output, DIO = Digital Input/Output, and P = Power Supply
Connection.
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SBAS362C–AUGUST 2006–REVISED MARCH 2008.................................................................................................................................................... www.ti.com
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
CH C1+
NO.
19
20
21
22
23
24
25
26
27
I/O(1)
AI
DESCRIPTION
Noninverting input channel C1
Nap mode.Low level or unconnected = normal operation; high level = Nap mode.
Analog ground
NAP
DI
P
AGND
AVDD
BYTE
BVDD
BGND
FD
P
+5V power supply
DI
P
2 x 8 output capability (active high)
Power supply for digital interface from 3V to 5V
Buffer digital ground
P
DO
DO
First data (A0 data)
EOC
End of conversion (active low)
An external CMOS compatible clock can be applied to the CLK input to synchronize the conversion process to an
external source.
CLK
28
DI
RD
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
DI
DI
Read (active low)
WR
Write (active low)
CS
DI
Chip select (active low)
Buffer digital ground
BGND
D15
P
DO
DO
DO
DO
DO
DO
DO
DO
DIO
DIO
DIO
DIO
DIO
DIO
DIO
DIO
P
Data bit 15 (MSB)
D14
Data bit 14
D13
Data bit 13
D12
Data bit 12
D11
Data bit 11
D10
Data bit 10
D9
Data bit 9
D8
Data bit 8
D7
Data bit 7 (software input 7)
Data bit 6 (software input 6)
Data bit 5 (software input 5)
Data bit 4 (software input 4)
Data bit 3 (software input 3)
Data bit 2 (software input 2)
Data bit 1 (software input 1)
Data bit 0 (software input 0) (LSB)
Buffer digital ground
D6
D5
D4
D3
D2
D1
D0
BGND
BVDD
RESET
ADD
A2
P
Power supply for digital interface from 3V to 5V
Global reset (active low)
Address mode select
Address line 3
DI
DI
DI
A1
DI
Address line 2
A0
DI
Address line 1
HOLDA
HOLDB
HOLDC
AVDD
AGND
REFOUT
REFIN
CH A0+
CH A0–
DI
Hold command A (active low)
Hold command B (active low)
Hold command C (active low)
Analog power supply
Analog ground
DI
DI
P
P
AO
AI
Reference output; attach 0.1µF and 10µF capacitors
Reference input
AI
Noninverting input channel A0
Inverting input channel A0
AI
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TIMING INFORMATION
tC1
CLK
1
2
16
17
18
20
1
2
19
tW1
tD1
CONVERSION
tCONV
ACQUISITION
tACQ
HOLDX
tW3
tW2
EOC
CS
tD4
tD5
tW6
RD
tW5
tD7
tD6
D15–D8
D7–D0
Bits 15–8
Bits 7–0
Bits 15–8
Bits 7–0
BYTE
Figure 1. Read and Convert Timing
CS
WR
WR or CS
DB7:0
tD10
tW6
tD11
Figure 2. Write Timing
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TIMING CHARACTERISTICS(1)(2)(3)(4)
Over recommended operating free-air temperature range, TMIN to TMAX, AVDD = 5V, REFIN = REFOUT, VREF = internal +2.5V,
fCLK = 5MHz, fSAMPLE = 250kSPS, and BVDD = 2.7 to 5V, unless otherwise noted,
SYMBOL
tACQ
DESCRIPTION
MIN
TYP
MAX
0.8
UNIT
µs
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Acquisition time
tCONV
Conversion time
3.2
tC1
Cycle time of CLK
200
10
20
40
0
(5)
tD1
Delay time of rising edge of CLK after falling edge of HOLDX
BVDD = 5V
tD2
Delay time of first hold after RESET
BVDD = 3V
tD4
tD5
Delay time of falling edge of RD after falling edge of CS
Delay time of rising edge of CS after rising edge of RD
0
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
40
60
5
tD6
Delay time of data valid after falling edge of RD
Delay time of data hold from rising edge of RD
Delay time of RD high after CS low
tD7
10
50
60
10
20
10
20
10
20
60
15
30
20
30
20
40
30
40
50
70
tD8
tD9
Delay time of RD low after address setup
Delay time of data valid to WR low
tD10
tD11
tW1
tW2
Delay time of WR or CS high to data release
Pulse width CLK high time or low time
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
BVDD = 5V
BVDD = 3V
Pulse width of HOLDX high time to be recognized again
tW3
tW4
tW5
tW6
Pulse width of HOLDX low time
Pulse width of RESET
Pulse width of RD high time
Pulse width of RD and CS both low time
(1) Assured by design.
(2) All input signals are specified with rise time and fall time = 5ns (10% to 90% of BVDD ) and timed from a voltage level of (VIL + VIH )/2.
(3) See Figure 1.
(4) BYTE is asynchronous; when BYTE is 0, bits 15 to 0 appear at DB15 to DB0. When BYTE is 1, bits 15 to 8 appear on DB7 to DB0. RD
may remain LOW between changes in BYTE.
(5) Only important when synchronization to clock is important.
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TYPICAL CHARACTERISTICS
At TA = +25°C, AVDD = +5V, BVDD = +3V, VREF = internal +2.5V, fCLK = 5MHz, and fSAMPLE = 250kSPS, unless otherwise noted.
INTEGRAL LINEARITY ERROR
vs CODE (100kSPS)
DIFFERENTIAL LINEARITY ERROR
vs CODE (100kSPS)
2.0
1.5
1.0
0.5
0
4
3
2
1
0
1
2
3
4
-0.5
-1.0
0
8192 16384 24576 32768 40960 49152 57344 65535
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
Code
Figure 3.
Figure 4.
MINIMUM AND MAXIMUM INL OF ALL CHANNELS
vs TEMPERATURE (100kSPS)
MINIMUM AND MAXIMUM INL OF ALL CHANNELS
vs TEMPERATURE (250kSPS)
1.5
1.0
1.5
1.0
Max
Max
Min
0.5
0.5
0
0
-0.5
-1.0
-1.5
-2.0
-2.5
-0.5
-1.0
-1.5
-2.0
-2.5
Min
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
Figure 5.
Figure 6.
MINIMUM AND MAXIMUM DNL OF ALL CHANNELS
vs TEMPERATURE (100kSPS)
MINIMUM AND MAXIMUM DNL OF ALL CHANNELS
vs TEMPERATURE (250kSPS)
3.0
2.5
3.0
2.5
Max
Max
2.0
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0
0
-0.5
-1.0
-1.5
-2.0
-0.5
-1.0
-1.5
-2.0
Min
Min
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
Figure 7.
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = +5V, BVDD = +3V, VREF = internal +2.5V, fCLK = 5MHz, and fSAMPLE = 250kSPS, unless otherwise noted.
FREQUENCY SPECTRUM
(16384 point FFT, fIN = 10kHz, –0.2dB)
FREQUENCY SPECTRUM
(16384 point FFT, fIN = 45kHz, –0.2dB)
0
-20
0
-20
-40
-40
-60
-60
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
0
25
50
75
100
125
0
25
50
75
100
125
100
100
Frequency (kHz)
Frequency (kHz)
Figure 9.
Figure 10.
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-NOISE + DISTORTION
vs INPUT FREQUENCY (ALL CHANNELS)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY (ALL CHANNELS)
100
95
90
85
80
75
70
120
115
110
105
100
95
SFDR
THD
SNR
SINAD
90
85
80
1
10
100
1
10
Frequency (kHz)
Frequency (kHz)
Figure 11.
Figure 12.
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-NOISE + DISTORTION
vs TEMPERATURE (ALL CHANNELS)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs TEMPERATURE (ALL CHANNELS)
90.0
89.5
89.0
88.5
88.0
87.5
87.0
86.5
86.0
85.5
85.0
107
105
103
101
99
SFDR
THD
SNR
SINAD
97
95
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
Temperature (°C)
Temperature (°C)
Figure 13.
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = +5V, BVDD = +3V, VREF = internal +2.5V, fCLK = 5MHz, and fSAMPLE = 250kSPS, unless otherwise noted.
OFFSET OF ALL CHANNELS
vs TEMPERATURE
OFFSET MATCHING OF CHANNEL PAIRS
vs TEMPERATURE
-0.8
-0.9
-1.0
-1.1
-1.2
-1.3
-1.4
0.25
0.20
0.15
0.10
0.05
0
C0
A0
A1
B
A
C1
-0.05
-0.10
-0.15
-0.20
-0.25
B0
B1
C
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
Figure 15.
Figure 16.
GAIN ERROR OF ALL CHANNELS
vs TEMPERATURE
GAIN-ERROR MATCHING OF CHANNEL PAIRS
vs TEMPERATURE
100
50
100
50
B1
A0
B0
A1
B
C
A
0
0
C1
C0
-50
-100
-150
-50
-100
-150
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
Figure 17.
Figure 18.
REFERENCE VOLTAGE OUTPUT
vs TEMPERATURE
ANALOG SUPPLY CURRENT
vs TEMPERATURE
2.498
2.496
2.494
2.492
2.490
42
40
38
36
34
32
30
250kSPS
100kSPS
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
Figure 19.
Figure 20.
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INTRODUCTION
5ns. The average delta of repeated aperture delay
The ADS8365 is
a
high-speed, low-power,
values (also known as aperture jitter) is typically
50ps. These specifications reflect the ability of the
ADS8365 to capture ac input signals accurately at the
exact same moment in time.
six-channel simultaneous sampling and converting,
16-bit ADC that operates from a single +5V supply.
The input channels are fully differential with a typical
common-mode rejection of 80dB. The ADS8365
contains six 4µs successive approximation ADCs, six
differential sample-and-hold amplifiers, an internal
+2.5V reference with REFIN and REFOUT pins, and a
high-speed parallel interface. There are six analog
inputs that are grouped into three channel pairs (A, B,
and C). There are six ADCs, one for each input that
can be sampled and converted simultaneously, thus
preserving the relative phase information of the
signals on both analog inputs. Each pair of channels
has a hold signal (HOLDA, HOLDB, and HOLDC) to
allow simultaneous sampling on each channel pair,
on four or on all six channels. The part accepts a
differential analog input voltage in the range of –VREF
to +VREF, centered on the common-mode voltage
(see the Analog Input section). The ADS8365 also
accepts bipolar input ranges when a level shift circuit
is used at the front end (see Figure 26).
REFERENCE
Under normal operation, REFOUT (pin 61) can be
directly connected to REFIN (pin 62) to provide an
internal +2.5V reference to the ADS8365. The
ADS8365 can operate, however, with an external
reference in the range of 1.5V to 2.6V, for a
corresponding full-scale range of 3.0V to 5.2V, as
long as the input does not exceed the AVDD + 0.3V
limit.
The reference output of the ADS8365 has an
impedance of 2kΩ. The high impedance reference
input can be driven directly. For an external resistive
load, an additional buffer is required.
A load
capacitance of 0.1µF to 10µF should be applied to
the reference output to minimize noise. If an external
reference is used, the three input buffers provide
isolation between the external reference and the
CDACs. These buffers are also used to recharge all
the capacitors of all CDACs during conversion.
A conversion is initiated on the ADS8365 by bringing
the HOLDX pin low for a minimum of 20ns. HOLDX
low places the sample-and-hold amplifiers of the X
channels in the hold state simultaneously and the
conversion process is started on each channel. The
EOC output goes low for half a clock cycle when the
conversion is latched into the output register. The
data can be read from the parallel output bus
following the conversion by bringing both RD and CS
low. Conversion time for the ADS8365 is 3.2µs when
a 5MHz external clock is used. The corresponding
acquisition time is 0.8µs. To achieve the maximum
output data rate (250kSPS), the read function can be
performed during the next conversion. NOTE: This
mode of operation is described in more detail in the
Timing and Control section of this data sheet.
ANALOG INPUT
The analog input is bipolar and fully differential. There
are two general methods of driving the analog input
of the ADS8365: single-ended or differential, as
shown in Figure 21 and Figure 22. When the input is
single-ended, the –IN input is held at the
common-mode voltage. The +IN input swings around
the same common voltage and the peak-to-peak
amplitude is the (common-mode + VREF) and the
(common-mode –VREF). The value of VREF determines
the range over which the common-mode voltage may
vary (see Figure 23).
SAMPLE AND HOLD
Single-Ended Input
The sample-and-hold amplifiers on the ADS8365
allow the ADCs to accurately convert an input sine
wave of full-scale amplitude to 16-bit resolution. The
input bandwidth of the sample-and-hold amplifiers is
greater than the Nyquist rate (Nyquist = 1/2 of the
sampling rate) of the ADC, even when the ADC is
operated at its maximum throughput rate of 250kSPS.
The typical small-signal bandwidth of the
sample-and-hold amplifiers is 10MHz. Typical
aperture delay time (or the time it takes for the
ADS8365 to switch from the sample to the hold mode
following the negative edge of the HOLDX signal) is
-VREF to +VREF
ADS8365
peak-to-peak
Common
Voltage
Differential Input
VREF
peak-to-peak
ADS8365
Common
VREF
Voltage
peak-to-peak
Figure 21. Methods of Driving the ADS8365
Single-Ended or Differential
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+IN
CM +VREF
+VREF
CM Voltage
-IN = CM Voltage
-VREF
t
CM -VREF
Single-Ended Inputs
+IN
+VREF
CM +1/2VREF
CM Voltage
-VREF
-IN
t
CM -1/2VREF
Differential Inputs
NOTES:
Common−mode voltage (Differential mode) =
(+IN) ) (−IN)
. Common−mode voltage (Single−ended mode) = −IN
2
The maximum differential voltage between +IN and –IN of the ADS8365 is VREF. See Figure 23 and Figure 24 for a
further explanation of the common voltage range for single-ended and differential inputs.
Figure 22. Using the ADS8365 in the Single-Ended and Differential Input Modes
5
4
5
AVDD = 5V
AVDD = 5V
4.55
3.8
4
3
4.0
3
2.7
2.3
Differential Input
Single-Ended Input
2
2
1.2
1
1
1.0
0.45
0
0
- 1
- 1
2.6
2.5
2.6
2.5
1.0
1.5
2.0
3.0
1.0
1.5
2.0
3.0
VREF (V)
VREF (V)
Figure 23. Single-Ended Input: Common-Mode
Voltage Range vs VREF
Figure 24. Differential Input: Common-Mode
Voltage Range vs VREF
When the input is differential, the amplitude of the
input is the difference between the +IN and –IN input,
or: (+IN) – (–IN). The peak-to-peak amplitude of each
input is ±1/2VREF around this common voltage.
However, since the inputs are 180° out-of-phase, the
peak-to-peak amplitude of the differential voltage is
+VREF to –VREF. The value of VREF also determines
the range of the voltage that may be common to both
inputs, as shown in Figure 24.
In each case, care should be taken to ensure that the
output impedance of the sources driving the +IN and
–IN inputs are matched. Often, a small capacitor
(20pF) between the positive and negative input helps
to match the impedance. Otherwise, a mismatch may
result in offset error, which will change with both
temperature and input voltage.
The input current on the analog inputs depends on a
number of factors, such as sample rate or input
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voltage. Essentially, the current into the ADS8365
charges the internal capacitor array during the
sampling period. After this capacitance has been fully
charged, there is no further input current. The source
of the analog input voltage must be able to charge
the input capacitance (25pF) to a 16-bit settling level
within three clock cycles if the minimum acquisition
time is used. When the converter goes into the hold
mode, the input impedance is greater than 1GΩ.
Care must be taken regarding the absolute analog
input voltage. The +IN and –IN inputs should always
BIPOLAR INPUTS
The differential inputs of the ADS8365 were designed
to accept bipolar inputs (–VREF and +VREF) around the
common-mode voltage (2.5V), which corresponds to
a 0V to 5V input range with a 2.5V reference. By
using
a simple op amp circuit featuring four,
high-precision external resistors, the ADS8365 can
be configured to accept a bipolar input range. The
conventional ±2.5V, ±5V, and ±10V input ranges
could be interfaced to the ADS8365 using the resistor
values shown in Figure 26.
remain within the range of AGND – 0.3V to AVDD
0.3V.
+
R1
The OPA365 is a good choice for driving the analog
inputs in a 5V, single-supply application.
4kW
1.2kW
+IN
OPA227
20kW
TRANSITION NOISE
Bipolar
Input
1.2kW
The transition noise of the ADS8365 itself is low, as
shown in Figure 25 These histograms were
generated by applying a low-noise dc input and
initiating 8000 conversions. The digital output of the
ADC will vary in output code due to the internal noise
of the ADS8365; this feature is true for all 16-bit,
successive approximation register (SAR) type ADCs.
Using a histogram to plot the output codes, the
distribution should appear bell-shaped, with the peak
of the bell curve representing the nominal code for
the input value. The ±1σ , ±2σ , and ±3σ distributions
represent the 68.3%, 95.5%, and 99.7%, respectively,
of all codes. The transition noise can be calculated by
dividing the number of codes measured by 6, yielding
the ±3σ distribution, or 99.7%, of all codes.
Statistically, up to three codes could fall outside the
distribution when executing 1000 conversions.
Remember, in order to achieve this low-noise
performance, the peak-to-peak noise of the input
signal and reference must be < 50µV.
-IN
R2
ADS8365
OPA227
REFOUT (pin 61)
2.5V
BIPOLAR INPUT
R1
R2
±10V
±5V
1kW
2kW
4kW
5kW
10kW
20kW
±2.5V
Figure 26. Level Shift Circuit for Bipolar Input
Ranges
TIMING AND CONTROL
The ADS8365 uses an external clock (CLK, pin 28)
that controls the conversion rate of the CDAC. With a
5MHz external clock, the ADC sampling rate is
250kSPS which corresponds to a 4µs maximum
throughput time. Acquisition and conversion take a
total of 20 clock cycles.
4000
3379
3500
3000
2500
2000
1500
1000
500
3290
649
603
37
42
0
32782 32783 32784 32785 32786 32787
Code
Figure 25. 8000 Conversion Histogram of a DC
Input
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THEORY OF OPERATION
and all the output registers, aborts any
The ADS8365 contains six 16-bit ADCs that can
conversion in process, and closes the
operate simultaneously in pairs. The three hold
sampling switches. The reset signal must stay
signals (HOLDA, HOLDB, and HOLDC) initiate the
low for at least 20ns (see Figure 27, tW4). The
conversion on the specific channels. A simultaneous
reset signal should be back high for at least
hold on all six channels can occur with all three hold
20ns (Figure 27, tD2) before starting the next
signals strobed together. The converted values are
conversion (negative hold edge).
saved in six registers. For each read operation, the
ADS8365 outputs 16 bits of information (16 data or 3
channel address, data valid, and some
EOC End of conversion goes low when new data
from the internal ADC are latched into the
output registers, which usually happens 16.5
clock cycles after hold initiated the conversion.
It remains low for half a clock cycle. If more
than one channel pair is converted
synchronization information). The address/mode
signals (A0, A1, and A2) select how the data are read
from the ADS8365. These address/mode signals can
define a selection of a single channel, a cycle mode
that cycles through all channels, or a FIFO mode that
sequences the data determined by the order of the
hold signals. The FIFO mode will allow the six
registers to be used by a single-channel pair;
therefore, three locations for CH X0 and three
locations for CH X1 can be updated before they are
read from the device.
simultaneously, the A-channels get stored to
the registers first (16.5 clock cycles after hold),
followed by the B-channels one clock cycle
later, and finally the C-channels another clock
cycle later. If a reading (both RD and CS are
low) is in process, then the latch process is
delayed until the read operation is finished.
FD
First data or A0 data are high if channel A0 is
chosen to be read next. In FIFO mode, the
channel (X0) that is written to the FIFO first is
latched into the A0 register. For example,
when the FIFO is empty, FD is 0. The first
result latched into the FIFO register A0 is,
therefore, chosen to be read next, and FD
rises. After the first channel is read (one to
three read cycles, depending on BYTE and
ADD), FD goes low again.
EXPLANATION OF CLOCK, RESET, FD, AND
EOC PINS
Clock An external clock has to be provided for the
ADS8365. The maximum clock frequency is
5MHz. The minimum clock cycle is 200ns (see
Figure 1, tC1), and the clock has to remain high
(Figure 1, tW1) or low for at least 60ns.
RESET Bringing the RESET signal low will reset the
ADS8365. Resetting clears the control register
tC1
CLK
tW1
tD1
HOLD A
tW3
HOLD B
tD2
tW2
HOLD C
tW4
RESET
Figure 27. Start of the Conversion
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START OF A CONVERSION AND READING
DATA
The ADS8365 can also convert one channel
continuously (see Figure 28). Therefore, HOLDA and
HOLDC are kept high all the time. To gain acquisition
time, the falling edge of HOLDB takes place just
before the rising edge of clock. One conversion
requires 20 clock cycles. Here, data are read after the
next conversion is initiated by HOLDB. To read data
from channel B, A1 is set high and A2 is low. Since
A0 is low during the first reading (A2 A1 A0 = 010),
data B0 are put to the output. Before the second RD,
A0 switches high (A2 A1 A0 = 011) so that data from
channel B1 are read, as shown in Table 1. However,
reading data during the conversion or on a falling
hold edge might cause a loss in performance.
By bringing one, two, or all three of the HOLDX
signals low, the input data of the corresponding
channel X are immediately placed in the hold mode
(5ns). The conversion of this channel X follows with
the next rising edge of clock. If it is important to
detect a hold command during a certain clock-cycle,
then the falling edge of the hold signal has to occur at
least 10ns before the rising edge of clock, as shown
in Figure 27, tD1. The hold signal can remain low
without initiating a new conversion. The hold signal
must be high for at least 15ns (as shown in
Figure 27, tW2) before it is brought low again, and
hold must stay low for at least 20ns (Figure 27, tW3).
Table 1. Address Control for RD Functions
Once a particular hold signal goes low, further
impulses of this hold signal are ignored until the
conversion is finished or the device is reset. When
the conversion is finished (after 16 clock cycles) the
sampling switches close and sample the selected
channel. The start of the next conversion must be
delayed to allow the input capacitor of the ADS8365
to be fully charged. This delay time depends on the
driving amplifier, but should be at least 800ns.
A2
0
A1
0
A0
0
CHANNEL TO BE READ
CH A0
CH A1
CH B0
CH B1
CH C0
CH C1
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
Cycle mode reads registers CH A0
to CH C1 on successive transitions
of the read line
1
1
1
1
0
1
FIFO mode
CONVERSION
ACQUISITION
19
CLK
1
2
16
17
18
20
1
2
HOLD B
EOC
CS
RD
A0
Figure 28. Timing of One Conversion Cycle
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Reading data (RD and CS)
CS being low tells the ADS8365 that the bus on the
board is assigned to the ADS8365. If an ADC shares
a bus with digital gates, there is a possibility that
digital (high-frequency) noise will be coupled into the
ADC. If the bus is just used by the ADS8365, CS can
be hardwired to ground. Reading data at the falling
edge of one of the HOLDX signals might cause noise.
In general, the channel/data outputs are in tri-state.
Both CS and RD must be low to enable these
outputs. RD and CS must stay low together for at
least 40ns (see Figure 1, tD6) before the output data
are valid. RD must remain HIGH for at least 30ns
(see Figure 1, tW5) before bringing it back low for a
subsequent read command.
BYTE
The new data are latched into its output register 16.5
clock cycles after the start of a conversion (next rising
edge of clock after the falling edge of HOLDX). Even
if the ADS8365 is forced to wait until the read
process is finished (RD signal going high) before the
new data are latched into its output register, the
possibility still exists that the new data was latched to
the output register just before the falling edge of RD.
If a read process is initiated around 16.5 clock cycles
after the conversion started, RD and CS should stay
low for at least 50ns (see Figure 1, tW6) to get the
new data stored to its register and switched to the
output.
If there is only an 8-bit bus available on a board, then
BYTE can be set high (see Figure 29). In this case,
the lower eight bits can be read at the output pins
D15 to D8 or D7 to D0 at the first RD signal, and the
higher bits after the second RD signal. If the
ADS8365 is used in the cycle or the FIFO mode, then
the address and data valid information is added to the
data (if ADD is high). In this case, the address will be
read first, then the lower eight bits, and finally the
higher eight bits. If BYTE is low, then the ADS8365
operates in the 16-bit output mode. Here, data are
read between pins DB15 and DB0. As long as ADD is
low, with every RD impulse, data from a new channel
are brought to the output. If ADD is high and the
cycle or the FIFO mode is chosen; the first output
word contains the address, while the second output
word contains the 16-bit data.
CS
RD
BYTE
A0
A0
A1
A1
B0
B0
B1
C0
C1
A0
D7 – D0
LOW
HIGH
LOW
HIGH
LOW
HIGH
Figure 29. Reading Data in Cycling Mode
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ADD Signal
In the cycle and the FIFO mode, it might be desirable
to have address information with the 16-bit output
data. Therefore, ADD can be set high. In this case,
two RD signals (or three readings if the part is
operated with BYTE being high) are necessary to
read data of one channel, while the ADS8365
provides channel information on the first RD signal
(see Table 2 and Table 3).
If conversion timing between ADCs is not critical, Soft
Trigger mode can allow all three HOLDX signals to
be triggered simultaneously. This simultaneous
triggering can be done by tying all three HOLDX pins
high, and issuing a write (CS and WR low) with the
DB0, DB1, DB2, and DB7 bits low, and the reset bit
(DB3) high. Writing a low to the reset bit (DB3) while
the RESET pin is high forces a device reset, and all
HOLDX signals that occur during that time are
ignored.
Soft Trigger Mode
Signals NAP, ADD, A0, A1, A2, RESET, HOLDA,
HOLDB, and HOLDC are accessible through the data
bus and control word. Bits NAP, ADD, A0, A1 and A2
are in an OR configuration with hardware pins. When
software configuration is used, these pins must be
connected to ground. Conversely, the RESET,
HOLDA, HOLDB, and HOLDC bits are in a NAND
configuration with the hardware pins. When software
configuration is used, these pins must be connected
The HOLDX signals start conversion automatically on
the next clock cycle. The format of the two words that
can be written to the ADS8365 are shown in Table 4.
Bits DB5 and DB4 do not have corresponding
hardware pins. Bit DB5 = 1 enables Powerdown
mode. Bit DB4 = 1 inverts the MSB of the output
data, putting the output data in two's complement
format. When DB4 is low, the data is in straight
binary format.
to BVDD
.
Table 2. Overview of the Output Formats Depending on Mode When ADD = 0
ADD = 0
A2 A1 A0
000
BYTE = 0
BYTE = 1
2nd RD
1st RD
2nd RD
1st RD
3rd RD
DB15...DB0
DB15...DB0
DB15...DB0
DB15...DB0
DB15...DB0
DB15...DB0
DB15...DB0
DB15...DB0
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
DB7...DB0
DB7...DB0
DB7...DB0
DB7...DB0
DB7...DB0
DB7...DB0
DB7...DB0
DB7...DB0
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
001
010
011
100
101
110
111
Table 3. Overview of the Output Formats Depending on Mode When ADD = 1
ADD = 1
A2 A1 A0
000
BYTE = 0
BYTE = 1
2nd RD
1st RD
2nd RD
1st RD
DB7...DB0
3rd RD
DB15...DB0
DB15...DB0
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
No 2nd RD
DB15...DB0
DB15...DB0
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB15...DB8
DB7...DB0
DB7...DB0
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
No 3rd RD
DB15...DB8
DB15...DB8
001
DB7...DB0
010
DB15...DB0
DB7...DB0
011
DB15...DB0
DB7...DB0
100
DB15...DB0
DB7...DB0
101
DB15...DB0
DB7...DB0
110
1000 0000 0000 DV A2 A1 A0
1000 0000 0000 DV A2 A1 A0
DV A2 A1 A0 DB3 DB2 DB0
DV A2 A1 A0 DB3 DB2 DB0
111
Table 4. Control Register Bits
DB7 (MSB)
DB6
NAP
X
DB5
PD
X
DB4
Invert MSB
X
DB3
ADD
DB2
A2
DB1
A1
DB0 (LSB)
A0
1
0
RESET
HOLDA
HOLDB
HOLDC
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NAP AND POWERDOWN MODE CONTROL
B1, C0, and finally, C1 before reading A0 again. Data
from channel A0 are brought to the output first after a
reset signal, or after powering up the device. The
third mode is a FIFO mode that is addressed with
(A2, A1, A0 = 111). Data of the channel that is
converted first is read first. So, if a particular channel
pair is most interesting and is converted more
frequently (for example, to get a history of a particular
channel pair), then there are three output registers
per channel available to store data.
In order to minimize power consumption when the
ADS8365 is not in use, two low-power options are
available. Nap mode minimizes power without
shutting down the biasing circuitry and internal
reference, allowing immediate recovery after it is
disabled. It can be enabled by either the NAP pin
going high, or setting DB6 in the data register high.
Enabling Powerdown mode results in lower power
consumption than Nap mode, but requires a short
recovery period after disabling. It can only be enabled
by setting DB5 in the data register high.
If all the output registers are filled up with unread
data and new data from an additional conversion
must be latched in, then the oldest data is discarded.
If a read process is going on (RD signal low) and new
data must be stored, then the ADS8365 waits until
the read process is finished (RD signal going high)
before the new data gets latched into its output
register. Again, with the ADD signal, it can be chosen
whether the address should be added to the output
data.
GETTING DATA
Flexible Output Modes: A0 A1, and A2.
The ADS8365 has three different output modes that
are selected with A2, A1, and A0. The A2, A1 and A0
pins are held with a transparent latch that triggers on
a falling edge of the RD pin negative-ANDed with the
CS pin (that is, if either RD or CS is low, the falling
edge of the other will latch A0-2).
New data is always written into the next available
register. At t0 (see Figure 31), the reset deletes all the
existing data. At t1, the new data of the channels A0
and A1 are put into registers 0 and 1. At t2, a dummy
read (RD low) is performed to latch the address data
correctly. At t3, the read process of channel A0 data
is finished; therefore, these data are dumped and A1
data are shifted to register 0. At t4, new data are
available, this time from channels B0, B1, C0, and
C1. These data are written into the next available
registers (registers 1, 2, 3, and 4).
When (A2, A1, A0) = 000 to 101, a particular channel
can be directly addressed (see Table
1 and
Figure 30). The channel address should be set at
least 10ns (see Figure 30, tD9) before the falling edge
of RD and should not change as long as RD is low. In
this standard address mode, ADD will be ignored, but
should be connected to either ground or supply.
When (A2, A1, A0) = 110, the interface is running in a
cycle mode (see Figure 29). Here, data 7 down to
data 0 of channel A0 is read on the first RD signal,
and data 15 down to data 8 on the second as BYTE
is high. Then A1 on the second RD, followed by B0,
CLK
16
17
18
19
20
1
2
tD1
HOLD X
tACQ
EOC
CS
tD8
tD7
RD
A0
tD9
Figure 30. Timing for Reading Data
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RESET
EOC
RD
Conversion
Channel A
Conversion
Conversion
Channel C
Channels B and C
empty
empty
empty
empty
empty
empty
empty
empty
empty
empty
CH A1
CH A0
empty
empty
empty
empty
empty
CH A1
empty
CH C1
CH C0
empty
empty
CH C1
CH C0
CH B1
CH B0
CH C1
CH C0
CH C1
CH C0
CH B1
CH B0
Register 5
Register 4
Register 3
Register 2
CH B1
CH B0
CH A1
Register 1
Register 0
t0
t1
t2
t3
t4
t5
t6
Figure 31. Functionality Diagram of the FIFO Registers
On t5, the new read process of channel A1 data is
finished. The new data of channel C0 and C1 at t6
are put on top (registers 4 and 5).
second RD, the 16-bit data word can be read
(DB15…DB0). If BYTE = 1, then three RD impulses
are needed. On the first RD impulse, data valid, the
three address bits, and data bits DB3…DB0 (DV, A2,
A1, A0, DB3, DB2, DB1, DB0) are read, followed by
the eight lower bits of the 16-bit data word
(db7…db0), and finally the higher eight data bits
(DB15…DB8). 1000 0000 0000 is added before the
address in case BYTE = 0, and DB3…DB0 is added
after the address if BYTE = 1. This provides the
possibility to check if the counting of the RD signals
inside the ADS8365 are still tracking with the external
interface (see Table 2 and Table 3).
In Cycle mode and in FIFO mode, the ADS8365
offers the ability to add the address of the channel to
the output data. Since there is only a 16-bit bus
available (or 8-bit bus in the case BYTE is high), an
additional RD signal is necessary to get the
information (see Table 2 and Table 3).
In FIFO mode, a dummy read signal (RD) is required
after
a reset signal to set the address bits
appropriately; otherwise, the first conversion will not
be valid. This is only necessary in FIFO mode.
The data valid bit is useful for the FIFO mode. Valid
data can simply be read until the data valid bit equals
0. The three address bits are listed in Table 5. If the
FIFO is empty, 16 zeroes are loaded to the output.
The Output Code (DB15 …DB0)
In the standard address mode (A2 A1 A0
=
000…101), the ADS8365 has a 16-bit output word on
pins DB15…DB0, if BYTE = 0. If BYTE = 1, then two
RD impulses are necessary to first read the lower
bits, and then the higher bits on either DB7…DB0 or
DB15...DB8.
Table 5. Address Bit in the Output Data
DATA FROM ...
Channel A0
Channel A1
Channel B0
Channel B1
Channel C0
Channel C1
A2
0
A1
0
A0
0
0
0
1
If the ADS8365 operates in Cycle or in FIFO mode
and ADD is set high, then the address of the channel
(A2A1A0) and a data valid (DV) bit are added to the
data. If BYTE = 0, then the data valid and the
address of the channel is active during the first RD
impulse (1000 0000 0000 DV A2 A1 A0). During the
0
1
0
0
1
1
1
0
0
1
0
1
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Binary Two's Complement (BTC)
65535
0111111111111111
65534
65533
0111111111111110
0111111111111101
32769
32768
32767
0000000000000001
0000000000000000
1111111111111111
1000000000000010
1000000000000001
1000000000000000
2
1
0
VNFS = VCM - VREF = 0V
2.499962V
2.500038V
VPFS = VCM + VREF = 5V
VPFS - 1LSB = 4.999924V
4.999848V
0.000038V
0.000076V
0.000152V
VBPZ = 2.5V
Unipolar Analog Input Voltage
1LSB = 76V
VCM = 2.5V
VREF = 2.5V
16-BIT
Bipolar Input, Binary Two’s Complement Output: (BTC)
Negative Full-Scale Code = VNFS = 8000H, Vcode = VCM - VREF
Bipolar Zero Code
= VBPZ = 0000H, Vcode = VCM
Positive Full-Scale Code = VPFS = 7FFFH, Vcode = (VCM + VREF) - 1LSB
Figure 32. Ideal Conversion Characteristics (Condition: Single-Ended, VCM = chXX– = 2.5V, VREF = 2.5V)
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LAYOUT
capacitor and a 5Ω or 10Ω series resistor may be
used to low-pass filter a noisy supply. On average,
the ADS8365 draws very little current from an
external reference because the reference voltage is
internally buffered. A bypass capacitor of 0.1µF and
10µF are suggested when using the internal
reference (tie pin 61 directly to pin 62).
For optimum performance, care should be taken with
the physical layout of the ADS8365 circuitry. This
recommendation is particularly true if the CLK input is
approaching the maximum throughput rate.
The basic SAR architecture is sensitive to glitches or
sudden changes on the power supply, reference,
ground connections, and digital inputs that occur just
prior to latching the output of the analog comparator.
Thus, driving any single conversion for an n-bit SAR
converter, there are n windows in which large
external transient voltages can affect the conversion
result. Such glitches might originate from switching
power supplies, nearby digital logic, or high-power
devices. The degree of error in the digital output
depends on the reference voltage, layout, and the
exact timing of the external event. Their error can
change if the external event changes in time with
respect to the CLK input.
GROUNDING
The AGND pins should be connected to a clean
ground point. In all cases, this point should be the
analog ground. Avoid connections that are too close
to the grounding point of a microcontroller or digital
signal processor. If required, run a ground trace
directly from the converter to the power-supply entry
point. The ideal layout includes an analog ground
plane dedicated to the converter and associated
analog circuitry. Three signal ground pins (SGND) are
the input signal grounds that are on the same
potential as analog ground.
With this information in mind, power to the ADS8365
should be clean and well-bypassed. A 0.1µF ceramic
bypass capacitor should be placed as close to the
device as possible. In addition, a 1µF to 10µF
capacitor is recommended. If needed, an even larger
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APPLICATION INFORMATION
Different connection diagrams to DSPs or microcontrollers are shown in Figure 33 through Figure 39.
5V
5V
2.048V
AVDD
REF3220
REFIN
100nF
5V
V+
REFOUT
100kW
20kW
OPA343
-IN
SENSE
OUT
0.5V to 4.5V
100W
100W
CH A0+
100kW
40kW
40kW
1nF
VREF
VIN +IN
A0
REF 2
REF 1
CH A0-
2.5V
±10V
INA159
ADS8365
100W
100W
-IN
OUT
CH A1+
1nF
INA159
VIN
A1
CH A1-
+IN
REF 1/2
CH B0+
CH B0-
CH B1+
CH B1-
CH C0+
CH C0-
100W
100W
-IN
OUT
CH C1+
1nF
INA159
VIN
C1
CH C1-
+IN
REF 1/2
SGND
AGND
Figure 33. ±10V Input Range By Using the INA159
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3.3V
ADS8365
C28xx
BVDD
DVDD
PWM1
PWM2
PWM3
EA0
56
57
58
54
53
52
BVDD
HOLDA
HOLDB
HOLDC
A0
26
FD
30
23
WR
A1
EA1
ADD
BYTE
55
A2
EA2
EA3
31
8:1
OE
CS
IS
29
RD
EOC
RE
27
28
51
EXT_INT1
MCLKX
CLK
ADC_RST (MFSX)
RESET
DATA [0]
...
D0
...
48
...
DATA [15]
33
D15
VSS
BGND
Figure 34. Typical C28xx Connection (Hardware Control)
3.3V
BVDD
ADS8365
C28xx
56
57
BVDD
DVDD
HOLDA
HOLDB
58
26
A2
A1
A0
IS
HOLDC
FD
8:1
OE
23
55
54
53
52
ADD
BYTE
A0
31
29
30
CS
RD
RE
WE
A1
WR
27
28
EXT_INT1
MCLKX
EOC
A2
CLK
D0
...
DATA [0]
...
48
...
33
D15
DATA [15]
VSS
BGND
Figure 35. Typical C28xx Connection (Software Control)
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3.3V
ADS8365
C67xx
BVDD
DVDD
BVDD
56
57
58
TOUT1
HOLDA
HOLDB
HOLDC
30
53
WR
A1
A2
A1
8:1
OE
52
23
54
A0
A2
31
55
29
ADD
A0
CS
IS
BE0
RE
BYTE
RD
27
28
51
INT0
TOUT0
EOC
CLK
DB_CNTL0 (ED27)
RESET
D0
...
DATA [0]
...
48
...
33
D15
DATA [15]
VSS
BGND
Figure 36. Typical C67xx Connection (Cycle Mode—Hardware Control)
BVDD
3.3V
ADS8365
HOLDA
C67xx
56
57
58
26
23
55
BVDD
DVDD
HOLDB
HOLDC
FD
A2
A1
8:1
OE
A0
ADD
BYTE
A0
31
29
30
CS
RD
IS
54
53
52
RE
WE
INT0
TOUT0
A1
WR
27
28
EOC
A2
CLK
D0
...
DATA [0]
...
48
...
33
D15
DATA [15]
VSS
BGND
Figure 37. Typical C67xx Connection (Software Control)
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3.3V
ADS8365
C54xx
BVDD
DVDD
56
57
58
BVDD
TOUT0
HOLDA
HOLDB
HOLDC
A2
A1
A0
IS
26
54
53
FD
8:1
OE
A0
31
29
30
CS
RD
A1
52
30
23
55
A2
<
1
WR
ADD
BYTE
27
28
51
I/OSTRB
(1G32)
INT0
EOC
CLK
BCLKX1
XF
RESET
DATA [0]
...
D0
...
48
...
33
DATA [15]
D15
VSS
BGND
Figure 38. Typical C54xx Connection (FIFO Mode—Hardware Control)
3.3V
ADS8365
MSP430x1xx
DVDD
BVDD
BVDD
56
57
58
31
51
27
28
TACLK (P1.0)
HOLDA
HOLDB
HOLDC
CS
30
52
54
WR
ADD
A1
P1.1
53
23
55
A2
RESET
EOC
P1.2
P1.3 (ADC_INT)
SMCLK (P1.4)
BYTE
A0
CLK
29
DATA [0]
...
RD
P2.0
...
48
...
41
DATA [7]
P2.7
VSS
BGND
Figure 39. Typical MSP430x1xx Connection (Cycle Mode—Hardware Control)
30
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): ADS8365
ADS8365
www.ti.com .................................................................................................................................................... SBAS362C–AUGUST 2006–REVISED MARCH 2008
Part Change Notification # 20071210003
The ADS8365 device underwent a silicon change under Texas Instruments Part Change Notification (PCN)
number 20071210003. Details of this change can be obtained from the Product Information Center at Texas
Instruments or by contacting your local sales/distribution office. Devices with a date code of 81x and higher are
covered by this PCN.
Copyright © 2006–2008, Texas Instruments Incorporated
Submit Documentation Feedback
31
Product Folder Link(s): ADS8365
ADS8365
SBAS362C–AUGUST 2006–REVISED MARCH 2008.................................................................................................................................................... www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (November 2006) to Revision C ........................................................................................... Page
•
Added Part Change Notification information........................................................................................................................ 31
32
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): ADS8365
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ADS8365IPAG
ADS8365IPAGG4
ADS8365IPAGR
ACTIVE
ACTIVE
ACTIVE
TQFP
TQFP
TQFP
PAG
PAG
PAG
64
64
64
160
160
RoHS & Green
RoHS & Green
NIPDAU
Level-4-260C-72 HR
Level-4-260C-72 HR
Level-4-260C-72 HR
-40 to 85
-40 to 85
-40 to 85
ADS8365AI
NIPDAU
NIPDAU
ADS8365AI
ADS8365AI
1500 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2021
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ADS8365IPAGR
TQFP
PAG
64
1500
330.0
24.4
13.0
13.0
1.5
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TQFP PAG 64
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
ADS8365IPAGR
1500
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2022
TRAY
L - Outer tray length without tabs
KO -
Outer
tray
height
W -
Outer
tray
width
Text
P1 - Tray unit pocket pitch
CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
ADS8365IPAG
PAG
PAG
TQFP
TQFP
64
64
160
160
8 x 20
8 x 20
150
150
315 135.9 7620 15.2
315 135.9 7620 15.2
13.1
13.1
13
13
ADS8365IPAGG4
Pack Materials-Page 3
MECHANICAL DATA
MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996
PAG (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
48
M
0,08
33
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
0,25
12,20
SQ
0,05 MIN
11,80
0°–7°
1,05
0,95
0,75
0,45
Seating Plane
0,08
1,20 MAX
4040282/C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
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