AFE11612-SEP [TI]

具有温度传感器和 12 个 DAC 通道以及 16 个 ADC 通道的耐辐射 12 位模拟前端;


型号：	AFE11612-SEP
厂家：	TEXAS INSTRUMENTS
描述：	具有温度传感器和 12 个 DAC 通道以及 16 个 ADC 通道的耐辐射 12 位模拟前端温度传感传感器温度传感器
文件：	总9页 (文件大小：1459K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AFE11612-SEP

ZHCSRG3 –DECEMBER 2022

AFE11612-SEP 具有多通道ADC、DAC 和温度传感器的

耐辐射模拟监视器和控制器

1 特性

3 说明

• 抗辐射：

AFE11612-SEP 是一款高度集成的模拟监视和控制器

件，专为高密度通用监视和控制系统而设计。该器件包

含12 个12 位数模转换器(DAC) 和一个16 通道12 位

模数转换器 (ADC)。该器件还包含八个通用输入和输

出 (GPIO)、两个远程温度传感器通道和一个本地温度

传感器通道。

– 在125°C 的环境温度下，单粒子锁定(SEL) 抗

扰度高达

LET = 43 MeV-cm²/mg

– 单粒子功能中断(SEFI) 的LET 特征值高达43

MeV-cm²/mg

– 电离辐射总剂量(TID) RLAT/RHA 特征值高达

20 krad(Si)

• 增强型航天塑料（航天EP）：

该器件具有一个 2.5V 内部基准，可将 DAC 设置为 0V

至 5V 的输出电压范围。该器件还支持通过外部基准运

行。该器件支持通过 SPI 兼容接口和 I²C 兼容接口进

行通信。

– 符合ASTM E595 释气规格要求

– 供应商项目图(VID) V62/22614

– 军用级温度范围：–55°C 至+125°C

– 制造、组装和测试一体化基地

– 金键合线，NiPdAu 铅涂层

– 晶圆批次可追溯性

该器件的高集成度可显著减少组件数量并简化闭环系统

设计，从而使该器件成为辐射耐受性和布板空间至关重

要的高密度应用的理想选择。

封装信息

封装⁽¹⁾

– 延长了产品生命周期

– 延长了产品变更通知周期

• 12 个单调性12 位DAC

封装尺寸（标称值）

器件型号

AFE11612-SEP

HTQFP (64)

10.0mm × 10.0mm

(1) 要了解所有可用封装，请参见数据表末尾的封装选项附录。

– 0V 至5V 输出范围

– DAC 关断至用户定义电平

• 16 输入12 位SAR ADC

AFE11612-SEP

2.5-V

Reference

– 高采样率：500kSPS

– 16 个单端输入或

2 个差分输入和12 个单端输入

– 可编程超限报警

SPI / I²C

Serial

Interface

DAC-0

DAC

Outputs

• 8 个GPIO 引脚

• 内部2.5V 基准电压

• 两个远程温度传感器

• 内部温度传感器

• 可配置的SPI 和I²C 接口

GPIO

Control

DAC-11

8 GPIOs

– 2.7V 至5.5V 的工作电压

ADC

Inputs

2 Remote

Temperature

Sensors

Remote

Temperature

Sensor

ADC

MUX

2 应用

• 命令和数据处理(C&DH)

• 通信负载

• 雷达成像有效载荷

• 光学成像有效载荷

• 一般模拟监视和控制

Internal

Temperature

Sensor

简化版原理图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLASF76

AFE11612-SEP

ZHCSRG3 –DECEMBER 2022

www.ti.com.cn

4 Device and Documentation Support

4.1 Trademarks

所有商标均为其各自所有者的财产。

4.2 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

4.3 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: AFE11612-SEP

PACKAGE OPTION ADDENDUM

www.ti.com

26-Mar-2023

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

250

(1)

(2)

(3)

(4/5)

(6)

AFE11612PAPSEP

V62/22614-01XE

ACTIVE

HTQFP

PAP

RoHS & Green

NIPDAU

Level-3-260C-168 HR

-55 to 125

AFE11612

PAPSEP

Samples

ACTIVE

PAP

NIPDAU

AFE11612

PAPSEP

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

26-Mar-2023

Addendum-Page 2

GENERIC PACKAGE VIEW

PAP 64

10 x 10, 0.5 mm pitch

HTQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226442/A

www.ti.com

PACKAGE OUTLINE

PAP0064G

PowerPAD TQFP - 1.2 mm max height

SCALE 1.300

PLASTIC QUAD FLATPACK

10.2

9.8

NOTE 3

PIN 1 ID

10.2

9.8

12.2

TYP

11.8

NOTE 3

0.27

64X

60X 0.5

0.17

0.08

C A B

4X 7.5

SEATING PLANE

1.2 MAX

(0.127)

TYP

SEE DETAIL A

0.25

GAGE PLANE

(1)

0.15

0.05

0.08 C

0 -7

0.75

0.45

7.00

5.99

DETAIL A

TYPICAL

4218924/A 01/2022

PowerPAD is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs.

4. Strap features may not be present.

5. Reference JEDEC registration MS-026.

www.ti.com

EXAMPLE BOARD LAYOUT

PAP0064G

PowerPAD TQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(

NOTE 8

(

SYMM

SOLDER MASK

DEFINED PAD

64X (1.5)

(R0.05)

TYP

64X (0.3)

(11.4)

SYMM

(1.3 TYP)

60X (0.5)

(

0.2) TYP

VIA

METAL COVERED

BY SOLDER MASK

SEE DETAILS

(1.3 TYP)

(11.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4218924/A 01/2022

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,

Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,

plugged or tented.

10. Size of metal pad may vary due to creepage requirement.

www.ti.com

EXAMPLE STENCIL DESIGN

PAP0064G

PowerPAD TQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(

BASED ON 0.125

THICK STENCIL

SYMM

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

64X (1.5)

64X (0.3)

(R0.05) TYP

SYMM

(11.4)

60X (0.5)

METAL COVERED

BY SOLDER MASK

(11.4)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

7.83 X 7.83

7.0 X 7.0 (SHOWN)

6.39 X 6.39

0.125

0.15

0.175

5.92 X 5.92

4218924/A 01/2022

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

www.ti.com

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AFE11612-SEP [TI]

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