AFE4410 [TI]

适用于可穿戴设备光学心率监测和生物传感且具有 FIFO 的低功耗集成式 AFE;


型号：	AFE4410
厂家：	TEXAS INSTRUMENTS
描述：	适用于可穿戴设备光学心率监测和生物传感且具有 FIFO 的低功耗集成式 AFE 先进先出芯片
文件：	总11页 (文件大小：841K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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AFE4410

SBAS832B –MAY 2017–REVISED JULY 2019

AFE4410 Ultra-Small, Integrated AFE With FIFO for

Wearable, Continuous Optical Heart-Rate Monitoring and Biosensing

1 Features

2 Applications

•

Accurate, Continuous Heart-Rate Monitoring:

•

Optical Heart-Rate Monitoring (HRM) for

Wearables, Hearables

–

Up to 100-dB Dynamic Range for Accurate

Heart-Rate Detection

•

Heart-Rate Variability (HRV)

Pulse Oximetry (SpO₂) Measurements

Maximum Oxygen Consumption (VO₂Max)

–

Low Current for Continuous Operation on a

Wearable Device With a Typical Value:

–

30 µA for an LED, 25 µA for the Receiver

3 Description

•

Transmitter:

TheAFE4410is an analog front-end for optical

biosensing applications, such as heart rate monitoring

(HRM). The device supports a maximum of four

–

4 LEDs in Common Anode Configurations

8-Bit Programmable LED Current to 200 mA

Mode to Fire Two LEDs in Parallel

Programmable LED On-Time

switching light-emitting diodes (LEDs) and

maximum of three photodiodes (PDs). The electrical

current from the photodiode is converted into voltage

by the transimpedance amplifier (TIA) and digitized

using an analog-to-digital converter (ADC). The ADC

code is stored in a 128-sample first-in, first-out block

(FIFO) with programmable depth. The FIFO can be

read out using either an I²C interface or a serial

peripheral interface (SPI). The AFE also has a fully

integrated LED driver with 8-bit current control. The

device has high dynamic range transmit-and-receive

circuitry offering a dynamic range of up to 100 dB that

enables accurate heart ratesensing. The AFE

achieves extremely low current levels by operating an

ultralow power (ULP) mode set by using the

ENABLE_ULP register bit.

Simultaneous Support of 3 LEDs for Optimized

SpO₂, HRM, or Multiwavelength HRM

–

Average Current of 30 µA Adequate for a

Typical Heart-Rate Monitoring Scenario:

–

20-mA Setting, 60-µs Pulse Duration,

25-Hz Sampling Rate

•

Receiver:

–

Supports 3 Time-Multiplexed PD Inputs

24-Bit Representation of Current Input From

PD in Two's-Complement Format

–

Individual DC Offset Subtraction DAC

(Up to ±127-µA Range) at TIA Input for Each

LED, Ambient

Device Information⁽¹⁾

PART NUMBER

PACKAGE

BODY SIZE (NOM)

–

Digital Ambient Subtraction at ADC Output

Transimpedance Gain: 10 kΩ to 2 MΩ

AFE4410

DSBGA (30)

2.60 mm × 2.10 mm

(1) For all available packages, see the package option addendum

at the end of the datasheet.

Noise Filtering With Programmable Bandwidth

Receiver Operates at Approximately 1-µA/Hz

Sampling Rate (Example, 25 µA at 25 Hz)

Simplified Block Diagram

–

Hardware Power-Down Mode: Approximately

0-µA Current

TX_SUP

LED1

LED2

LED3

LED4

TX4

CONTROL1

RX_SUP

TX_SUP

IO_SUP

•

Flexible Pulse Sequencing and Timing Control

Clocking Via External Clock or Internal Oscillator

FIFO With 128-Sample Depth:

TX1

TX2

TX3

1.8 V LDOs

ALDO_1V8, DLDO_1V8

INP1

INM1

C_F

R_F

PD1

ILED

THR_DET_RDY

I2C_SPI_SEL

Threshold

Detection

Offset

DAC

Noise

reduction

filter (x4)

INP2

INM2

SPI/

I2C Interface

SPI

I2C

TIA

R_F

Decimation

ADC

PD2

PD3

FIFO

–

Programmable Partitioning Across Phases

RESETZ

INP3

INM3

•

Pin-Selectable I²C, SPI Interface

Operating Temperature Range: –20°C to +70°C

2.6-mm × 2.1-mm, 0.4-mm Pitch DSBGA Package

Supplies:

4 MHz

Oscillator

ADC_RDY

PROG_OUT1

C_F

Timing Engine

128 kHz

Oscillator

CLK

–

Tx: 3 V to 5.25 V

Rx: 1.8 V to 1.9 V (LDO Bypass),

2.0 V to 3.6 V (LDO Enabled)

–

IO: 1.7 V to Rx_SUP

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

AFE4410

SBAS832B –MAY 2017–REVISED JULY 2019

www.ti.com

4 Revision History

Changes from Revision A (May 2017) to Revision B

Page

•

Changed the Mechanical Packaging images ......................................................................................................................... 4

Changes from Original (May 2017) to Revision A

Page

•

Changed ±126-µA Range to ±127-µA Range ........................................................................................................................ 1

Submit Documentation Feedback

Product Folder Links: AFE4410

AFE4410

www.ti.com

SBAS832B –MAY 2017–REVISED JULY 2019

5 Device and Documentation Support

5.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

5.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

5.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

5.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

5.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Documentation Feedback

Product Folder Links: AFE4410

AFE4410

SBAS832B –MAY 2017–REVISED JULY 2019

www.ti.com

PACKAGE OUTLINE

YZ0030-C01

DSBGA - 0.5 mm max height

SCALE 5.000

DIE SIZE BALL GRID ARRAY

2.095

2.035

BALL A1

CORNER

2.595

2.535

0.5 MAX

SEATING PLANE

0.05 C

BALL TYP

0.19

0.13

1.6

TYP

0.85

TYP

SYMM

0.4

TYP

0.25

0.21

30X

PKG

0.015

C A B

0.4 TYP

4222550/D 07/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

Submit Documentation Feedback

Product Folder Links: AFE4410

AFE4410

www.ti.com

SBAS832B –MAY 2017–REVISED JULY 2019

EXAMPLE BOARD LAYOUT

YZ0030-C01

DSBGA - 0.5 mm max height

DIE SIZE BALL GRID ARRAY

(0.85)

(0.4) TYP

30X ( 0.23)

(0.4) TYP

PKG SYMM

PKG

LAND PATTERN EXAMPLE

SCALE:30X

( 0.23)

METAL

0.05 MAX

0.05 MIN

METAL UNDER

SOLDER MASK

(

0.23)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

4222550/D 07/2019

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

www.ti.com

Submit Documentation Feedback

Product Folder Links: AFE4410

AFE4410

SBAS832B –MAY 2017–REVISED JULY 2019

www.ti.com

EXAMPLE STENCIL DESIGN

YZ0030-C01

DSBGA - 0.5 mm max height

DIE SIZE BALL GRID ARRAY

(0.85)

(0.4) TYP

30X ( 0.25)

(R0.05) TYP

(0.4) TYP

METAL

TYP

PKG SYMM

PKG

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:35X

4222550/D 07/2019

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release.

www.ti.com

Submit Documentation Feedback

Product Folder Links: AFE4410

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AFE4410YZR

AFE4410YZT

ACTIVE

DSBGA

3000 RoHS & Green SAC396 | SNAGCU

250 RoHS & Green SAC396 | SNAGCU

Level-1-260C-UNLIM

0 to 0

AFE4410

-20 to 70

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

29-Jan-2020

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

AFE4410YZR

AFE4410YZT

DSBGA

3000

250

178.0

180.0

178.0

180.0

9.2

8.4

9.2

8.4

2.27

2.16

2.27

2.16

2.72

2.66

2.72

2.66

0.78

0.6

4.0

8.0

0.78

0.6

250

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

29-Jan-2020

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

AFE4410YZR

AFE4410YZT

DSBGA

3000

250

220.0

182.0

220.0

182.0

220.0

182.0

220.0

182.0

35.0

20.0

35.0

20.0

250

Pack Materials-Page 2

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable

warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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