AFE4432 [TI]

具有 FIFO 且适用于可穿戴设备光学生物传感的超小型、超低功耗、高 SNR 集成式 AFE;


型号：	AFE4432
厂家：	TEXAS INSTRUMENTS
描述：	具有 FIFO 且适用于可穿戴设备光学生物传感的超小型、超低功耗、高 SNR 集成式 AFE 先进先出芯片
文件：	总12页 (文件大小：1015K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AFE4432

ZHCSQY8 –AUGUST 2022

AFE4432 适用于光学生物传感应用的超小型集成式AFE

1 特性

3 说明

• 支持多达12 个相位集的信号采集

• 支持多达4 个LED 和3 个PD

• 在每个相位内均可实现灵活的LED 和PD 分配

• 从不同的传感器以不同的数据速率同时采集信号

• 精确、连续的PPG 监测：

– 可穿戴设备连续监测心率的低电流，其典型值

为：接收器为12μA

– 在0.5Hz - 10Hz 频带内的峰值系统SNR 为

115dB，可实现高精度SpO2 测量

• 发送器：

AFE4432 是一款面向诸如心率监测(HRM) 和周围毛细

血管氧饱和度 (SpO2) 测量等光学生物传感应用的模拟

前端。该器件支持多达 4 个开关发光二极管 (LED) 和

三个光电二极管 (PD)。AFE 配有两个带 8 位电流控制

的 LED 驱动器。该器件具有宽动态范围的发送和接收

电路，有助于检测超小信号电平。可定义多达 12 个信

号相位集，每个相位集都包含 LED 和环境相位的组

合。接收器输入端的低噪声失调 DAC 可自动控制，从

而消除环境光和 LED 光产生的直流。在各相位中，PD

所产生的电流先经 TIA 转换为电压，再滤波，然后使

用通用 ADC 进行数字化。ADC 代码可存储在 160 样

本的FIFO 块中。可使用SPI 或I²C 接口读取FIFO。

– 8 位可编程LED 电流，可调范围为25mA 至

250mA

– 可点亮两个并联LED 且具有独立的每相位电流

控制功能的模式

– 可编程每相位LED 导通时间

– 同时支持4 个LED，适用于SpO2、多波长

HRM

器件信息

封装⁽¹⁾

器件型号

封装尺寸（标称值）

AFE4432

DSBGA (25)

1.80mm x 1.92mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

• 接收器：

TX_SUP

– 支持3 路时分多路复用PD 输入

– 2 个并行接收器（2 组TIA/滤波器）

– 各TIA 输入端都具有独立环境失调电压消减

DAC，各相控制均为8 位，可调范围高达

255μA

TX_SUP

TX1

TX2

TX3

TX4

TI Gray Alternate

LED_DRV2

LED_DRV1

– 每个TIA 输入端具有单独的LED 失调电压消减

DAC，各相控制均为9 位，范围为64μA

– ADC 输出端的数字环境消减

SPI, I2C

FIFO

Cf1

INP1

INM1

Rf1

– 具有可编程带宽的噪声滤波器

– 跨阻增益：3.7 kΩ至1 MΩ

• 支持外部时钟或内部振荡器

• 可选择以与系统时钟同步的方式获取数据

• 自动消除环境、LED 直流

Noise

Reduction

Filter

Processing,

Decimation

Filters

INP2

INM2

ADC

TIA1

TI Gray Alternate

–

Rf1

INP3

INM3

ADC_RDY

GPIO

Oscillator

4 MHz

Timing

Engine

Cf1

AACM

• 采样深度为160 的FIFO

2 PPG RX Channels

Oscillator

256 kHz

• SPI™ 接口/I2C 接口

CLK

• 1.9mm × 1.8mm DSBGA 封装，0.35mm 间距

• 电源：接收：1.7V - 1.9V，发射：3V - 5.5V

2 应用

• 用于可穿戴设备和耳戴式设备的光学心率监测

(HRM)

• 心率变异性(HRV) 分析

• 血氧饱和度(SpO2) 测量

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SBASAL9

AFE4432

ZHCSQY8 –AUGUST 2022

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Table of Contents

4.4 Electrostatic Discharge Caution..................................3

4.5 术语表......................................................................... 3

5 Mechanical, Packaging, and Orderable Information....3

5.1 Package Option Addendum........................................4

5.2 Tape and Reel Information..........................................5

5.3 Mechanical Data......................................................... 7

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Device and Documentation Support..............................3

4.1 接收文档更新通知....................................................... 3

4.2 支持资源......................................................................3

4.3 Trademarks.................................................................3

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4 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

4.1 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

4.2 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

4.3 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

4.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

4.5 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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5.1 Package Option Addendum

Packaging Information

Orderable

Device

Package

Drawing

Lead/Ball

Finish⁽⁶⁾

MSL Peak

Temp⁽³⁾

Device

Status⁽¹⁾

ACTIVE

Package Type

Pins

Package Qty

3000

Eco Plan⁽²⁾

Op Temp (°C)

-20 to 85

Marking^{(4) (5)}

Green (RoHS &

no Sn/Br)

Level-1-260C-

UNLIM

AFE4432YCHR

DSBGA

YCH

SNAGCU

AFE4432

Green (RoHS &

no Sn/Br)

Level-1-260C-

UNLIM

AFE4432YCHT

250

-20 to 85

AFE4432

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest

availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the

requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified

lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used

between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by

weight in homogeneous material).

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the

finish value exceeds the maximum column width.

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5.2 Tape and Reel Information

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

Reel

Diameter

(mm)

Reel

Width W1

(mm)

Package

Type

Package

Drawing

(mm)

Pin1

Quadrant

Device

Pins

SPQ

AFE4432YCHR

AFE4432YCHT

DSBGA

YCH

3000

250

128.0

9.2

1.92

2.02

0.48

4.0

12.0

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TAPE AND REEL BOX DIMENSIONS

Width (mm)

Device

Package Type

Package Drawing Pins

SPQ

3000

250

Length (mm) Width (mm)

Height (mm)

55.0

AFE4432YCHR

AFE4432YCHT

DSBGA

YCH

345.0

365.0

55.0

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5.3 Mechanical Data

PACKAGE OUTLINE

YCH0025-C01

DSBGA - 0.365 mm max height

SCALE 8.000

DIE SIZE BALL GRID ARRAY

1.83

1.77

BALL A1

CORNER

1.945

1.885

0.365 MAX

SEATING PLANE

0.05 C

BALL TYP

0.125

0.065

1.4 TYP

SYMM

1.4

TYP

SYMM

0.35

TYP

0.20

0.16

25X

0.015

C A B

0.35 TYP

4227031/A 08/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

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EXAMPLE BOARD LAYOUT

YCH0025-C01

DSBGA - 0.365 mm max height

DIE SIZE BALL GRID ARRAY

(0.35) TYP

25X ( 0.18)

(0.35) TYP

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 40X

0.0375 MIN

0.0375 MAX

METAL UNDER

SOLDER MASK

(

0.18)

METAL

EXPOSED

METAL

(

0.18)

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK

DEFINED

(PREFERRED)

NON-SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

4227031/A 08/2021

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

www.ti.com

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EXAMPLE STENCIL DESIGN

YCH0025-C01

DSBGA - 0.365 mm max height

DIE SIZE BALL GRID ARRAY

(0.35) TYP

(R0.05) TYP

25X ( 0.21)

(0.35) TYP

SYMM

METAL

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.075 mm THICK STENCIL

SCALE: 40X

4227031/A 08/2021

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

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PACKAGE OPTION ADDENDUM

www.ti.com

16-Sep-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AFE4432YCHR

AFE4432YCHT

ACTIVE

DSBGA

YCH

3000 RoHS & Green

250 RoHS & Green

Call TI

Level-1-260C-UNLIM

-40 to 85

AFE4432

Samples

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

16-Sep-2022

Addendum-Page 2

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

AFE4432 [TI]

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