AFE4460YBGT [TI]
具有 FIFO 且适用于可穿戴设备光学生物检测的高 SNR、超低功耗集成式 AFE | YBG | 36 | -40 to 85;型号: | AFE4460YBGT |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 FIFO 且适用于可穿戴设备光学生物检测的高 SNR、超低功耗集成式 AFE | YBG | 36 | -40 to 85 先进先出芯片 |
文件: | 总9页 (文件大小:911K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AFE4460
ZHCSPX5 –JUNE 2022
AFE4460 光学生物检测用超小型集成式AFE
1 特性
3 说明
• 支持多达16 个相位集的信号采集
• 支持多达32 个LED 和4 个PD
• 在每个相位内均可实现灵活的LED 和PD 分配
• 从不同的传感器以不同的数据速率同时采集信号
• 精确、连续的PPG 监测:
AFE4460 是一款面向诸如心率监测(HRM) 和周围毛细
血管氧饱和度 (SpO2) 测量等光学生物传感应用的模拟
前端。该器件支持多达 32 个可切换发光二极管 (LED)
和四个光电二极管 (PD)。AFE 配有两个带 8 位电流控
制的 LED 驱动器。该器件具有宽动态范围的发送和接
收电路,有助于检测超小信号电平。可定义多达 16 个
信号相位集,每个相位集都包含 LED 和环境相位的组
合。接收器输入端的低噪声失调 DAC 可自动控制,从
而消除环境光和 LED 光产生的直流。在各相位中,4
个 PD 所产生的电流先经 TIA 转换为电压,再滤波,
然后使用通用 ADC 进行数字化。ADC 代码可存储在
256 样本的 FIFO 块中。可使用 SPI 或 I2C 接口读取
FIFO。
– 可穿戴设备连续监测心率的低电流,其典型值
为:LED 为15μA,接收器为15μA
– 系统峰值SNR 为115dB
• 发送器:
– 8 位可编程LED 电流,可调范围为25mA 至
250mA
– 可点亮两个并联LED 且具有独立的每相位电流
控制功能的模式
– 每相位可编程LED 导通时间
– 同时支持32 个LED,适用于SpO2、多波长
HRM 和光谱分析
器件信息
封装(1)
器件型号
封装尺寸(标称值)
AFE4460
DSBGA (36)
2.60mm × 2.60mm
• 接收器:
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
– 支持4 路时分多路复用PD 输入
– 4 个并行接收器(4 组TIA/滤波器)
– 各TIA 输入端都具有独立环境失调电压消减
DAC,各相控制均为8 位,可调范围高达
255μA
TX_SUP TXN1 TXN2 TXN3 TXN4 TXN5 TXN6 TXN7 TXN8
TXP1 TXP2 TXP3 TXP4
VDD_INT
LDO
– 每个TIA 输入端具有单独的LED 失调电压消减
DAC,各相控制均为9 位,范围为64μA
– ADC 输出端的数字环境消减
TX_SUP
LED_DRV2
LED_DRV1
SPI, I2C
SPI, I2C
FIFO
INP1
INM1
– 具有可编程带宽的噪声滤波器
– 跨阻增益:3.7 kΩ至1 MΩ
• 支持外部时钟或内部振荡器
• 可选择以与系统时钟同步的方式获取数据
• 自动消除环境、LED 直流
• 采样深度为256 的FIFO
• SPI™ 接口/I2C 接口
• 2.6mm × 2.6mm DSBGA 封装,0.4mm 间距
• 电源:Rx:1.7V 至1.9V(LDO 旁路);1.9V 至
3.6V(启用LDO),Tx:3-5.5V,IO:1.7-
RX_SUP
Cf1
INP2
INM2
Rf1
M
U
X
Noise
Processing,
Decimation
Filters
+
ADC
Reduction
Filter
TIA1
–
INP3
INM3
Rf1
ADC_RDY
GPIO
8 MHz
Oscillator
Timing
Engine
Cf1
INP4
INM4
AACM
4 PPG RX Channels
256 kHz
Oscillator
CLK
2 应用
• 用于可穿戴设备和耳戴式设备的光学心率监测
(HRM)
• 心率变异性(HRV) 分析
• 血氧饱和度(SpO2) 测量
• 光谱分析
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SBASAL6
AFE4460
ZHCSPX5 –JUNE 2022
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Documentation Support.............................................. 3
5.2 接收文档更新通知....................................................... 3
5.3 支持资源......................................................................3
5.4 Trademarks.................................................................3
5.5 Electrostatic Discharge Caution..................................3
5.6 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....3
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
June 2022
*
Initial Release
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: AFE4460
AFE4460
ZHCSPX5 –JUNE 2022
www.ti.com.cn
5 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
5.1 Documentation Support
5.1.1 Related Documentation
5.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: AFE4460
PACKAGE OPTION ADDENDUM
www.ti.com
9-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE4460YBGR
AFE4460YBGT
ACTIVE
ACTIVE
DSBGA
DSBGA
YBG
YBG
36
36
3000 RoHS & Green
250 RoHS & Green
SAC396
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
AFE4460
AFE4460
Samples
Samples
SAC396
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Dec-2022
Addendum-Page 2
PACKAGE OUTLINE
YBG0036
DSBGA - 0.5 mm max height
SCALE 6.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.20
0.14
BALL TYP
2 TYP
SYMM
F
E
D
C
2
TYP
SYMM
D: Max = 2.59 mm, Min = 2.53 mm
E: Max = 2.59 mm, Min = 2.53 mm
B
A
0.4 TYP
0.27
2
1
4
5
6
3
36X
0.23
0.015
C A B
0.4 TYP
4224846/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.23)
2
1
4
5
6
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224846/A 03/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.25)
(0.4) TYP
(R0.05) TYP
6
2
1
4
5
A
B
C
SYMM
METAL
TYP
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4224846/A 03/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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