AFE4950_V02 [TI]
AFE4950 Ultra-Small, Integrated AFE for Wearable Optical Heart-Rate Monitoring, SpO2 and Electrical Bio-sensing;
| 型号： | AFE4950_V02 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AFE4950 Ultra-Small, Integrated AFE for Wearable Optical Heart-Rate Monitoring, SpO2 and Electrical Bio-sensing 监控 |
| 文件： | 总11页 (文件大小：1145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFE4950
SBASA37B – JUNE 2020 – REVISED JULY 2021
AFE4950 Ultra-Small, Integrated AFE for Wearable Optical Heart-Rate Monitoring,
SpO2 and Electrical Bio-sensing
•
•
•
SPI, I2C interfaces: Selectable by pin
2.6-mm × 2.5-mm DSBGA, 0.4-mm Pitch
Supplies: Rx:1.7-1.9V (LDO Bypass); 1.9-3.6V
(LDO Enabled), Tx:3-5.5V, IO:1.7-RX_SUP
1 Features
•
Supports simultaneous and synchronized
acquisition of up to 24 PPG and a single-lead ECG
signal.
2 Applications
•
•
Flexible allocation of 8 LED, 4 PD in each phase
ECG signal chain:
•
Optical Heart-Rate Monitoring (HRM) for
Wearables, Hearables
High performance ECG signal acquisition
Synchronized PPG, ECG for BP estimation
Heart-rate variability (HRV)
– 1-lead ECG signal acquisition up to 2 kHz
– RLD output to drive a third electrode
– Input noise : 0.7 µV-rms
•
•
•
•
– Supports up to ±0.65 V differential DC offset
and +/-0.55 V common mode range
– Programmable INA gain: 11, 21
– High-pass filter with quick saturation recovery
– Integrated 300 Hz anti-aliasing low pass filter
– AC, DC lead-off detect: 2.9 nA to 92.5 nA
– Low power continuous lead-on detection
Impedance signal chain
– Continuous low-power monitoring of impedance
between 2 electrodes
– 7 MΩ range
– 300 Ω noise on 620 kΩ
PPG Transmitter:
Pulse oximetry (SpO2) measurements
3 Description
The AFE4950 device is an analog front-end (AFE)
for synchronized signal acquisition of PPG and ECG
signals. The device can also be used for optical bio-
sensing applications, such as heart-rate monitoring
(HRM) and saturation of peripheral capillary oxygen
(SpO2). The ECG signal chain supports 2- and 3-
electrode configurations and has an integrated Right
leg drive (RLD) buffer. The ECG signal chain can also
be used to do a continuous, low-power monitoring of
the impedance between pair of electrodes.
•
•
– 8-Bit Programmable LED Current with range
adjustable from 25 mA to 250 mA
– Mode to fire two LEDs in parallel
– Support of 8 LEDs in Common Anode
configuration for SpO2, Multi-Wavelength HRM
PPG Receiver:
Device Information
PART NUMBER
AFE4950
PACKAGE(1)
BODY SIZE (NOM)
DSBGA (36)
2.60 mm × 2.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
– 2 parallel receivers (two sets of TIA/ filter)
– Supports 4 Time-Multiplexed Photodiode Inputs
to each Receiver
– 8-bit Ambient Offset subtraction at each TIA
input with 256 µA range
– 8-bit LED Offset Subtraction DAC with 64 µA
range
– Automatic ambient cancellation and dynamic
LED DC cancellation at TIA input
– Ambient rejection close to 100 dB up to 10 Hz
– Noise filtering with programmable bandwidth
– Trans-impedance Gain: 3.7 kΩ to 1 MΩ
Accurate, Continuous Heart-Rate Monitoring:
•
– System SNR up to 109-dB at 16 µA PD current
– Low Current for Continuous Operation on a
Wearable Device with a Typical Value: 15-μA
for an LED, 20-μA for the Receiver
External clock and internal oscillator modes
Acquire data synchronized with system master
clock
Simplified Schematic
•
•
•
FIFO with 256-sample Depth
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE4950
www.ti.com
SBASA37B – JUNE 2020 – REVISED JULY 2021
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2020) to Revision B (July 2021)
Page
•
Changed the Features list AC, DC lead-off detect value From: 2.6-nA to 85-nA To: 2.9 nA to 92.5 nA ............1
Changes from Revision * (June 2020) to Revision A (July 2020)
Page
•
Changed the data sheet From: Advanced Information To: Production data.......................................................1
Copyright © 2021 Texas Instruments Incorporated
2
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Product Folder Links: AFE4950
AFE4950
www.ti.com
SBASA37B – JUNE 2020 – REVISED JULY 2021
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: AFE4950
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE4950YBGR
AFE4950YBGT
ACTIVE
ACTIVE
DSBGA
DSBGA
YBG
YBG
36
36
3000 RoHS & Green
250 RoHS & Green
SAC396
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
AFE4950
AFE4950
SAC396
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AFE4950YBGR
AFE4950YBGT
DSBGA
DSBGA
YBG
YBG
36
36
3000
250
330.0
330.0
12.4
12.4
2.64
2.64
2.8
2.8
0.74
0.74
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
AFE4950YBGR
AFE4950YBGT
DSBGA
DSBGA
YBG
YBG
36
36
3000
250
345.0
345.0
365.0
365.0
55.0
55.0
Pack Materials-Page 2
PACKAGE OUTLINE
YBG0036
DSBGA - 0.5 mm max height
SCALE 6.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.20
0.14
BALL TYP
2 TYP
SYMM
F
E
D
C
2
TYP
SYMM
D: Max = 2.59 mm, Min = 2.53 mm
E: Max = 2.49 mm, Min = 2.43 mm
B
A
0.4 TYP
0.27
2
1
4
5
6
3
36X
0.23
0.015
C A B
0.4 TYP
4224846/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.23)
2
1
4
5
6
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224846/A 03/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.25)
(0.4) TYP
(R0.05) TYP
6
2
1
4
5
A
B
C
SYMM
METAL
TYP
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4224846/A 03/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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