AFE5832ZBV [TI]

具有 42mW/通道功率、LVDS 接口和 CW 无源混频器的 32 通道超声波 AFE | ZBV | 289 | 0 to 85;


型号：	AFE5832ZBV
厂家：	TEXAS INSTRUMENTS
描述：	具有 42mW/通道功率、LVDS 接口和 CW 无源混频器的 32 通道超声波 AFE \| ZBV \| 289 \| 0 to 85
文件：	总11页 (文件大小：1014K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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AFE5832

SBOS887A –AUGUST 2017–REVISED APRIL 2018

AFE5832 32-Channel Ultrasound AFE With 35-mW/Channel Power,

2.1 nV/√Hz Noise, 12-Bit, 40-MSPS or 10-Bit, 50-MSPS Output, Passive CW Mixer and

LVDS Interface

1 Features

•

32-Channel, AFE for Ultrasound Applications:

•

Low Harmonic Distortion: –55 dBc

Fast and Consistent Overload Recovery

Continuous Wave (CW) Path With:

–

Input Attenuator, LNA, LPF, ADC,

and CW Mixer

–

Digital Time Gain Compensation (DTGC)

Total Gain Range: 12 dB to 51 dB

Linear Input Range: 800 mV_PP

–

Low Close-In Phase Noise of –151 dBc/Hz

at 1-kHz Frequency Offset Off 2.5-MHz Carrier

–

Phase Resolution: λ / 16

Supports 16X CW Clock

•

Input Attenuator With DTGC:

12-dB Suppression on Third and Fifth

Harmonics

–

8-dB to 0-dB Attenuation With 0.125-dB Step

Supports Matched Impedance for:

•

LVDS Interface With a Speed Up to 1 Gbps

Small Package: 15-mm × 15-mm NFBGA-289

–

50-Ω to 800-Ω Source Impedance

Low-Noise Amplifier (LNA) With DTGC:

–

20-dB to 51-dB Gain With 0.125-dB Step

2 Applications

Low Input Current Noise: 1.2 pA/√Hz

•

Medical Ultrasound Imaging

•

3rd-Order, Linear-Phase, Low-Pass Filter (LPF):

5 MHz, 7.5 MHz, 10 MHz, and 12.5 MHz

Nondestructive Evaluation Equipment

Sonar Imaging Equipment

–

16 ADCs Converting at 12-Bit, 80 MSPS or 10-bit,

100 MSPS:

Multichannel, High-Speed Data Acquisition

–

Each ADC Converts Two Sets of Inputs at Half

Rate

3 Description

The AFE5832 device is a highly-integrated, analog

front-end solution specifically designed for ultrasound

systems where high performance, low power, and

small size are required.

–

12-Bit ADC: 72-dBFS SNR

10-Bit ADC: 61-dBFS SNR

•

Optimized for Noise and Power:

–

35 mW/Ch at 2.1 nV/√Hz, 40 MSPS

42 mW/Ch at 1.4 nV/√Hz, 40 MSPS

52 mW/Ch at 1.3 nV/√Hz, 40 MSPS

60 mW/Ch in CW Mode

Device Information⁽¹⁾

PART NUMBER

PACKAGE

BODY SIZE (NOM)

AFE5832

NFBGA (289)

15.00 mm × 15.00 mm

(1) For all available packages, see the package option addendum

at the end of the datasheet.

Excellent Device-to-Device Gain Matching:

–

±0.5 dB (Typical)

Simplified Block Diagram

SPI IN

SPI Logic

ATTEN

8 dB

0 dB

INP

3^rd-Order LPF with

5 MHz, 7.5 MHz,

10- or

12-Bit

ADC

LNA

20 dB to

51 dB

Digital

Processing

LVDS

10 MHz, and 12.5 MHz

INM

Cross-Point

Switch

CW Mixer

Reference

TGC Control

Signals

DTGC Engine

16-Phase

Generator

CW Clocks

CW Current Outputs

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

AFE5832

SBOS887A –AUGUST 2017–REVISED APRIL 2018

www.ti.com

Table of Contents

6.2 Receiving Notification of Documentation Updates.... 4

6.3 Community Resources.............................................. 4

6.4 Trademarks............................................................... 4

6.5 Electrostatic Discharge Caution................................ 4

6.6 Glossary.................................................................... 4

Features.................................................................. 1

Applications ........................................................... 1

Description ............................................................. 1

Revision History..................................................... 2

Description (continued)......................................... 3

Device and Documentation Support.................... 4

6.1 Documentation Support ............................................ 4

Mechanical, Packaging, and Orderable

Information ............................................................. 5

7.1 Tray Information........................................................ 6

4 Revision History

Changes from Original (August 2017) to Revision A

Page

•

Changed Power and Noise values in the Title ...................................................................................................................... 1

Added values for Ultra low-power mode in Features section ................................................................................................ 1

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Product Folder Links: AFE5832

AFE5832

www.ti.com

SBOS887A –AUGUST 2017–REVISED APRIL 2018

5 Description (continued)

The AFE5832 is an integrated analog front-end (AFE) optimized for medical ultrasound application. The device is

realized through a multichip module (MCM) with three dies: two voltage-controlled amplifier (VCA) dies and one

analog-to-digital converter (ADC) die. Each VCA die has 16 channels and the ADC die converts all of the 32

channels.

Each channel in the VCA die is configured in either of two modes: time gain compensation (TGC) mode or

continuous wave (CW) mode. In TGC mode, each channel includes an input attenuator (ATTEN), a low-noise

amplifier (LNA) with variable-gain, and a third-order, low-pass filter (LPF). The attenuator supports an attenuation

range of 8 dB to 0 dB, and the LNA supports gain ranges from 20 dB to 51 dB. The LPF cutoff frequency can be

configured at 5 MHz, 7.5 MHz, 10 MHz, or 12.5 MHz to support ultrasound applications with different

frequencies. In CW mode, each channel includes an LNA with a fixed gain of 18 dB, and a low-power passive

mixer with 16 selectable phase delays. Different phase delays can be applied to each analog input signal to

perform an on-chip beamforming operation. A harmonic filter in the CW mixer suppresses the third and fifth

harmonic to enhance the sensitivity of the CW Doppler measurement.

The ADC die has 16 physical ADCs. Each ADC converts two sets of outputs – one from each VCA die. The ADC

is configured to operate with a resolution of 12 bits or 10 bits. The ADC resolution can be traded off with

conversion rate, and operates at maximum speeds of 80 MSPS and 100 MSPS at 12-bit and 10-bit resolution,

respectively. The ADC is designed to scale its power with sampling rate. The output interface of the ADC comes

out through a low-voltage differential signaling (LVDS) which can easily interface with low-cost field-

programmable gate arrays (FPGAs).

The AFE5832 also allows various power and noise combinations to be selected for optimizing system

performance. Therefore, this device is a suitable ultrasound AFE solution for systems with strict battery-life

requirements.

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Product Folder Links: AFE5832

AFE5832

SBOS887A –AUGUST 2017–REVISED APRIL 2018

www.ti.com

6 Device and Documentation Support

6.1 Documentation Support

6.1.1 Related Documentation

For related documentation see the following:

•

AFE5818 16-Channel, Ultrasound, Analog Front-End with 140-mW/Channel Power, 0.75-nV/√Hz Noise, 14-

Bit, 65-MSPS or 12-Bit, 80-MSPS ADC, and Passive CW Mixer

•

ADS8413 16-BIT, 2-MSPS, LVDS SERIAL INTERFACE, SAR ANALOG-TO-DIGITAL CONVERTER

ADS8472 16-BIT, 1-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER

SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE

•

CDCE72010 Ten Output High Performance Clock Synchronizer, Jitter Cleaner, and Clock Distributor

CDCM7005 3.3-V High Performance Clock Synchronizer and Jitter Cleaner

ISO724x High-Speed, Quad-Channel Digital Isolators

LMK0480x Low-Noise Clock Jitter Cleaner with Dual Loop PLLs

OPA1632 High-Performance, Fully-Differential Audio Operational Amplifier

OPA2x11 1.1-nv/√Hz Noise, Low Power, Precision Operational Amplifier

SN74AUP1T04 LOW POWER, 1.8/2.5/3.3-V INPUT, 3.3-V CMOS OUTPUT, SINGLE INVERTER GATE

THS413x High-Speed, Low-Noise, Fully-Differential I/O Amplifiers

MicroStar BGA Packaging Reference Guide

6.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

6.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

6.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

6.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

6.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

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Product Folder Links: AFE5832

AFE5832

www.ti.com

SBOS887A –AUGUST 2017–REVISED APRIL 2018

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Documentation Feedback

Product Folder Links: AFE5832

AFE5832

SBOS887A –AUGUST 2017–REVISED APRIL 2018

www.ti.com

7.1 Tray Information

Figure 1. Tray Diagram, Section 1

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Product Folder Links: AFE5832

AFE5832

www.ti.com

SBOS887A –AUGUST 2017–REVISED APRIL 2018

Tray Information (continued)

Figure 2. Tray Diagram, Section 2

Submit Documentation Feedback

Product Folder Links: AFE5832

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AFE5832ZBV

ACTIVE

NFBGA

ZBV

289

126

RoHS & Green

SNAGCU

Level-3-260C-168 HR

0 to 85

AFE5832

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jan-2022

TRAY

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device

Package Package Pins SPQ Unit array

Max

matrix temperature

(°C)

L (mm)

Name

Type

(mm) (µm) (mm) (mm) (mm)

AFE5832ZBV

ZBV

NFBGA

289

126

7 X 18

150

315 135.9 7620 17.2

11.3 16.35

Pack Materials-Page 1

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, regulatory or other requirements.

These resources are subject to change without notice. TI grants you permission to use these resources only for development of an

application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license

is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you

will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these

resources.

TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with

such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for

TI products.

TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

AFE5832ZBV [TI]

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