AFE7685IABJ [TI]
具有 14 位 9GSPS DAC 和 3GSPS ADC 的 4TX/4RX 射频采样收发器 | ABJ | 400 | -40 to 85;
| 型号： | AFE7685IABJ |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 14 位 9GSPS DAC 和 3GSPS ADC 的 4TX/4RX 射频采样收发器 | ABJ | 400 | -40 to 85 射频 |
| 文件： | 总15页 (文件大小：753K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
具有 14 位 9GSPS DAC 和 14 位 3GSPS ADC 的 AFE76xx 四通道/双
通道、射频采样模拟前端
1 器件概述
1.1 特性
1
– 用于 DUC/DDC 的 32 位 NCO
• 14 位分辨率
– 插值率：6 倍、8 倍、9 倍、12 倍、16 倍、18
倍、24 倍、36 倍
– 抽取率：/2、/3、/4、/6、/8、/9、/12、/16、
/18、/24、/32
• 采样率：
– DAC：9GSPS
– ADC：3GSPS
• 射频频率范围：高达 5.2GHz
• 最大射频信号带宽
– 适用于 TDD 的 RX/FB 动态转换
• 接口：
– 四通道模式 (4T4R)：800MHz（单频带）；
300MHz（双频带）
– 双通道模式 (2T2R)：1200MHz (TX)/1000MHz
(RX)（单频带）；800MHz（双频带）
– 8 个高达 15Gbps 的 SerDes 收发器
– 采用 8b/10b 编码的 16 位和 12 位 JESD204B 传
输层格式
– 子类 1 多器件同步
• 时钟：
– 用于生成 DAC 和 ADC 时钟的内部 PLL/VCO
• 封装：17mm x 17mm FC BGA，间距为 0.8mm
• 电源：1.85V、1.15V、1.0V、–1.8V
• 每 RX 通道配备片上双频可选择 DSA
• 集成型 TX DSA 功能
• 数字：
– 双频带数字上变频器 (DUC)
– 双频带数字下变频器 (DDC)
1.2 应用
•
•
蜂窝基站
宽带通信
•
•
微波回程连线
分布式天线系统 (DAS)
1.3 说明
AFE76xx 是一系列高性能四通道/双通道 14 位集成式射频采样模拟前端 (AFE)，配备 9 个 GSPS DAC 和 3
个 GSPS ADC，支持合成和数字化宽带信号。高动态范围使得 AFE76xx 能够为无线基站生成和数字化
3G/4G 信号。在 TDD 模式下，接收器通道经过配置可在流量接收器 (TDD RX) 状态和宽带反馈接收器
(TDD FB) 状态间动态切换以辅助发送器路径上功率放大器 (PA) 的 DPD（数字预失真）。
AFE76xx 系列在接收器通道上具有集成式 DSA，同时支持发送器通道上等同于 DSA 的功能。每个接收器通
道都有一个模拟射频峰值功耗检测器和多个数字功耗检测器，可在接收器通道上辅助进行自动增益控制
(AGC)，另有两个射频过载检测器可实现器件可靠性保护。AFE76xx 系列拥有 8 个兼容 JESD204B 的
SerDes 收发器，运行速率高达 15Gbps。这些器件每 TX 通道拥有多达 2 个 DUC，每 RX 通道拥有 2 个
DDC，采用多种插值/抽取率以及具有频率灵活的独立 NCO 的数字正交调制器/解调器。这些器件在单频带
模式下支持超过 1000MHz（4T4R 下为 800MHz）射频信号带宽，在双频带模式下支持每频带高达
800MHz（4T4R 下为 300MHz）射频信号带宽。低抖动 PLL/VCO 通过允许使用频率较低的参考时钟来简化
采样时钟的生成。
器件信息(1)
封装
器件型号
封装尺寸
AFE7685
AFE7686
AFE7684
AFE7683
AFE7681
FC-BGA
FC-BGA
FC-BGA
FC-BGA
FC-BGA
17.00mm x 17.00mm
17.00mm x 17.00mm
17.00mm x 17.00mm
17.00mm x 17.00mm
17.00mm x 17.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLASEQ7
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
www.ti.com.cn
1.4 功能方框图
VDDTX18AB
VDDTXAB
VDDTX18CD
VDDTXCD
Divider
/2, /3, /4
Temp Sensor
VEE18AB
VDDL1AB
Low jitter PLL
VEE18CD
VDDL1CD
VDDL2CD
DVDD
VDDL2AB
DVDD
TXB DSA
DAC
TXD DSA
DAC
TXDP/M
TXBP/M
DUC
DUC
NCO NCO
NCO
NCO
TXAP/M
TXCP/M
DAC
DUC
DAC
DUC
TXC DSA
TXA DSA
RX1P8V
RX1P2V
RX1P8V
RX1P2V
DSA
DSA
DSA
DSA
RXCDSA1P/M
RXADSA1P/M
Buffer
SHA
ADC
Buffer SHA
DDC
DDC
ADC
RXCDSA2P/M
RXADSA2P/M
DVDD
DVDD
FSPICLKD
FSPIDD
NCO NCO
NCO NCO
FSPICLKA
FSPIDA
DSA
DSA
DSA
DSA
RXDDSA1P/M
RXBDSA1P/M
Buffer
SHA
Buffer SHA
ADC
ADC
DDC
DDC
RXDDSA2P/M
RXBDSA2P/M
FSPICLKC
FSPIDC
FSPICLKB
FSPIDB
SerDes
JTAG
图 1-1. AFE7685/AFE7686 功能方框图
2
器件概述
版权 © 2018–2019, Texas Instruments Incorporated
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
www.ti.com.cn
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
Divider
/2, /3, /4
Temp Sensor
Low jitter PLL
VDDTX18AB
VDDTXAB
VEE18AB
VDDTX18CD
VDDTXCD
VEE18CD
VDDL1CD
VDDL2CD
DVDD
VDDL1AB
NCO NCO
NCO NCO
VDDL2AB
DVDD
TXAP/M
TXCP/M
DAC
DUC
DAC
DUC
TXC DSA
TXA DSA
RX1P8V
RX1P2V
RX1P8V
RX1P2V
DSA
DSA
DSA
DSA
RXCDSA1P/M
RXADSA1P/M
Buffer
SHA
ADC
Buffer SHA
DDC
DDC
ADC
RXCDSA2P/M
RXADSA2P/M
DVDD
DVDD
FSPICLKD
FSPIDD
NCO NCO
NCO NCO
FSPICLKA
FSPIDA
DSA
DSA
DSA
DSA
RXDDSA1P/M
RXBDSA1P/M
Buffer
SHA
Buffer SHA
ADC
ADC
DDC
DDC
RXDDSA2P/M
RXBDSA2P/M
FSPICLKC
FSPIDC
FSPICLKB
FSPIDB
SerDes
JTAG
图 1-2. AFE7684 功能方框图
2 修订历史记录
Changes from Revision D (December 2018) to Revision E
Page
•
已更改 将 AFE7681 从“预告信息”更改为“生产数据”.............................................................................. 1
Changes from Revision C (October 2018) to Revision D
Page
•
已添加 AFE7681 作为“预告信息”，AFE7683 作为“生产数据”................................................................... 1
Changes from Revision B (September 2018) to Revision C
Page
•
已更改 将 AFE7684 从“预告信息”更改为“生产数据”.............................................................................. 1
Changes from Revision A (July 2018) to Revision B
Page
•
已更改 将 AFE7686 从“预告信息”更改为“生产数据”.............................................................................. 1
版权 © 2018–2019, Texas Instruments Incorporated
修订历史记录
3
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
www.ti.com
Changes from Original (May 2018) to Revision A
Page
•
•
已更改 将 AFE7684 从“产品预览”更改为“预告信息”，将 AFE7685 从“产品预览”更改为“生产数据”........................ 1
已删除 从数据手册中删除了 AFE7683 ............................................................................................. 1
4
修订历史记录
Copyright © 2018–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
www.ti.com.cn
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
3 Device Comparison
Table 3-1. Device Features Comparison
MAX INPUT/OUTPUT
DATA RATE (MSPS)
DEVICE
# of TXs/RXs
# of DUCs/TX
# of DDCs/RX
AFE7685
AFE7686
AFE7684
AFE7683
AFE7681
4T4R
4T4R
2T4R
2T4R
4T2R
1
2
2
1
1
1
2
2
1
1
750
1500
1500
750
750
版权 © 2018–2019, Texas Instruments Incorporated
Device Comparison
5
提交文档反馈意见
产品主页链接: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
www.ti.com.cn
4 器件和文档支持
4.1 器件支持
4.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构
成此类产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
4.2 文档支持
如需接收文档更新通知，请访问 ti.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周
接收产品信息更改摘要。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。
下面列出了介绍 DSP、相关外设以及其他配套技术资料的最新文档。
4.2.1 相关文档
《AFE76xx EVM 设计文档用户指南》(SLAU761)
《AFE76xx 技术参考手册》(SLAU744)
《AFE76xx 编程人员用户指南》(SLAU767)
4.3 相关链接
下表列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件，以及申请样片或购买产品的
快速链接。
表 4-1. 相关链接
器件
产品文件夹
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
请单击此处
请单击此处
请单击此处
AFE7681
AFE7683
AFE7684
AFE7685
AFE7686
4.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Established to help developers get started with Embedded Processors
from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
4.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
4.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
6
器件和文档支持
版权 © 2018–2019, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
www.ti.com.cn
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
4.7 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
4.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
版权 © 2018–2019, Texas Instruments Incorporated
提交文档反馈意见
器件和文档支持
7
产品主页链接: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686
ZHCSIA4E –MAY 2018–REVISED MARCH 2019
www.ti.com.cn
5 机械、封装和可订购信息
5.1 封装信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通
知，且不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
8
机械、封装和可订购信息
版权 © 2018–2019, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE7681IABJ
AFE7683IABJ
AFE7684IABJ
AFE7685IABJ
AFE7686IABJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
ABJ
ABJ
ABJ
ABJ
ABJ
400
400
400
400
400
90
90
90
90
90
RoHS & Green
RoHS & Green
RoHS & Green
RoHS & Green
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AFE7681I
SNAGCU
SNAGCU
SNAGCU
SNAGCU
AFE7683I
AFE7684I
AFE7685I
AFE7686I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AFE7681IABJ
AFE7683IABJ
AFE7684IABJ
AFE7685IABJ
AFE7686IABJ
ABJ
ABJ
ABJ
ABJ
ABJ
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
400
400
400
400
400
90
90
90
90
90
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
150
150
150
150
150
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
21
21
21
21
21
19.2
19.2
19.2
19.2
19.2
Pack Materials-Page 1
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/C 03/2022
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/C 03/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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