AFE7921IABJ [TI]
具有单频带 DUC/DDC 和两个反馈路径的 4TX/4RX 多频带射频采样收发器 | ABJ | 400 | -40 to 85;
| 型号： | AFE7921IABJ |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有单频带 DUC/DDC 和两个反馈路径的 4TX/4RX 多频带射频采样收发器 | ABJ | 400 | -40 to 85 射频 |
| 文件： | 总13页 (文件大小：346K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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AFE7920, AFE7921, AFE7988, AFE7989
SBAS971C –DECEMBER 2019–REVISED JUNE 2020
AFE79xx Quad-Channel RF Transceiver With Feedback Path
1 Features
between TX and RX
•
•
•
Internal PLL/VCO to generate DAC/ADC clocks
1
•
•
•
Quad RF sampling 12-GSPS transmit DACs
Quad RF sampling 3-GSPS receive ADCs
Optional external CLK at DAC or ADC rate
SerDes data interface:
Dual RF sampling 3-GSPS feedback ADCs
(AFE792x only)
–
–
–
–
–
JESD204B and JESD204C compliant
8 SerDes transceivers up to 29.5 Gbps
8b/10b and 64b/66b encoding
•
•
Maximum RF signal bandwidth:
–
TX/FB: 1200 MHz (AFE7920/88) or 400 MHz
(AFE7989) or 800MHz (AFE7921)
12-bit, 16-bit, 24-bit, and 32-bit resolution
Subclass 1 multi-device synchronization
–
RX: 600 MHz (AFE7920/88) or 400 MHz
(AFE7921/AFE7989)
•
Package: 17-mm × 17-mm FCBGA, 0.8-mm pitch
Digital Step Attenuators (DSA):
–
TX: 40 dB range, 1-dB analog and 0.125-dB
digital steps
2 Applications
•
•
•
•
•
Macro remote radio unit (RRU)
Active antenna system mMIMO (AAS)
Small cell base station
–
–
RX: 25 dB range, 0.5-dB steps
FB: 25 dB range, 0.5-dB steps
•
Single or dual-band DUC/DDCs (AFE7920/88
only) for TX and RX
Repeater
Distributed Antenna Systems (DAS)
•
•
Dual NCOs for fast frequency switching
Supports TDD operation with fast switching
3 Description
The AFE79xx is a family of high performance, wide bandwidth multi-channel transceivers, integrating four RF
sampling transmitter chains, four RF sampling receiver chains, and up to two RF sampling digitizing auxiliary
chains (feedback paths). The high dynamic range of the transmitter and receiver chains allows the device to
generate and receive 3G, 4G, and 5G signals from wireless base stations, while the wide bandwidth capability of
the AFE79xx devices is designed for multi-band 4G and 5G base stations.
Each receiver chain includes a 25-dB range DSA (Digital Step Attenuator), followed by a 3-GSPS ADC (analog-
to-digital converter). Each receiver channel has an analog peak power detector and various digital power
detectors to assist an external or internal autonomous automatic gain controller, and RF overload detectors for
device reliability protection. The single or dual digital down converters (DDC) provide up to 600 MHz of combined
signal BW. In TDD mode, the receiver channel can be configured to dynamically switch between the traffic
receiver (TDD RX) and wideband feedback receiver (TDD FB), with the capability of re-using the same analog
input for both purposes.
Each transmitter chain includes a single or dual digital up converters (DUCs) supporting up to 1200-MHz
combined signal bandwidth. The output of the DUCs drives a 12-GSPS DAC (digital to analog converter) with a
mixed mode output option to enhance 2nd or 3rd Nyquist operation. The DAC output includes a variable gain
amplifier (TX DSA) with 40-dB range and 1-dB analog and 0.125-dB digital steps.
The feedback path includes an 25-dB range DSA driving a 3-GSPS RF sampling ADC, followed by a DDC with
up to 1200-MHz bandwidth.
Device Information(1)
PART NUMBER
PACKAGE
FC-BGA
FC-BGA
FC-BGA
FC-BGA
BODY SIZE
AFE7989
AFE7920
AFE7988
AFE7921
17.00 mm × 17.00 mm
17.00 mm × 17.00 mm
17.00 mm × 17.00 mm
17.00 mm × 17.00 mm
(1) For more information, see Mechanical, Packaging, and Orderable Information.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE7920, AFE7921, AFE7988, AFE7989
SBAS971C –DECEMBER 2019–REVISED JUNE 2020
www.ti.com
4 Functional Block Diagram
4.1 AFE7920/AFE7921 Functional Block Diagram
DSA
Buffer
FB
ADC
1FB+/-
SHA
DDC
DSA
Buffer
RX
ADC
1RX+/-
SHA
DDC
1SRX+/-
2SRX+/-
3SRX+/-
4SRX+/-
5SRX+/-
6SRX+/-
7SRX+/-
8SRX+/-
DSA
RX
Buffer
ADC
2RX+/-
DDC
SHA
DSA
1TX+/-
2TX+/-
DAC
DAC
DUC
DUC
DSA
PLL
CLKIN+/-
/2,3,4,6
SYSREF+/-
1STX+/-
2STX+/-
3STX+/-
4STX+/-
5STX+/-
6STX+/-
7STX+/-
8STX+/-
DSA
DSA
DUC
DAC
3TX+/-
4TX+/-
DUC
DAC
ADC
DSA
DSA
RX
Buffer
SHA
4RX+/-
3RX+/-
DDC
Buffer
SHA
RX
ADC
ADC
DDC
DSA
Buffer
SHA
FB
2FB+/-
DDC
2
Submit Documentation Feedback
Copyright © 2019–2020, Texas Instruments Incorporated
Product Folder Links: AFE7920 AFE7921 AFE7988 AFE7989
AFE7920, AFE7921, AFE7988, AFE7989
www.ti.com
SBAS971C –DECEMBER 2019–REVISED JUNE 2020
4.2 AFE7988/89 Functional Block Diagram
FB
DDC
DSA
Buffer
RX
ADC
1RX+/-
SHA
DDC
1SRX+/-
2SRX+/-
3SRX+/-
4SRX+/-
5SRX+/-
6SRX+/-
7SRX+/-
8SRX+/-
DSA
DSA
RX
Buffer
SHA
ADC
DAC
2RX+/-
1TX+/-
DDC
DUC
DUC
DSA
DAC
2TX+/-
PLL
CLKIN+/-
/2,3,4,6
SYSREF+/-
1STX+/-
2STX+/-
3STX+/-
4STX+/-
5STX+/-
6STX+/-
7STX+/-
8STX+/-
DSA
DSA
DUC
DAC
3TX+/-
4TX+/-
DUC
DAC
ADC
DSA
DSA
Buffer
SHA
RX DDC
RX DDC
FB DDC
4RX+/-
3RX+/-
Buffer
SHA
ADC
Copyright © 2019–2020, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: AFE7920 AFE7921 AFE7988 AFE7989
AFE7920, AFE7921, AFE7988, AFE7989
SBAS971C –DECEMBER 2019–REVISED JUNE 2020
www.ti.com
Table of Contents
6.1 Device Support.......................................................... 5
6.2 Related Links ............................................................ 5
6.3 Receiving Notification of Documentation Updates.... 5
6.4 Support Resources ................................................... 5
6.5 Trademarks............................................................... 5
6.6 Electrostatic Discharge Caution................................ 5
6.7 Glossary.................................................................... 5
1
2
3
4
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Functional Block Diagram .................................... 2
4.1 AFE7920/AFE7921 Functional Block Diagram......... 2
4.2 AFE7988/89 Functional Block Diagram.................... 3
Revision History..................................................... 4
Device and Documentation Support.................... 5
5
6
7
Mechanical, Packaging, and Orderable
Information ............................................................. 6
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2020) to Revision C
Page
•
•
Changed AFE7921 device status from advanced information to production data ................................................................ 1
Changed AFE7921 maximum TX/FB RF signal bandwidth from 400MHz to 800MHz. ........................................................ 1
Changes from Revision A (February 2020) to Revision B
Page
•
Changed AFE7988 device status from advanced information to production data ................................................................ 1
Changes from Original (December 2019) to Revision A
Page
•
Changed AFE7920 device status from advanced information to production data ................................................................ 1
4
Submit Documentation Feedback
Copyright © 2019–2020, Texas Instruments Incorporated
Product Folder Links: AFE7920 AFE7921 AFE7988 AFE7989
AFE7920, AFE7921, AFE7988, AFE7989
www.ti.com
SBAS971C –DECEMBER 2019–REVISED JUNE 2020
6 Device and Documentation Support
6.1 Device Support
6.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
6.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
ORDER NOW
AFE7920
AFE7921
AFE7988
AFE7989
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
6.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
6.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
6.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
6.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2019–2020, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: AFE7920 AFE7921 AFE7988 AFE7989
AFE7920, AFE7921, AFE7988, AFE7989
SBAS971C –DECEMBER 2019–REVISED JUNE 2020
www.ti.com
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6
Submit Documentation Feedback
Copyright © 2019–2020, Texas Instruments Incorporated
Product Folder Links: AFE7920 AFE7921 AFE7988 AFE7989
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE7920IABJ
AFE7921IABJ
AFE7988IABJ
AFE7989IABJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FCBGA
FCBGA
FCBGA
FCBGA
ABJ
ABJ
ABJ
ABJ
400
400
400
400
90
90
90
90
RoHS & Green
RoHS & Green
RoHS & Green
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AFE7920I
SNAGCU
SNAGCU
SNAGCU
AFE7921I
AFE7988I
AFE7989I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jul-2023
TRAY
L - Outer tray length without tabs
KO -
Outer
tray
height
W -
Outer
tray
width
Text
P1 - Tray unit pocket pitch
CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AFE7920IABJ
AFE7920IABJ
AFE7921IABJ
AFE7921IABJ
AFE7988IABJ
AFE7988IABJ
AFE7989IABJ
AFE7989IABJ
ABJ
ABJ
ABJ
ABJ
ABJ
ABJ
ABJ
ABJ
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
400
400
400
400
400
400
400
400
90
90
90
90
90
90
90
90
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
6 x 16
150
150
150
150
150
150
150
150
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
315 135.9 7620 19.5
21
21
21
21
21
21
21
21
19.2
19.2
19.2
19.2
19.2
19.2
19.2
19.2
Pack Materials-Page 1
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/C 03/2022
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/C 03/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
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