AFE7952IABJ [TI]

具有两条反馈路径的四通道宽带宽射频采样收发器 | ABJ | 400 | -40 to 85;


型号：	AFE7952IABJ
厂家：	TEXAS INSTRUMENTS
描述：	具有两条反馈路径的四通道宽带宽射频采样收发器 \| ABJ \| 400 \| -40 to 85 射频
文件：	总12页 (文件大小：1152K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AFE7952

ZHCSR81 – NOVEMBER 2022

AFE7952 四通道射频收发器

1 特性

3 说明

•

四通道射频采样 12 GSPS 发送 DAC

高性能、宽带宽、多通道收发器，集成了四个射频采样

发送器链四个射频采样接收器链和两个射频采样数字化

辅助链（反馈路径）。发送器链和接收器链的高动态范

围使器件能够从无线基站生成和接收 3G、4G 和 5G

信号，而的宽带宽功能专为多频带 4G 和 5G 基站而

设计。

四通道射频采样 3 GSPS 接收 ADC

双通道射频采样 3GSPS 反馈 ADC

最大射频信号带宽：

– TX：2TX 为 2400MHz，4TX 为 1200MHz

– FB：1200 MHz

– RX：1200MHz（无 FB）；600MHz（带 FB）

射频频率范围：高达 12GHz

每个接收器链均包含一个 25dB 范围的数字步进衰减

器 (DSA)，后跟一个 3GSPS 模数转换器 (ADC)。

每个接收器通道都有一个模拟峰值功率检测器和各种数

字功率检测器，用于支持外部或内部自主自动增益控制

器，另外还具有射频过载检测器，用于提供器件可靠性

保护。单通道或双通道数字下变频器 (DDC) 可提供高

达 600MHz 的组合信号带宽（双通道 DDC 模式）

或 1200MHz 的组合信号带宽（单通道 DDC 模式）。

在 TDD 模式下，接收器通道经过配置可在流量接收器

(TDD RX) 和宽带反馈接收器 (TDD FB) 间动态切换，

能够重复使用同一模拟输入来实现两种用途。

•

数字步进衰减器 (DSA)：

– TX：40dB 范围、1dB 模拟和 0.125dB 数字步

进

– RX：25 dB 范围，0.5 dB 步进

用于 TX 和 RX 的双频带 DUC/DDC

用于快速频率开关的双通道 NCO

通过在 TX 和 RX 之间快速切换来支持 TDD 操作

用于生成 DAC/ADC 时钟的内部 PLL/VCO

DAC 或 ADC 速率下的可选外部 CLK

串行器/解串器数据接口：

•

每个发送器链都包含一个单通道或双通道数字上变频

器 (DUC)，支持高达 2400MHz（对于 2TX）或

1200MHz（对于 4TX）的组合信号带宽。DUC 的输出

驱动 12GSPS DAC（数模转换器），通过混合模式输

出选项增强在第二或第三奈奎斯特区域的运行。DAC

输出包括一个具有 40dB 范围以及 1dB 模拟和

0.125dB 数字步进的可变增益放大器 (TX DSA)。

– 符合 JESD204B 和 JESD204C 标准

– 8 个高达 29.5Gbps 的串行器/解串器收发器

– 8b/10b 和 64b/66b 编码

– 12 位、16 位、24 位和 32 位分辨率

– 子类 1 多器件同步

封装：17mm × 17mm FCBGA，间距 0.8 mm

•

2 应用

反馈路径包括一个驱动 3GSPS 射频采样 ADC 的

25dB 范围 DSA，后跟一个带宽高达 1200MHz 的

DDC。

•

宏远程无线电单元 (RRU)

有源天线系统 mMIMO (AAS)

小型蜂窝基站

中继器

5G 毫米波无线电

分布式天线系统 (DAS)

封装信息⁽¹⁾

器件型号

AFE7952

封装

封装尺寸

FC BGA

17.00mm × 17.00mm

(1) 如需了解详情，请参阅机械、封装和可订购信息。

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SBAS972

AFE7952

ZHCSR81 – NOVEMBER 2022

www.ti.com.cn

4 功能方框图

4.1 AFE7952 Functional Block Diagram

DSA

Buffer

ADC

1FB+/-

SHA

DDC

DSA

Buffer

1RX+/-

SHA

DDC

1SRX+/-

2SRX+/-

3SRX+/-

4SRX+/-

5SRX+/-

6SRX+/-

7SRX+/-

8SRX+/-

DSA

Buffer

ADC

DAC

2RX+/-

DDC

SHA

DSA

1TX+/-

DUC

DSA

DAC

2TX+/-

PLL

CLKIN+/-

/2,3,4,6

SYSREF+/-

1STX+/-

2STX+/-

3STX+/-

4STX+/-

5STX+/-

6STX+/-

7STX+/-

8STX+/-

DSA

DUC

DAC

3TX+/-

DSA

4TX+/-

DUC

DAC

ADC

DSA

Buffer

4RX+/-

SHA

DDC

DSA

Buffer

ADC

3RX+/-

SHA

DDC

DSA

Buffer

2FB+/-

SHA

DDC

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ZHCSR81 – NOVEMBER 2022

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Table of Contents

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 功能方框图.........................................................................2

4.1 AFE7952 Functional Block Diagram...........................2

5 Revision History.............................................................. 3

6 Device and Documentation Support..............................4

6.1 Trademarks.................................................................4

6.2 Electrostatic Discharge Caution..................................4

6.3 术语表......................................................................... 4

7 Mechanical, Packaging, and Orderable Information....4

5 Revision History

注：以前版本的页码可能与当前版本的页码不同

DATE

VERSION

NOTES

November 2022

Initial release.

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ZHCSR81 – NOVEMBER 2022

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6 Device and Documentation Support

6.1 Trademarks

所有商标均为其各自所有者的财产。

6.2 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

6.3 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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AFE7952

ZHCSR81 – NOVEMBER 2022

www.ti.com.cn

PACKAGE OUTLINE

ABJ0400A

FCBGA - 2.65 mm max height

SCALE 0.750

BALL GRID ARRAY

17.2

16.8

BALL A1 CORNER

17.2

16.8

(

16)

2.65 MAX

0.2 C

(2.08)

SEATING PLANE

NOTE 4

0.76

0.56

BALL TYP

0.12 C

0.5

0.3

TYP

15.2 TYP

SYMM

(0.9) TYP

0.8 TYP

15.2

TYP

SYMM

0.55

0.45

400X

0.15

0.08

C A B

NOTE 3

11 13 15 17 19

10 12 14 16 18 20

0.8 TYP

4221311/B 04/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

4. Primary datum C and seating plane are deﬁned by the spherical crowns of the solder balls.

www.ti.com

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ZHCSR81 – NOVEMBER 2022

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EXAMPLE BOARD LAYOUT

ABJ0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

2 3

19 20

11 12

14 15

(0.8) TYP

0.415

0.385

400X

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

( 0.4)

METAL

0.025 MAX

0.025 MIN

METAL

UNDER

MASK

EXPOSED

METAL

EXPOSED

METAL

(

0.4)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

4221311/B 04/2020

NOTES: (continued)

5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

www.ti.com

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ZHCSR81 – NOVEMBER 2022

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EXAMPLE STENCIL DESIGN

ABJ0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

(

0.4) TYP

2 3

19 20

11 12

14 15

(0.8)

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL

SCALE:6X

4221311/B 04/2020

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release.

www.ti.com

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PACKAGE OPTION ADDENDUM

www.ti.com

28-Nov-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AFE7952IABJ

ACTIVE

FCBGA

ABJ

400

RoHS & Green

SNAGCU

Level-3-260C-168 HR

-40 to 85

AFE7952I

Samples

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OUTLINE

ABJ0400A

FCBGA - 2.65 mm max height

SCALE 0.750

BALL GRID ARRAY

17.2

16.8

BALL A1 CORNER

17.2

16.8

(

16)

2.65

2.29

(1.4)

0.2 C

SEATING PLANE

NOTE 4

0.76

0.56

BALL TYP

0.12 C

0.5

0.3

TYP

15.2 TYP

SYMM

(0.9) TYP

0.8 TYP

15.2

TYP

SYMM

0.55

0.45

400X

0.15

0.08

C A B

NOTE 3

11 13 15 17 19

10 12 14 16 18 20

0.8 TYP

4221311/C 03/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

www.ti.com

EXAMPLE BOARD LAYOUT

ABJ0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

2 3

19 20

11 12 13 14 15

(0.8) TYP

400X ( 0.4)

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

(

0.4)

0.025 MAX

0.025 MIN

METAL

UNDER

MASK

METAL

EXPOSED

METAL

EXPOSED

METAL

(

0.4)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4221311/C 03/2022

NOTES: (continued)

5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

www.ti.com

EXAMPLE STENCIL DESIGN

ABJ0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

(

0.4) TYP

2 3

19 20

11 12 13 14 15

(0.8)

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL

SCALE:6X

4221311/C 03/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

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AFE7952IABJ [TI]

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