AFE8000IABJ [TI]

具有 12GSPS DAC 和 4GSPS ADC 的 8 发射 (TX) 10 接收 (RX) 7GHz 射频采样 AFE | ABJ | 400 | -40 to 85;


型号：	AFE8000IABJ
厂家：	TEXAS INSTRUMENTS
描述：	具有 12GSPS DAC 和 4GSPS ADC 的 8 发射 (TX) 10 接收 (RX) 7GHz 射频采样 AFE \| ABJ \| 400 \| -40 to 85 射频
文件：	总13页 (文件大小：1090K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AFE8000, AFE8004, AFE8010

ZHCSPD3A –DECEMBER 2022 –REVISED JUNE 2023

AFE80xx 射频采样收发器

1 特性

3 说明

• 申请完整数据表

• AFE80xx 版本：

AFE8000 是一款高性能、宽带宽、多通道收发器，集

成了 8 个射频采样 DAC 和10 个射频采样 ADC。可提

供引脚和编程兼容的低通道数版本（具有 4TX 和 4RX

通道的AFE8004、具有10RX 通道的AFE8010），用

于实现可扩展的系统设计。

– AFE8000：8 TX，10 RX

– AFE8004：4 TX，4 RX

– AFE8010：10 RX

• 12GSPS 射频采样DAC

• 4GSPS 射频取样ADC

• 最大射频信号带宽：

每个接收器 (RX) 链包含一个 25dB 范围的 DSA（数字

步进衰减器），后跟一个 4GSPS ADC（模数转换

器）。10 个 ADC 连接到 8 个接收器路径（1RX 至

8RX）和 2 个反馈路径（1FB 和 2FB）。RX 和 FB 之

间的 ADC 是相同的，但数字下变频器路径不同（FB

路径具有更宽的带宽，可用作接收器）。每个接收器通

道都有多个模拟峰值功耗检测器和数字峰值及功耗检测

器，可辅助进行外部或内部自主自动增益控制器，另外

还具有一个射频过载检测器，用于提供器件可靠性保

护。单频带或双频带数字下变频器 (DDC) 可提供高达

800MHz （ 8 通道），或 400MHz （ 8 通道）和

800MHz（2 通道）的信号带宽。

– TX：800MHz（8 通道）或1.2GHz（4 通道）

– RX：800MHz（8 通道）或400MHz（8 通道）

+ 800MHz（2 通道）

• 射频频率范围：

– TX：5MHz 至7.125GHz

– RX：100MHz 至7.125GHz

• 数字步进衰减器(DSA)：

– TX：40dB 范围，1dB 模拟和0.125dB 数字步

进

– RX/FB：25dB 范围，1dB 步进

• 单频带或双频带DUC、DDC

每个发送器 (TX) 链包含一个单频带或双频带数字上变

频器 (DUC) 。支持高达 800MHz （ 8 通道）或

1200MHz（4 通道）的信号带宽。DUC 的输出驱动一

个 12GSPS DAC（数模转换器），通过混合模式输出

选项增强在第二奈奎斯特区的运行。DAC 输出包括一

个具有 40dB 范围以及 1dB 模拟和 0.125dB 数字步进

的可变增益放大器(TX DSA)。

• 每链两个NCO，支持快速频率切换

• 通过在TX 和RX 之间快速切换来支持TDD 操作

• 用于生成DAC/ADC 时钟的内部PLL/VCO

• DAC 或ADC 速率下的可选外部CLK

• 串行器/解串器数据接口：

– JESD204B 和JESD204C

– 8 个高达32.5Gbps 的串行器/解串器收发器

– 8b/10b 和64b/66b 编码

– 12 位、16 位、24 位和32 位分辨率

– 子类1 多器件同步

封装信息

封装⁽¹⁾

封装尺寸⁽²⁾

器件型号

AFE8000

AFE8004

AFE8010

FC-BGA

17 mm × 17 mm

• 封装：

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

– 17mm × 17mm FCBGA，间距为0.8mm

(2) 封装尺寸（长× 宽）为标称值，并包括引脚（如适用）。

2 应用

• 雷达

• 导引头前端

• 国防无线电

• 战术通信基础设施

• 无线通信测试

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SBASAG9

AFE8000, AFE8004, AFE8010

ZHCSPD3A –DECEMBER 2022 –REVISED JUNE 2023

www.ti.com.cn

4 Functional Block Diagram

1TX+/-

RF DAC

1SRX

1STX

TX Chain 1

TX Chain 2

TX Chain 3

VDD1p2TX

VSSTX

2TX+/-

2SRX

2STX

VDD1p8TX

VSSTX

3TX+/-

4TX+/-

3SRX

3STX

TX DIG

4SRX

4STX

VDDA1P8

VSS

TX Chain 4

Ref CLK

SYSREF

Syncbin/out

DC CLK

Common Dig

REFCLK_+/-

Dist

5SRX

5STX

VDD1p8PLL

VSSPLL

PLL-VCO

TX DIG

5TX+/-

6TX+/-

RF DAC

6SRX

6STX

TX Chain 5

TX Chain 6

TX Chain 7

TX Chain 8

7SRX

7STX

RF DAC

VDD1p8TX

VSSTX

8SRX

8STX

7TX+/-

VSST

VDDT

VDD1p2TX

VSSTX

SPIB

SPI

MCU

8TX+/-

GPIO

. . Y Y

5 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from December 31, 2022 to June 14, 2023 (from Revision * (December 2022) to

Revision A (June 2023))

Page

• 更改了封装信息表中的注释2 从AFE8004 和AFE8010 器件中删除了产品预发布...........................................1

English Data Sheet: SBASAG9

Submit Document Feedback

Product Folder Links: AFE8000 AFE8004 AFE8010

AFE8000, AFE8004, AFE8010

ZHCSPD3A –DECEMBER 2022 –REVISED JUNE 2023

www.ti.com.cn

6 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

6.1 Documentation Support

6.1.1 Related Documentation

6.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

6.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

6.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

6.5 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

6.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: AFE8000 AFE8004 AFE8010

English Data Sheet: SBASAG9

PACKAGE OPTION ADDENDUM

www.ti.com

8-Jul-2023

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AFE8000IABJ

AFE8000IALK

ACTIVE

FCBGA

ABJ

ALK

400

RoHS & Green

SNAGCU

Level-3-260C-168 HR

Level-3-220C-168 HR

-40 to 85

AFE8000

Samples

Non-RoHS

& Green

Call TI

AFE8000

SNPB

AFE8004IABJ

AFE8004IALK

ACTIVE

FCBGA

ABJ

ALK

400

RoHS & Green

SNAGCU

Call TI

Level-3-260C-168 HR

Level-3-220C-168 HR

-40 to 85

AFE8004

Samples

Non-RoHS

& Green

AFE8004

SNPB

AFE8010IABJ

AFE8010IALK

ACTIVE

FCBGA

ABJ

ALK

400

RoHS & Green

SNAGCU

Call TI

Level-3-260C-168 HR

Level-3-220C-168 HR

-40 to 85

AFE8010

Samples

Non-RoHS

& Green

AFE8010

SNPB

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

8-Jul-2023

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

9-Jul-2023

TRAY

L - Outer tray length without tabs

KO -

Outer

tray

height

W -

Outer

tray

width

Text

P1 - Tray unit pocket pitch

CW - Measurement for tray edge (Y direction) to corner pocket center

CL - Measurement for tray edge (X direction) to corner pocket center

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device

Package Package Pins SPQ Unit array

Max

matrix temperature

(°C)

L (mm)

Name

Type

(mm) (µm) (mm) (mm) (mm)

AFE8000IABJ

AFE8000IALK

AFE8004IABJ

AFE8004IALK

AFE8010IABJ

AFE8010IALK

ABJ

ALK

ABJ

ALK

ABJ

ALK

FCBGA

400

6 x 16

150

315 135.9 7620 19.5

19.2

Pack Materials-Page 1

PACKAGE OUTLINE

ABJ0400A

FCBGA - 2.65 mm max height

SCALE 0.750

BALL GRID ARRAY

17.2

16.8

BALL A1 CORNER

17.2

16.8

(

16)

2.65

2.29

(1.4)

0.2 C

SEATING PLANE

NOTE 4

0.76

0.56

BALL TYP

0.12 C

0.5

0.3

TYP

15.2 TYP

SYMM

(0.9) TYP

0.8 TYP

15.2

TYP

SYMM

0.55

0.45

400X

0.15

0.08

C A B

NOTE 3

11 13 15 17 19

10 12 14 16 18 20

0.8 TYP

4221311/C 03/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

www.ti.com

EXAMPLE BOARD LAYOUT

ABJ0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

2 3

19 20

11 12 13 14 15

(0.8) TYP

400X ( 0.4)

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

(

0.4)

0.025 MAX

0.025 MIN

METAL

UNDER

MASK

METAL

EXPOSED

METAL

EXPOSED

METAL

(

0.4)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4221311/C 03/2022

NOTES: (continued)

5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

www.ti.com

EXAMPLE STENCIL DESIGN

ABJ0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

(

0.4) TYP

2 3

19 20

11 12 13 14 15

(0.8)

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL

SCALE:6X

4221311/C 03/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

PACKAGE OUTLINE

ALK0400A

FCBGA - 2.65 mm max height

SCALE 0.750

BALL GRID ARRAY

17.2

16.8

BALL A1 CORNER

17.2

16.8

(

16)

2.65

2.29

(1.4)

0.2 C

SEATING PLANE

NOTE 4

0.76

0.56

BALL TYP

0.12 C

0.5

0.3

TYP

15.2 TYP

SYMM

(0.9) TYP

0.8 TYP

15.2

TYP

SYMM

0.55

0.45

400X

0.15

0.08

C A B

NOTE 3

11 13 15 17 19

10 12 14 16 18 20

0.8 TYP

4225930/B 03/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

5. Pb-Free die bump and SnPb solder ball.

www.ti.com

EXAMPLE BOARD LAYOUT

ALK0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

2 3

19 20

11 12 13 14 15

(0.8) TYP

400X ( 0.4)

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

(

0.4)

0.025 MAX

0.025 MIN

METAL

UNDER

MASK

METAL

EXPOSED

METAL

EXPOSED

METAL

(

0.4)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4225930/B 03/2022

NOTES: (continued)

6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).

www.ti.com

EXAMPLE STENCIL DESIGN

ALK0400A

FCBGA - 2.65 mm max height

BALL GRID ARRAY

(0.8) TYP

(

0.4) TYP

2 3

19 20

11 12 13 14 15

(0.8)

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL

SCALE:6X

4225930/B 03/2022

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

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这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

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TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

AFE8000IABJ [TI]

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