AFE8092HIABJ [TI]
八通道射频收发器 | ABJ | 400 | -40 to 85;
| 型号： | AFE8092HIABJ |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 八通道射频收发器 | ABJ | 400 | -40 to 85 射频 |
| 文件： | 总13页 (文件大小：1126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFE8092
ZHCSO04A –MAY 2021 –REVISED OCTOBER 2021
AFE8092 具有反馈路径的八通道射频收发器
1 特性
3 说明
• 八通道射频采样12GSPS 发送DAC
• 八通道射频采样4GSPS 接收ADC
• 最大射频信号带宽：
AFE8092 是一款高性能、高带宽、多通道收发器，集
成了八个射频采样发送器链、八个射频采样接收器链和
两个用于 辅助链（反馈路径）的独立射频前端。发送
器链和接收器链的高动态范围支持从无线基站生成和接
收 3G、4G 和 5G 信号，而高带宽能力则使 AFE8092
器件适用于多频带4G 和5G 基站。
– TX/FB：800MHz。
• 4 通道模式中为1200MHz
– RX：400MHz
每个接收器链均包含一个31dB 范围的数字步进衰减器
(DSA)，后跟一个 4GSPS 模数转换器 (ADC)。每个接
收器通道都有多个模拟峰值功耗检测器和数字峰值及功
耗检测器，可辅助进行外部或内部自主自动增益控制
器，另外还具有一个射频过载检测器，用于提供器件可
靠性保护。数字下变频器 (DDC) 可提供高达 400MHz
的组合信号带宽（在 8 通道模式下，而在 4 通道模式
下为 800MHz）。在 TDD 模式下，接收器通道经过配
置可在流量接收器 (TDD RX) 和宽带反馈接收器 (TDD
FB) 间动态切换，能够重复使用同一模拟输入来实现这
两个目的。
• 4 通道模式中为800MHz
• 射频频率范围：高达6GHz
• 数字步进衰减器(DSA)：
– TX：40dB 范围、1dB 模拟和0.125dB 数字步
进
– RX/FB：31/25dB 范围，1dB 步进
• 每个链一个DUC/DDC
• 每个链两个NCO，支持快速频率切换
• 通过在TX 和RX 之间快速切换来支持TDD 操作
• 用于生成DAC/ADC 时钟的内部PLL/VCO
• DAC 或ADC 速率下的可选外部CLK
• 串行器/解串器数据接口：
每个发送器链包含一个数字下变频器 (DUC)，支持最
高 800MHz 的组合信号带宽（ 4 通道模式下为
1200MHz）。DUC 的输出驱动 12GSPS DAC（数模
转换器），通过混合模式输出选项增强在第二奈奎斯特
区的运行。DAC 输出包括一个具有 40dB 范围以及
1dB 模拟和 0.125dB 数字步进的可变增益放大器 (TX
DSA)。
– JESD204B 和JESD204C
– 8 个高达32.5Gbps 的串行器/解串器收发器
– 8b/10b 和64b/66b 编码
– 12 位、16 位、24 位和32 位分辨率
– 子类1 多器件同步
• 封装：
– 17mm × 17mm FCBGA，间距0.8mm
反馈路径包含一个驱动 4GSPS 射频采样 ADC、与接
收器链共用的 25dB 范围 DSA，后跟一个 DDC，该
DDC 具有高达 800MHz 的带宽（在 4 通道模式下为
1200MHz）。
2 应用
• 宏远程无线电单元(RRU)
• 有源天线系统mMIMO (AAS)
• 小型蜂窝基站
器件信息(1)
• 分布式天线系统(DAS)
• 中继器
封装尺寸（标称值）
器件型号
AFE8092
封装
17.00mm ×
17.00mm
FC-BGA
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBASA16
AFE8092
www.ti.com.cn
ZHCSO04A –MAY 2021 –REVISED OCTOBER 2021
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Device Support........................................................... 3
5.2 接收文档更新通知....................................................... 3
5.3 支持资源......................................................................3
5.4 Trademarks.................................................................3
5.5 Electrostatic Discharge Caution..................................3
5.6 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....3
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (May 2021) to Revision A (October 2021)
Page
• 添加了对4 通道宽带模式的支持.........................................................................................................................1
Copyright © 2021 Texas Instruments Incorporated
2
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Product Folder Links: AFE8092
AFE8092
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ZHCSO04A –MAY 2021 –REVISED OCTOBER 2021
5 Device and Documentation Support
5.1 Device Support
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: AFE8092
AFE8092
www.ti.com.cn
ZHCSO04A –MAY 2021 –REVISED OCTOBER 2021
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65 MAX
(2.08)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
TYP
0.3
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
W
V
T
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/B 04/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
Copyright © 2021 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: AFE8092
AFE8092
www.ti.com.cn
ZHCSO04A –MAY 2021 –REVISED OCTOBER 2021
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
2 3
4
6
7
8
9
10
13
16
18
19 20
17
1
5
11 12
14 15
A
B
C
D
E
F
(0.8) TYP
0.415
0.385
G
H
J
400X
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
( 0.4)
METAL
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221311/B 04/2020
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: AFE8092
AFE8092
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ZHCSO04A –MAY 2021 –REVISED OCTOBER 2021
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
2 3
4
6
7
8
9
13
16
18
19 20
17
1
5
11 12
14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/B 04/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
Copyright © 2021 Texas Instruments Incorporated
6
Submit Document Feedback
Product Folder Links: AFE8092
PACKAGE OPTION ADDENDUM
www.ti.com
3-Aug-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE8092HIABJ
AFE8092IABJ
ACTIVE
ACTIVE
FCBGA
FCBGA
ABJ
ABJ
400
400
90
90
RoHS & Green
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
AFE8092
AFE8092
Samples
Samples
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Aug-2022
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TRAY
L - Outer tray length without tabs
KO -
Outer
tray
height
W -
Outer
tray
width
Text
P1 - Tray unit pocket pitch
CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
AFE8092HIABJ
AFE8092IABJ
ABJ
ABJ
FCBGA
FCBGA
400
400
90
90
6 x 16
6 x 16
150
150
315 135.9 7620 19.5
315 135.9 7620 19.5
21
21
19.2
19.2
Pack Materials-Page 1
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/C 03/2022
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/C 03/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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