AMC60304 [TI]

AMC60304 4-Channel Optical Monitor and Controller With High-Current Output DACs and Multichannel ADC;


型号：	AMC60304
厂家：	TEXAS INSTRUMENTS
描述：	AMC60304 4-Channel Optical Monitor and Controller With High-Current Output DACs and Multichannel ADC
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中文：	中文翻译
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AMC60304

SLASF19 – DECEMBER 2021

AMC60304 4-Channel Optical Monitor and Controller

With High-Current Output DACs and Multichannel ADC

supply and temperature alarm monitors, and a high-

precision internal reference.

1 Features

•

Four 12-bit current output DACs (IDACs)

– 200-mA full-scale output range

Multichannel, 12-bit, 1-MSPS SAR ADC

– Four external inputs: 2.5-V and 5-V input

ranges

The AMC60304 IDACs support a full-scale output

range of 200 mA with very-low power dissipation.

These IDACs eliminate the need for external

components to provide an accurate current bias.

•

The AMC60304 also includes four input pins that

are multiplexed to the ADC and incorporate a low-

latency window comparator. These features make this

device an excellent choice for received signal strength

indicator (RSSI) and loss-of-signal (LOS) detection.

The ADC is also capable of measuring the voltage

at the IDAC pins, thus enabling these outputs to be

monitored.

– Four IDAC voltage monitor channels

– Programmable sequencer

– Programmable out-of-range alarms

Internal 2.5-V reference

•

Suppy and temperature fault alarms

SPI and I²C interfaces: 1.7-V to 3.6-V operation

– SPI: 4-wire interface

– I²C: Four target addresses

•

Specified temperature range: –40°C to +125°C

The AMC60304 low power, high integration, very

small size, and wide operating temperature range

make this device an excellent choice as an all-in-one

control circuit for optical modules.

2 Applications

•

Optical module

Intra-dc interconnect (metro)

Device Information

PART NUMBER

PACKAGE⁽¹⁾

BODY SIZE (NOM)

3 Description

AMC60304

DSBGA (36)

2.56 mm × 2.56 mm

The AMC60304 is a highly integrated, low-power

analog monitor and controller optimized for high-

current outputs. The device includes four 12-bit

current output digital-to-analog converters (IDACs),

a 12-bit, 1-MSPS analog-to-digital converter (ADC),

(1) For all available packages, see the package option

addendum at the end of the data sheet.

AMC60304

Supply and Temperature Monitors

IDAC Channels 1-4

IDAC1

I²C / SPI

Serial Interface

Voltage

Monitors

IDAC2

IDAC

IDAC3

IDAC4

Interrupt Control

and

Alarm Detector

ADC1

ADC2

ADC3

ADC4

ADC

MUX

Reference

Simplified Schematic

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

AMC60304

SLASF19 – DECEMBER 2021

www.ti.com

4 Device and Documentation Support

4.1 Documentation Support

Note

TI is transitioning to use more inclusive terminology. Some language may be different than what you

would expect to see for certain technology areas.

4.1.1 Related Documentation

For related documentation, see the following: AMC60304EVM user's guide

4.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

4.3 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

4.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

4.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

4.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: AMC60304

PACKAGE OPTION ADDENDUM

www.ti.com

3-Jan-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

AMC60304YBHR

AMC60304YBHT

ACTIVE

DSBGA

YBH

3000 RoHS & Green

250 RoHS & Green

SNAGCU

Level-1-260C-UNLIM

-40 to 125

AMC60304

SNAGCU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

3-Jan-2022

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

1-Jan-2022

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

AMC60304YBHR

AMC60304YBHT

DSBGA

YBH

3000

250

180.0

8.4

2.71

0.6

4.0

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

1-Jan-2022

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

AMC60304YBHR

AMC60304YBHT

DSBGA

YBH

3000

250

182.0

20.0

Pack Materials-Page 2

PACKAGE OUTLINE

YBH0036

DSBGA - 0.4 mm max height

SCALE 7.000

DIE SIZE BALL GRID ARRAY

BALL A1

CORNER

0.4 MAX

SEATING PLANE

0.05 C

BALL TYP

0.16

0.10

2 TYP

SYMM

TYP

SYMM

D: Max = 2.585 mm, Min =2.524 mm

E: Max = 2.585 mm, Min =2.524 mm

0.4 TYP

0.225

0.185

C A B

36X

0.015

0.4 TYP

4225648/A 01/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

YBH0036

DSBGA - 0.4 mm max height

DIE SIZE BALL GRID ARRAY

(0.4) TYP

36X ( 0.2)

(0.4) TYP

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 30X

0.05 MIN

0.05 MAX

METAL UNDER

SOLDER MASK

(

0.2)

METAL

(

0.2)

EXPOSED

METAL

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK

DEFINED

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4225648/A 01/2020

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).

www.ti.com

EXAMPLE STENCIL DESIGN

YBH0036

DSBGA - 0.4 mm max height

DIE SIZE BALL GRID ARRAY

(0.4) TYP

(R0.05) TYP

36X ( 0.21)

(0.4) TYP

SYMM

METAL

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.075 mm THICK STENCIL

SCALE: 30X

4225648/A 01/2020

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, regulatory or other requirements.

These resources are subject to change without notice. TI grants you permission to use these resources only for development of an

application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license

is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you

will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these

resources.

TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with

such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for

TI products.

TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

AMC60304 [TI]

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