BQ24002PWPR [TI]
SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS; 单节锂离子电池充电管理ICFOR PDAS
| 型号： | BQ24002PWPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS |
| 文件： | 总31页 (文件大小：881K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
ꢇꢈꢉ ꢊ ꢋ ꢌꢍ ꢎ ꢌꢋ ꢋ ꢋ ꢏꢍ ꢈꢐ ꢉ ꢎꢑ ꢒ ꢓꢊ ꢌ ꢔ ꢒꢉ ꢒꢊ ꢌꢔ ꢌ ꢉꢕ ꢈ ꢎ ꢖꢐ ꢓ ꢗ ꢘꢒꢙ
ꢒ ꢉ ꢘ ꢈꢉ ꢕꢌꢓ ꢉ ꢌꢕ ꢒꢗ ꢗ ꢋꢈꢒ ꢉꢎ ꢌꢇ
FEATURES
DESCRIPTION
D
Highly Integrated Solution With FET Pass
Transistor and Reverse-Blocking Schottky
and Thermal Protection
The bq2400x series ICs are advanced Li-Ion linear
charge management devices for highly integrated and
space-limited applications. They combine high-
accuracy current and voltage regulation; FET pass-
transistor and reverse-blocking Schottky; battery
conditioning, temperature, or input-power monitoring;
charge termination; charge-status indication; and
charge timer in a small package.
D
D
D
Integrated Voltage and Current Regulation
With Programmable Charge Current
High-Accuracy Voltage Regulation ( 1%)
Ideal for Low-Dropout Linear Charger
Designs for Single-Cell Li-Ion Packs With
Coke or Graphite Anodes
The bq2400x measures battery temperature using an
external thermistor. For safety reasons, the bq2400x
inhibits charge until the battery temperature is within the
user-defined thresholds. Alternatively, the user can
monitor the input voltage to qualify charge. The
bq2400x series then charge the battery in three phases:
preconditioning, constant current, and constant
voltage. If the battery voltage is below the internal
low-voltage threshold, the bq2400x uses low-current
precharge to condition the battery. A preconditioning
timer is provided for additional safety. Following pre-
conditioning, the bq2400x applies a constant-charge
current to the battery. An external sense-resistor sets
the magnitude of the current. The constant-current
phase is maintained until the battery reaches the
charge-regulation voltage. The bq2400x then
transitions to the constant voltage phase. The user can
configure the device for cells with either coke or
graphite anodes. The accuracy of the voltage regulation
is better than 1% over the operating junction
temperature and supply voltage range.
D
D
D
Up to 1.2-A Continuous Charge Current
Safety-Charge Timer During Preconditioning
and Fast Charge
Integrated Cell Conditioning for Reviving
Deeply Discharged Cells and Minimizing Heat
Dissipation During Initial Stage of Charge
D
D
Optional Temperature or Input-Power
Monitoring Before and During Charge
Various Charge-Status Output Options for
Driving Single, Double, or Bicolor LEDs or
Host-Processor Interface
D
Charge Termination by Minimum Current and
Time
D
Low-Power Sleep Mode
D
Packaging: 5 mm × 5 mm MLP or 20-Lead
TSSOP PowerPAD
APPLICATIONS
Charge is terminated by maximum time or minimum
taper current detection
D
D
D
D
PDAs
Internet Appliances
MP3 Players
Digital Cameras
The bq2400x automatically restarts the charge if the
battery voltage falls below an internal recharge
threshold.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
ꢗꢓ ꢐ ꢘꢚ ꢎ ꢕꢈ ꢐꢉ ꢘ ꢒꢕꢒ ꢏꢛ ꢜꢝ ꢞ ꢟꢠ ꢡꢏꢝꢛ ꢏꢙ ꢢꢣ ꢞ ꢞ ꢤꢛꢡ ꢠꢙ ꢝꢜ ꢥꢣꢀ ꢦꢏꢢ ꢠꢡꢏ ꢝꢛ ꢧꢠ ꢡꢤꢨ ꢗꢞ ꢝꢧꢣ ꢢꢡꢙ
ꢢ ꢝꢛ ꢜꢝꢞ ꢟ ꢡꢝ ꢙ ꢥꢤ ꢢ ꢏ ꢜꢏ ꢢ ꢠ ꢡꢏ ꢝꢛꢙ ꢥ ꢤꢞ ꢡꢩꢤ ꢡꢤ ꢞ ꢟꢙ ꢝꢜ ꢕꢤꢪ ꢠꢙ ꢈꢛꢙ ꢡꢞ ꢣꢟ ꢤꢛꢡ ꢙ ꢙꢡ ꢠꢛꢧ ꢠꢞ ꢧ ꢫ ꢠꢞ ꢞ ꢠ ꢛꢡꢬꢨ
ꢗꢞ ꢝ ꢧꢣꢢ ꢡ ꢏꢝ ꢛ ꢥꢞ ꢝ ꢢ ꢤ ꢙ ꢙ ꢏꢛ ꢭ ꢧꢝ ꢤ ꢙ ꢛꢝꢡ ꢛꢤ ꢢꢤ ꢙꢙ ꢠꢞ ꢏꢦ ꢬ ꢏꢛꢢ ꢦꢣꢧ ꢤ ꢡꢤ ꢙꢡꢏ ꢛꢭ ꢝꢜ ꢠꢦ ꢦ ꢥꢠ ꢞ ꢠꢟ ꢤꢡꢤ ꢞ ꢙꢨ
Copyright 2002 − 2004, Texas Instruments Incorporated
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE
CHARGE STATUS
CONFIGURATION
T
J
20-LEAD HTTSOP PowerPAD 20-LEAD 5 mm × 5 mm MLP
(1)
(2)
(PWP) (RGW)
bq24001PWP
bq24002PWP
bq24003PWP
bq24001RGW
bq24002RGW
bq24003RGW
Single LED
2 LEDs
−40°C to 125°C
Single bicolor LED
(1)
(2)
The PWP package is available taped and reeled. Add R suffix to device type (e.g. bq24001PWPR) to order. Quantities 2500 devices per reel.
The RGW package is available taped and reeled. Add R suffix to device type (e.g. bq24001RGWR) to order. Quantities 3000 devices per reel.
PACKAGE DISSIPATION RATINGS
T
≤ 25°C
DERATING FACTOR
A
PACKAGE
Θ
JA
Θ
JC
POWER RATING
ABOVE T = 25°C
A
(1)
PWP
30.88°C/W
31.41°C/W
1.19°C/W
1.25°C/W
3.238 W
0.0324W/°C
0.0318W/°C
(2)
RGW
3.183 W
(1)
(2)
This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (6.5 × 3.4 mm), internal 1 oz power and
ground planes, 8 thermal via underneath the die connecting to ground plane.
This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (3.25 × 3.25 mm), internal 1 oz power
and ground planes, 9 thermal via underneath the die connecting to ground plane.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
bq24001
bq24002
bq24003
Supply voltage (Vcc with respect to GND)
13.5 V
13.5 V
Input voltage (IN, ISNS, EN, APG/THERM/CR/STAT1/STAT2, VSENSE, TMR SEL, VSEL) (all with respect to GND)
Output current (OUT pins)
2 A
Output sink/source current (STAT1 and STAT2)
10 mA
Operating free-air temperature range, T
−40°C to 70°C
−65°C to 150°C
−40°C to 125°C
300°C
A
Storage temperature range, T
stg
Junction temperature range, T
J
Lead temperature (Soldering, 10 sec)
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN MAX
UNIT
V
Supply voltage, V
CC
4.5
4.5
10
10
Input voltage, VIN
V
Continuous output current
Operating junction temperature range, T
1.2
125
A
−40
°C
J
2
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature supply and input voltages, and V (V ) ≥ V (IN) ( unless otherwise noted)
I
CC
I
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mA
µA
V
V
current
V
> V _UVLO,
CC
EN ≤ V
IH(EN)
1
CC
CC
current, standby mode
EN ≤ V
EN ≤ V
1
CC
IL(EN)
IN current, standby mode
10
4
µA
IL(EN)
V
CC
< V _UVLO,
CC
V
= 4.3 V, VSENSE = 4.3V
= 4.3 V, VSENSE = 4.3 V
2
2
Standby current (sum of currents into OUT
and VSENSE pins)
OUT
µA
EN <= Vil
EN,
V
OUT
4
VOLTAGE REGULATION, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
0 < I ≤ 1.2 A
MIN
4.059
4.158
TYP
MAX
UNIT
V
VSEL = V
,
4.10 4.141
4.20 4.242
SS
O
Output voltage
VSEL = V
,
0 < I ≤ 1.2 A
V
CC
O
1 mA ≤ I ≤ 1.2 A,
V
= 5 V,
O
I(IN)
Load regulation
Line regulation
1
mV
V
CC
=5 V,
T = 25°C
J
V +V +V
OUT DO ilim(MAX)
< V
< 10 V, T = 25°C
0.01
0.7
%/V
V
I(VCC)
J
I
O
I
O
= 1.0 A,
4.9 V <V
< 10 V
I(Vcc)
<V
Dropout voltage = VI(IN)-Vout
= 1.2 A,
V
+V +V
< 10 V
0.8
V
OUT DO ilimMAX I(VCC)
CURRENT REGULATION, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Current regulation threshold, V
VSENSE < V
O(VSEL-LOW/HIGH)
0.095
0.1 0.105
V
I(limit)
VSENSE pulsed above VVLOWV to I = 10% of
regulated value
O
Delay time
1
ms
ms
(1)
I
R
increasing from 10% to 90% of regulated value.
(1)
O
SNS
Rise time
0.1
1
≥ 0.2 Ω,
(1)
Specified by design, not production tested.
CURRENT SENSE RESISTOR, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
100 mA ≤ Ilim ≤ 1.2 A
MIN
TYP
MAX
UNIT
External current sense resistor range (R
)
0.083
1
Ω
SNS
PRECHARGE CURRENT REGULATION, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Precharge current regulation
V
<V
0.083 ≤ R ≤ 1.0 Ω
40
60
80
mA
SENSE LOWV,
SNS
V
UVLO COMPARATOR, 0°C ≤ T ≤ 125°C
J
CC
PARAMETER
TEST CONDITIONS
TEST CONDITIONS
TEST CONDITIONS
MIN
4.35
4.25
50
TYP
4.43
4.33
MAX
4.50
4.40
UNIT
V
Start threshold
Stop threshold
Hysteresis
V
mV
APG/THERM COMPARATOR, 0°C ≤ T ≤ 125°C
J
PARAMETER
Upper trip threshold
Lower trip threshold
Input bias current
MIN
TYP
MAX
UNIT
V
1.480 1.498 1.515
0.545 0.558 0.570
1
V
µA
LOWV COMPARATOR, 0°C ≤ T ≤ 125°C
J
PARAMETER
Start threshold
MIN
2.80
3.00
100
TYP
2.90
3.10
MAX
3.00
3.20
UNIT
V
Stop threshold
V
Hysteresis
mV
3
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
ELECTRICAL CHARACTERISTICS CONTINUED
over recommended operating junction temperature supply and input voltages, and V (V ) ≥ V (IN) ( unless otherwise noted)
I
CC
I
HIGHV (RECHARGE) COMPARATOR, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Start threshold
3.80
3.90
4.00
V
OVERV COMPARATOR, 0°C ≤ T ≤ 125°C
J
PARAMETER
Start threshold
TEST CONDITIONS
MIN
4.35
4.25
50
TYP
4.45
4.30
MAX
4.55
4.35
UNIT
V
Stop threshold
V
Hysteresis
mV
TAPERDET COMPARATOR, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Trip threshold
12
18.5
25
mV
EN LOGIC INPUT, 0°C ≤ T ≤ 125°C
J
PARAMETER
High-level input voltage
MIN
TYP
TYP
MAX
UNIT
V
2.25
Low-level input voltage
0.8
V
Input pulldown resistance
100
200
kΩ
VSEL LOGIC INPUT, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
High-level input voltage
2.25
Low-level input voltage
0.8
V
Input pulldown resistance
100
200
kΩ
TMR SEL INPUT 0°C ≤ T ≤ 125°C
J
PARAMETER
High-level input voltage
Low-level input voltage
Input bias current
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
2.7
0.6
15
V
V
≤ 5V
µA
I(TMR SEL)
STAT1, STAT2 (bq24001, bq24003), 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.5
UNIT
V
Output (low) saturation voltage
Output (low) saturation voltage
Output (high) saturation voltage
Output (high) saturation voltage
Output turn on/off time
I
O
I
O
I
O
I
O
I
O
= 10 mA
= 4 mA
0.6
V
= −10 mA
= −4 mA
V
CC
V
CC
−1.5
−0.5
V
V
(1)
=
10 mA, C = 100 p
100
µs
(1) Assured by design, not production tested.
POWER-ON RESET (POR), 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
1.2
25
TYP
MAX
3
UNIT
ms
POR delay
See Note 1
See Note 1
POR falling-edge deglitch
75
µs
(1) Assured by design, not production tested.
4
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
ELECTRICAL CHARACTERISTICS CONTINUED
over recommended operating junction temperature supply and input voltages, and V (V ) ≥ V (IN) ( unless otherwise noted)
I
CC
I
APG/THERM DELAY, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
APG/THERM falling-edge deglitch
See Note 1
25
75
µs
(1) Assured by design, not production tested.
TIMERS, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
MIN
−15%
−20%
TYP
MAX
15%
20%
UNIT
T
A
= 25°C
User-selectable timer accuracy
Precharge and taper timer
22.5
minute
THERMAL SHUTDOWN, 0°C ≤ T ≤ 125°C
J
PARAMETER
Thermal trip
TEST CONDITIONS
MIN
TYP
165
10
MAX
UNIT
°C
See Note 1
See Note 1
Thermal hysteresis
°C
(1) Assured by design, not production tested.
CR PIN, 0°C ≤ T ≤ 125°C
J
PARAMETER
TEST CONDITIONS
< 100 µA
MIN
TYP
MAX
UNIT
Output voltage
0 < I
O(CR)
2,816
2.85
2.88
V
PIN ASSIGNMENTS
bq24002, bq24003
PWP PACKAGE
(TOP VIEW)
bq24001
PWP PACKAGE
(TOP VIEW)
1
20
19
18
17
16
15
14
13
12
11
N/C
IN
IN
N/C
OUT
OUT
VSENSE
AGND
STAT2
STAT1
TMR SEL
CR
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
N/C
IN
IN
N/C
OUT
OUT
VSENSE
AGND
N/C
STAT1
TMR SEL
CR
2
3
4
V
CC
V
CC
5
ISNS
N/C
APG/THERM
EN
ISNS
6
N/C
APG/THERM
EN
7
8
9
VSEL
GND/HEATSINK
VSEL
GND/HEATSINK
10
N/C
10
N/C
N/C − Do not connect
5
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
bq24001
RGW PACKAGE
(TOP VIEW)
bq24002, bq24003
RGW PACKAGE
(TOP VIEW)
EN 6
VSEL 7
GND 8
CR 9
20 N/C
EN 6
VSEL 7
GND 8
CR 9
20 N/C
19 N/C
18 N/C
17 OUT
19 N/C
18 N/C
17 OUT
N/C
OUT
N/C
OUT
16
10
16
10
N/C − Do Not Connect
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
AGND
NO.
NO.
14
5
16
7
Ground pin; connect close to the negative battery terminal.
Adapter power good input/thermistor sense input
Internal regulator bypass capacitor
APG/THERM
I
I
I
CR
EN
12
8
9
6
Charge-enableinput. Active-high enable input with internal pull down. Low-current stand-by mode
active when EN is low.
GND/HEATSINK
10
2, 3
5
8
1, 2
4
Ground pin; connect to PowerPAD heat-sink layout pattern.
Input voltage. This input provides the charging voltage for the battery.
Current sense input
IN
I
I
ISNS
N/C
1, 6, 11, 10, 13,
No connect. These pins must be left floating. Pin 15 is N/C on bq24001PWP only. Pin 13 is N/C on
bq24001RGWonly.
15, 20
18, 19
14
18−20
16, 17
12
OUT
O
O
O
I
Charge current output
STAT1
STAT2
TMR SEL
Status display output 1
15
13
Status display output 2 (for bq24002 and bq24003 only)
Charge timer selection input
13
11
V
CC
4
3
I
Supply voltage
VSEL
9
7
I
4.1 V or 4.2 V charge regulation selection input
Battery voltage sense input
VSENSE
17
15
I
6
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
FUNCTIONAL BLOCK DIAGRAM
OUT
IN
+
−
VSENSE
TaperDet
0.2*V
ilim
+
−
−
+
ISNS
V
ilim
V
CC
V
ref
AGND
+
ChargeOK
LowV
UVS
Precharge
−
GND/
HEATSINK
V
uvlo
+
−
OverV
HighV
LowV
ChipEN
EN
+
−
H: V
L: V
= 4.2 V/Cell
= 4.1 V/Cell
Bias and
Ref
Generator
reg
reg
VSEL
R9
R8
−
+
Power On
Delay
V
V
uvlo
ref
V
ref
+
−
APG/
THERM
CLRFLT
+
−
PWRDWN
Thermal
Shutdown
UVS
V
V
CC
TaperDet
STAT1
STAT2
PWRDWN
PWRDWN
OSC
CC
Charge Control, Charge Timer
and
Display Logic
TMR SEL
REG
CR
Two Open
Drain
Outputs
for
ChargeOK
bq24002
7
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
JUNCTION TEMPERATURE
4.24
4.22
4.20
4.18
4.16
4.14
4.12
4.10
4.08
4.06
4.24
4.22
4.20
4.18
4.16
4.14
4.12
4.10
4.08
4.06
V
IN
= 5 V
V
T
= 5 V
= 25°C
IN
A
V
SEL
= V
CC
V
= V
CC
SEL
V
SEL
= V
SS
V
= V
SS
SEL
−50
0
50
100
150
0
200
400
600
800
1000
1200
T
J
− Junction Temperature − °C
I
O
− Output Current − mA
Figure 1
Figure 2
OUTPUT VOLTAGE
vs
CURRENT SENSE VOLTAGE
vs
INPUT VOLTAGE
INPUT VOLTAGE
4.24
4.22
4.20
4.18
4.16
4.14
4.12
4.10
4.08
4.06
103
102
101
100
99
I
T
= 100 mA
= 25°C
I
T
= 100 mA
= 25°C
O
A
O
A
V
= V
CC
SEL
V
= V
SS
SEL
98
97
5
6
7
8
9
10
5
6
7
8
9
10
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 3
Figure 4
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
TYPICAL CHARACTERISTICS
CURRENT SENSE VOLTAGE
vs
QUIESCENT CURRENT
vs
JUNCTION TEMPERATURE
INPUT VOLTAGE
103
0.5
0.4
0.3
0.2
0.1
0.0
I
T
= 100 mA
= 25°C
T
A
= 25°C
O
A
102
101
100
99
V
V
= 10 V
CC
= 5 V
CC
98
−50
0
50
100
150
5
6
7
8
9
10
T
J
− Junction Temperature − °C
V − Input Voltage − V
I
Figure 5
Figure 6
QUIESCENT CURRENT
(POWER DOWN)
vs
DROPOUT VOLTAGE
vs
INPUT VOLTAGE
INPUT VOLTAGE
600
30
25
20
15
10
5
T
A
= 25°C
T
A
= 25°C
500
400
300
200
100
0
1200 mA
800 mA
400 mA
100 mA
0
4.5
5.5
6.5
7.5
8.5
9.5
5
6
7
8
9
10
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 7
Figure 8
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
TYPICAL CHARACTERISTICS
DROPOUT VOLTAGE
vs
DROPOUT VOLTAGE
vs
OUTPUT CURRENT
JUNCTION TEMPERATURE
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
I
O
= 1.2 A
T
A
= 25°C
V
= 5 V
IN
V
= 5 V
CC
V
= 10 V
IN
V
CC
= 10 V
0
200
400
600
800
1000
1200
−50
0
50
100
150
I
O
− Output Current − mA
T
J
− Junction Temperature − °C
Figure 9
Figure 10
REVERSE CURRENT
vs
REVERSE CURRENT LEAKAGE
vs
JUNCTION TEMPERATURE
VOLTAGE ON OUT PIN
6
5
4
3
2
1
0
4.0
V
OUT
= 4.3 V
T
A
= 25°C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
−50
0
50
100
150
5
6
7
8
9
10
T
J
− Junction Temperature − °C
V
O
− Voltage on Out Pin − V
Figure 11
Figure 12
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
APPLICATION INFORMATION
U1
V
CC
1
2
20
19
18
17
16
15
14
13
12
11
R1
0.1 Ω
N/C
IN
N/C
OUT
OUT
DC+
DC−
PACK+
PACK−
TEMP
C1
10 µF
V
CC
3
+
IN
+
−
4
V
CC
VSENSE
AGND
5
ISNS
N/C
6
STAT2
C4
1 µF
C2
0.1 µF
7
APG/THM STAT1
8
EN
TMR SEL
CR
9
Battery
Pack
VSEL
GND
V
CC
C3
0.22 µF
10
N/C
R4
bq24002PWP
500 Ω
D1
D2
R5
500 Ω
R2
18.7 kΩ
R3
95.3 kΩ
Figure 13. Li-Ion/Li-Pol Charger
D
D
If the TMR SEL pin is left floating (3 HR time), a 10-pF capacitor should be installed between TMR SEL and CR.
If a micro process is monitoring the STAT pins, it may be necessary to add some hysteresis into the feedback
to prevent the STAT pins from cycling while crossing the taper detect threshold (usually less than one half
second). See SLUU083 EVM or SLUU113 EVM for additional resistors used for the STAT pins.
11
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
APPLICATION INFORMATION
FUNCTIONAL DESCRIPTION
The bq2400x supports a precision current- and voltage-regulated Li-Ion charging system suitable for cells with either coke
or graphite anodes. See Figure 14 for a typical charge profile and Figure 15 for an operational flowchart.
Current Regulation
Phase
Voltage Regulation and
Charge TerminationPhase
Preconditioning
Phase
Regulation Voltage
(V
)
OUT
Regulation Current
(I
)
lim
Charge Voltage
Minimum Charge
Voltage (LowV)
Preconditioning
Current (I
PRECHG
)
Charge Current
Taper Detect
22.5 Minutes
Charge Timer (3, 4.5 or 6 Hours)
22.5 Minutes
Figure 14. Typical Charge Profile
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
POR
Regulate
(PRECHG)
I
Yes
Reset and Start
22.5 min Timer
V
< V ?
(LOWV)
I(VSENSE)
Indicate Pre−
Charge
No
Reset All Timers,
Start Charge Timer
(TMR SEL input )
Yes
V
> V ?
(OVERV)
I(VSENSE)
No
Regulate Current
or Voltage
Indicate Charge
No
V
< V ?
(LOWV)
I(VSENSE)
Yes
Yes
V
> V ?
(OVERV)
I(VSENSE)
No
22.5min Timer
Expired?
No
Yes
Yes
Charge timer
Expired?
No
Fault Condition
Indicate Fault
Yes
V
< V ?
(LOWV)
I(VSENSE)
No
POR?
or
APG/THERM toggle?
No
Start 22.5 minute
Timer
or
Yes
Taper
Detected?
EN toggle?
Indicate DONE
Yes
No
22.5min Timer
Expired?
Yes
Turn Off Charge
Indicate DONE
V
< V
?
(HIGHV)
I(VSENSE)
or
No
POR?
or
APG/THERM Toggle?
or
EN Toggle?
Yes
Figure 15. Operational Flow Chart
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
either the adapter power or the battery temperature using
a thermistor. The bq2400x suspends charge if this input is
outside the limits set by the user. Please refer to the
APG/THERM input section for additional details.
Charge Qualification and Preconditioning
The bq2400x starts a charge cycle when power is applied
while a battery is present. Charge qualification is based on
battery voltage and the APG/THERM input.
APG/THERM Input
The bq400x continuously monitors temperature or system
input voltage by measuring the voltage between the
APG/THERM (adapter power good/thermistor) and GND.
For temperature, a negative- or a positive- temperature
coefficient thermistor (NTC, PTC) and an external voltage
divider typically develop this voltage (see Figure 16). The
As shown in the block diagram, the internal LowV
comparator output prevents fast-charging a deeply
depleted battery. When set, charging current is provided
by a dedicated precharge current source. The precharge
timer limits the precharge duration. The precharge current
also minimizes heat dissipation in the pass element during
the initial stage of charge.
bq2400x compares this voltage against its internal V
TP1
and V
thresholds to determine if charging is allowed.
TP2
The APG/THERM input can also be configured to monitor
(See Figure 17.)
U1
1
2
20
19
18
17
16
15
14
13
12
11
N/C
IN
N/C
OUT
PACK+
PACK−
TEMP
3
IN
OUT
+
−
4
V
CC
VSENSE
AGND
STAT2
5
ISNS
N/C
6
NTC Thermistor
Battery Pack
7
APG/THM STAT1
8
EN
TMR SEL
CR
9
VSEL
GND
C3
0.22 µF
10
N/C
bq24002PWP
RT1
RT2
Figure 16. Temperature Sensing Circuit
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
If the charger designs incorporate a thermistor, the resistor
divider RT1 and RT2 is calculated by using the following
two equations.
Where:
VB = VCR (bias voltage)
First, calculate RT2.
RH = Resistance of the thermistor at the desired hot trip
threshold
1
1
ƪ ƫ
V R R
*
V
V
B
H
C
C
H
RC = Resistance of the thermistor at the desired cold trip
threshold
RT2 +
V
V
V
B
H
B
ǒ
* 1Ǔ* R
ǒ Ǔ
R
* 1
V
C
H
C
VH = VP2 or the lower APG trip threshold
VC = VP2 or the upper APG trip threshold
RT1 = Top resistor in the divider string
RT2 = Bottom resistor in the divider string
then use the resistor value to find RT1.
V
B
* 1
V
C
RT1 +
1
1
)
RT2
R
C
U1
V
CC
1
2
20
19
18
17
16
15
14
13
12
11
N/C
IN
N/C
OUT
DC+
3
Vcc
IN
OUT
4
V
CC
VSENSE
AGND
STAT2
Temp Fault
5
ISNS
N/C
6
R1
R2
VTP1
7
APG/THM STAT1
Normal Temp Range
Temp Fault
8
VTP2
EN
TMR SEL
CR
9
VSEL
GND
10
DC−
N/C
GND
bq24002PWP
Figure 17. Temperature Threshold
Figure 18. APG Sensing Circuit
Values of resistors R1 and R2 can be calculated using the following equation:
R2
V
+ V
CC
APG
(R1 ) R2)
where V
is the voltage at the APG/THM pin.
APG
Current Regulation
The bq2400x provides current regulation while the battery-pack voltage is less than the regulation voltage. The current
regulation loop effectively amplifies the error between a reference signal, Vilim, and the drop across the external sense
resistor, R
.
SNS
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
U1
V
CC
1
2
20
19
18
17
16
15
14
13
12
11
N/C
IN
N/C
OUT
OUT
R
SNS
DC+
DC−
C1
10 µF
V
CC
3
+
IN
4
V
CC
VSENSE
AGND
5
ISNS
N/C
6
STAT2
C2
0.1 µF
7
APG/THM STAT1
8
EN
TMR SEL
CR
9
VSEL
GND
10
N/C
bq24002PWP
Figure 19. Current Sensing Circuit
Charge current feedback, applied through pin ISNS,
maintains regulation around a threshold of Vilim. The
following formula calculates the value of the sense
resistor:
that in the case of a fault condition, such as an out-of-range
signal on the APG/THERM input or a thermal shutdown,
the bq2400x suspends the timer.
TMRSEL STATE
(1)
CHARGE TIME
3 hours
Vilim
Floating
R
+
SNS
I
REG
Low
6 hours
High
4.5 hours
where I
is the desired charging current.
REG
(1)
To improve noise immunity, it is recommended that a minimum of
10 pF capacitor be tied to Vss on a floating pin.
Voltage Monitoring and Regulation
Minimum Current: The bq2400x monitors the charging
current during the voltage regulation phase. The bq2400x
initiates a 22-minute timer once the current falls below the
taperdet trip threshold. Fast charge is terminated once the
22-minute timer expires.
Voltage regulation feedback is through pin VSENSE. This
input is tied directly to the positive side of the battery pack.
The bq2400x supports cells with either coke (4.1 V) or
graphite (4.2 V) anode. Pin VSEL selects the charge
regulation voltage.
Charge Status Display
VSEL State
(see Note)
CHARGE REGULATION
VOLTAGE
The three available options allow the user to configure the
charge status display for single LED (bq24001), two
individual LEDs (bq24002) or a bicolor LED (bq24003).
The output stage is totem pole for the bq24001 and
bq24003 and open-drain for the bq24002. The following
tables summarize the operation of the three options:
Low
4.1 V
4.2 V
High
NOTE: VSEL should not be left floating.
Table 1. bq24001 (Single LED)
Charge Termination
CHARGE STATE
Precharge
STAT1
ON (LOW)
The bq2400x continues with the charge cycle until
termination by one of the two possible termination
conditions:
Fast charge
ON (LOW)
FAULT
Flashing (1 Hz, 50% duty cycle)
OFF (HIGH)
Maximum Charge Time: The bq2400x sets the maximum
charge time through pin TMRSEL. The TMR SEL pin
allows the user to select between three different total
charge-time timers (3, 4, 5, or 6 hours). The charge timer
is initiated after the preconditioning phase of the charge
and is reset at the beginning of a new charge cycle. Note
Done (>90%)
Sleep-mode
OFF (HIGH)
APG/Therm invalid
Thermal shutdown
Battery absent
OFF (HIGH)
OFF (HIGH)
OFF (HIGH)
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
Table 2. bq24002 (2 Individual LEDs)
Table 3. bq24003 (Single Bicolor LED)
LED2
(GREEN)
APPARENT
COLOR
CHARGE STATE LED1 (RED)
STAT2
(GREEN)
CHARGE STATE
STAT1 (RED)
Precharge
Fast charge
FAULT
ON (LOW)
ON (LOW)
ON (LOW)
OFF (HIGH)
OFF (HIGH)
OFF (HIGH)
OFF (HIGH)
ON (LOW)
ON (LOW)
OFF (HIGH)
RED
RED
Precharge
ON (LOW)
ON (LOW)
OFF
OFF
Fast charge
YELLOW
GREEN
OFF
Flashing (1 Hz,
50% duty cycle)
FAULT
OFF
Done (>90%)
Sleep-mode
Done (>90%)
OFF
OFF
OFF
OFF
OFF
ON (LOW)
OFF
APG/Therm
invalid
Sleep-mode
OFF (HIGH)
OFF (HIGH)
OFF (HIGH)
OFF (HIGH)
OFF
OFF
APG/Therm invalid
Thermal shutdown
Battery absent
OFF
Thermal
shutdown
OFF
(1)
OFF
(1)
OFF (HIGH) OFF (HIGH)
(1)
OFF
Battery absent
(1) If thermistor is used, then the Green LED is off.
(1) If thermistor is used, then the Green LED is off.
Thermal Shutdown
The bq2400x monitors the junction temperature T of the DIE and suspends charging if T exceeds 165°C. Charging
J
J
resumes when T falls below 155°C.
J
DETAILED DESCRIPTION
POWER FET
VOLTAGE SENSE
The integrated transistor is a P-channel MOSFET. The
power FET features a reverse-blocking Schottky diode,
which prevents current flow from OUT to IN.
To achieve maximum voltage regulation accuracy, the
bq2400x uses the feedback on the VSENSE pin.
Externally, this pin should be connected as close to the
battery cell terminals as possible. For additional safety, a
10kΩ internal pullup resistor is connected between the
VSENSE and OUT pins.
An internal thermal-sense circuit shuts off the power FET
when the junction temperature rises to approximately
165°C. Hysteresis is built into the thermal sense circuit.
After the device has cooled approximately 10°C, the
power FET turns back on. The power FET continues to
cycle off and on until the fault is removed.
ENABLE (EN)
The logic EN input is used to enable or disable the IC. A
high-level signal on this pin enables the bq2400x. A
low-level signal disables the IC and places the device in a
low-power standby mode.
CURRENT SENSE
The bq2400x regulates current by sensing, on the ISNS
pin, the voltage drop developed across an external sense
resistor. The sense resistor must be placed between the
supply voltage (Vcc) and the input of the IC (IN pins).
17
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
THERMAL INFORMATION
THERMALLY ENHANCED TSSOP-20
DIE
The thermally enhanced PWP package is based on the
20-pin TSSOP, but includes a thermal pad (see
Figure 20) to provide an effective thermal contact between
the IC and the PWB.
Side View (a)
DIE
Traditionally, surface mount and power have been
mutually exclusive terms. A variety of scaled-down
TO220-type packages have leads formed as gull wings to
make them applicable for surface-mount applications.
These packages, however, suffer from several
shortcomings: they do not address the very low profile
requirements (<2 mm) of many of today’s advanced
systems, and they do not offer a pin-count high enough to
accommodate increasing integration. On the other hand,
traditional low-power surface-mount packages require
power-dissipation derating that severely limits the usable
range of many high-performance analog circuits.
End View (b)
Thermal
Pad
The PWP package (thermally enhanced TSSOP)
combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power
packages.
Bottom View (c)
The PWP package is designed to optimize the heat
transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement
is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is
formed using a lead-frame design (patent pending) and
manufacturing technique to provide the user with direct
connection to the heat-generating IC. When this pad is
soldered or otherwise coupled to an external heat
dissipator, high power dissipation in the ultrathin,
fine-pitch, surface-mount package can be reliably
achieved.
Figure 20. Views of Thermally Enhanced
PWP Package
Because the conduction path has been enhanced,
power-dissipation capability is determined by the thermal
considerations in the PWB design. For example, simply
adding a localized copper plane (heat-sink surface), which
is coupled to the thermal pad, enables the PWP package
to dissipate 2.5 W in free air. (Reference Figure 22(a), 8
2
cm of copper heat sink and natural convection.)
Increasing the heat-sink size increases the power
dissipation range for the component. The power
dissipation limit can be further improved by adding airflow
to a PWB/IC assembly (see Figure 22(b) and 22(c)). The
2
line drawn at 0.3 cm in Figures 21 and 22 indicates
performance at the minimum recommended heat-sink
size.
18
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
THERMAL INFORMATION
THERMAL RESISTANCE
vs
COPPER HEAT-SINK AREA
150
125
100
Natural Convection
50 ft/min
100 ft/min
150 ft/min
200 ft/min
75
50
25
250 ft/min
300 ft/min
0 0.3
1
2
3
4
5
6
7
8
2
Copper Heat-Sink Area − cm
Figure 21
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
THERMAL INFORMATION
3.5
3.5
T
A
= 25°C
T
A
= 55°C
300 ft/min
3
2.5
2
3
2.5
2
150 ft/min
300 ft/min
150 ft/min
Natural Convection
1.5
1.5
Natural Convection
1
0.5
0
1
0.5
0
0
2
4
6
8
0
2
4
6
8
0.3
0.3
2
2
Copper Heat-Sink Size − cm
Copper Heat-Sink Size − cm
(a)
(b)
3.5
T
A
= 105°C
3
2.5
2
1.5
1
150 ft/min
300 ft/min
Natural Convection
0.5
0
0
0.3
2
4
6
8
2
Copper Heat-Sink Size − cm
(c)
Figure 22. Power Ratings of the PWP Package at Ambient Temperatures of 25°C, 55°C, and 105°C
20
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
PACKAGING INFORMATION
Orderable Device
BQ24001PWP
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
HTSSOP
PWP
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BQ24001PWPG4
BQ24001PWPR
BQ24001PWPRG4
BQ24001RGWR
BQ24001RGWRG4
BQ24002PWP
HTSSOP
HTSSOP
HTSSOP
VQFN
PWP
PWP
PWP
RGW
RGW
PWP
PWP
PWP
PWP
RGW
RGW
PWP
PWP
PWP
PWP
RGW
RGW
70 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
VQFN
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
HTSSOP
HTSSOP
HTSSOP
HTSSOP
VQFN
70 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BQ24002PWPG4
BQ24002PWPR
BQ24002PWPRG4
BQ24002RGWR
BQ24002RGWRG4
BQ24003PWP
70 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
VQFN
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
HTSSOP
HTSSOP
HTSSOP
HTSSOP
VQFN
70 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BQ24003PWPG4
BQ24003PWPR
BQ24003PWPRG4
BQ24003RGWR
BQ24003RGWRG4
70 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
VQFN
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ24001PWPR
BQ24001RGWR
BQ24002PWPR
BQ24002RGWR
BQ24003PWPR
BQ24003RGWR
HTSSOP PWP
VQFN RGW
HTSSOP PWP
VQFN RGW
HTSSOP PWP
VQFN RGW
20
20
20
20
20
20
2000
3000
2000
3000
2000
3000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
12.4
16.4
12.4
16.4
12.4
6.95
5.3
7.1
5.3
7.1
5.3
7.1
5.3
1.6
1.5
1.6
1.5
1.6
1.5
8.0
8.0
8.0
8.0
8.0
8.0
16.0
12.0
16.0
12.0
16.0
12.0
Q1
Q2
Q1
Q2
Q1
Q2
6.95
5.3
6.95
5.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ24001PWPR
BQ24001RGWR
BQ24002PWPR
BQ24002RGWR
BQ24003PWPR
BQ24003RGWR
HTSSOP
VQFN
PWP
RGW
PWP
RGW
PWP
RGW
20
20
20
20
20
20
2000
3000
2000
3000
2000
3000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
35.0
38.0
35.0
38.0
35.0
HTSSOP
VQFN
HTSSOP
VQFN
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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相关型号：
BQ24002PWPTR
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20, GREEN, PLASTIC, HTSSOP-20, Power Management Circuit
TI
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