BQ24002 [TI]

SINGLE-CELL Li-ION CHARGE MANAGEMENT IC FOR PDAs AND INTERNET APPLIANCES; 单节锂离子电池充电管理IC ,用于PDA和互联网设备
BQ24002
型号: BQ24002
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE-CELL Li-ION CHARGE MANAGEMENT IC FOR PDAs AND INTERNET APPLIANCES
单节锂离子电池充电管理IC ,用于PDA和互联网设备

电池 光电二极管
文件: 总23页 (文件大小:190K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D – SEPTEMBER 2000 – REVISED MAY 2002  
SINGLE-CELL Li-ION CHARGE MANAGEMENT IC FOR PDAs  
AND INTERNET APPLIANCES  
FEATURES  
DESCRIPTION  
D
Highly Integrated Solution With FET Pass  
Transistor and Reverse-Blocking Schottky  
and Thermal Protection  
The bq2400x series ICs are advanced Li-Ion linear  
charge management devices for highly integrated and  
space-limited applications. They combine high-  
accuracy current and voltage regulation; FET pass-  
transistor and reverse-blocking Schottky; battery  
conditioning, temperature, or input-power monitoring;  
charge termination; charge-status indication; and  
charge timer in a small package.  
D
D
D
Integrated Voltage and Current Regulation  
With Programmable Charge Current  
High-Accuracy Voltage Regulation (±1%)  
Ideal for Low-Dropout Linear Charger  
Designs for Single-Cell Li-Ion Packs With  
Coke or Graphite Anodes  
The bq2400x measures battery temperature using an  
external thermistor. For safety reasons, the bq2400x  
inhibitscharge until the battery temperature is within the  
user-defined thresholds. Alternatively, the user can  
monitor the input voltage to qualify charge. The  
bq2400xseries then charge the battery in three phases:  
preconditioning, constant current, and constant  
voltage. If the battery voltage is below the internal  
low-voltage threshold, the bq2400x uses low-current  
precharge to condition the battery. A preconditioning  
timer is provided for additional safety. Following pre-  
conditioning, the bq2400x applies a constant-charge  
current to the battery. An external sense-resistor sets  
the magnitude of the current. The constant-current  
phase is maintained until the battery reaches the  
charge-regulation voltage. The bq2400x then  
transitions to the constant voltage phase. The user can  
configure the device for cells with either coke or  
graphiteanodes. The accuracy of the voltageregulation  
is better than ±1% over the operating junction  
temperature and supply voltage range.  
D
D
D
Up to 1.2-A Continuous Charge Current  
Safety-Charge Timer During Preconditioning  
and Fast Charge  
Integrated Cell Conditioning for Reviving  
Deeply Discharged Cells and Minimizing Heat  
Dissipation During Initial Stage of Charge  
D
D
Optional Temperature or Input-Power  
Monitoring Before and During Charge  
Various Charge-Status Output Options for  
Driving Single, Double, or Bicolor LEDs or  
Host-Processor Interface  
D
Charge Termination by Minimum Current and  
Time  
D
Low-Power Sleep Mode  
D
Packaging: 5 mm × 5 mm MLP or 20-Lead  
TSSOP PowerPAD  
APPLICATIONS  
Charge is terminated by maximum time or minimum  
taper current detection  
D
D
D
D
PDAs  
Internet Appliances  
MP3 Players  
Digital Cameras  
The bq2400x automatically restarts the charge if the  
battery voltage falls below an internal recharge  
threshold.  
Pleasebe aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of TexasInstruments.  
PRODUCTION DATA information is current as of publication date. Products  
conform to specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all parameters.  
Copyright 2002, Texas Instruments Incorporated  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoamduring  
storageor handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION  
PACKAGE  
CHARGE STATUS  
CONFIGURATION  
T
J
20-LEAD HTTSOP PowerPAD 20-LEAD 5 mm × 5 mm MLP  
(1)  
(2)  
(PWP) (RGW)  
bq24001PWP  
bq24002PWP  
bq24003PWP  
bq24001RGW  
bq24002RGW  
bq24003RGW  
SingleLED  
2 LEDs  
40°C to 125°C  
Single bicolor LED  
(1)  
(2)  
The PWP package is available taped and reeled. Add R suffix to device type(e.g. bq24001PWPR)toorder. Quantities2500devicesperreel.  
TheRGWpackageisavailabletapedandreeled. AddRsuffix to device type (e.g. bq24001RGWR) to order. Quantities3000devices perreel.  
PACKAGE DISSIPATION RATINGS  
T
25°C  
DERATING FACTOR  
A
PACKAGE  
Θ
JA  
Θ
JC  
POWER RATING  
ABOVE T = 25°C  
A
(1)  
PWP  
30.88°C/W  
31.41°C/W  
1.19°C/W  
1.25°C/W  
3.238 W  
0.0324W/°C  
0.0318W/°C  
(2)  
RGW  
3.183 W  
(1)  
(2)  
Thisdata is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (6.5 × 3.4 mm), internal 1 oz power and  
ground planes, 8 thermal via underneath the die connecting to ground plane.  
This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (3.25 × 3.25 mm), internal 1 oz power  
and ground planes, 9 thermal via underneath the die connecting to ground plane.  
ABSOLUTE MAXIMUM RATINGS  
overoperating free-air temperature range unless otherwise noted  
(1)  
bq24001  
bq24002  
bq24003  
Supply voltage (Vcc with respect to GND)  
13.5 V  
13.5 V  
Input voltage (IN, ISNS, EN, APG/THERM/CR/STAT1/STAT2, VSENSE, TMR SEL, VSEL) (all with respect to GND)  
Output current (OUT pins)  
2 A  
Output sink/source current (STAT1 and STAT2)  
10 mA  
Operating free-air temperature range, T  
40°C to 70°C  
65°C to 150°C  
40°C to 125°C  
300°C  
A
Storage temperature range, T  
stg  
Junction temperature range, T  
J
Lead temperature (Soldering, 10 sec)  
(1)  
Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratingsonly,and  
functionaloperation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
RECOMMENDED OPERATING CONDITIONS  
MIN MAX  
UNIT  
V
Supply voltage, V  
4.5  
4.5  
10  
10  
CC  
Input voltage, VIN  
V
Continuousoutputcurrent  
Operatingjunctiontemperaturerange, T  
1.2  
125  
A
40  
°C  
J
2
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
ELECTRICAL CHARACTERISTICS  
over recommended operating junction temperature supply and input voltages, and V (V ) V (IN) ( unless otherwise noted)  
I
CC  
I
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
mA  
µA  
V
V
current  
V
> V _UVLO,  
CC  
EN V  
IH(EN)  
1
CC  
CC  
current, standby mode  
EN V  
EN V  
1
CC  
IL(EN)  
IN current, standby mode  
10  
4
µA  
IL(EN)  
V
CC  
< V _UVLO,  
CC  
V
= 4.3 V, VSENSE = 4.3V  
= 4.3 V, VSENSE = 4.3 V  
2
2
Standby current (sum of currents into OUT  
and VSENSE pins)  
OUT  
µA  
EN <= Vil  
EN,  
V
OUT  
4
VOLTAGE REGULATION, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
0 < I 1.2 A  
MIN  
4.059  
4.158  
TYP  
MAX  
UNIT  
V
VSEL = V  
,
4.10 4.141  
4.20 4.242  
SS  
O
Outputvoltage  
VSEL = V  
,
0 < I 1.2 A  
V
CC  
1 mA I 1.2 A,  
O
V
= 5 V,  
O
=5 V,  
I(IN)  
Loadregulation  
Lineregulation  
1
mV  
V
CC  
T = 25°C  
J
V
+V +V  
OUT DO ilim(MAX)  
= 1.0 A,  
< V  
< 10 V, T = 25°C  
0.01  
0.7  
%/V  
V
I(VCC)  
J
I
O
I
O
4.9 V <V  
< 10 V  
I(Vcc)  
Dropout voltage = VI(IN)-Vout  
= 1.2 A,  
V +V +V  
OUT DO ilimMAX I(VCC)  
<V  
< 10 V  
0.8  
V
CURRENT REGULATION, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Current regulation threshold, V  
VSENSE < V  
0.095  
0.1 0.105  
V
I(limit)  
O(VSEL-LOW/HIGH)  
VSENSE pulsed above VVLOWV to I = 10% of  
O
Delay time  
1
ms  
ms  
(1)  
regulatedvalue  
I
R
increasing from 10% to 90% of regulated value.  
O
Rise time  
0.1  
1
(1)  
0.2 Ω,  
SNS  
(1)  
Specified by design, not production tested.  
CURRENT SENSE RESISTOR, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
100 mA Ilim 1.2 A  
MIN  
TYP  
MAX  
UNIT  
Externalcurrentsenseresistorrange(R  
)
0.083  
1
SNS  
PRECHARGE CURRENT REGULATION, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
0.083 R 1.0 Ω  
MIN  
TYP  
MAX  
UNIT  
Prechargecurrentregulation  
V
<V  
40  
60  
80  
mA  
SENSE LOWV,  
SNS  
V
UVLO COMPARATOR, 0°C T 125°C  
J
CC  
PARAMETER  
TEST CONDITIONS  
TEST CONDITIONS  
TEST CONDITIONS  
MIN  
4.35  
4.25  
50  
TYP  
4.43  
4.33  
MAX  
4.50  
4.40  
UNIT  
V
Startthreshold  
Stopthreshold  
Hysteresis  
V
mV  
APG/THERM COMPARATOR, 0°C T 125°C  
J
PARAMETER  
Upper trip threshold  
Lower trip threshold  
Input bias current  
MIN  
TYP  
MAX  
UNIT  
V
1.480 1.498 1.515  
0.545 0.558 0.570  
1
V
µA  
LOWV COMPARATOR, 0°C T 125°C  
J
PARAMETER  
Startthreshold  
MIN  
2.80  
3.00  
100  
TYP  
2.90  
3.10  
MAX  
3.00  
3.20  
UNIT  
V
Stopthreshold  
V
Hysteresis  
mV  
3
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
ELECTRICAL CHARACTERISTICS CONTINUED  
over recommended operating junction temperature supply and input voltages, and V (V ) V (IN) ( unless otherwise noted)  
I
CC  
I
HIGHV (RECHARGE) COMPARATOR, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Startthreshold  
3.80  
3.90  
4.00  
V
OVERV COMPARATOR, 0°C T 125°C  
J
PARAMETER  
Startthreshold  
TEST CONDITIONS  
MIN  
4.35  
4.25  
50  
TYP  
4.45  
4.30  
MAX  
4.55  
4.35  
UNIT  
V
Stopthreshold  
V
Hysteresis  
mV  
TAPERDET COMPARATOR, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Tripthreshold  
12  
18.5  
25  
mV  
EN LOGIC INPUT, 0°C T 125°C  
J
PARAMETER  
High-levelinputvoltage  
MIN  
TYP  
TYP  
MAX  
UNIT  
V
2.25  
Low-levelinputvoltage  
0.8  
V
Inputpulldownresistance  
100  
200  
kΩ  
VSEL LOGIC INPUT, 0°C T 125°C  
J
PARAMETER  
High-levelinputvoltage  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
V
2.25  
Low-levelinputvoltage  
0.8  
V
Inputpulldownresistance  
100  
200  
kΩ  
TMR SEL INPUT 0°C T 125°C  
J
PARAMETER  
High-levelinputvoltage  
Low-levelinputvoltage  
Input bias current  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
2.7  
0.6  
15  
V
V
5V  
µA  
I(TMR SEL)  
STAT1, STAT2 (bq24001, bq24003), 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
1.5  
UNIT  
V
Output (low) saturation voltage  
Output (low) saturation voltage  
Output (high) saturation voltage  
Output (high) saturation voltage  
Output turn on/off time  
I
O
I
O
I
O
I
O
I
O
= 10 mA  
= 4 mA  
0.6  
V
= 10 mA  
V
CC  
V
CC  
1.5  
0.5  
V
= 4 mA  
V
(1)  
= ± 10 mA, C = 100 p  
100  
µs  
(1) Assured by design, not production tested.  
POWER-ON RESET (POR), 0°C T 125°C  
J
PARAMETER  
POR delay  
TEST CONDITIONS  
MIN  
1.2  
25  
TYP  
MAX  
3
UNIT  
ms  
See Note 1  
See Note 1  
PORfalling-edgedeglitch  
75  
µs  
(1) Assured by design, not production tested.  
4
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
ELECTRICAL CHARACTERISTICS CONTINUED  
over recommended operating junction temperature supply and input voltages, and V (V ) V (IN) ( unless otherwise noted)  
I
CC  
I
APG/THERM DELAY, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
APG/THERMfalling-edgedeglitch  
See Note 1  
25  
75  
µs  
(1) Assured by design, not production tested.  
TIMERS, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
MIN  
15%  
20%  
TYP  
MAX  
15%  
20%  
UNIT  
T
A
= 25°C  
User-selectable timer accuracy  
Precharge and taper timer  
22.5  
minute  
THERMAL SHUTDOWN, 0°C T 125°C  
J
PARAMETER  
Thermaltrip  
TEST CONDITIONS  
MIN  
TYP  
165  
10  
MAX  
UNIT  
°C  
See Note 1  
See Note 1  
Thermalhysteresis  
°C  
(1) Assured by design, not production tested.  
CR PIN, 0°C T 125°C  
J
PARAMETER  
TEST CONDITIONS  
< 100 µA  
MIN  
TYP  
MAX  
UNIT  
Outputvoltage  
0 < I  
2,816  
2.85  
2.88  
V
O(CR)  
PIN ASSIGNMENTS  
bq24002,bq24003  
PWP PACKAGE  
(TOP VIEW)  
bq24001  
PWP PACKAGE  
(TOP VIEW)  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
N/C  
IN  
IN  
N/C  
OUT  
OUT  
VSENSE  
AGND  
STAT2  
STAT1  
TMR SEL  
CR  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
N/C  
IN  
IN  
N/C  
OUT  
OUT  
VSENSE  
AGND  
N/C  
STAT1  
TMR SEL  
CR  
2
3
4
V
CC  
V
CC  
5
ISNS  
N/C  
APG/THERM  
EN  
ISNS  
6
N/C  
APG/THERM  
EN  
7
8
9
VSEL  
GND/HEATSINK  
VSEL  
GND/HEATSINK  
10  
N/C  
10  
N/C  
N/C Do not connect  
5
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
bq24001  
RGW PACKAGE  
(TOP VIEW)  
bq24002,bq24003  
RGW PACKAGE  
(TOP VIEW)  
EN 6  
VSEL 7  
GND 8  
CR 9  
20 N/C  
19 N/C  
18 N/C  
17 OUT  
EN 6  
VSEL 7  
GND 8  
CR 9  
20 N/C  
19 N/C  
18 N/C  
17 OUT  
N/C  
OUT  
N/C  
OUT  
16  
10  
16  
10  
N/C Do Not Connect  
Terminal Functions  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
AGND  
NO.  
NO.  
14  
5
16  
7
Groundpin; connect close to the negative battery terminal.  
Adapter power good input/thermistor sense input  
Internal regulator bypass capacitor  
APG/THERM  
I
I
I
CR  
EN  
12  
8
9
6
Charge-enableinput.Active-highenableinputwithinternalpulldown.Low-currentstand-bymode  
active when EN is low.  
GND/HEATSINK  
10  
2, 3  
5
8
1, 2  
4
Ground pin; connect to PowerPAD heat-sink layout pattern.  
Input voltage. This input provides the charging voltage for the battery.  
Current sense input  
IN  
I
I
ISNS  
N/C  
1, 6, 11, 10, 13,  
Noconnect. Thesepinsmustbeleftfloating. Pin15isN/Conbq24001PWPonly. Pin 13 is N/Con  
bq24001RGWonly.  
15, 20  
18, 19  
14  
1820  
16, 17  
12  
OUT  
O
O
O
I
Charge current output  
STAT1  
STAT2  
TMR SEL  
Status display output 1  
15  
13  
Status display output 2 (for bq24002 and bq24003 only)  
Charge timer selection input  
13  
11  
V
CC  
4
3
I
Supplyvoltage  
VSEL  
9
7
I
4.1 V or 4.2 V charge regulation selection input  
Battery voltage sense input  
VSENSE  
17  
15  
I
6
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
FUNCTIONAL BLOCK DIAGRAM  
OUT  
IN  
+
VSENSE  
TaperDet  
0.2*V  
ilim  
+
+
ISNS  
V
ilim  
V
CC  
V
ref  
AGND  
+
ChargeOK  
LowV  
UVS  
Precharge  
GND/  
HEATSINK  
V
uvlo  
+
OverV  
ChipEN  
EN  
+
HighV  
LowV  
H: V  
L: V  
= 4.2 V/Cell  
= 4.1 V/Cell  
Bias and  
Ref  
Generator  
reg  
reg  
VSEL  
R9  
R8  
+
Power On  
Delay  
V
ref  
V
uvlo  
V
ref  
+
APG/  
THERM  
CLRFLT  
+
PWRDWN  
Thermal  
Shutdown  
UVS  
V
V
CC  
TaperDet  
STAT1  
STAT2  
PWRDWN  
PWRDWN  
OSC  
CC  
Charge Control, Charge Timer  
and  
DisplayLogic  
TMR SEL  
REG  
CR  
Two Open  
Drain  
Outputs  
for  
ChargeOK  
bq24002  
7
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
TYPICAL CHARACTERISTICS  
OUTPUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
JUNCTION TEMPERATURE  
4.24  
4.24  
V
IN  
= 5 V  
V
T
= 5 V  
= 25°C  
IN  
A
4.22  
4.20  
4.18  
4.16  
4.14  
4.12  
4.10  
4.08  
4.06  
4.22  
4.20  
4.18  
4.16  
4.14  
4.12  
4.10  
4.08  
4.06  
V
SEL  
= V  
CC  
V
= V  
CC  
SEL  
V
SEL  
= V  
SS  
V
SEL  
= V  
SS  
50  
0
50  
100  
150  
0
200  
400  
600  
800  
1000  
1200  
T Junction Temperature °C  
J
I
O
Output Current mA  
Figure 1  
Figure 2  
OUTPUT VOLTAGE  
vs  
CURRENT SENSE VOLTAGE  
vs  
INPUT VOLTAGE  
INPUT VOLTAGE  
4.24  
4.22  
4.20  
4.18  
4.16  
4.14  
4.12  
4.10  
4.08  
4.06  
103  
102  
101  
100  
99  
I
T
= 100 mA  
= 25°C  
I
T
= 100 mA  
= 25°C  
O
A
O
A
V
= V  
CC  
SEL  
V
= V  
SS  
SEL  
98  
97  
5
6
7
8
9
10  
5
6
7
8
9
10  
V Input Voltage V  
I
V Input Voltage V  
I
Figure 3  
Figure 4  
8
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
TYPICAL CHARACTERISTICS  
CURRENT SENSE VOLTAGE  
QUIESCENT CURRENT  
vs  
vs  
JUNCTION TEMPERATURE  
INPUT VOLTAGE  
103  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
I
T
= 100 mA  
= 25°C  
T
A
= 25°C  
O
A
102  
101  
100  
99  
V
V
= 10 V  
CC  
= 5 V  
CC  
98  
50  
0
50  
100  
150  
5
6
7
8
9
10  
T Junction Temperature °C  
J
V Input Voltage V  
I
Figure 5  
Figure 6  
QUIESCENT CURRENT  
(POWER DOWN)  
vs  
DROPOUT VOLTAGE  
vs  
INPUT VOLTAGE  
INPUT VOLTAGE  
600  
30  
25  
20  
15  
10  
5
T
A
= 25°C  
T
A
= 25°C  
500  
400  
300  
200  
100  
0
1200 mA  
800 mA  
400 mA  
100 mA  
0
4.5  
5.5  
6.5  
7.5  
8.5  
9.5  
5
6
7
8
9
10  
V Input Voltage V  
I
V Input Voltage V  
I
Figure 7  
Figure 8  
9
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
TYPICAL CHARACTERISTICS  
DROPOUT VOLTAGE  
vs  
DROPOUT VOLTAGE  
vs  
OUTPUT CURRENT  
JUNCTION TEMPERATURE  
600  
500  
400  
300  
200  
100  
0
800  
700  
600  
500  
400  
300  
200  
100  
I
O
= 1.2 A  
T
A
= 25°C  
V
= 5 V  
IN  
V
= 5 V  
CC  
V
= 10 V  
IN  
V
CC  
= 10 V  
0
200  
400  
600  
800  
1000  
1200  
50  
0
50  
100  
150  
I
O
Output Current mA  
T Junction Temperature °C  
J
Figure 9  
Figure 10  
REVERSE CURRENT  
vs  
REVERSE CURRENT LEAKAGE  
vs  
JUNCTION TEMPERATURE  
VOLTAGE ON OUT PIN  
6
5
4
3
2
1
0
4.0  
V
OUT  
= 4.3 V  
T
A
= 25°C  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
50  
0
50  
100  
150  
5
6
7
8
9
10  
T Junction Temperature °C  
J
V
O
Voltage on Out Pin V  
Figure 11  
Figure 12  
10  
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
APPLICATION INFORMATION  
U1  
V
CC  
1
2
20  
R1  
0.1 Ω  
N/C  
IN  
N/C  
OUT  
19  
18  
17  
16  
15  
14  
13  
12  
11  
DC+  
PACK+  
C1  
10 µF  
V
CC  
3
+
IN  
OUT  
+
4
V
CC  
VSENSE  
AGND  
STAT2  
DC–  
5
ISNS  
N/C  
PACK–  
6
C4  
1 µF  
C2  
0.1 µF  
7
APG/THM STAT1  
8
EN  
TMR SEL  
CR  
TEMP  
9
Battery  
Pack  
VSEL  
GND  
V
CC  
C3  
0.22 µF  
10  
N/C  
R4  
bq24002PWP  
500 Ω  
D1  
D2  
R5  
500 Ω  
R2  
18.7 kΩ  
R3  
95.3 kΩ  
Figure 13. Li-Ion/Li-Pol Charger  
11  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
APPLICATION INFORMATION  
FUNCTIONAL DESCRIPTION  
Thebq2400x supports a precision current- and voltage-regulated Li-Ion charging system suitable for cells with either coke  
or graphite anodes. See Figure 14 for a typical charge profile and Figure 15 for an operational flowchart.  
CurrentRegulation  
Phase  
Voltage Regulation and  
Charge TerminationPhase  
Preconditioning  
Phase  
Regulation Voltage  
(V  
)
OUT  
RegulationCurrent  
(I  
)
lim  
Charge Voltage  
MinimumCharge  
Voltage (LowV)  
Preconditioning  
Current (I  
)
PRECHG  
Charge Current  
Taper Detect  
22.5Minutes  
Charge Timer (3, 4.5 or 6 Hours)  
22.5Minutes  
Figure 14. Typical Charge Profile  
12  
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
POR  
Regulate  
(PRECHG)  
I
Yes  
Reset and Start  
22.5 min Timer  
V
< V ?  
(LOWV)  
I(VSENSE)  
Indicate Pre–  
Charge  
No  
Reset All Timers,  
Start Charge Timer  
(TMR SEL input )  
Yes  
V
> V ?  
(OVERV)  
I(VSENSE)  
No  
Regulate Current  
or Voltage  
Indicate Charge  
No  
V
< V ?  
(LOWV)  
I(VSENSE)  
Yes  
Yes  
V
> V ?  
(OVERV)  
I(VSENSE)  
No  
22.5min Timer  
Expired?  
No  
Yes  
Yes  
Charge timer  
Expired?  
No  
Fault Condition  
Indicate Fault  
Yes  
V
< V ?  
(LOWV)  
I(VSENSE)  
No  
POR?  
or  
APG/THERM toggle?  
No  
Start 22.5 minute  
Timer  
or  
Yes  
Taper  
Detected?  
EN toggle?  
Indicate DONE  
Yes  
No  
22.5min Timer  
Expired?  
Yes  
Turn Off Charge  
Indicate DONE  
V
< V  
I(VSENSE)  
or  
?
(HIGHV)  
No  
POR?  
or  
APG/THERM Toggle?  
or  
EN Toggle?  
Yes  
Figure 15. Operational Flow Chart  
13  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
either the adapter power or the battery temperature using  
a thermistor. The bq2400x suspends charge if this input is  
outside the limits set by the user. Please refer to the  
APG/THERM input section for additional details.  
Charge Qualification and Preconditioning  
The bq2400x starts a charge cycle when power is applied  
while a battery is present. Charge qualification is based on  
battery voltage and the APG/THERM input.  
APG/THERM Input  
Thebq400x continuously monitors temperature or system  
input voltage by measuring the voltage between the  
APG/THERM (adapter power good/thermistor) and GND.  
For temperature, a negative- or a positive- temperature  
coefficient thermistor (NTC, PTC) and an external voltage  
divider typically develop this voltage (see Figure 16). The  
As shown in the block diagram, the internal LowV  
comparator output prevents fast-charging a deeply  
depleted battery. When set, charging current is provided  
by a dedicated precharge current source. The precharge  
timerlimits the precharge duration. The precharge current  
alsominimizesheatdissipationinthepasselementduring  
the initial stage of charge.  
bq2400x compares this voltage against its internal V  
TP1  
and V  
thresholds to determine if charging is allowed.  
TP2  
The APG/THERM input can also be configured to monitor  
(See Figure 17.)  
U1  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
N/C  
IN  
N/C  
OUT  
PACK+  
PACK–  
TEMP  
3
IN  
OUT  
+
4
V
CC  
VSENSE  
AGND  
STAT2  
5
ISNS  
N/C  
6
NTCThermistor  
BatteryPack  
7
APG/THM STAT1  
8
EN  
TMR SEL  
CR  
9
VSEL  
GND  
C3  
0.22 µF  
10  
N/C  
bq24002PWP  
RT1  
RT2  
Figure 16. Temperature Sensing Circuit  
14  
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
U1  
V
CC  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
N/C  
IN  
N/C  
OUT  
DC+  
3
Vcc  
IN  
OUT  
4
V
CC  
VSENSE  
AGND  
STAT2  
Temp Fault  
5
ISNS  
N/C  
6
R1  
VTP1  
7
APG/THM STAT1  
Normal Temp Range  
Temp Fault  
8
VTP2  
EN  
TMR SEL  
CR  
R2  
9
VSEL  
GND  
10  
DC–  
N/C  
GND  
bq24002PWP  
Figure 17. Temperature Threshold  
Figure 18. APG Sensing Circuit  
Values of resistors R1 and R2 can be calculated using the following equation:  
R2  
V
+ V  
CC  
APG  
(R1 ) R2)  
where V  
is the voltage at the APG/THM pin.  
APG  
Current Regulation  
The bq2400x provides current regulation while the battery-pack voltage is less than the regulation voltage. The current  
regulation loop effectively amplifies the error between a reference signal, Vilim, and the drop across the external sense  
resistor, R  
.
SNS  
U1  
V
CC  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
N/C  
IN  
N/C  
OUT  
OUT  
R
SNS  
DC+  
C1  
10 µF  
V
CC  
3
+
IN  
4
V
CC  
VSENSE  
AGND  
DC–  
5
ISNS  
N/C  
6
STAT2  
C2  
0.1 µF  
7
APG/THM STAT1  
8
EN  
TMR SEL  
CR  
9
VSEL  
GND  
10  
N/C  
bq24002PWP  
Figure 19. Current Sensing Circuit  
15  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
Charge current feedback, applied through pin ISNS,  
maintains regulation around a threshold of Vilim. The  
following formula calculates the value of the sense  
The output stage is totem pole for the bq24001 and  
bq24003 and open-drain for the bq24002. The following  
tables summarize the operation of the three options:  
resistor:  
Table 1. bq24001 (Single LED)  
Vilim  
R
+
SNS  
I
REG  
CHARGE STATE  
Precharge  
STAT1  
ON (LOW)  
where I  
is the desired charging current.  
REG  
Fast charge  
ON (LOW)  
Voltage Monitoring and Regulation  
FAULT  
Flashing (1 Hz, 50% duty cycle)  
OFF (HIGH)  
Done(>90%)  
Sleep-mode  
Voltageregulation feedback is through pin VSENSE. This  
input is tied directly to the positive side of the battery pack.  
The bq2400x supports cells with either coke (4.1 V) or  
graphite (4.2 V) anode. Pin VSEL selects the charge  
regulation voltage.  
OFF (HIGH)  
APG/Therminvalid  
Thermalshutdown  
Batteryabsent  
OFF (HIGH)  
OFF (HIGH)  
OFF (HIGH)  
VSEL State  
(see Note)  
CHARGE REGULATION  
VOLTAGE  
Table 2. bq24002 (2 Individual LEDs)  
Low  
4.1 V  
4.2 V  
STAT2  
High  
CHARGE STATE  
STAT1 (RED)  
(GREEN)  
NOTE: VSEL should not be left floating.  
Precharge  
ON (LOW)  
ON (LOW)  
OFF  
Fast charge  
OFF  
Charge Termination  
Flashing (1 Hz,  
50% duty cycle)  
FAULT  
OFF  
The bq2400x continues with the charge cycle until  
termination by one of the two possible termination  
conditions:  
Done(>90%)  
OFF  
OFF  
OFF  
OFF  
OFF  
ON (LOW)  
OFF  
Sleep-mode  
Maximum Charge Time: The bq2400x sets the maximum  
charge time through pin TMRSEL. The TMR SEL pin  
allows the user to select between three different total  
charge-time timers (3, 4, 5, or 6 hours). The charge timer  
is initiated after the preconditioning phase of the charge  
and is reset at the beginning of a new charge cycle. Note  
thatinthecaseofafaultcondition,suchasanout-of-range  
signal on the APG/THERM input or a thermal shutdown,  
the bq2400x suspends the timer.  
APG/Therminvalid  
Thermalshutdown  
Batteryabsent  
OFF  
OFF  
(1)  
OFF  
(1) If thermistor is used, then the Green LED is off.  
Table 3. bq24003 (Single Bicolor LED)  
LED2  
(GREEN)  
APPARENT  
COLOR  
CHARGE STATE LED1 (RED)  
Precharge  
Fast charge  
FAULT  
ON (LOW)  
ON (LOW)  
ON (LOW)  
OFF (HIGH)  
OFF (HIGH)  
OFF (HIGH)  
OFF (HIGH)  
ON (LOW)  
ON (LOW)  
OFF (HIGH)  
RED  
RED  
TMRSEL STATE  
CHARGE TIME  
3 hours  
(1)  
Floating  
YELLOW  
GREEN  
OFF  
Low  
6 hours  
Done(>90%)  
Sleep-mode  
High  
4.5 hours  
(1)  
To improve noise immunity, it is recommended that a minimum of  
10 pF capacitor be tied to Vss on a floating pin.  
APG/Therm  
invalid  
OFF (HIGH)  
OFF (HIGH)  
OFF (HIGH)  
OFF (HIGH)  
OFF  
OFF  
Minimum Current: The bq2400x monitors the charging  
current during the voltage regulation phase. The bq2400x  
initiates a 22-minute timer once the current falls below the  
taperdet trip threshold. Fast charge is terminated once the  
22-minute timer expires.  
Thermal  
shutdown  
(1)  
OFF (HIGH) OFF (HIGH)  
(1)  
OFF  
Batteryabsent  
(1) If thermistor is used, then the Green LED is off.  
Charge Status Display  
Thermal Shutdown  
The three available options allow the user to configure the  
charge status display for single LED (bq24001), two  
individual LEDs (bq24002) or a bicolor LED (bq24003).  
The bq2400x monitors the junction temperature T of the  
J
DIE and suspends charging if T exceeds 165°C.  
J
Charging resumes when T falls below 155°C.  
J
16  
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
DETAILED DESCRIPTION  
VOLTAGE SENSE  
POWER FET  
The integrated transistor is a P-channel MOSFET. The  
power FET features a reverse-blocking Schottky diode,  
which prevents current flow from OUT to IN.  
To achieve maximum voltage regulation accuracy, the  
bq2400x uses the feedback on the VSENSE pin.  
Externally, this pin should be connected as close to the  
battery cell terminals as possible. For additional safety, a  
10kinternal pullup resistor is connected between the  
VSENSE and OUT pins.  
An internal thermal-sense circuit shuts off the power FET  
when the junction temperature rises to approximately  
165°C. Hysteresis is built into the thermal sense circuit.  
After the device has cooled approximately 10°C, the  
power FET turns back on. The power FET continues to  
cycle off and on until the fault is removed.  
ENABLE (EN)  
The logic EN input is used to enable or disable the IC. A  
high-level signal on this pin enables the bq2400x. A  
low-level signal disables the IC and places the device in a  
low-power standby mode.  
CURRENT SENSE  
The bq2400x regulates current by sensing, on the ISNS  
pin, the voltage drop developed across an external sense  
resistor. The sense resistor must be placed between the  
supply voltage (Vcc) and the input of the IC (IN pins).  
17  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
THERMAL INFORMATION  
THERMALLY ENHANCED TSSOP-20  
DIE  
The thermally enhanced PWP package is based on the  
20-pin TSSOP, but includes a thermal pad (see  
Figure 20)toprovideaneffectivethermalcontactbetween  
the IC and the PWB.  
Side View (a)  
DIE  
Traditionally, surface mount and power have been  
mutually exclusive terms. A variety of scaled-down  
TO220-type packages have leads formed as gull wings to  
make them applicable for surface-mount applications.  
These packages, however, suffer from several  
shortcomings: they do not address the very low profile  
requirements (<2 mm) of many of todays advanced  
systems, and they do not offer a pin-count high enough to  
accommodate increasing integration. On the other hand,  
traditional low-power surface-mount packages require  
power-dissipation derating that severely limits the usable  
range of many high-performance analog circuits.  
End View (b)  
Thermal  
Pad  
The PWP package (thermally enhanced TSSOP)  
combines fine-pitch surface-mount technology with  
thermal performance comparable to much larger power  
packages.  
Bottom View (c)  
The PWP package is designed to optimize the heat  
transfer to the PWB. Because of the very small size and  
limited mass of a TSSOP package, thermal enhancement  
isachievedbyimprovingthethermalconductionpathsthat  
remove heat from the component. The thermal pad is  
formed using a lead-frame design (patent pending) and  
manufacturing technique to provide the user with direct  
connection to the heat-generating IC. When this pad is  
soldered or otherwise coupled to an external heat  
dissipator, high power dissipation in the ultrathin,  
fine-pitch, surface-mount package can be reliably  
achieved.  
Figure 20. Views of Thermally Enhanced  
PWP Package  
Because the conduction path has been enhanced,  
power-dissipation capability is determined by the thermal  
considerations in the PWB design. For example, simply  
addingalocalizedcopperplane(heat-sinksurface), which  
is coupled to the thermal pad, enables the PWP package  
to dissipate 2.5 W in free air. (Reference Figure 22(a), 8  
2
cm of copper heat sink and natural convection.)  
Increasing the heat-sink size increases the power  
dissipation range for the component. The power  
dissipation limit can be further improved by adding airflow  
to a PWB/IC assembly (see Figure 22(b) and 22(c)). The  
2
line drawn at 0.3 cm in Figures 21 and 22 indicates  
performance at the minimum recommended heat-sink  
size.  
18  
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
THERMAL INFORMATION  
THERMAL RESISTANCE  
vs  
COPPER HEAT-SINK AREA  
150  
125  
100  
NaturalConvection  
50 ft/min  
100 ft/min  
150 ft/min  
200 ft/min  
75  
50  
25  
250 ft/min  
300 ft/min  
0 0.3  
1
2
3
4
5
6
7
8
2
Copper Heat-Sink Area cm  
Figure 21  
19  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
THERMAL INFORMATION  
3.5  
3.5  
T
A
= 25°C  
T
A
= 55°C  
300 ft/min  
3
2.5  
2
3
150 ft/min  
300 ft/min  
2.5  
2
150 ft/min  
NaturalConvection  
1.5  
1.5  
NaturalConvection  
1
0.5  
0
1
0.5  
0
0
2
4
6
8
0
2
4
6
8
0.3  
0.3  
2
2
Copper Heat-Sink Size cm  
Copper Heat-Sink Size cm  
(a)  
(b)  
3.5  
T
A
= 105°C  
3
2.5  
2
1.5  
1
150 ft/min  
300 ft/min  
NaturalConvection  
6
0.5  
0
0
2
4
8
0.3  
2
Copper Heat-Sink Size cm  
(c)  
Figure 22. Power Ratings of the PWP Package at Ambient Temperatures of 25°C, 55°C, and 105°C  
20  
bq24001  
bq24002  
bq24003  
www.ti.com  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
MECHANICAL DATA  
PWP (R-PDSO-G**)  
PowerPAD PLASTIC SMALL-OUTLINE  
20 PINS SHOWN  
0,30  
0,19  
M
0,65  
20  
0,10  
11  
ThermalPad  
(See Note D)  
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
1
10  
0,25  
A
0°ā8°  
0,75  
0,50  
SeatingPlane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
28  
DIM  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
7,70  
9,80  
9,60  
A MAX  
A MIN  
4073225/F10/98  
NOTES:A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusions.  
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.  
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.  
E. Falls within JEDEC MO-153.  
PowerPAD is a trademark of TexasInstruments.  
21  
bq24001  
bq24002  
bq24003  
SLUS462D SEPTEMBER 2000 REVISED MAY 2002  
www.ti.com  
MECHANICAL DATA  
RGW (S-PQFP-N20)  
PLASTIC QUAD FLATPACK  
5,15  
4,85  
5,15  
4,85  
Pin 1 Index  
Area  
Top and Bottom  
1,00  
0,80  
0,20 REF.  
SeatingPlane  
0,05  
0,00  
0,08  
3,25 SQ MAX  
0,75  
20X  
0,65  
0,35  
5
1
20  
6
16  
10  
Exposed Thermal Die  
Pad  
(See Note D)  
11  
15  
0,38  
20X  
0,23  
0,10  
2,60  
4204100/A01/02  
NOTES:A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Quad Flatpack, No-leads, (QFN) package configuration.  
D. The package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane.  
E. Falls within JEDEC M0-220.  
22  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, maskworkright, orotherTIintellectualpropertyrightrelatingtoanycombination, machine, orprocess  
in which TI products or services are used. Information published by TI regarding third–party products or services  
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Use of such information may require a license from a third party under the patents or other intellectual property  
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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Mailing Address:  
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Post Office Box 655303  
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Copyright 2002, Texas Instruments Incorporated  

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TI

BQ24002PWPG4

SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS
TI

BQ24002PWPR

SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS
TI

BQ24002PWPRG4

SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS
TI

BQ24002PWPTR

IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20, GREEN, PLASTIC, HTSSOP-20, Power Management Circuit
TI

BQ24002RGW

SINGLE-CELL Li-ION CHARGE MANAGEMENT IC FOR PDAs AND INTERNET APPLIANCES
TI

BQ24002RGWR

SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS
TI

BQ24002RGWRG4

SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS
TI

BQ24002RGWTR

1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC20, 5 X 5 MM, PLASTIC, QFN-20
TI

BQ24003

SINGLE-CELL Li-ION CHARGE MANAGEMENT IC FOR PDAs AND INTERNET APPLIANCES
TI

BQ24003PWP

SINGLE-CELL Li-ION CHARGE MANAGEMENT IC FOR PDAs AND INTERNET APPLIANCES
TI

BQ24003PWPG4

SINGLE-CELL LI-ION CHARGE MANAGEMENT ICFOR PDAS
TI